FR2595899B1 - Procede pour monter des composants electroniques en des endroits determines sur une plaquette de circuit imprime - Google Patents

Procede pour monter des composants electroniques en des endroits determines sur une plaquette de circuit imprime

Info

Publication number
FR2595899B1
FR2595899B1 FR8603739A FR8603739A FR2595899B1 FR 2595899 B1 FR2595899 B1 FR 2595899B1 FR 8603739 A FR8603739 A FR 8603739A FR 8603739 A FR8603739 A FR 8603739A FR 2595899 B1 FR2595899 B1 FR 2595899B1
Authority
FR
France
Prior art keywords
circuit board
printed circuit
electronic components
mounting electronic
specified locations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8603739A
Other languages
English (en)
Other versions
FR2595899A1 (fr
Inventor
Shigeru Kubota
Shoji Kanou
Masahiro Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Kogyo Co Ltd
Original Assignee
Nitto Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US06/834,924 priority Critical patent/US4670981A/en
Priority to DE19863607242 priority patent/DE3607242A1/de
Priority to GB08606319A priority patent/GB2187707B/en
Application filed by Nitto Kogyo Co Ltd filed Critical Nitto Kogyo Co Ltd
Priority to FR8603739A priority patent/FR2595899B1/fr
Publication of FR2595899A1 publication Critical patent/FR2595899A1/fr
Application granted granted Critical
Publication of FR2595899B1 publication Critical patent/FR2595899B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
FR8603739A 1986-03-14 1986-03-17 Procede pour monter des composants electroniques en des endroits determines sur une plaquette de circuit imprime Expired FR2595899B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US06/834,924 US4670981A (en) 1986-03-17 1986-02-28 Method of mounting electronic parts on the predetermined positions of a printed circuit board
DE19863607242 DE3607242A1 (de) 1986-03-17 1986-03-05 Verfahren zum anbringen von elektronischen bauteilen an vorgegebenen stellen einer gedruckten schaltungsplatte
GB08606319A GB2187707B (en) 1986-03-14 1986-03-14 Method of placing an article
FR8603739A FR2595899B1 (fr) 1986-03-17 1986-03-17 Procede pour monter des composants electroniques en des endroits determines sur une plaquette de circuit imprime

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8603739A FR2595899B1 (fr) 1986-03-17 1986-03-17 Procede pour monter des composants electroniques en des endroits determines sur une plaquette de circuit imprime

Publications (2)

Publication Number Publication Date
FR2595899A1 FR2595899A1 (fr) 1987-09-18
FR2595899B1 true FR2595899B1 (fr) 1989-11-17

Family

ID=9333167

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8603739A Expired FR2595899B1 (fr) 1986-03-14 1986-03-17 Procede pour monter des composants electroniques en des endroits determines sur une plaquette de circuit imprime

Country Status (3)

Country Link
US (1) US4670981A (fr)
DE (1) DE3607242A1 (fr)
FR (1) FR2595899B1 (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62130596A (ja) * 1985-12-02 1987-06-12 三菱電機株式会社 電子部品自動組立装置
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
US4875279A (en) * 1987-08-21 1989-10-24 E. I. Du Pont De Nemours And Company Die attach pickup tools
US4868974A (en) * 1987-09-01 1989-09-26 Sumitomo Electric Industries, Ltd. Chip mounting apparatus
KR920002278B1 (ko) * 1988-02-15 1992-03-20 다이요유덴 가부시끼가이샤 리드선이 없는 회로부품의 장착장치
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
US5034802A (en) * 1989-12-11 1991-07-23 Hewlett-Packard Company Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates
US5035062A (en) * 1990-04-06 1991-07-30 Intel Corporation Apparatus and method for aligning automated loading and unloading arms
US5042709A (en) * 1990-06-22 1991-08-27 International Business Machines Corporation Methods and apparatus for precise alignment of objects
US5222305A (en) * 1992-03-26 1993-06-29 Hughes Aircraft Company Method for specifying and verifying positive graphics pattern positions relative to non-plated tooling holes patterns on the same substrate
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5446960A (en) * 1994-02-15 1995-09-05 International Business Machines Corporation Alignment apparatus and method for placing modules on a circuit board
US5456018A (en) * 1994-02-28 1995-10-10 The Whitaker Corporation Alignment system for planar electronic devices arranged in parallel fashion
JP3222334B2 (ja) * 1994-10-19 2001-10-29 ヤマハ発動機株式会社 表面実装機における認識用ノズル高さ調整方法及び同装置
US5670009A (en) * 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
JP3618449B2 (ja) * 1996-03-14 2005-02-09 松下電器産業株式会社 プリント基板位置規正方法及び装置
US6026566A (en) * 1997-06-05 2000-02-22 Cooper Industries, Inc. Stenciling method and apparatus for PC board repair
US6047480A (en) * 1998-04-13 2000-04-11 Motorola, Inc. Method of processing a semiconductor device
DE19844662C2 (de) * 1998-09-29 2000-08-31 Siemens Ag Verfahren und Vorrichtung zum Zuführen von gegurteten Bauelementen
JP2001135995A (ja) * 1999-11-05 2001-05-18 Matsushita Electric Ind Co Ltd 部品実装装置及び方法
US6357131B1 (en) * 1999-12-20 2002-03-19 Taiwan Semiconductor Manufacturing Company Overlay reliability monitor
US20030106210A1 (en) * 2000-05-22 2003-06-12 Yoshiyuki Arai Chip-mounting device and method of alignment
US6545227B2 (en) 2001-07-11 2003-04-08 Mce/Kdi Corporation Pocket mounted chip having microstrip line
JP4341302B2 (ja) * 2003-06-09 2009-10-07 パナソニック株式会社 電子部品実装装置および電子部品実装方法
US8297472B2 (en) * 2010-11-24 2012-10-30 Texas Instruments Incorporated Pellet loader with pellet separator for molding IC devices
WO2018119867A1 (fr) * 2016-12-29 2018-07-05 深圳市柔宇科技有限公司 Écran d'affichage souple, et procédé et dispositif de détection de flexion d'écran d'affichage souple

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982979A (en) * 1973-06-28 1976-09-28 Western Electric Company, Inc. Methods for mounting an article on an adherent site on a substrate
US3868759A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Magnetic pre-alignment of semiconductor device chips for bonding
US3887997A (en) * 1973-11-09 1975-06-10 Gen Motors Corp Magnetic alignment for semiconductor device bonding
US4116348A (en) * 1976-07-19 1978-09-26 Deval Industries, Inc. Component locating apparatus
FR2440256A1 (fr) * 1978-10-31 1980-05-30 Sercel Rech Const Elect Ajustement automatique de la position d'une piece entre deux butees
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
US4451324A (en) * 1979-05-12 1984-05-29 Sony Corporation Apparatus for placing chip type circuit elements on a board
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
JPS5661194A (en) * 1979-10-25 1981-05-26 Hitachi Ltd Method of carrying chip element
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
NL8103574A (nl) * 1981-07-29 1983-02-16 Philips Nv Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.
DE3150945A1 (de) * 1981-12-23 1983-07-07 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum ueberbringen von anschlussbeinlosen bauelementen auf eine vorgesehene setzposition einer schaltungsplatine
DE3474750D1 (en) * 1983-11-05 1988-11-24 Zevatech Ag Method and device positioning elements on a work piece
US4610388A (en) * 1984-02-24 1986-09-09 Eldon Industries, Inc. Circuit board and component manipulation device

Also Published As

Publication number Publication date
US4670981A (en) 1987-06-09
FR2595899A1 (fr) 1987-09-18
DE3607242A1 (de) 1987-09-10

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Legal Events

Date Code Title Description
ST Notification of lapse