DE60217023D1 - Mehrschichtige Leiterplatte und Verfahren zur Herstellung einer mehrschichtigen Leiterplatte - Google Patents
Mehrschichtige Leiterplatte und Verfahren zur Herstellung einer mehrschichtigen LeiterplatteInfo
- Publication number
- DE60217023D1 DE60217023D1 DE60217023T DE60217023T DE60217023D1 DE 60217023 D1 DE60217023 D1 DE 60217023D1 DE 60217023 T DE60217023 T DE 60217023T DE 60217023 T DE60217023 T DE 60217023T DE 60217023 D1 DE60217023 D1 DE 60217023D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- multilayer printed
- producing
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001206889 | 2001-07-06 | ||
JP2001206889A JP2003023250A (ja) | 2001-07-06 | 2001-07-06 | 多層基板のおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60217023D1 true DE60217023D1 (de) | 2007-02-08 |
DE60217023T2 DE60217023T2 (de) | 2007-08-16 |
Family
ID=19042955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60217023T Expired - Lifetime DE60217023T2 (de) | 2001-07-06 | 2002-07-05 | Mehrschichtige Leiterplatte und Verfahren zur Herstellung einer mehrschichtigen Leiterplatte |
Country Status (9)
Country | Link |
---|---|
US (2) | US6768061B2 (de) |
EP (1) | EP1280393B1 (de) |
JP (1) | JP2003023250A (de) |
KR (1) | KR100502498B1 (de) |
CN (1) | CN1247053C (de) |
DE (1) | DE60217023T2 (de) |
MX (1) | MXPA02006635A (de) |
SG (1) | SG107602A1 (de) |
TW (1) | TW519863B (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW540281B (en) * | 2001-08-09 | 2003-07-01 | Matsushita Electric Ind Co Ltd | Manufacturing method of conductive paste material and manufacturing method of printing wiring base board |
JP4488684B2 (ja) * | 2002-08-09 | 2010-06-23 | イビデン株式会社 | 多層プリント配線板 |
JP4029759B2 (ja) * | 2003-04-04 | 2008-01-09 | 株式会社デンソー | 多層回路基板およびその製造方法 |
JP3979391B2 (ja) * | 2004-01-26 | 2007-09-19 | 松下電器産業株式会社 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
US7316512B2 (en) * | 2004-07-30 | 2008-01-08 | General Electric Company | Interconnect device |
JP4747707B2 (ja) * | 2004-11-09 | 2011-08-17 | ソニー株式会社 | 多層配線基板及び基板製造方法 |
TWI301656B (en) * | 2004-11-26 | 2008-10-01 | Via Tech Inc | Circuit board and process thereof |
US7361585B2 (en) * | 2004-12-23 | 2008-04-22 | Advantech Global, Ltd | System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition |
JP4625346B2 (ja) * | 2005-02-25 | 2011-02-02 | 株式会社リコー | 情報処理システム |
JP4667086B2 (ja) * | 2005-03-14 | 2011-04-06 | 日東電工株式会社 | 電子部品の実装構造および電子部品の実装方法 |
DE102005013762C5 (de) | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters |
JP3779721B1 (ja) * | 2005-07-28 | 2006-05-31 | 新神戸電機株式会社 | 積層回路基板の製造方法 |
EP1928030B1 (de) * | 2005-09-20 | 2019-01-30 | Panasonic Intellectual Property Management Co., Ltd. | Led-beleuchtungskörper |
JP2007036172A (ja) * | 2005-11-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | 積層回路基板 |
JP5021216B2 (ja) | 2006-02-22 | 2012-09-05 | イビデン株式会社 | プリント配線板およびその製造方法 |
US7956293B2 (en) * | 2006-04-03 | 2011-06-07 | Panasonic Corporation | Multilayer printed wiring board and manufacturing method thereof |
JP2007324200A (ja) * | 2006-05-30 | 2007-12-13 | Yazaki Corp | 回路基板およびそれを備えた電気接続箱 |
KR100757907B1 (ko) * | 2006-07-06 | 2007-09-11 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP5436774B2 (ja) * | 2007-12-25 | 2014-03-05 | 古河電気工業株式会社 | 多層プリント基板およびその製造方法 |
US20110084372A1 (en) | 2009-10-14 | 2011-04-14 | Advanced Semiconductor Engineering, Inc. | Package carrier, semiconductor package, and process for fabricating same |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
TWI411075B (zh) | 2010-03-22 | 2013-10-01 | Advanced Semiconductor Eng | 半導體封裝件及其製造方法 |
KR101421083B1 (ko) * | 2012-06-13 | 2014-07-18 | 손재설 | 히트싱크 일체형 회로기판의 제조방법 |
KR20150002492A (ko) * | 2013-06-28 | 2015-01-07 | 쿄세라 서킷 솔루션즈 가부시키가이샤 | 배선 기판 |
JP6291738B2 (ja) * | 2013-07-25 | 2018-03-14 | 富士通株式会社 | 回路基板、回路基板の製造方法及び電子機器 |
JP2015208200A (ja) * | 2014-04-23 | 2015-11-19 | 株式会社デンソー | 電源装置 |
JP2015211204A (ja) * | 2014-04-30 | 2015-11-24 | イビデン株式会社 | 回路基板及びその製造方法 |
JP6337644B2 (ja) * | 2014-06-25 | 2018-06-06 | 三菱電機株式会社 | 半導体装置 |
TWI699145B (zh) | 2015-01-13 | 2020-07-11 | 日商宇部愛科喜模股份有限公司 | 可撓性積層板與多層電路基板 |
JP6475020B2 (ja) * | 2015-01-13 | 2019-02-27 | 宇部エクシモ株式会社 | 積層板の製造方法 |
US9907190B1 (en) * | 2015-02-03 | 2018-02-27 | Amazon Technologies, Inc. | Composite structures and methods of making |
JP6525319B2 (ja) * | 2015-08-31 | 2019-06-05 | アルプスアルパイン株式会社 | シート状コイル部品とシート状コイル部品の実装体およびシート状コイル部品の実装方法 |
JP6696996B2 (ja) * | 2015-11-10 | 2020-05-20 | 株式会社村田製作所 | 樹脂多層基板およびその製造方法 |
JP6516023B2 (ja) * | 2016-01-07 | 2019-05-22 | 株式会社村田製作所 | 多層基板、電子機器及び多層基板の製造方法 |
JP6623941B2 (ja) | 2016-06-09 | 2019-12-25 | 株式会社デンソー | 多層基板の製造方法 |
JP7251446B2 (ja) * | 2019-10-28 | 2023-04-04 | 株式会社オートネットワーク技術研究所 | 伝熱部材付基板及び伝熱部材付基板の製造方法 |
WO2021193385A1 (ja) * | 2020-03-26 | 2021-09-30 | 株式会社クラレ | 多層回路基板の製造方法 |
DE102021112611A1 (de) | 2021-05-14 | 2022-11-17 | Alpha Deuren International Bv | Sektionaltor |
KR102537710B1 (ko) * | 2021-05-28 | 2023-05-31 | (주)티에스이 | 일괄 접합 방식의 다층 회로기판 및 그 제조 방법 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0111890B1 (de) * | 1982-12-15 | 1991-03-13 | Nec Corporation | Monolithisches Vielschichtkeramiksubstrat mit mindestens einer dielektrischen Schicht aus einem Material mit Perovskit-Struktur |
US4897338A (en) * | 1987-08-03 | 1990-01-30 | Allied-Signal Inc. | Method for the manufacture of multilayer printed circuit boards |
US5158801A (en) * | 1988-04-01 | 1992-10-27 | The United States Of America As Represented By The United States Administrator Of The National Aeronautics And Space Administration | Method of forming a multiple layer dielectric and a hot film sensor therewith |
JPH03283594A (ja) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | 回路基板 |
US5259100A (en) * | 1992-05-27 | 1993-11-09 | Amada Engineering & Service Co., Inc. | Milling tool for turret punch press |
JPH06232558A (ja) | 1993-02-04 | 1994-08-19 | Toshiba Corp | 多層プリント配線板の製造方法 |
US5386339A (en) * | 1993-07-29 | 1995-01-31 | Hughes Aircraft Company | Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
KR100326655B1 (ko) * | 1993-08-03 | 2002-06-29 | 후루타 다케시 | 카바레이필름또는fpc제작용베이스필름에사용되는폴리이미드적층체및그적층체의제조방법 |
JP3087152B2 (ja) * | 1993-09-08 | 2000-09-11 | 富士通株式会社 | 樹脂フィルム多層回路基板の製造方法 |
JP2783751B2 (ja) * | 1993-12-21 | 1998-08-06 | 富士通株式会社 | 多層セラミック基板の製造方法 |
JP3512225B2 (ja) * | 1994-02-28 | 2004-03-29 | 株式会社日立製作所 | 多層配線基板の製造方法 |
JPH07263867A (ja) | 1994-03-18 | 1995-10-13 | Fujitsu General Ltd | 多層配線基板 |
JPH08148828A (ja) | 1994-11-18 | 1996-06-07 | Hitachi Ltd | 薄膜多層回路基板およびその製造方法 |
JP3603354B2 (ja) | 1994-11-21 | 2004-12-22 | 株式会社デンソー | 混成集積回路装置 |
JPH08279684A (ja) | 1995-04-05 | 1996-10-22 | Mitsui Toatsu Chem Inc | 金属ベース多層配線基板 |
JPH0936553A (ja) * | 1995-07-21 | 1997-02-07 | Furukawa Electric Co Ltd:The | 金属ベース多層配線基板 |
US5747164A (en) * | 1995-09-19 | 1998-05-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Conductive composite plastic sheet and container |
US6143116A (en) * | 1996-09-26 | 2000-11-07 | Kyocera Corporation | Process for producing a multi-layer wiring board |
TW383435B (en) | 1996-11-01 | 2000-03-01 | Hitachi Chemical Co Ltd | Electronic device |
JP3299679B2 (ja) * | 1996-12-27 | 2002-07-08 | 新光電気工業株式会社 | 多層配線基板及びその製造方法 |
JPH10199882A (ja) * | 1997-01-13 | 1998-07-31 | Nec Corp | 半導体装置 |
KR100371877B1 (ko) * | 1997-04-16 | 2003-02-11 | 가부시끼가이샤 도시바 | 배선기판과 배선기판의 제조방법 및 반도체 패키지 |
JPH11284342A (ja) | 1998-03-31 | 1999-10-15 | Sumitomo Metal Ind Ltd | パッケージとその製造方法 |
JP3236818B2 (ja) | 1998-04-28 | 2001-12-10 | 京セラ株式会社 | 素子内蔵多層配線基板の製造方法 |
JP4124297B2 (ja) * | 1998-09-16 | 2008-07-23 | 大日本印刷株式会社 | 多層配線基板とその製造方法 |
JP3119630B2 (ja) * | 1998-09-18 | 2000-12-25 | 日本電気株式会社 | 半導体チップモジュール用多層回路基板およびその製造方法 |
US6207259B1 (en) * | 1998-11-02 | 2001-03-27 | Kyocera Corporation | Wiring board |
JP3635219B2 (ja) * | 1999-03-11 | 2005-04-06 | 新光電気工業株式会社 | 半導体装置用多層基板及びその製造方法 |
JP2000294929A (ja) | 1999-04-05 | 2000-10-20 | Ibiden Co Ltd | 多層プリント配線板の製造方法および多層プリント配線板 |
JP4436946B2 (ja) * | 1999-06-25 | 2010-03-24 | イビデン株式会社 | 片面回路基板の製造方法、および多層プリント配線板の製造方法 |
JP2001024323A (ja) * | 1999-07-12 | 2001-01-26 | Ibiden Co Ltd | 導電性ペーストの充填方法および多層プリント配線板用の片面回路基板の製造方法 |
JP3227444B2 (ja) * | 1999-11-10 | 2001-11-12 | ソニーケミカル株式会社 | 多層構造のフレキシブル配線板とその製造方法 |
TW512653B (en) * | 1999-11-26 | 2002-12-01 | Ibiden Co Ltd | Multilayer circuit board and semiconductor device |
JP4486196B2 (ja) * | 1999-12-08 | 2010-06-23 | イビデン株式会社 | 多層プリント配線板用片面回路基板およびその製造方法 |
-
2001
- 2001-07-06 JP JP2001206889A patent/JP2003023250A/ja active Pending
-
2002
- 2002-06-26 US US10/179,203 patent/US6768061B2/en not_active Expired - Lifetime
- 2002-06-27 SG SG200203906A patent/SG107602A1/en unknown
- 2002-06-27 TW TW091114202A patent/TW519863B/zh not_active IP Right Cessation
- 2002-07-03 MX MXPA02006635A patent/MXPA02006635A/es active IP Right Grant
- 2002-07-05 EP EP02015076A patent/EP1280393B1/de not_active Expired - Fee Related
- 2002-07-05 DE DE60217023T patent/DE60217023T2/de not_active Expired - Lifetime
- 2002-07-05 CN CNB021411255A patent/CN1247053C/zh not_active Expired - Fee Related
- 2002-07-05 KR KR10-2002-0038933A patent/KR100502498B1/ko not_active IP Right Cessation
-
2004
- 2004-05-11 US US10/842,526 patent/US7328505B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1247053C (zh) | 2006-03-22 |
TW519863B (en) | 2003-02-01 |
US20030007330A1 (en) | 2003-01-09 |
EP1280393B1 (de) | 2006-12-27 |
KR100502498B1 (ko) | 2005-07-22 |
EP1280393A2 (de) | 2003-01-29 |
US20040208933A1 (en) | 2004-10-21 |
US6768061B2 (en) | 2004-07-27 |
DE60217023T2 (de) | 2007-08-16 |
CN1396796A (zh) | 2003-02-12 |
JP2003023250A (ja) | 2003-01-24 |
KR20030005054A (ko) | 2003-01-15 |
SG107602A1 (en) | 2004-12-29 |
US7328505B2 (en) | 2008-02-12 |
MXPA02006635A (es) | 2003-02-10 |
EP1280393A3 (de) | 2004-10-13 |
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