FR2652703B1 - Procede de montage d'un composant electronique sur une carte de circuit imprime. - Google Patents

Procede de montage d'un composant electronique sur une carte de circuit imprime.

Info

Publication number
FR2652703B1
FR2652703B1 FR9012064A FR9012064A FR2652703B1 FR 2652703 B1 FR2652703 B1 FR 2652703B1 FR 9012064 A FR9012064 A FR 9012064A FR 9012064 A FR9012064 A FR 9012064A FR 2652703 B1 FR2652703 B1 FR 2652703B1
Authority
FR
France
Prior art keywords
mounting
circuit board
printed circuit
electronic component
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9012064A
Other languages
English (en)
Other versions
FR2652703A1 (fr
Inventor
Yoshio Zenshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2652703A1 publication Critical patent/FR2652703A1/fr
Application granted granted Critical
Publication of FR2652703B1 publication Critical patent/FR2652703B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR9012064A 1989-10-03 1990-10-01 Procede de montage d'un composant electronique sur une carte de circuit imprime. Expired - Fee Related FR2652703B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1259284A JPH03120789A (ja) 1989-10-03 1989-10-03 プリント配線板への電子部品取付法

Publications (2)

Publication Number Publication Date
FR2652703A1 FR2652703A1 (fr) 1991-04-05
FR2652703B1 true FR2652703B1 (fr) 1993-07-09

Family

ID=17331949

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9012064A Expired - Fee Related FR2652703B1 (fr) 1989-10-03 1990-10-01 Procede de montage d'un composant electronique sur une carte de circuit imprime.

Country Status (3)

Country Link
US (1) US5180097A (fr)
JP (1) JPH03120789A (fr)
FR (1) FR2652703B1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283587A (ja) * 1992-03-30 1993-10-29 Sony Corp 多リード素子の半田付方法
JPH06177526A (ja) * 1992-12-09 1994-06-24 Toyota Autom Loom Works Ltd 接合剤の印刷方法
US5282565A (en) * 1992-12-29 1994-02-01 Motorola, Inc. Solder bump interconnection formed using spaced solder deposit and consumable path
GB9302228D0 (en) * 1993-02-05 1993-03-24 Ncr Int Inc Method of forming discrete solder portions on respective contact pads of a printed circuit board
US5362985A (en) * 1993-05-27 1994-11-08 Ma Laboratories, Inc. Packaged integrated circuit add-on card and method of manufacture
US5358169A (en) * 1994-01-14 1994-10-25 Caddock Electronics, Inc. Method of soldering leads to electrical components
US5647124A (en) * 1994-04-25 1997-07-15 Texas Instruments Incorporated Method of attachment of a semiconductor slotted lead to a substrate
US6412768B1 (en) * 1999-09-01 2002-07-02 Micron Technology, Inc. Self-adjusting printed circuit board support and method of use
JP4449907B2 (ja) 2003-12-15 2010-04-14 日本電気株式会社 二次電池用電解液およびそれを用いた二次電池
CN104684250A (zh) * 2013-11-27 2015-06-03 广东美的制冷设备有限公司 印制电路板的集成电路芯片封装结构及封装设计方法
AT516750B1 (de) * 2014-12-18 2016-08-15 Zizala Lichtsysteme Gmbh Verfahren zur Voidreduktion in Lötstellen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1331980A (en) * 1970-12-15 1973-09-26 Mullard Ltd Mounting semiconductor bodies
JPS55103276A (en) * 1979-01-30 1980-08-07 Fujitsu Ltd Brazing method by dissimilar diameter wire shaped braze material
DE2924592C2 (de) * 1979-06-19 1983-05-26 Süddeutsche Kühlerfabrik Julius Fr. Behr GmbH & Co KG, 7000 Stuttgart Verfahren zum Herstellen einer Trägermatrix für einen katalytischen Reaktor zur Abgasreinigung bei Brennkraftmaschinen von Kraftfahrzeugen
JPS56165582A (en) * 1980-05-26 1981-12-19 Agency Of Ind Science & Technol Method for joining of porous body and ingot body
US4428523A (en) * 1980-12-12 1984-01-31 United Technologies Corporation Metallic solder composite bonding
GB2148584B (en) * 1983-08-02 1987-07-15 Atomic Energy Authority Uk Waste material particularly radioactive waste material
JPS61129281A (ja) * 1984-11-29 1986-06-17 Nec Corp ペ−スト半田の供給装置
US4607782A (en) * 1985-05-24 1986-08-26 Contact Systems, Inc. Method and apparatus for soldering electrical components to circuit boards
JPS63124496A (ja) * 1986-11-13 1988-05-27 株式会社日立製作所 多端子部品の取付方法
JPS63202989A (ja) * 1987-02-19 1988-08-22 株式会社日立製作所 半田付け方法

Also Published As

Publication number Publication date
JPH03120789A (ja) 1991-05-22
US5180097A (en) 1993-01-19
FR2652703A1 (fr) 1991-04-05

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Legal Events

Date Code Title Description
D6 Patent endorsed licences of rights
ST Notification of lapse