DE60234300D1 - Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte - Google Patents
Verfahren zur Herstellung einer Metall/Keramik-VerbundleiterplatteInfo
- Publication number
- DE60234300D1 DE60234300D1 DE60234300T DE60234300T DE60234300D1 DE 60234300 D1 DE60234300 D1 DE 60234300D1 DE 60234300 T DE60234300 T DE 60234300T DE 60234300 T DE60234300 T DE 60234300T DE 60234300 D1 DE60234300 D1 DE 60234300D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- metal
- circuit board
- printed circuit
- ceramic composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001304434A JP4811756B2 (ja) | 2001-09-28 | 2001-09-28 | 金属−セラミックス接合回路基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60234300D1 true DE60234300D1 (de) | 2009-12-24 |
Family
ID=19124363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60234300T Expired - Lifetime DE60234300D1 (de) | 2001-09-28 | 2002-09-25 | Verfahren zur Herstellung einer Metall/Keramik-Verbundleiterplatte |
Country Status (4)
Country | Link |
---|---|
US (1) | US6918529B2 (de) |
EP (1) | EP1298970B1 (de) |
JP (1) | JP4811756B2 (de) |
DE (1) | DE60234300D1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6826868B2 (en) * | 2001-03-28 | 2004-12-07 | Dorma Gmbh + Co. Kg | Slim-frame door |
US7069645B2 (en) * | 2001-03-29 | 2006-07-04 | Ngk Insulators, Ltd. | Method for producing a circuit board |
JP3969987B2 (ja) * | 2001-10-01 | 2007-09-05 | Dowaホールディングス株式会社 | セラミックスと合金の接合体 |
DE10212495B4 (de) * | 2002-03-21 | 2004-02-26 | Schulz-Harder, Jürgen, Dr.-Ing. | Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats |
JP3863067B2 (ja) * | 2002-06-04 | 2006-12-27 | Dowaホールディングス株式会社 | 金属−セラミックス接合体の製造方法 |
JP3868854B2 (ja) * | 2002-06-14 | 2007-01-17 | Dowaホールディングス株式会社 | 金属−セラミックス接合体およびその製造方法 |
US20040149689A1 (en) * | 2002-12-03 | 2004-08-05 | Xiao-Shan Ning | Method for producing metal/ceramic bonding substrate |
JP4394477B2 (ja) * | 2003-03-27 | 2010-01-06 | Dowaホールディングス株式会社 | 金属−セラミックス接合基板の製造方法 |
JP5299160B2 (ja) * | 2003-03-27 | 2013-09-25 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板の製造方法 |
JP3565835B1 (ja) * | 2003-04-28 | 2004-09-15 | 松下電器産業株式会社 | 配線基板およびその製造方法ならびに半導体装置およびその製造方法 |
JP4802248B2 (ja) * | 2005-12-16 | 2011-10-26 | エルジー・ケム・リミテッド | 導電性パターンの製造方法およびこれによって製造された導電性パターン |
JP2008044009A (ja) * | 2006-07-19 | 2008-02-28 | Honda Motor Co Ltd | 熱膨張係数が異なる部材の接合方法 |
US7999369B2 (en) * | 2006-08-29 | 2011-08-16 | Denso Corporation | Power electronic package having two substrates with multiple semiconductor chips and electronic components |
TWI335792B (en) * | 2007-02-09 | 2011-01-01 | Univ Nat Taiwan | Method of manufacturing ceramic/metal composite structure |
DE102007029031A1 (de) * | 2007-06-23 | 2008-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot |
US9586382B2 (en) | 2008-01-24 | 2017-03-07 | National Taiwan University | Ceramic/metal composite structure |
JP5129189B2 (ja) * | 2009-03-31 | 2013-01-23 | Dowaメタルテック株式会社 | 金属セラミックス接合基板及びその製造方法 |
JP5133960B2 (ja) * | 2009-10-22 | 2013-01-30 | 電気化学工業株式会社 | 半導体搭載用回路基板及びその製造方法 |
JP2011199212A (ja) * | 2010-03-24 | 2011-10-06 | Dowa Metaltech Kk | 金属−セラミックス回路基板およびその製造方法 |
JP2013084822A (ja) * | 2011-10-11 | 2013-05-09 | Hitachi Metals Ltd | セラミックス回路基板用素材およびセラミックス回路基板の製造方法 |
JP6202487B2 (ja) * | 2013-03-21 | 2017-09-27 | Dowaメタルテック株式会社 | 金属−セラミックス接合回路基板およびその製造方法並びに検査方法 |
US10057992B2 (en) | 2013-08-15 | 2018-08-21 | Hitachi Metals, Ltd. | Ceramic circuit substrate and its production method |
PL2916627T3 (pl) * | 2013-08-29 | 2019-09-30 | Hitachi Metals, Ltd. | Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego |
JP6210818B2 (ja) * | 2013-09-30 | 2017-10-11 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP2017010981A (ja) * | 2015-06-17 | 2017-01-12 | 日本特殊陶業株式会社 | 配線基板の製造方法 |
JP2017010982A (ja) * | 2015-06-17 | 2017-01-12 | 日本特殊陶業株式会社 | 配線基板の製造方法及び配線基板 |
DE102016105456A1 (de) * | 2016-03-23 | 2017-09-28 | Epcos Ag | Verfahren zur Herstellung einer gasdichten Metall-Keramikverbindung und Verwendung der gasdichten Metall-Keramikverbindung |
JP6799479B2 (ja) | 2017-03-03 | 2020-12-16 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板の製造方法 |
EP3684148B1 (de) | 2017-09-12 | 2023-11-29 | Kabushiki Kaisha Toshiba | Verfahren zur herstellung einer keramischen leiterplatte |
CN111490018A (zh) * | 2019-01-29 | 2020-08-04 | 瑷司柏电子股份有限公司 | 具有金属导热凸块接垫的陶瓷基板元件、组件及制法 |
US20220330447A1 (en) * | 2019-08-29 | 2022-10-13 | Kyocera Corporation | Electric circuit board and power module |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3883947A (en) * | 1971-11-05 | 1975-05-20 | Bosch Gmbh Robert | Method of making a thin film electronic circuit unit |
DE2906813C2 (de) * | 1979-02-22 | 1982-06-03 | Robert Bosch Gmbh, 7000 Stuttgart | Elektronische Dünnschichtschaltung |
US5302492A (en) * | 1989-06-16 | 1994-04-12 | Hewlett-Packard Company | Method of manufacturing printing circuit boards |
JP2594475B2 (ja) * | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | セラミックス回路基板 |
EP0480038B1 (de) * | 1990-04-16 | 1997-07-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Keramische leiterplatte |
JPH0710030B2 (ja) * | 1990-05-18 | 1995-02-01 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層配線基板の製造方法 |
JPH04176882A (ja) * | 1990-11-08 | 1992-06-24 | Kawasaki Steel Corp | 銅板接合セラミックス基板のエッチング方法 |
JPH0736467B2 (ja) * | 1991-07-05 | 1995-04-19 | 電気化学工業株式会社 | セラミックス回路基板の製造法 |
JPH0736429B2 (ja) * | 1992-03-24 | 1995-04-19 | 日本碍子株式会社 | セラミックス配線基板の製造方法 |
JPH06169145A (ja) * | 1992-11-27 | 1994-06-14 | Cmk Corp | プリント配線板の製造方法 |
JPH0736467A (ja) | 1993-07-15 | 1995-02-07 | Nippon Tokushu Toryo Co Ltd | 防音部品の製造方法 |
JP3353990B2 (ja) * | 1994-02-22 | 2002-12-09 | 電気化学工業株式会社 | 回路基板の製造方法 |
WO1996042107A1 (en) * | 1995-06-13 | 1996-12-27 | Hitachi Chemical Company, Ltd. | Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device |
JP4077888B2 (ja) * | 1995-07-21 | 2008-04-23 | 株式会社東芝 | セラミックス回路基板 |
US5800726A (en) * | 1995-07-26 | 1998-09-01 | International Business Machines Corporation | Selective chemical etching in microelectronics fabrication |
EP0789397B1 (de) | 1996-02-07 | 2004-05-06 | Hitachi, Ltd. | Schaltungsplatine und Halbleiterbauteil mit dieser |
JP3512977B2 (ja) | 1996-08-27 | 2004-03-31 | 同和鉱業株式会社 | 高信頼性半導体用基板 |
JPH10154866A (ja) * | 1996-11-21 | 1998-06-09 | Sumitomo Kinzoku Electro Device:Kk | セラミックス回路基板の製造方法 |
JPH1112716A (ja) * | 1997-06-19 | 1999-01-19 | Seiko Epson Corp | ロウ接用材料およびその製造方法 |
JPH11135915A (ja) * | 1997-10-27 | 1999-05-21 | Sumitomo Metal Smi Electron Devices Inc | セラミックス回路基板の製造方法 |
US6015505A (en) * | 1997-10-30 | 2000-01-18 | International Business Machines Corporation | Process improvements for titanium-tungsten etching in the presence of electroplated C4's |
US6197435B1 (en) * | 1997-11-07 | 2001-03-06 | Denki Kagaku Kogyo Kabushiki Kaisha | Substrate |
JP3001485B2 (ja) * | 1997-11-20 | 2000-01-24 | 富山日本電気株式会社 | 多層プリント配線板の製造方法 |
JP4018264B2 (ja) * | 1998-10-16 | 2007-12-05 | Dowaホールディングス株式会社 | アルミニウム−窒化アルミニウム絶縁基板の製造方法 |
EP1063873A3 (de) * | 1999-06-22 | 2003-04-23 | Dr.-Ing. Jürgen Schulz-Harder | Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte-und Fixierelement zur Verwendung bei dem Verfahren |
JP3930671B2 (ja) * | 1999-11-08 | 2007-06-13 | Dowaホールディングス株式会社 | 窒化ケイ素回路基板の製造方法 |
US6706622B1 (en) * | 2001-09-07 | 2004-03-16 | Lsi Logic Corporation | Bonding pad interface |
-
2001
- 2001-09-28 JP JP2001304434A patent/JP4811756B2/ja not_active Expired - Lifetime
-
2002
- 2002-09-25 DE DE60234300T patent/DE60234300D1/de not_active Expired - Lifetime
- 2002-09-25 EP EP02021757A patent/EP1298970B1/de not_active Expired - Lifetime
- 2002-09-25 US US10/254,750 patent/US6918529B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6918529B2 (en) | 2005-07-19 |
EP1298970B1 (de) | 2009-11-11 |
JP4811756B2 (ja) | 2011-11-09 |
US20030066865A1 (en) | 2003-04-10 |
EP1298970A3 (de) | 2004-10-20 |
EP1298970A2 (de) | 2003-04-02 |
JP2003110222A (ja) | 2003-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent |