DE60234300D1 - Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte - Google Patents

Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte

Info

Publication number
DE60234300D1
DE60234300D1 DE60234300T DE60234300T DE60234300D1 DE 60234300 D1 DE60234300 D1 DE 60234300D1 DE 60234300 T DE60234300 T DE 60234300T DE 60234300 T DE60234300 T DE 60234300T DE 60234300 D1 DE60234300 D1 DE 60234300D1
Authority
DE
Germany
Prior art keywords
producing
metal
circuit board
printed circuit
ceramic composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60234300T
Other languages
English (en)
Inventor
Nobuyoshi Tsukaguchi
Masami Kimura
Masahiro Furo
Yoshinori Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19124363&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60234300(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Application granted granted Critical
Publication of DE60234300D1 publication Critical patent/DE60234300D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Ceramic Products (AREA)
DE60234300T 2001-09-28 2002-09-25 Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte Expired - Lifetime DE60234300D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001304434A JP4811756B2 (ja) 2001-09-28 2001-09-28 金属−セラミックス接合回路基板の製造方法

Publications (1)

Publication Number Publication Date
DE60234300D1 true DE60234300D1 (de) 2009-12-24

Family

ID=19124363

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60234300T Expired - Lifetime DE60234300D1 (de) 2001-09-28 2002-09-25 Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte

Country Status (4)

Country Link
US (1) US6918529B2 (de)
EP (1) EP1298970B1 (de)
JP (1) JP4811756B2 (de)
DE (1) DE60234300D1 (de)

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US6826868B2 (en) * 2001-03-28 2004-12-07 Dorma Gmbh + Co. Kg Slim-frame door
US7069645B2 (en) * 2001-03-29 2006-07-04 Ngk Insulators, Ltd. Method for producing a circuit board
JP3969987B2 (ja) * 2001-10-01 2007-09-05 Ｄｏｗａホールディングス株式会社 セラミックスと合金の接合体
DE10212495B4 (de) * 2002-03-21 2004-02-26 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats
JP3863067B2 (ja) * 2002-06-04 2006-12-27 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体の製造方法
JP3868854B2 (ja) * 2002-06-14 2007-01-17 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体およびその製造方法
US20040149689A1 (en) * 2002-12-03 2004-08-05 Xiao-Shan Ning Method for producing metal/ceramic bonding substrate
JP4394477B2 (ja) * 2003-03-27 2010-01-06 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板の製造方法
JP5299160B2 (ja) * 2003-03-27 2013-09-25 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板の製造方法
JP3565835B1 (ja) * 2003-04-28 2004-09-15 松下電器産業株式会社 配線基板およびその製造方法ならびに半導体装置およびその製造方法
KR101050137B1 (ko) * 2005-12-16 2011-07-19 주식회사 엘지화학 전도성 패턴의 제조방법 및 이에 의해 제조된 전도성 패턴
JP2008044009A (ja) * 2006-07-19 2008-02-28 Honda Motor Co Ltd 熱膨張係数が異なる部材の接合方法
US7999369B2 (en) * 2006-08-29 2011-08-16 Denso Corporation Power electronic package having two substrates with multiple semiconductor chips and electronic components
TWI335792B (en) * 2007-02-09 2011-01-01 Univ Nat Taiwan Method of manufacturing ceramic/metal composite structure
DE102007029031A1 (de) * 2007-06-23 2008-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot
US9586382B2 (en) 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure
JP5129189B2 (ja) * 2009-03-31 2013-01-23 Ｄｏｗａメタルテック株式会社 金属セラミックス接合基板及びその製造方法
JP5133960B2 (ja) * 2009-10-22 2013-01-30 電気化学工業株式会社 半導体搭載用回路基板及びその製造方法
JP2011199212A (ja) * 2010-03-24 2011-10-06 Dowa Metaltech Kk 金属−セラミックス回路基板およびその製造方法
JP2013084822A (ja) * 2011-10-11 2013-05-09 Hitachi Metals Ltd セラミックス回路基板用素材およびセラミックス回路基板の製造方法
JP6202487B2 (ja) * 2013-03-21 2017-09-27 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合回路基板およびその製造方法並びに検査方法
EP2861046B1 (de) * 2013-08-15 2016-11-16 Hitachi Metals, Ltd. Herstellungsverfahren für eine keramikleiterplatte und keramikleiterplatte
JP5720860B1 (ja) * 2013-08-29 2015-05-20 日立金属株式会社 セラミックス回路基板の製造方法
JP6210818B2 (ja) * 2013-09-30 2017-10-11 三菱電機株式会社 半導体装置およびその製造方法
JP2017010982A (ja) * 2015-06-17 2017-01-12 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
JP2017010981A (ja) * 2015-06-17 2017-01-12 日本特殊陶業株式会社 配線基板の製造方法
DE102016105456A1 (de) * 2016-03-23 2017-09-28 Epcos Ag Verfahren zur Herstellung einer gasdichten Metall-Keramikverbindung und Verwendung der gasdichten Metall-Keramikverbindung
JP6799479B2 (ja) * 2017-03-03 2020-12-16 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板の製造方法
WO2019054294A1 (ja) 2017-09-12 2019-03-21 株式会社 東芝 セラミックス回路基板の製造方法
CN111490018A (zh) * 2019-01-29 2020-08-04 瑷司柏电子股份有限公司 具有金属导热凸块接垫的陶瓷基板元件、组件及制法
JP7221401B2 (ja) * 2019-08-29 2023-02-13 京セラ株式会社 電気回路基板及びパワーモジュール

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Also Published As

Publication number Publication date
US6918529B2 (en) 2005-07-19
US20030066865A1 (en) 2003-04-10
EP1298970A2 (de) 2003-04-02
JP4811756B2 (ja) 2011-11-09
EP1298970A3 (de) 2004-10-20
EP1298970B1 (de) 2009-11-11
JP2003110222A (ja) 2003-04-11

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Legal Events

Date Code Title Description
8363 Opposition against the patent