DE9113601U1 - Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten - Google Patents
Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-KartenInfo
- Publication number
- DE9113601U1 DE9113601U1 DE9113601U DE9113601U DE9113601U1 DE 9113601 U1 DE9113601 U1 DE 9113601U1 DE 9113601 U DE9113601 U DE 9113601U DE 9113601 U DE9113601 U DE 9113601U DE 9113601 U1 DE9113601 U1 DE 9113601U1
- Authority
- DE
- Germany
- Prior art keywords
- chip card
- cover
- carrier substrate
- card according
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001681 protective effect Effects 0.000 title claims description 10
- 238000004377 microelectronic Methods 0.000 title description 2
- 239000002184 metal Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 6
- 230000002093 peripheral effect Effects 0.000 claims 2
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9113601U DE9113601U1 (de) | 1991-10-31 | 1991-10-31 | Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9113601U DE9113601U1 (de) | 1991-10-31 | 1991-10-31 | Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9113601U1 true DE9113601U1 (de) | 1993-03-04 |
Family
ID=6872842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9113601U Expired - Lifetime DE9113601U1 (de) | 1991-10-31 | 1991-10-31 | Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9113601U1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29516811U1 (de) * | 1995-10-25 | 1995-12-21 | Hornig, Wolfgang, Dr.-Ing., 90542 Eckental | Chipkarten aus Metall |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DE3124332A1 (de) * | 1980-07-09 | 1982-06-03 | Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven | "tragbares, aus mehreren schichten aufgebautes ausweiselement" |
DE8122540U1 (de) * | 1981-07-31 | 1983-01-13 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "informationskarte mit integriertem baustein" |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
US4552383A (en) * | 1981-12-24 | 1985-11-12 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Identification card having an IC module |
DE2659573C2 (de) * | 1975-12-31 | 1986-02-27 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull, Paris | Karte nach Art einer genormten Kreditkarte zur Verarbeitung von elektrischen Signalen und Verfahren zur Herstellung der Karte |
DE3535791A1 (de) * | 1984-11-05 | 1986-05-07 | Casio Computer Co., Ltd., Tokio/Tokyo | Karte mit eingebautem chip |
FR2586886A1 (fr) * | 1985-08-09 | 1987-03-06 | Sharp Kk | Dispositif electronique mince du type carte. |
FR2599893A1 (fr) * | 1986-05-23 | 1987-12-11 | Ricoh Kk | Procede de montage d'un module electronique sur un substrat et carte a circuit integre |
DE3633257A1 (de) * | 1986-09-30 | 1988-05-05 | Wilde Membran Impuls Tech | Metallisiertes, textiles flaechengebilde als schirmschutz gegen elektromagnetische strahlung und brandschutz bei gegenstaenden, insbesondere elektrischen und elektronischen geraeten und bauteilen sowie raeumen |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
EP0312067A2 (fr) * | 1987-10-16 | 1989-04-19 | Sumitomo Metal Industries, Ltd. | Boîte métallique pour circuit intégré et son procédé de fabrication |
EP0317201A2 (fr) * | 1987-11-14 | 1989-05-24 | Kabushiki Kaisha Toshiba | Milieu d'enregistrement portable |
DE3118298C2 (fr) * | 1981-05-08 | 1989-09-28 | Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De | |
EP0391790A1 (fr) * | 1989-04-07 | 1990-10-10 | STMicroelectronics S.A. | Procédé de fabrication d'un module électronique |
US5005106A (en) * | 1988-12-08 | 1991-04-02 | E. I. Du Pont De Nemours And Company | Multifunctional card having an electromagnetic wave protection |
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
DE4109959A1 (de) * | 1990-03-26 | 1991-10-02 | Mitsubishi Electric Corp | Verfahren zur herstellung einer ic-karte |
-
1991
- 1991-10-31 DE DE9113601U patent/DE9113601U1/de not_active Expired - Lifetime
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2659573C2 (de) * | 1975-12-31 | 1986-02-27 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull, Paris | Karte nach Art einer genormten Kreditkarte zur Verarbeitung von elektrischen Signalen und Verfahren zur Herstellung der Karte |
DE3124332A1 (de) * | 1980-07-09 | 1982-06-03 | Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven | "tragbares, aus mehreren schichten aufgebautes ausweiselement" |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DE3118298C2 (fr) * | 1981-05-08 | 1989-09-28 | Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De | |
DE8122540U1 (de) * | 1981-07-31 | 1983-01-13 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "informationskarte mit integriertem baustein" |
US4552383A (en) * | 1981-12-24 | 1985-11-12 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Identification card having an IC module |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
DE3535791A1 (de) * | 1984-11-05 | 1986-05-07 | Casio Computer Co., Ltd., Tokio/Tokyo | Karte mit eingebautem chip |
FR2586886A1 (fr) * | 1985-08-09 | 1987-03-06 | Sharp Kk | Dispositif electronique mince du type carte. |
FR2599893A1 (fr) * | 1986-05-23 | 1987-12-11 | Ricoh Kk | Procede de montage d'un module electronique sur un substrat et carte a circuit integre |
DE3633257A1 (de) * | 1986-09-30 | 1988-05-05 | Wilde Membran Impuls Tech | Metallisiertes, textiles flaechengebilde als schirmschutz gegen elektromagnetische strahlung und brandschutz bei gegenstaenden, insbesondere elektrischen und elektronischen geraeten und bauteilen sowie raeumen |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
EP0312067A2 (fr) * | 1987-10-16 | 1989-04-19 | Sumitomo Metal Industries, Ltd. | Boîte métallique pour circuit intégré et son procédé de fabrication |
EP0317201A2 (fr) * | 1987-11-14 | 1989-05-24 | Kabushiki Kaisha Toshiba | Milieu d'enregistrement portable |
US5005106A (en) * | 1988-12-08 | 1991-04-02 | E. I. Du Pont De Nemours And Company | Multifunctional card having an electromagnetic wave protection |
EP0391790A1 (fr) * | 1989-04-07 | 1990-10-10 | STMicroelectronics S.A. | Procédé de fabrication d'un module électronique |
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
DE4109959A1 (de) * | 1990-03-26 | 1991-10-02 | Mitsubishi Electric Corp | Verfahren zur herstellung einer ic-karte |
Non-Patent Citations (4)
Title |
---|
2-30597 A., M-960, Vol.14, No.177 * |
JP Patents Abstracts of Japan: 2-92597 A., M-989, June 22, 1990, Vol.14, No.291 * |
RIGID DISH SMART CARD. In: IBM Technical Disclo- sure Bulletin, Vol.32, No.4A, Sept. 1989, S.431-432 * |
STIFFEND CARD WITH INTEGRATED CIRCUIT. In: IBM Technical Disclosure Bulletin, Vol. 28, No.11, April 1986, S.4723-4725 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29516811U1 (de) * | 1995-10-25 | 1995-12-21 | Hornig, Wolfgang, Dr.-Ing., 90542 Eckental | Chipkarten aus Metall |
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