JP5894745B2 - 集積回路検査装置 - Google Patents
集積回路検査装置 Download PDFInfo
- Publication number
- JP5894745B2 JP5894745B2 JP2011121893A JP2011121893A JP5894745B2 JP 5894745 B2 JP5894745 B2 JP 5894745B2 JP 2011121893 A JP2011121893 A JP 2011121893A JP 2011121893 A JP2011121893 A JP 2011121893A JP 5894745 B2 JP5894745 B2 JP 5894745B2
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- light
- integrated circuit
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- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007689 inspection Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 44
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000001514 detection method Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 22
- 229910052710 silicon Inorganic materials 0.000 description 22
- 239000010703 silicon Substances 0.000 description 22
- 238000010586 diagram Methods 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 101100059532 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CDC45 gene Proteins 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
となり、平均として、
となる。
を満たす必要がある。
となる。シリコン基板21の厚さTが100μmであれば、光Lの波長幅dは33.8nmを超える必要がある。
となる。
Claims (7)
- 半導体基板、及び前記半導体基板の表面側に形成された回路部を有する集積回路を検査するための集積回路検査装置であって、
波長幅を有する光を発生する光発生部と、
前記光発生部が発生する光の波長幅を調整する波長幅調整部と、
前記波長幅調整部で調整された光の照射位置を調整する照射位置調整部と、
前記照射位置調整部からの光が前記半導体基板の裏面を介して前記回路部に照射されたときに、前記集積回路からの光を検出する光検出部と、を備えることを特徴とする集積回路検査装置。 - 前記光検出部は、前記集積回路からの光として干渉光の強度を検出することを特徴とする請求項1に記載の集積回路検査装置。
- 前記光発生部は、スーパールミネッセントダイオードを有し、
前記波長幅調整部は、前記スーパールミネッセントダイオードに印加する電圧を調整することにより、前記波長幅を調整することを特徴とする請求項1又は2に記載の集積回路検査装置。 - 前記光発生部は、白色光源を有し、
前記波長幅調整部は、前記白色光源からの光のうち通過させる光の波長帯域を調整することにより、前記波長幅を調整することを特徴とする請求項1又は2に記載の集積回路検査装置。 - 前記照射位置調整部は、前記光発生部からの光が、前記半導体基板に形成される空乏層を介して前記回路部に照射されるように、前記照射位置を調整することを特徴とする請求項1〜4のいずれか一項に記載の集積回路検査装置。
- 前記波長幅調整部は、前記集積回路に照射される光の中心波長、前記半導体基板の屈折率、前記半導体基板の厚さ及び前記空乏層の深さに基づいて、前記波長幅を調整することを特徴とする請求項5に記載の集積回路検査装置。
- 前記半導体基板の厚みをTμm、前記光発生部が発生する光の波長幅をdμmとすると、
前記波長幅調整部は、d>3.38/Tとなるように、前記光発生部が発生する光の波長幅を調整する、請求項1〜6のいずれか一項記載の集積回路検査装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011121893A JP5894745B2 (ja) | 2011-05-31 | 2011-05-31 | 集積回路検査装置 |
KR1020137030653A KR101951969B1 (ko) | 2011-05-31 | 2012-05-25 | 집적 회로 검사 장치 |
CN201280026635.8A CN103563064B (zh) | 2011-05-31 | 2012-05-25 | 集成电路检查装置 |
PCT/JP2012/063521 WO2012165344A1 (ja) | 2011-05-31 | 2012-05-25 | 集積回路検査装置 |
CN201610452908.5A CN106198566B (zh) | 2011-05-31 | 2012-05-25 | 集成电路检查装置 |
EP12793492.5A EP2717305B1 (en) | 2011-05-31 | 2012-05-25 | Method of integrated circuit inspection |
TW101119392A TWI557415B (zh) | 2011-05-31 | 2012-05-30 | Integrated circuit inspection device |
US13/485,016 US9099350B2 (en) | 2011-05-31 | 2012-05-31 | Apparatus for inspecting integrated circuit |
US14/751,637 US10508996B2 (en) | 2011-05-31 | 2015-06-26 | System for testing integrated circuit and method for testing integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011121893A JP5894745B2 (ja) | 2011-05-31 | 2011-05-31 | 集積回路検査装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016036867A Division JP6194380B2 (ja) | 2016-02-29 | 2016-02-29 | 集積回路検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012247397A JP2012247397A (ja) | 2012-12-13 |
JP5894745B2 true JP5894745B2 (ja) | 2016-03-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011121893A Active JP5894745B2 (ja) | 2011-05-31 | 2011-05-31 | 集積回路検査装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9099350B2 (ja) |
EP (1) | EP2717305B1 (ja) |
JP (1) | JP5894745B2 (ja) |
KR (1) | KR101951969B1 (ja) |
CN (2) | CN106198566B (ja) |
TW (1) | TWI557415B (ja) |
WO (1) | WO2012165344A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016136153A (ja) * | 2016-02-29 | 2016-07-28 | 浜松ホトニクス株式会社 | 集積回路検査装置 |
US10508996B2 (en) | 2011-05-31 | 2019-12-17 | Hamamatsu Photonics K.K. | System for testing integrated circuit and method for testing integrated circuit |
Families Citing this family (15)
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KR20170069292A (ko) | 2013-02-01 | 2017-06-20 | 하마마츠 포토닉스 가부시키가이샤 | 반도체 디바이스 검사 장치 및 반도체 디바이스 검사 방법 |
US10191111B2 (en) * | 2013-03-24 | 2019-01-29 | Dcg Systems, Inc. | Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets |
JP6283501B2 (ja) | 2013-11-12 | 2018-02-21 | 浜松ホトニクス株式会社 | 周波数解析装置及び周波数解析方法 |
JP6283507B2 (ja) * | 2013-11-29 | 2018-02-21 | 浜松ホトニクス株式会社 | 半導体デバイス計測装置及び半導体デバイス計測方法 |
TWI619954B (zh) * | 2014-10-16 | 2018-04-01 | Dcg系統公司 | 雷射電壓測試系統與方法 |
JP2016223899A (ja) * | 2015-05-29 | 2016-12-28 | 浜松ホトニクス株式会社 | 光源装置及び検査装置 |
WO2016194556A1 (ja) * | 2015-05-29 | 2016-12-08 | 浜松ホトニクス株式会社 | 光源装置及び検査装置 |
WO2017078127A1 (ja) | 2015-11-05 | 2017-05-11 | 有限会社ビジョンサイテック | 偏光された平行光により基板を評価することを含む方法 |
JP7028783B2 (ja) * | 2015-11-06 | 2022-03-02 | エフ イー アイ カンパニ | 波形マッピングおよびゲートレーザ電圧イメージング |
US10132861B2 (en) * | 2016-09-16 | 2018-11-20 | Qualcomm Incorporated | Visible laser circuit fault isolation |
DE102018108283A1 (de) | 2018-04-09 | 2019-10-10 | Carl Zeiss Smt Gmbh | Elektro-optische Leiterplatte zur Kontaktierung von photonischen integrierten Schaltungen |
JP7158224B2 (ja) | 2018-09-26 | 2022-10-21 | 浜松ホトニクス株式会社 | 半導体デバイス検査方法及び半導体デバイス検査装置 |
JP7398449B2 (ja) * | 2019-05-31 | 2023-12-14 | 浜松ホトニクス株式会社 | 半導体デバイス検査方法及び半導体デバイス検査装置 |
KR20240015650A (ko) * | 2021-06-01 | 2024-02-05 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 전자 부품 본딩 머신, 및 이러한 머신 상의 거리를 측정하는 방법 |
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-
2011
- 2011-05-31 JP JP2011121893A patent/JP5894745B2/ja active Active
-
2012
- 2012-05-25 EP EP12793492.5A patent/EP2717305B1/en active Active
- 2012-05-25 CN CN201610452908.5A patent/CN106198566B/zh active Active
- 2012-05-25 KR KR1020137030653A patent/KR101951969B1/ko active IP Right Grant
- 2012-05-25 WO PCT/JP2012/063521 patent/WO2012165344A1/ja active Application Filing
- 2012-05-25 CN CN201280026635.8A patent/CN103563064B/zh active Active
- 2012-05-30 TW TW101119392A patent/TWI557415B/zh active
- 2012-05-31 US US13/485,016 patent/US9099350B2/en active Active
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2015
- 2015-06-26 US US14/751,637 patent/US10508996B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10508996B2 (en) | 2011-05-31 | 2019-12-17 | Hamamatsu Photonics K.K. | System for testing integrated circuit and method for testing integrated circuit |
JP2016136153A (ja) * | 2016-02-29 | 2016-07-28 | 浜松ホトニクス株式会社 | 集積回路検査装置 |
Also Published As
Publication number | Publication date |
---|---|
US10508996B2 (en) | 2019-12-17 |
KR20140033368A (ko) | 2014-03-18 |
EP2717305B1 (en) | 2020-03-18 |
CN106198566B (zh) | 2020-08-21 |
CN103563064B (zh) | 2016-08-17 |
US20150293036A1 (en) | 2015-10-15 |
WO2012165344A1 (ja) | 2012-12-06 |
EP2717305A1 (en) | 2014-04-09 |
US9099350B2 (en) | 2015-08-04 |
CN106198566A (zh) | 2016-12-07 |
JP2012247397A (ja) | 2012-12-13 |
US20120307249A1 (en) | 2012-12-06 |
CN103563064A (zh) | 2014-02-05 |
TWI557415B (zh) | 2016-11-11 |
KR101951969B1 (ko) | 2019-02-25 |
EP2717305A4 (en) | 2015-03-11 |
TW201303332A (zh) | 2013-01-16 |
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