DE69607546D1 - Verfahren zur Herstellung einer Schaltungsanordnung - Google Patents
Verfahren zur Herstellung einer SchaltungsanordnungInfo
- Publication number
- DE69607546D1 DE69607546D1 DE69607546T DE69607546T DE69607546D1 DE 69607546 D1 DE69607546 D1 DE 69607546D1 DE 69607546 T DE69607546 T DE 69607546T DE 69607546 T DE69607546 T DE 69607546T DE 69607546 D1 DE69607546 D1 DE 69607546D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- circuit arrangement
- arrangement
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/524,498 US5607538A (en) | 1995-09-07 | 1995-09-07 | Method of manufacturing a circuit assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69607546D1 true DE69607546D1 (de) | 2000-05-11 |
DE69607546T2 DE69607546T2 (de) | 2000-08-24 |
Family
ID=24089459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69607546T Expired - Fee Related DE69607546T2 (de) | 1995-09-07 | 1996-08-19 | Verfahren zur Herstellung einer Schaltungsanordnung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5607538A (de) |
EP (1) | EP0762820B1 (de) |
DE (1) | DE69607546T2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5777846A (en) * | 1996-05-30 | 1998-07-07 | Northern Telecom Limited | Circuit packs and circuit pack and shelf assemblies |
US6129260A (en) * | 1998-08-19 | 2000-10-10 | Fravillig Technologies Company | Solderable structures |
US6323060B1 (en) | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
FR2802763A1 (fr) * | 1999-12-17 | 2001-06-22 | Thomson Csf | Procede d'assemblage de structures multicouches hyperfrequence, comprenant des circuits electroniques, notamment pour panneaux actifs |
KR100385399B1 (ko) * | 2000-04-19 | 2003-05-23 | 삼성전자주식회사 | 반도체 소자 검사용 기판과 그 기판을 포함하는 반도체소자 검사 장치 |
US6404043B1 (en) * | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
DE10109083B4 (de) * | 2001-02-24 | 2006-07-13 | Conti Temic Microelectronic Gmbh | Elektronische Baugruppe |
US20030002267A1 (en) * | 2001-06-15 | 2003-01-02 | Mantz Frank E. | I/O interface structure |
US20020190367A1 (en) * | 2001-06-15 | 2002-12-19 | Mantz Frank E. | Slice interconnect structure |
US6573460B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Post in ring interconnect using for 3-D stacking |
US6573461B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Retaining ring interconnect used for 3-D stacking |
US6856010B2 (en) * | 2002-12-05 | 2005-02-15 | Staktek Group L.P. | Thin scale outline package |
DE10259770A1 (de) * | 2002-12-19 | 2004-07-15 | Linos Photonics Gmbh & Co. Kg | Pockelszelle |
US20040207990A1 (en) * | 2003-04-21 | 2004-10-21 | Rose Andrew C. | Stair-step signal routing |
US7446924B2 (en) * | 2003-10-02 | 2008-11-04 | Donnelly Corporation | Mirror reflective element assembly including electronic component |
US7164587B1 (en) * | 2004-01-14 | 2007-01-16 | Sun Microsystems, Inc. | Integral heatsink grounding arrangement |
DE102004040591A1 (de) * | 2004-08-21 | 2006-02-23 | Robert Bosch Gmbh | Elektrische Vorrichtung |
TWI255684B (en) * | 2004-08-26 | 2006-05-21 | Asustek Comp Inc | Auxiliary supporting structure of circuit board and assembling method for the same |
US7400435B2 (en) | 2005-01-19 | 2008-07-15 | Donnelly Corporation | Mirror assembly with heater element |
US7242593B2 (en) * | 2005-07-08 | 2007-07-10 | Ims Inc. | Thermally efficient motor housing assembly |
US7195145B2 (en) * | 2005-07-13 | 2007-03-27 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
DE102005047547B4 (de) * | 2005-09-30 | 2008-02-14 | Siemens Ag | Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul |
DE102008029410A1 (de) * | 2008-06-23 | 2009-12-24 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | Vorrichtung, insbesondere zur Stromleitung, und ein Verfahren zur Herstellung einer Vorrichtung, insbesondere zur Stromleitung |
US9481304B2 (en) | 2010-05-24 | 2016-11-01 | Magna Mirrors Of America, Inc. | Automotive exterior mirror heater control |
US9776569B2 (en) | 2015-01-30 | 2017-10-03 | Magna Mirrors Of America, Inc. | Exterior mirror with heater pad |
US10962422B2 (en) * | 2018-09-05 | 2021-03-30 | Hamilton Sundstrand Corporation | Differential and high rate of change temperature sensing circuit |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4325771A (en) * | 1980-03-19 | 1982-04-20 | Gte Products Corporation | Method of making a die-stamped circuit board assembly for photoflash devices |
US4935090A (en) * | 1981-09-03 | 1990-06-19 | Gte Products Corporation | Photoflash array quick-cure laminating process |
US4612601A (en) * | 1983-11-30 | 1986-09-16 | Nec Corporation | Heat dissipative integrated circuit chip package |
US4935086A (en) * | 1986-01-13 | 1990-06-19 | Raytheon Company | Process of bonding an electrical device package to a mounting surface |
US4706166A (en) * | 1986-04-25 | 1987-11-10 | Irvine Sensors Corporation | High-density electronic modules--process and product |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
US4818823A (en) * | 1987-07-06 | 1989-04-04 | Micro-Circuits, Inc. | Adhesive component means for attaching electrical components to conductors |
JPS6476799A (en) * | 1987-09-17 | 1989-03-22 | Fujitsu Ltd | Method of controlling packaging thickness of heat conductive adhesive |
US5010444A (en) * | 1987-11-13 | 1991-04-23 | Radstone Technology Limited | Rack mounted circuit board |
US5195021A (en) * | 1989-08-21 | 1993-03-16 | Texas Instruments Incorporated | Constraining core for surface mount technology |
GB2236213A (en) * | 1989-09-09 | 1991-03-27 | Ibm | Integral protective enclosure for an assembly mounted on a flexible printed circuit board |
US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
US5051645A (en) * | 1990-01-30 | 1991-09-24 | Johnson Service Company | Acoustic wave H2 O phase-change sensor capable of self-cleaning and distinguishing air, water, dew, frost and ice |
US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
US5173839A (en) * | 1990-12-10 | 1992-12-22 | Grumman Aerospace Corporation | Heat-dissipating method and device for led display |
DE4102265A1 (de) * | 1991-01-26 | 1992-07-30 | Telefunken Electronic Gmbh | Gehaeuse kfz-elektronik |
US5141050A (en) * | 1991-07-31 | 1992-08-25 | Tra-Con, Inc. | Controlled highly densified diamond packing of thermally conductive electrically resistive conduit |
JPH0548000A (ja) * | 1991-08-13 | 1993-02-26 | Fujitsu Ltd | 半導体装置 |
US5172301A (en) * | 1991-10-08 | 1992-12-15 | Lsi Logic Corporation | Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
US5172755A (en) * | 1992-04-01 | 1992-12-22 | Digital Equipment Corporation | Arcuate profiled heatsink apparatus and method |
US5308429A (en) * | 1992-09-29 | 1994-05-03 | Digital Equipment Corporation | System for bonding a heatsink to a semiconductor chip package |
US5280409A (en) * | 1992-10-09 | 1994-01-18 | Sun Microsystems, Inc. | Heat sink and cover for tab integrated circuits |
US5268048A (en) * | 1992-12-10 | 1993-12-07 | Hewlett-Packard Company | Reworkable die attachment |
US5291062A (en) * | 1993-03-01 | 1994-03-01 | Motorola, Inc. | Area array semiconductor device having a lid with functional contacts |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
US5410451A (en) * | 1993-12-20 | 1995-04-25 | Lsi Logic Corporation | Location and standoff pins for chip on tape |
US5504653A (en) * | 1994-11-21 | 1996-04-02 | Delco Electronics Corp. | Heat sinking assembly for electrical components |
-
1995
- 1995-09-07 US US08/524,498 patent/US5607538A/en not_active Expired - Fee Related
-
1996
- 1996-08-19 DE DE69607546T patent/DE69607546T2/de not_active Expired - Fee Related
- 1996-08-19 EP EP96306031A patent/EP0762820B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0762820A2 (de) | 1997-03-12 |
DE69607546T2 (de) | 2000-08-24 |
US5607538A (en) | 1997-03-04 |
EP0762820B1 (de) | 2000-04-05 |
EP0762820A3 (de) | 1998-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |