FR2599893B1 - Procede de montage d'un module electronique sur un substrat et carte a circuit integre - Google Patents

Procede de montage d'un module electronique sur un substrat et carte a circuit integre

Info

Publication number
FR2599893B1
FR2599893B1 FR8707247A FR8707247A FR2599893B1 FR 2599893 B1 FR2599893 B1 FR 2599893B1 FR 8707247 A FR8707247 A FR 8707247A FR 8707247 A FR8707247 A FR 8707247A FR 2599893 B1 FR2599893 B1 FR 2599893B1
Authority
FR
France
Prior art keywords
substrate
mounting
integrated circuit
electronic module
circuit card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8707247A
Other languages
English (en)
Other versions
FR2599893A1 (fr
Inventor
Shindo Toshikazu Yosh Masahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61119944A external-priority patent/JPS63260041A/ja
Priority claimed from JP61227395A external-priority patent/JPS6381095A/ja
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Publication of FR2599893A1 publication Critical patent/FR2599893A1/fr
Application granted granted Critical
Publication of FR2599893B1 publication Critical patent/FR2599893B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
FR8707247A 1986-05-23 1987-05-22 Procede de montage d'un module electronique sur un substrat et carte a circuit integre Expired - Fee Related FR2599893B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11994286 1986-05-23
JP61119944A JPS63260041A (ja) 1986-05-23 1986-05-23 集積回路装置の実装方法
JP61227395A JPS6381095A (ja) 1986-09-25 1986-09-25 Ｉｃチツプの実装方法

Publications (2)

Publication Number Publication Date
FR2599893A1 FR2599893A1 (fr) 1987-12-11
FR2599893B1 true FR2599893B1 (fr) 1996-08-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
FR8707247A Expired - Fee Related FR2599893B1 (fr) 1986-05-23 1987-05-22 Procede de montage d'un module electronique sur un substrat et carte a circuit integre

Country Status (2)

Country Link
US (1) US5048179A (fr)
FR (1) FR2599893B1 (fr)

Families Citing this family (119)

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US5192716A (en) * 1989-01-25 1993-03-09 Polylithics, Inc. Method of making a extended integration semiconductor structure
DE3917707A1 (de) * 1989-05-31 1990-12-06 Siemens Ag Elektronisches modul und verfahren zu seiner herstellung
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
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