DE60234300D1 - Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte - Google Patents

Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte

Info

Publication number
DE60234300D1
DE60234300D1 DE60234300T DE60234300T DE60234300D1 DE 60234300 D1 DE60234300 D1 DE 60234300D1 DE 60234300 T DE60234300 T DE 60234300T DE 60234300 T DE60234300 T DE 60234300T DE 60234300 D1 DE60234300 D1 DE 60234300D1
Authority
DE
Germany
Prior art keywords
producing
metal
circuit board
printed circuit
ceramic composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60234300T
Other languages
English (en)
Inventor
Nobuyoshi Tsukaguchi
Masami Kimura
Masahiro Furo
Yoshinori Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19124363&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60234300(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Application granted granted Critical
Publication of DE60234300D1 publication Critical patent/DE60234300D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0753Insulation
    • H05K2201/0761Insulation resistance, e.g. of the surface of the PCB between the conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796Oxidant in aqueous solution, e.g. permanganate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/121Metallo-organic compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Products (AREA)
DE60234300T 2001-09-28 2002-09-25 Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte Expired - Lifetime DE60234300D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001304434A JP4811756B2 (ja) 2001-09-28 2001-09-28 金属−セラミックス接合回路基板の製造方法

Publications (1)

Publication Number Publication Date
DE60234300D1 true DE60234300D1 (de) 2009-12-24

Family

ID=19124363

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60234300T Expired - Lifetime DE60234300D1 (de) 2001-09-28 2002-09-25 Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte

Country Status (4)

Country Link
US (1) US6918529B2 (de)
EP (1) EP1298970B1 (de)
JP (1) JP4811756B2 (de)
DE (1) DE60234300D1 (de)

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US6826868B2 (en) * 2001-03-28 2004-12-07 Dorma Gmbh + Co. Kg Slim-frame door
US7069645B2 (en) * 2001-03-29 2006-07-04 Ngk Insulators, Ltd. Method for producing a circuit board
JP3969987B2 (ja) * 2001-10-01 2007-09-05 Dowaホールディングス株式会社 セラミックスと合金の接合体
DE10212495B4 (de) * 2002-03-21 2004-02-26 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats
JP3863067B2 (ja) * 2002-06-04 2006-12-27 Dowaホールディングス株式会社 金属−セラミックス接合体の製造方法
JP3868854B2 (ja) * 2002-06-14 2007-01-17 Dowaホールディングス株式会社 金属−セラミックス接合体およびその製造方法
US20040149689A1 (en) * 2002-12-03 2004-08-05 Xiao-Shan Ning Method for producing metal/ceramic bonding substrate
JP4394477B2 (ja) * 2003-03-27 2010-01-06 Dowaホールディングス株式会社 金属−セラミックス接合基板の製造方法
JP5299160B2 (ja) * 2003-03-27 2013-09-25 Dowaメタルテック株式会社 金属−セラミックス接合基板の製造方法
JP3565835B1 (ja) * 2003-04-28 2004-09-15 松下電器産業株式会社 配線基板およびその製造方法ならびに半導体装置およびその製造方法
JP4802248B2 (ja) * 2005-12-16 2011-10-26 エルジー・ケム・リミテッド 導電性パターンの製造方法およびこれによって製造された導電性パターン
JP2008044009A (ja) * 2006-07-19 2008-02-28 Honda Motor Co Ltd 熱膨張係数が異なる部材の接合方法
US7999369B2 (en) * 2006-08-29 2011-08-16 Denso Corporation Power electronic package having two substrates with multiple semiconductor chips and electronic components
TWI335792B (en) * 2007-02-09 2011-01-01 Univ Nat Taiwan Method of manufacturing ceramic/metal composite structure
DE102007029031A1 (de) * 2007-06-23 2008-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot
US9586382B2 (en) 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure
JP5129189B2 (ja) * 2009-03-31 2013-01-23 Dowaメタルテック株式会社 金属セラミックス接合基板及びその製造方法
JP5133960B2 (ja) * 2009-10-22 2013-01-30 電気化学工業株式会社 半導体搭載用回路基板及びその製造方法
JP2011199212A (ja) * 2010-03-24 2011-10-06 Dowa Metaltech Kk 金属−セラミックス回路基板およびその製造方法
JP2013084822A (ja) * 2011-10-11 2013-05-09 Hitachi Metals Ltd セラミックス回路基板用素材およびセラミックス回路基板の製造方法
JP6202487B2 (ja) * 2013-03-21 2017-09-27 Dowaメタルテック株式会社 金属−セラミックス接合回路基板およびその製造方法並びに検査方法
US10057992B2 (en) 2013-08-15 2018-08-21 Hitachi Metals, Ltd. Ceramic circuit substrate and its production method
PL2916627T3 (pl) * 2013-08-29 2019-09-30 Hitachi Metals, Ltd. Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego
JP6210818B2 (ja) * 2013-09-30 2017-10-11 三菱電機株式会社 半導体装置およびその製造方法
JP2017010981A (ja) * 2015-06-17 2017-01-12 日本特殊陶業株式会社 配線基板の製造方法
JP2017010982A (ja) * 2015-06-17 2017-01-12 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
DE102016105456A1 (de) * 2016-03-23 2017-09-28 Epcos Ag Verfahren zur Herstellung einer gasdichten Metall-Keramikverbindung und Verwendung der gasdichten Metall-Keramikverbindung
JP6799479B2 (ja) 2017-03-03 2020-12-16 Dowaメタルテック株式会社 金属−セラミックス回路基板の製造方法
EP3684148B1 (de) 2017-09-12 2023-11-29 Kabushiki Kaisha Toshiba Verfahren zur herstellung einer keramischen leiterplatte
CN111490018A (zh) * 2019-01-29 2020-08-04 瑷司柏电子股份有限公司 具有金属导热凸块接垫的陶瓷基板元件、组件及制法
US20220330447A1 (en) * 2019-08-29 2022-10-13 Kyocera Corporation Electric circuit board and power module

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DE2906813C2 (de) * 1979-02-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnschichtschaltung
US5302492A (en) * 1989-06-16 1994-04-12 Hewlett-Packard Company Method of manufacturing printing circuit boards
JP2594475B2 (ja) * 1990-04-16 1997-03-26 電気化学工業株式会社 セラミックス回路基板
EP0480038B1 (de) * 1990-04-16 1997-07-09 Denki Kagaku Kogyo Kabushiki Kaisha Keramische leiterplatte
JPH0710030B2 (ja) * 1990-05-18 1995-02-01 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線基板の製造方法
JPH04176882A (ja) * 1990-11-08 1992-06-24 Kawasaki Steel Corp 銅板接合セラミックス基板のエッチング方法
JPH0736467B2 (ja) * 1991-07-05 1995-04-19 電気化学工業株式会社 セラミックス回路基板の製造法
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JPH1112716A (ja) * 1997-06-19 1999-01-19 Seiko Epson Corp ロウ接用材料およびその製造方法
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Also Published As

Publication number Publication date
US6918529B2 (en) 2005-07-19
EP1298970B1 (de) 2009-11-11
JP4811756B2 (ja) 2011-11-09
US20030066865A1 (en) 2003-04-10
EP1298970A3 (de) 2004-10-20
EP1298970A2 (de) 2003-04-02
JP2003110222A (ja) 2003-04-11

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Legal Events

Date Code Title Description
8363 Opposition against the patent