DE3575512D1 - Verfahren zur herstellung einer keramischen leiterplatte. - Google Patents

Verfahren zur herstellung einer keramischen leiterplatte.

Info

Publication number
DE3575512D1
DE3575512D1 DE8585303570T DE3575512T DE3575512D1 DE 3575512 D1 DE3575512 D1 DE 3575512D1 DE 8585303570 T DE8585303570 T DE 8585303570T DE 3575512 T DE3575512 T DE 3575512T DE 3575512 D1 DE3575512 D1 DE 3575512D1
Authority
DE
Germany
Prior art keywords
producing
circuit board
ceramic circuit
ceramic
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585303570T
Other languages
English (en)
Inventor
Yukihisa Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE3575512D1 publication Critical patent/DE3575512D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • C04B35/634Polymers
    • C04B35/63404Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/63408Polyalkenes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/1017Multiple heating or additional steps
    • B22F3/1021Removal of binder or filler
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • C04B35/634Polymers
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • C04B35/634Polymers
    • C04B35/63404Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/63416Polyvinylalcohols [PVA]; Polyvinylacetates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • C04B35/634Polymers
    • C04B35/63404Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/63424Polyacrylates; Polymethacrylates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • C04B35/634Polymers
    • C04B35/63404Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/63432Polystyrenes
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638Removal thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5144Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the metals of the iron group
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5188Metallising, e.g. infiltration of sintered ceramic preforms with molten metal organic
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8585303570T 1984-05-25 1985-05-21 Verfahren zur herstellung einer keramischen leiterplatte. Expired - Lifetime DE3575512D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59107083A JPS60250686A (ja) 1984-05-25 1984-05-25 セラミツク配線基板の製造方法

Publications (1)

Publication Number Publication Date
DE3575512D1 true DE3575512D1 (de) 1990-02-22

Family

ID=14450042

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585303570T Expired - Lifetime DE3575512D1 (de) 1984-05-25 1985-05-21 Verfahren zur herstellung einer keramischen leiterplatte.

Country Status (4)

Country Link
US (1) US4551357A (de)
EP (1) EP0163478B1 (de)
JP (1) JPS60250686A (de)
DE (1) DE3575512D1 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221358A (ja) * 1984-04-13 1985-11-06 日本碍子株式会社 電気絶縁体用セラミック組成物
US4657778A (en) * 1984-08-01 1987-04-14 Moran Peter L Multilayer systems and their method of production
JPS6229194A (ja) * 1985-07-29 1987-02-07 株式会社東芝 厚膜基板装置
US4627160A (en) * 1985-08-02 1986-12-09 International Business Machines Corporation Method for removal of carbonaceous residues from ceramic structures having internal metallurgy
JPS6248097A (ja) * 1985-08-28 1987-03-02 日本特殊陶業株式会社 多層回路基板の製造法
JPS6287456A (ja) * 1985-10-11 1987-04-21 日本碍子株式会社 誘電体磁器用セラミツク組成物
GB8526397D0 (en) * 1985-10-25 1985-11-27 Oxley Dev Co Ltd Metallising paste
US4622240A (en) * 1985-11-12 1986-11-11 Air Products And Chemicals, Inc. Process for manufacturing thick-film electrical components
US4619836A (en) * 1985-12-31 1986-10-28 Rca Corporation Method of fabricating thick film electrical components
JPH0632355B2 (ja) * 1986-01-27 1994-04-27 株式会社日立製作所 セラミツク配線基板とその製造方法
US4795512A (en) * 1986-02-26 1989-01-03 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a multilayer ceramic body
US4885038A (en) * 1986-05-01 1989-12-05 International Business Machines Corporation Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
US4808770A (en) * 1986-10-02 1989-02-28 General Electric Company Thick-film copper conductor inks
US4830988A (en) * 1986-10-02 1989-05-16 General Electric Company Dielectric inks for multilayer copper circuits
US4766027A (en) * 1987-01-13 1988-08-23 E. I. Du Pont De Nemours And Company Method for making a ceramic multilayer structure having internal copper conductors
US4879261A (en) * 1987-01-13 1989-11-07 E. I. Du Pont De Nemours And Company Low Dielectric constant compositions
US4778549A (en) * 1987-04-13 1988-10-18 Corning Glass Works Catalysts for accelerating burnout or organic materials
US5062891A (en) * 1987-08-13 1991-11-05 Ceramics Process Systems Corporation Metallic inks for co-sintering process
AU2170688A (en) * 1987-09-04 1989-03-09 W.R. Grace & Co.-Conn. Method and composition for forming superconducting ceramics and other ceramic materials with reduced electrical resistivity and electrically conductive metal-clad products therefrom
CA1306903C (en) * 1987-09-24 1992-09-01 Edward A. Hayduk, Jr. Process for the manufacture of copper thick-film conductors using aninfrared furnace
FR2626270B1 (fr) * 1988-01-22 1992-04-30 Pechiney Recherche Procede de cofrittage, de conducteurs en cuivre ou en alliages a base de cuivre et de leur substrat ceramique en cordierite
US4884788A (en) * 1988-04-12 1989-12-05 Union Carbide Corporation Boron nitride containing vessel having a surface coating of titanium iron-silicon thereon
US5202154A (en) * 1988-09-19 1993-04-13 Ngk Spark Plug Co., Ltd. Method of producing thick-film gas sensor element having improved stability
US5194294A (en) * 1989-02-20 1993-03-16 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits
FR2643535B1 (fr) * 1989-02-20 1991-04-26 Air Liquide Procede d'elaboration de moyens de connexion electrique, en particulier de substrats d'interconnexion de circuits hybrides
DE3913161A1 (de) * 1989-04-21 1990-10-31 Schulz Harder Juergen Aus kupfer- und keramikschichten bestehendes mehrschichtiges substrat fuer leiterplatten elektrischer schaltungen
DE69022668T2 (de) * 1989-06-16 1996-05-23 Matsushita Electric Ind Co Ltd Elektronische Verbindungen, Verfahren zur Bildung von Endverbindern dafür und Paste zur Ausbildung derselben.
DE69201714T2 (de) * 1991-11-14 1995-10-05 Du Pont Lichtabsorbierende, dielektrische Zusammensetzungen.
US6004705A (en) * 1992-07-07 1999-12-21 Toray Industries, Inc. Photosensitive ceramics green sheet
EP0602252B1 (de) * 1992-07-07 2000-08-30 Toray Industries, Inc. Keramische grünfolie
JPH06169174A (ja) * 1992-08-17 1994-06-14 Praxair Technol Inc 多層セラミック構造物からのバインダー除去
US5925444A (en) * 1992-12-09 1999-07-20 Hitachi, Ltd. Organic binder for shaping ceramic, its production method and product employing the same
US6323549B1 (en) * 1996-08-29 2001-11-27 L. Pierre deRochemont Ceramic composite wiring structures for semiconductor devices and method of manufacture
DE69818485T2 (de) 1997-08-14 2004-07-22 Kodak Polychrome Graphics Co. Ltd., Norwalk Verfahren zur herstellung von elektronischen bauteilen
US6592696B1 (en) * 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
US6572830B1 (en) 1998-10-09 2003-06-03 Motorola, Inc. Integrated multilayered microfludic devices and methods for making the same
JP3767362B2 (ja) 1999-12-13 2006-04-19 株式会社村田製作所 積層型セラミック電子部品の製造方法
GB2370569B (en) * 1999-12-13 2003-03-05 Murata Manufacturing Co Monolithic ceramic electronic component and production process therefor
TW507484B (en) * 2000-03-15 2002-10-21 Matsushita Electric Ind Co Ltd Method of manufacturing multi-layer ceramic circuit board and conductive paste used for the same
JP2003002750A (ja) * 2001-06-21 2003-01-08 Sumitomo Metal Electronics Devices Inc 低温焼成セラミック基板の製造方法
JP4223848B2 (ja) * 2003-03-24 2009-02-12 Tdk株式会社 導電性組成物の製造方法、および導電ペーストの製造方法
US8076587B2 (en) * 2008-09-26 2011-12-13 Siemens Energy, Inc. Printed circuit board for harsh environments
US20120217233A1 (en) * 2011-02-28 2012-08-30 Tom Richards, Inc. Ptc controlled environment heater
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
US9865501B2 (en) 2013-03-06 2018-01-09 Lam Research Corporation Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US20160111342A1 (en) * 2014-10-17 2016-04-21 Lam Research Corporation Method and apparatus for characterizing metal oxide reduction
US10443146B2 (en) 2017-03-30 2019-10-15 Lam Research Corporation Monitoring surface oxide on seed layers during electroplating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661615A (en) * 1969-03-11 1972-05-09 Owens Illinois Inc Substrate coating process
US4079156A (en) * 1975-03-07 1978-03-14 Uop Inc. Conductive metal pigments
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
US4341820A (en) * 1976-10-13 1982-07-27 Owens-Illinois, Inc. Composition of matter
DE2814770C2 (de) * 1978-04-05 1983-07-14 UOP Inc., 60016 Des Plaines, Ill. Verfahren zur Erzeugung von auf ein Substrat aufgebrachten und leitfähige Pigmente enthaltenden Schichten
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
US4388347A (en) * 1980-11-11 1983-06-14 Uop Inc. Conductive pigment-coated surfaces

Also Published As

Publication number Publication date
US4551357A (en) 1985-11-05
EP0163478B1 (de) 1990-01-17
EP0163478A3 (en) 1987-06-24
JPH0222550B2 (de) 1990-05-18
JPS60250686A (ja) 1985-12-11
EP0163478A2 (de) 1985-12-04

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