DE68920383D1 - Verfahren zur Herstellung einer gedruckten Mehrschichtleiterplatte. - Google Patents

Verfahren zur Herstellung einer gedruckten Mehrschichtleiterplatte.

Info

Publication number
DE68920383D1
DE68920383D1 DE68920383T DE68920383T DE68920383D1 DE 68920383 D1 DE68920383 D1 DE 68920383D1 DE 68920383 T DE68920383 T DE 68920383T DE 68920383 T DE68920383 T DE 68920383T DE 68920383 D1 DE68920383 D1 DE 68920383D1
Authority
DE
Germany
Prior art keywords
producing
circuit board
printed circuit
multilayer printed
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920383T
Other languages
English (en)
Other versions
DE68920383T2 (de
Inventor
Yasuo Mitsubishi Gas Ch Tanaka
Naohito Mitsubishi G Yoshimura
Koichi Mitsubishi Gas C Nakano
Touro Mitsubishi Gas C Nohtomi
Morio Mitsubishi Gas Chem Gaku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63221373A external-priority patent/JPH0271586A/ja
Priority claimed from JP63221374A external-priority patent/JPH0271587A/ja
Priority claimed from JP63282364A external-priority patent/JPH02129996A/ja
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE68920383D1 publication Critical patent/DE68920383D1/de
Publication of DE68920383T2 publication Critical patent/DE68920383T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE68920383T 1988-09-06 1989-09-06 Verfahren zur Herstellung einer gedruckten Mehrschichtleiterplatte. Expired - Fee Related DE68920383T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63221373A JPH0271586A (ja) 1988-09-06 1988-09-06 多層プリント板の製造法
JP63221374A JPH0271587A (ja) 1988-09-06 1988-09-06 多層プリント板の製造法
JP63282364A JPH02129996A (ja) 1988-11-10 1988-11-10 多層プリント板の製造法

Publications (2)

Publication Number Publication Date
DE68920383D1 true DE68920383D1 (de) 1995-02-16
DE68920383T2 DE68920383T2 (de) 1995-06-01

Family

ID=27330542

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920383T Expired - Fee Related DE68920383T2 (de) 1988-09-06 1989-09-06 Verfahren zur Herstellung einer gedruckten Mehrschichtleiterplatte.

Country Status (5)

Country Link
US (1) US5076864A (de)
EP (1) EP0358480B1 (de)
KR (1) KR970004029B1 (de)
DE (1) DE68920383T2 (de)
MY (1) MY104191A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0469470B1 (de) * 1990-07-30 1996-10-09 Mitsubishi Gas Chemical Company, Inc. Verfahren zur Herstellung von Mehrschichtplatinen
EP0488299B1 (de) * 1990-11-30 1995-08-16 Toppan Printing Co., Ltd. Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine
US5289630A (en) * 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
US5286530A (en) * 1993-01-13 1994-02-15 General Electric Company Method for providing adherent metal coatings on cyanate ester polymer surfaces
JP2694802B2 (ja) * 1993-12-28 1997-12-24 日本電気株式会社 プリント配線板の製造方法
CN100475005C (zh) 1998-02-26 2009-04-01 揖斐电株式会社 具有充填导电孔构造的多层印刷布线板
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
JP3067021B2 (ja) * 1998-09-18 2000-07-17 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 両面配線基板の製造方法
JP4287622B2 (ja) * 2002-06-28 2009-07-01 デュポン帝人アドバンスドペーパー株式会社 コーティングセパレータ、その製造方法およびそれを用いた電気電子部品
US6986023B2 (en) * 2002-08-09 2006-01-10 Intel Corporation Conditional execution of coprocessor instruction based on main processor arithmetic flags
TW573327B (en) * 2002-12-27 2004-01-21 Ultratera Corp Plasma etching method
JP4784066B2 (ja) * 2004-10-28 2011-09-28 三菱瓦斯化学株式会社 樹脂組成物及び銅張積層板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4717439A (en) * 1985-10-24 1988-01-05 Enthone, Incorporated Process for the treatment of copper oxide in the preparation of printed circuit boards
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards

Also Published As

Publication number Publication date
EP0358480A3 (de) 1991-04-10
KR970004029B1 (ko) 1997-03-24
EP0358480A2 (de) 1990-03-14
DE68920383T2 (de) 1995-06-01
KR900005860A (ko) 1990-04-14
US5076864A (en) 1991-12-31
MY104191A (en) 1994-02-28
EP0358480B1 (de) 1995-01-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee