DE19883004T1 - Device for Inspecting Printed Boards - Google Patents

Device for Inspecting Printed Boards

Info

Publication number
DE19883004T1
DE19883004T1 DE19883004T DE19883004T DE19883004T1 DE 19883004 T1 DE19883004 T1 DE 19883004T1 DE 19883004 T DE19883004 T DE 19883004T DE 19883004 T DE19883004 T DE 19883004T DE 19883004 T1 DE19883004 T1 DE 19883004T1
Authority
DE
Germany
Prior art keywords
printed boards
inspecting printed
inspecting
boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19883004T
Other languages
English (en)
Inventor
Satoshi Nishida
Masanori Mizuno
Miki Kurosawa
Shozui Takeno
Masaharu Moriyasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE19883004T1 publication Critical patent/DE19883004T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
DE19883004T 1998-08-10 1998-08-10 Device for Inspecting Printed Boards Withdrawn DE19883004T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/003546 WO2000009993A1 (fr) 1998-08-10 1998-08-10 Dispositif de verification de cartes a circuit imprime

Publications (1)

Publication Number Publication Date
DE19883004T1 true DE19883004T1 (de) 2001-07-12

Family

ID=14208768

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19883004T Withdrawn DE19883004T1 (de) 1998-08-10 1998-08-10 Device for Inspecting Printed Boards

Country Status (7)

Country Link
US (1) US6633376B1 (de)
JP (1) JP3961220B2 (de)
KR (1) KR100423714B1 (de)
CN (1) CN1129788C (de)
DE (1) DE19883004T1 (de)
TW (1) TW389840B (de)
WO (1) WO2000009993A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8164625B2 (en) 2005-06-25 2012-04-24 Modi Modular Digits Gmbh Device and method for visually recording two-dimensional or three-dimensional objects

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JP2002321080A (ja) * 2001-04-24 2002-11-05 Tokyo Instruments Inc レーザ微細加工用オートフォーカス装置
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JP4320524B2 (ja) * 2002-04-04 2009-08-26 三菱電機株式会社 レーザ加工装置
JP4043859B2 (ja) * 2002-06-18 2008-02-06 浜松ホトニクス株式会社 樹脂溶接装置及び樹脂溶接方法
JP3733094B2 (ja) * 2002-08-22 2006-01-11 トヨタ自動車株式会社 良否判定装置、良否判定プログラムおよび良否判定方法
US7342218B2 (en) * 2002-12-19 2008-03-11 Applied Materials, Israel, Ltd. Methods and systems for optical inspection of surfaces based on laser screening
JP2006189718A (ja) * 2005-01-07 2006-07-20 Laserfront Technologies Inc 部材切替装置、レンズ切替装置、レーザリペア装置及びレーザ検査装置
US8768084B2 (en) * 2005-03-01 2014-07-01 Qualcomm Incorporated Region-of-interest coding in video telephony using RHO domain bit allocation
US8693537B2 (en) * 2005-03-01 2014-04-08 Qualcomm Incorporated Region-of-interest coding with background skipping for video telephony
US7724972B2 (en) * 2005-03-01 2010-05-25 Qualcomm Incorporated Quality metric-biased region-of-interest coding for video telephony
US20110199764A1 (en) * 2005-08-26 2011-08-18 Camtek Ltd. Device and method for controlling an angular coverage of a light beam
US8290239B2 (en) 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
KR101351474B1 (ko) * 2005-12-20 2014-01-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 레이저 조사장치, 레이저 조사방법, 및 반도체장치제조방법
CN1869667B (zh) * 2006-06-08 2010-07-28 浙江欧威科技有限公司 一种检测印刷电路板缺陷的轮廓分析方法
US7544304B2 (en) * 2006-07-11 2009-06-09 Electro Scientific Industries, Inc. Process and system for quality management and analysis of via drilling
KR100691509B1 (ko) * 2006-11-20 2007-03-12 광전자정밀주식회사 웨이퍼 수준의 발광소자 지향각 측정방법 및 장치
CN100440929C (zh) * 2006-11-30 2008-12-03 华南理工大学 一种用于全自动锡膏印刷机的t型双镜头图像采集装置
FR2916051A1 (fr) * 2007-05-07 2008-11-14 Beamind Soc Par Actions Simpli Procede et dispositif d'alignement d'un systeme de test avec un element electrique a tester
JP5187843B2 (ja) * 2008-09-01 2013-04-24 浜松ホトニクス株式会社 半導体検査装置及び検査方法
JP5334617B2 (ja) * 2009-02-17 2013-11-06 日東電工株式会社 配線回路基板の製造方法
US20100259805A1 (en) * 2009-04-13 2010-10-14 Molecular Devices, Inc. Methods and systems for reducing scanner image distortion
WO2011096562A1 (ja) * 2010-02-08 2011-08-11 三菱電機株式会社 制御装置およびレーザ加工機
US8648906B2 (en) * 2010-10-13 2014-02-11 Mitutoyo Corporation Precision solder resist registration inspection method
JP5894745B2 (ja) 2011-05-31 2016-03-30 浜松ホトニクス株式会社 集積回路検査装置
CN102507596B (zh) * 2011-11-18 2014-04-02 中国工程物理研究院激光聚变研究中心 一种基于激光束主动扫描的光学元件表面疵病检测系统
CN102590219B (zh) * 2012-02-10 2014-01-15 东莞市冠佳电子设备有限公司 Pcb综合检测设备
KR101278046B1 (ko) * 2012-03-23 2013-06-27 성균관대학교산학협력단 레이저 드릴링 가공홀 검사방법
CN103033521A (zh) * 2012-12-13 2013-04-10 京东方科技集团股份有限公司 一种布线检测方法及检测系统
CN106206353B (zh) * 2013-03-01 2021-04-16 日月光半导体制造股份有限公司 检测装置及方法
TWI490542B (zh) 2013-05-07 2015-07-01 Univ Nat Taiwan A scanning lens and an interference measuring device using the scanning lens
KR20150015254A (ko) * 2013-07-31 2015-02-10 삼성디스플레이 주식회사 레이저 빔의 모니터링 방법 및 이를 이용한 레이저 조사 장치
TWI487924B (zh) * 2013-11-19 2015-06-11 Machvision Inc 印刷電路板的檢測方法及其裝置
CN103969265A (zh) * 2014-03-26 2014-08-06 宋剑锋 一种紫外光在线路板检修站中的应用方法
KR101606197B1 (ko) * 2014-05-16 2016-03-25 참엔지니어링(주) 관찰기 및 이를 구비하는 레이저 처리장치
CN105136816A (zh) * 2015-09-10 2015-12-09 苏州威盛视信息科技有限公司 印刷线路板自动光学检测中检测框的矫正方法
CN105277569B (zh) * 2015-11-26 2018-11-27 凌云光技术集团有限责任公司 基于三维特征的线路板检测方法
US10600174B2 (en) * 2015-12-29 2020-03-24 Test Research, Inc. Optical inspection apparatus
CN108449974A (zh) * 2016-01-29 2018-08-24 株式会社斯库林集团 污迹检测装置、激光打孔加工装置以及激光打孔加工方法
CN106323204A (zh) * 2016-08-16 2017-01-11 深圳天珑无线科技有限公司 Pcb板介质厚度监控方法及装置
CN108072613B (zh) * 2016-11-11 2020-09-08 台湾积体电路制造股份有限公司 光学检测装置及其检测方法
CN110494789B (zh) 2017-04-12 2021-07-06 三菱电机株式会社 电控反射镜及其制造方法、电扫描器、激光加工机
CN107064778A (zh) * 2017-05-05 2017-08-18 柏承科技(昆山)股份有限公司 Pcb盲孔检测方法
JP6909195B2 (ja) * 2017-06-02 2021-07-28 浜松ホトニクス株式会社 半導体検査装置
JP6419893B1 (ja) * 2017-06-02 2018-11-07 浜松ホトニクス株式会社 半導体検査装置
WO2019102682A1 (ja) 2017-11-27 2019-05-31 浜松ホトニクス株式会社 解析方法、解析装置、解析プログラム、及び解析プログラムを記録する記録媒体
CN108254381A (zh) * 2018-02-12 2018-07-06 昆山镭崴光电科技有限公司 一种电路板高密度盲孔3d显微镜检测装置及检测方法
JP6771684B2 (ja) * 2018-06-22 2020-10-21 三菱電機株式会社 レーザ加工装置
CN108680849B (zh) * 2018-07-06 2024-03-22 中国电子技术标准化研究院 一种电子器件结温的测量方法和装置
CN109540208A (zh) * 2018-11-27 2019-03-29 江门市利诺达电路科技有限公司 一种基于光电效应的电路板过孔质量的检测装置
CN111215744B (zh) * 2020-01-10 2020-11-06 深圳市大德激光技术有限公司 激光能量分光的方法及装置
CN111324007B (zh) * 2020-03-26 2023-03-28 武汉华星光电半导体显示技术有限公司 掩膜板自动光学检测仪
US11255898B2 (en) * 2020-05-08 2022-02-22 Rohde & Schwarz Gmbh & Co. Kg System and method for testing a device-under-test
JP7091010B2 (ja) * 2020-06-18 2022-06-27 Ckd株式会社 スクリーンマスク検査装置
CN114571103A (zh) * 2020-11-30 2022-06-03 大族激光科技产业集团股份有限公司 印制线路板的激光加工方法和系统、计算机存储介质
KR102364376B1 (ko) * 2020-12-11 2022-02-17 주식회사 옴니엔지니어링 검사 및 리페어 기능을 갖는 레이저 마킹 시스템
RU2761863C1 (ru) * 2021-05-25 2021-12-13 Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук Способ неразрушающей диагностики дефектов сквозного металлизированного отверстия печатной платы
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8164625B2 (en) 2005-06-25 2012-04-24 Modi Modular Digits Gmbh Device and method for visually recording two-dimensional or three-dimensional objects
DE102005029901B4 (de) 2005-06-25 2022-10-06 Modi Modular Digits Gmbh Vorrichtung und Verfahren zum visuellen Erfassen von flächigen oder räumlichen Objekten

Also Published As

Publication number Publication date
KR20010106439A (ko) 2001-11-29
CN1299465A (zh) 2001-06-13
CN1129788C (zh) 2003-12-03
US6633376B1 (en) 2003-10-14
WO2000009993A1 (fr) 2000-02-24
JP3961220B2 (ja) 2007-08-22
TW389840B (en) 2000-05-11
KR100423714B1 (ko) 2004-03-18

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