DE60224611D1 - Leiterplatte mit eingebetteter elektrischer Vorrichtung und Verfahren zur Herstellung einer Leiterplatte mit eingebetteter elektrischer Vorrichtung - Google Patents
Leiterplatte mit eingebetteter elektrischer Vorrichtung und Verfahren zur Herstellung einer Leiterplatte mit eingebetteter elektrischer VorrichtungInfo
- Publication number
- DE60224611D1 DE60224611D1 DE60224611T DE60224611T DE60224611D1 DE 60224611 D1 DE60224611 D1 DE 60224611D1 DE 60224611 T DE60224611 T DE 60224611T DE 60224611 T DE60224611 T DE 60224611T DE 60224611 D1 DE60224611 D1 DE 60224611D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- electrical device
- embedded electrical
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001179118 | 2001-06-13 | ||
JP2001179118 | 2001-06-13 | ||
JP2001199392 | 2001-06-29 | ||
JP2001199392 | 2001-06-29 | ||
JP2001204023 | 2001-07-04 | ||
JP2001204023A JP3882540B2 (ja) | 2001-07-04 | 2001-07-04 | プリント基板の製造方法およびその製造方法によって形成されるプリント基板 |
JP2002062394A JP3867593B2 (ja) | 2001-06-13 | 2002-03-07 | プリント基板の製造方法およびその製造方法によって形成されるプリント基板 |
JP2002062394 | 2002-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60224611D1 true DE60224611D1 (de) | 2008-03-06 |
DE60224611T2 DE60224611T2 (de) | 2009-01-15 |
Family
ID=27482333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60224611T Expired - Lifetime DE60224611T2 (de) | 2001-06-13 | 2002-06-13 | Leiterplatte mit eingebetteter elektrischer Vorrichtung und Verfahren zur Herstellung einer Leiterplatte mit eingebetteter elektrischer Vorrichtung |
Country Status (8)
Country | Link |
---|---|
US (2) | US6680441B2 (de) |
EP (1) | EP1267597B1 (de) |
KR (1) | KR100488412B1 (de) |
CN (1) | CN100475003C (de) |
DE (1) | DE60224611T2 (de) |
MX (1) | MXPA02005829A (de) |
SG (1) | SG102054A1 (de) |
TW (1) | TW545100B (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100488412B1 (ko) * | 2001-06-13 | 2005-05-11 | 가부시키가이샤 덴소 | 내장된 전기소자를 갖는 인쇄 배선 기판 및 그 제조 방법 |
JP2003332749A (ja) | 2002-01-11 | 2003-11-21 | Denso Corp | 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板 |
US6756662B2 (en) * | 2002-09-25 | 2004-06-29 | International Business Machines Corporation | Semiconductor chip module and method of manufacture of same |
FI20030293A (fi) * | 2003-02-26 | 2004-08-27 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli |
JP2005158770A (ja) * | 2003-11-20 | 2005-06-16 | Matsushita Electric Ind Co Ltd | 積層基板とその製造方法及び前記積層基板を用いたモジュールの製造方法とその製造装置 |
US20050233122A1 (en) * | 2004-04-19 | 2005-10-20 | Mikio Nishimura | Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein |
WO2006011320A1 (ja) * | 2004-07-30 | 2006-02-02 | Murata Manufacturing Co., Ltd. | 複合型電子部品及びその製造方法 |
JP4575071B2 (ja) * | 2004-08-02 | 2010-11-04 | 新光電気工業株式会社 | 電子部品内蔵基板の製造方法 |
US7022464B2 (en) * | 2004-08-25 | 2006-04-04 | Peter Kukanskis | Integral plated resistor and method for the manufacture of printed circuit boards comprising the same |
JP2006073763A (ja) * | 2004-09-01 | 2006-03-16 | Denso Corp | 多層基板の製造方法 |
TWI287805B (en) * | 2005-11-11 | 2007-10-01 | Ind Tech Res Inst | Composite conductive film and semiconductor package using such film |
US7365273B2 (en) * | 2004-12-03 | 2008-04-29 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices |
GB2438816B (en) * | 2005-04-12 | 2009-04-01 | Yaskawa Denki Seisakusho Kk | Canned linear motor armature and canned linear motor |
JP2006324567A (ja) * | 2005-05-20 | 2006-11-30 | Matsushita Electric Ind Co Ltd | 部品内蔵基板とその製造方法 |
AU2006265765B2 (en) * | 2005-07-04 | 2009-08-27 | Griffith University | Fabrication of electronic components in plastic |
KR100643334B1 (ko) * | 2005-11-09 | 2006-11-10 | 삼성전기주식회사 | 소자 내장 인쇄회로기판 및 그 제조방법 |
JP5114041B2 (ja) * | 2006-01-13 | 2013-01-09 | 日本シイエムケイ株式会社 | 半導体素子内蔵プリント配線板及びその製造方法 |
JP4697037B2 (ja) * | 2006-05-09 | 2011-06-08 | 株式会社デンソー | 部品内蔵基板及びその配線不良検査方法 |
JP2007324550A (ja) * | 2006-06-05 | 2007-12-13 | Denso Corp | 多層基板 |
US7459202B2 (en) * | 2006-07-03 | 2008-12-02 | Motorola, Inc. | Printed circuit board |
WO2008047918A1 (fr) * | 2006-10-20 | 2008-04-24 | Nec Corporation | Structure de paquet de dispositifs électroniques et procédé de fabrication correspondant |
JP4862641B2 (ja) * | 2006-12-06 | 2012-01-25 | 株式会社デンソー | 多層基板及び多層基板の製造方法 |
US7504283B2 (en) * | 2006-12-18 | 2009-03-17 | Texas Instruments Incorporated | Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate |
JP4840132B2 (ja) * | 2006-12-26 | 2011-12-21 | 株式会社デンソー | 多層基板の製造方法 |
DE102007024189A1 (de) * | 2007-05-24 | 2008-11-27 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektronischen Baugruppe |
WO2008155957A1 (ja) * | 2007-06-19 | 2008-12-24 | Murata Manufacturing Co., Ltd. | 部品内蔵基板の製造方法および部品内蔵基板 |
JP5012896B2 (ja) * | 2007-06-26 | 2012-08-29 | 株式会社村田製作所 | 部品内蔵基板の製造方法 |
US20090114345A1 (en) * | 2007-11-07 | 2009-05-07 | Sumitomo Metal Mining Co., Ltd. | Method for manufacturing a substrate for mounting a semiconductor element |
JP4548509B2 (ja) * | 2008-04-23 | 2010-09-22 | 株式会社デンソー | プリント基板製造装置 |
US20100012354A1 (en) * | 2008-07-14 | 2010-01-21 | Logan Brook Hedin | Thermally conductive polymer based printed circuit board |
WO2010018708A1 (ja) * | 2008-08-12 | 2010-02-18 | 株式会社村田製作所 | 部品内蔵モジュールの製造方法及び部品内蔵モジュール |
KR101089840B1 (ko) * | 2009-04-01 | 2011-12-05 | 삼성전기주식회사 | 회로 기판 모듈 및 그의 제조 방법 |
WO2010113448A1 (ja) * | 2009-04-02 | 2010-10-07 | パナソニック株式会社 | 回路基板の製造方法および回路基板 |
US9299539B2 (en) * | 2009-08-21 | 2016-03-29 | Lam Research Corporation | Method and apparatus for measuring wafer bias potential |
JP5126278B2 (ja) | 2010-02-04 | 2013-01-23 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP2011249745A (ja) * | 2010-04-28 | 2011-12-08 | Denso Corp | 多層基板 |
JP5454681B2 (ja) * | 2010-05-26 | 2014-03-26 | 株式会社村田製作所 | モジュール基板およびその製造方法 |
JP5062302B2 (ja) | 2010-06-29 | 2012-10-31 | 株式会社デンソー | 冷却器への電子部品内蔵配線基板の取付構造及びその取付方法 |
CN102986314B (zh) * | 2010-07-06 | 2016-10-12 | 株式会社藤仓 | 层叠配线基板及其制造方法 |
JP5447453B2 (ja) | 2010-11-03 | 2014-03-19 | 株式会社デンソー | スイッチングモジュール |
TWM411098U (en) | 2011-01-28 | 2011-09-01 | Chunghwa Picture Tubes Ltd | Circuit board assembly |
JP2012186279A (ja) * | 2011-03-04 | 2012-09-27 | Fujikura Ltd | 電子部品を内蔵した積層プリント配線板及びその製造方法 |
JP5622939B2 (ja) * | 2011-08-23 | 2014-11-12 | 株式会社フジクラ | 部品内蔵基板およびその製造方法 |
US9277645B2 (en) * | 2012-01-18 | 2016-03-01 | Covidien Lp | Method of manufacturing a printed circuit board |
US9351395B2 (en) * | 2012-01-18 | 2016-05-24 | Covidien Lp | Printed circuit boards including strip-line circuitry and methods of manufacturing same |
JP5574073B2 (ja) * | 2012-06-14 | 2014-08-20 | 株式会社村田製作所 | 高周波モジュール |
CN105027692B (zh) | 2013-05-17 | 2018-01-30 | 株式会社村田制作所 | 元器件内置多层基板的制造方法以及元器件内置多层基板 |
DE102015113322B3 (de) | 2015-08-12 | 2016-11-17 | Schweizer Electronic Ag | Hochfrequenzantenne, Hochfrequenzsubstrat mit Hochfrequenzantenne und Verfahren zur Herstellung |
DE102015113324A1 (de) | 2015-08-12 | 2017-02-16 | Schweizer Electronic Ag | Leiterstrukturelement mit einlaminiertem Innenlagensubstrat und Verfahren zu dessen Herstellung |
JP6388097B2 (ja) | 2016-05-18 | 2018-09-12 | 株式会社村田製作所 | 部品内蔵基板の製造方法 |
CN209358846U (zh) | 2016-06-02 | 2019-09-06 | 株式会社村田制作所 | 树脂多层基板 |
WO2018030262A1 (ja) | 2016-08-09 | 2018-02-15 | 株式会社村田製作所 | モジュール部品の製造方法 |
JP6717245B2 (ja) * | 2017-03-17 | 2020-07-01 | 三菱マテリアル株式会社 | 接合体の製造方法、絶縁回路基板の製造方法、及び、ヒートシンク付き絶縁回路基板の製造方法 |
CN112201652A (zh) * | 2019-07-07 | 2021-01-08 | 深南电路股份有限公司 | 线路板及其制作方法 |
KR20210076585A (ko) | 2019-12-16 | 2021-06-24 | 삼성전기주식회사 | 전자부품 내장기판 |
CN113498633B (zh) * | 2020-01-21 | 2023-09-15 | 鹏鼎控股(深圳)股份有限公司 | 内埋电子元件的电路板及制作方法 |
EP4156874A4 (de) | 2020-07-07 | 2024-02-14 | Shennan Circuits Co., Ltd. | Leiterplatte und herstellungsverfahren dafür |
TWI777741B (zh) * | 2021-08-23 | 2022-09-11 | 欣興電子股份有限公司 | 內埋元件基板及其製作方法 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60116191A (ja) * | 1983-11-29 | 1985-06-22 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
JPS60137092A (ja) * | 1983-12-19 | 1985-07-20 | 株式会社東芝 | 回路基板の製造方法 |
JPH01251778A (ja) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | Icカード |
JPH02150098A (ja) | 1988-12-01 | 1990-06-08 | Japan Radio Co Ltd | 多層混成集積回路 |
JPH03191596A (ja) | 1989-12-21 | 1991-08-21 | Nippon Cement Co Ltd | コンデンサ内蔵多層セラミック基板の製造方法 |
US5161093A (en) * | 1990-07-02 | 1992-11-03 | General Electric Company | Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive |
JPH04163988A (ja) * | 1990-10-29 | 1992-06-09 | Toshiba Corp | 電池内装型プリント配線板 |
JP2816028B2 (ja) * | 1991-02-18 | 1998-10-27 | 株式会社東芝 | 半導体装置の製造方法 |
JPH06120670A (ja) | 1991-03-12 | 1994-04-28 | Japan Radio Co Ltd | 多層配線基板 |
JPH04356998A (ja) | 1991-06-01 | 1992-12-10 | Ibiden Co Ltd | マルチチップモジュール |
US5336928A (en) * | 1992-09-18 | 1994-08-09 | General Electric Company | Hermetically sealed packaged electronic system |
EP0644587B1 (de) * | 1993-09-01 | 2002-07-24 | Kabushiki Kaisha Toshiba | Halbleiteraufbau und Verfahren zur Herstellung |
JPH07263867A (ja) | 1994-03-18 | 1995-10-13 | Fujitsu General Ltd | 多層配線基板 |
US6031723A (en) * | 1994-08-18 | 2000-02-29 | Allen-Bradley Company, Llc | Insulated surface mount circuit board construction |
KR0172779B1 (ko) * | 1995-03-29 | 1999-03-20 | 김주용 | 감광막 제거 방법 |
JP3610999B2 (ja) * | 1996-06-07 | 2005-01-19 | 松下電器産業株式会社 | 半導体素子の実装方法 |
TW383435B (en) * | 1996-11-01 | 2000-03-01 | Hitachi Chemical Co Ltd | Electronic device |
US5808873A (en) * | 1997-05-30 | 1998-09-15 | Motorola, Inc. | Electronic component assembly having an encapsulation material and method of forming the same |
JPH11126978A (ja) | 1997-10-24 | 1999-05-11 | Kyocera Corp | 多層配線基板 |
JPH11145381A (ja) | 1997-11-12 | 1999-05-28 | Denso Corp | 半導体マルチチップモジュール |
US6038133A (en) * | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
JP2000208698A (ja) | 1999-01-18 | 2000-07-28 | Toshiba Corp | 半導体装置 |
KR100563122B1 (ko) * | 1998-01-30 | 2006-03-21 | 다이요 유덴 가부시키가이샤 | 하이브리드 모듈 및 그 제조방법 및 그 설치방법 |
JPH11233904A (ja) * | 1998-02-18 | 1999-08-27 | Nec Corp | 放熱構造プリント基板 |
JP3236818B2 (ja) | 1998-04-28 | 2001-12-10 | 京セラ株式会社 | 素子内蔵多層配線基板の製造方法 |
US6180881B1 (en) | 1998-05-05 | 2001-01-30 | Harlan Ruben Isaak | Chip stack and method of making same |
JP3119630B2 (ja) * | 1998-09-18 | 2000-12-25 | 日本電気株式会社 | 半導体チップモジュール用多層回路基板およびその製造方法 |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
JP2000151112A (ja) * | 1998-11-10 | 2000-05-30 | Toshiba Corp | 配線基板及びその製造方法 |
JP3207174B2 (ja) | 1999-02-01 | 2001-09-10 | 京セラ株式会社 | 電気素子搭載配線基板およびその製造方法 |
JP3213292B2 (ja) * | 1999-07-12 | 2001-10-02 | ソニーケミカル株式会社 | 多層基板、及びモジュール |
US6449836B1 (en) * | 1999-07-30 | 2002-09-17 | Denso Corporation | Method for interconnecting printed circuit boards and interconnection structure |
JP3619395B2 (ja) * | 1999-07-30 | 2005-02-09 | 京セラ株式会社 | 半導体素子内蔵配線基板およびその製造方法 |
TW472330B (en) | 1999-08-26 | 2002-01-11 | Toshiba Corp | Semiconductor device and the manufacturing method thereof |
JP2001119147A (ja) | 1999-10-14 | 2001-04-27 | Sony Corp | 電子部品内蔵多層基板及びその製造方法 |
JP2001251056A (ja) * | 2000-03-03 | 2001-09-14 | Sony Corp | プリント配線基板の製造方法 |
US6292366B1 (en) | 2000-06-26 | 2001-09-18 | Intel Corporation | Printed circuit board with embedded integrated circuit |
TW511415B (en) * | 2001-01-19 | 2002-11-21 | Matsushita Electric Ind Co Ltd | Component built-in module and its manufacturing method |
US6621012B2 (en) * | 2001-02-01 | 2003-09-16 | International Business Machines Corporation | Insertion of electrical component within a via of a printed circuit board |
US6512182B2 (en) * | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
KR100488412B1 (ko) * | 2001-06-13 | 2005-05-11 | 가부시키가이샤 덴소 | 내장된 전기소자를 갖는 인쇄 배선 기판 및 그 제조 방법 |
-
2002
- 2002-06-12 KR KR10-2002-0032880A patent/KR100488412B1/ko not_active IP Right Cessation
- 2002-06-12 US US10/166,731 patent/US6680441B2/en not_active Expired - Lifetime
- 2002-06-12 MX MXPA02005829A patent/MXPA02005829A/es active IP Right Grant
- 2002-06-13 EP EP02013103A patent/EP1267597B1/de not_active Expired - Lifetime
- 2002-06-13 DE DE60224611T patent/DE60224611T2/de not_active Expired - Lifetime
- 2002-06-13 SG SG200203488A patent/SG102054A1/en unknown
- 2002-06-13 TW TW091112932A patent/TW545100B/zh not_active IP Right Cessation
- 2002-06-13 CN CNB021230196A patent/CN100475003C/zh not_active Expired - Fee Related
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2003
- 2003-11-06 US US10/701,441 patent/US7165321B2/en not_active Expired - Fee Related
Also Published As
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CN1391432A (zh) | 2003-01-15 |
EP1267597B1 (de) | 2008-01-16 |
MXPA02005829A (es) | 2004-12-13 |
SG102054A1 (en) | 2004-02-27 |
EP1267597A2 (de) | 2002-12-18 |
US20040091687A1 (en) | 2004-05-13 |
EP1267597A3 (de) | 2004-10-13 |
KR100488412B1 (ko) | 2005-05-11 |
TW545100B (en) | 2003-08-01 |
US20020192442A1 (en) | 2002-12-19 |
DE60224611T2 (de) | 2009-01-15 |
KR20020094922A (ko) | 2002-12-18 |
US7165321B2 (en) | 2007-01-23 |
US6680441B2 (en) | 2004-01-20 |
CN100475003C (zh) | 2009-04-01 |
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