DE69209772T2 - Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren - Google Patents

Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren

Info

Publication number
DE69209772T2
DE69209772T2 DE69209772T DE69209772T DE69209772T2 DE 69209772 T2 DE69209772 T2 DE 69209772T2 DE 69209772 T DE69209772 T DE 69209772T DE 69209772 T DE69209772 T DE 69209772T DE 69209772 T2 DE69209772 T2 DE 69209772T2
Authority
DE
Germany
Prior art keywords
casing
functional device
filling
cavity
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69209772T
Other languages
English (en)
Other versions
DE69209772D1 (de
Inventor
Terje Kvisteroy
Henrik Jacobsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Sensonor AS
Sensonor AS
Original Assignee
Sensonor ASA
Sensonor AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensonor ASA, Sensonor AS filed Critical Sensonor ASA
Publication of DE69209772D1 publication Critical patent/DE69209772D1/de
Application granted granted Critical
Publication of DE69209772T2 publication Critical patent/DE69209772T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/22—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
DE69209772T 1991-05-06 1992-05-05 Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren Expired - Fee Related DE69209772T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO911774A NO911774D0 (no) 1991-05-06 1991-05-06 Anordning ved innkapsling av et funksjonsorgan, samt fremgangsmaate for fremstilling av samme.
PCT/NO1992/000085 WO1992020096A1 (en) 1991-05-06 1992-05-05 Arrangement for encasing a functional device, and a process for the production of same

Publications (2)

Publication Number Publication Date
DE69209772D1 DE69209772D1 (de) 1996-05-15
DE69209772T2 true DE69209772T2 (de) 1996-11-07

Family

ID=19894131

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69209772T Expired - Fee Related DE69209772T2 (de) 1991-05-06 1992-05-05 Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren

Country Status (10)

Country Link
EP (1) EP0539555B1 (de)
JP (1) JPH06500205A (de)
KR (1) KR0134790B1 (de)
AT (1) ATE136686T1 (de)
AU (1) AU649139B2 (de)
BR (1) BR9205261A (de)
CA (1) CA2086825A1 (de)
DE (1) DE69209772T2 (de)
NO (2) NO911774D0 (de)
WO (1) WO1992020096A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005013762B3 (de) * 2005-03-22 2006-08-24 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
DE102005048396A1 (de) * 2005-10-10 2007-04-19 Siemens Ag Sensorbaugruppe
WO2018065121A1 (de) 2016-10-06 2018-04-12 Possehl Electronics Deutschland Gmbh Gehäuse für ein elektronisches bauteil, insbesondere einen halbleiter-chip
DE102016011934A1 (de) * 2016-10-06 2018-05-03 Possehl Electronics Deutschland Gmbh Gehäuse für ein elektronisches Bauteil, insbesondere einen Halbleiter-Chip

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US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
US5700697A (en) * 1993-02-01 1997-12-23 Silicon Packaging Technology Method for packaging an integrated circuit using a reconstructed package
DE9312005U1 (de) * 1993-08-11 1993-09-23 Siemens Matsushita Components Elektrisches bauelement in chip-bauweise
DE4330977C2 (de) * 1993-09-13 1996-04-18 Duerrwaechter E Dr Doduco Gehäuse aus Kunststoff, insbesondere zum Aufnehmen elektrischer Bauteile
DE4340280C2 (de) * 1993-09-13 1996-08-29 Duerrwaechter E Dr Doduco Bauteilesatz für ein Gehäuse aus Kunststoff zum Aufnehmen von elektrischen Bauelementen
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.
DE69428578T2 (de) * 1993-12-16 2002-06-27 Sharp Kk Herstellungsverfahren für lichtemittierenden Halbleitervorrichtungen
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
EP0675363A3 (de) * 1994-03-31 1997-03-05 Delco Electronics Corp Beschleunigungsmessanordnung.
AU2103895A (en) * 1994-04-05 1995-10-23 Olin Corporation Cavity filled metal electronic package
SE502877C2 (sv) * 1994-06-14 1996-02-05 Ericsson Telefon Ab L M Anordning som förhindrar brand i elektronik
EP0793859B1 (de) * 1994-11-25 2002-09-11 AMI Doduco GmbH Zum aufnehmen von elektronischen und/oder mikromechanischen bauteilen bestimmtes gehäuse aus einem kunststoff, in welches leiterbahnen hineinführen
DE19503778C2 (de) * 1995-02-04 2002-10-31 Ami Doduco Gmbh Anordnung aus einem Gehäuse, einer Schaltungsträgerplatte und Zuleitungen
EP0764984B1 (de) * 1995-09-08 1998-10-21 Siemens Aktiengesellschaft Schutzgehäuse für auf einem Schaltungssubstrat mit Bonddrähten angeordnete Halbleiterchips
US6044569A (en) * 1997-02-10 2000-04-04 Mitutoyo Corporation Measuring method and measuring instrument
JP2003526084A (ja) * 1998-04-03 2003-09-02 アライドシグナル インコーポレイテッド 加速度計
US6301966B1 (en) 1999-03-31 2001-10-16 Honeywell International, Inc. Clamshell cover accelerometer
US6787969B2 (en) 2000-06-06 2004-09-07 Iolon, Inc. Damped micromechanical device
US7075112B2 (en) 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
DE10111657A1 (de) 2001-03-09 2003-01-02 Heraeus Electro Nite Int Verfahren zur Herstellung eines Gehäuses für Sensorelemente, sowie Sensor, insbesondere Temperatur-Sensor
US6429510B1 (en) * 2001-05-30 2002-08-06 Ericsson Inc. Liquid damping of high frequency bond wire vibration
DE10134646A1 (de) * 2001-07-17 2003-02-06 Bosch Gmbh Robert Sensorelement
US6813828B2 (en) 2002-01-07 2004-11-09 Gel Pak L.L.C. Method for deconstructing an integrated circuit package using lapping
US6884663B2 (en) 2002-01-07 2005-04-26 Delphon Industries, Llc Method for reconstructing an integrated circuit package using lapping
DE10221303A1 (de) * 2002-05-14 2003-11-27 Valeo Schalter & Sensoren Gmbh Sensor, insbesondere Ultraschallsensor, und Verfahren zur Herstellung
DE10233296A1 (de) * 2002-07-22 2004-02-12 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung eines Gehäuses für einen gekapselten Sensor und entsprechendes Gehäuse
CN100399550C (zh) * 2003-02-03 2008-07-02 株式会社电装 传感器器件以及用于安装电子元件的陶瓷封装外壳
EP1720018A3 (de) 2003-02-03 2007-03-21 Denso Corporation Keramikgehäuse für die Montage elektronischer Komponenten
JP4837245B2 (ja) * 2003-06-26 2011-12-14 アール・ビー・コントロールズ株式会社 電子装置およびその製造方法
US7382620B2 (en) * 2005-10-13 2008-06-03 International Business Machines Corporation Method and apparatus for optimizing heat transfer with electronic components
DE102005056760A1 (de) * 2005-11-29 2007-06-06 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
JP2007287967A (ja) * 2006-04-18 2007-11-01 Shinko Electric Ind Co Ltd 電子部品装置
DE102007019096B4 (de) * 2007-04-23 2015-03-12 Continental Automotive Gmbh Elektronikgehäuse
DE102007045262B4 (de) * 2007-09-21 2015-03-12 Continental Automotive Gmbh Elektronikgehäuse
DE102008040676A1 (de) * 2008-07-24 2010-01-28 Robert Bosch Gmbh Abdichtrahmen sowie Verfahren zum Abdecken eines Bauteils
FR2965348B1 (fr) * 2010-09-23 2013-03-29 Continental Automotive France Capteur pour vehicule automobile et procedes de fabrication et de demontage correspondants
TWM428477U (en) * 2012-01-19 2012-05-01 Mag Layers Scient Technics Co Magnetic component
US9534972B2 (en) * 2012-02-16 2017-01-03 7-Sigma Inc. Pressure sensor with a deformable electrically resistive membrane
US8746075B2 (en) 2012-02-16 2014-06-10 7-Sigma, Inc. Flexible electrically conductive nanotube sensor for elastomeric devices
JP2014082233A (ja) * 2012-10-12 2014-05-08 Sumitomo Electric Ind Ltd 半導体装置及びその製造方法
US9613911B2 (en) 2013-02-06 2017-04-04 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
US10840536B2 (en) 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
CA2900583A1 (en) * 2013-02-06 2014-08-14 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
US10497633B2 (en) 2013-02-06 2019-12-03 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with fluid containment
US10555415B2 (en) * 2013-08-07 2020-02-04 SMR Patents S.à.r.l. Method for manufacturing a printed circuit board
EP2924725A1 (de) * 2014-03-25 2015-09-30 ABB Technology Ltd Elektrisches Modul für Unterwasseranwendungen
US9443744B2 (en) * 2014-07-14 2016-09-13 Micron Technology, Inc. Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
US9337119B2 (en) * 2014-07-14 2016-05-10 Micron Technology, Inc. Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems
JP6314731B2 (ja) * 2014-08-01 2018-04-25 株式会社ソシオネクスト 半導体装置及び半導体装置の製造方法
DE102015208529B3 (de) * 2015-02-10 2016-08-04 Conti Temic Microelectronic Gmbh Elektronische Komponente und Verfahren zu deren Herstellung
DE102015208315A1 (de) * 2015-05-05 2016-11-10 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Bauelements und Bauelement
DE102019120886A1 (de) * 2019-08-02 2021-02-04 Infineon Technologies Ag Halbleitergehäuse mit einem Hohlraum in seinem Gehäusekörper
CN110702935A (zh) * 2019-10-17 2020-01-17 上海芯立电子科技有限公司 一种高灵敏度的传感器

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JPH07120733B2 (ja) * 1985-09-27 1995-12-20 日本電装株式会社 車両用半導体素子パッケージ構造とその製造方法
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005013762B3 (de) * 2005-03-22 2006-08-24 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
WO2006099936A2 (de) 2005-03-22 2006-09-28 Sew-Eurodrive Gmbh & Co. Kg Vorrichtung und verfahren zur bestimmung der temperatur eines kühlkörpers
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
US9318406B2 (en) 2005-03-22 2016-04-19 Sew-Eurodrive Gmbh & Co. Kg Device and method for determining the temperature of a heat sink
US9967966B2 (en) 2005-03-22 2018-05-08 Sew-Eurodrive Gmbh & Co. Kg Device and method for determining the temperature of a heat sink
DE102005048396A1 (de) * 2005-10-10 2007-04-19 Siemens Ag Sensorbaugruppe
WO2018065121A1 (de) 2016-10-06 2018-04-12 Possehl Electronics Deutschland Gmbh Gehäuse für ein elektronisches bauteil, insbesondere einen halbleiter-chip
DE102016011934A1 (de) * 2016-10-06 2018-05-03 Possehl Electronics Deutschland Gmbh Gehäuse für ein elektronisches Bauteil, insbesondere einen Halbleiter-Chip
US10903160B2 (en) 2016-10-06 2021-01-26 Possehl Electronics Deutschland Gmbh Housing for an electronic component, in particular a semiconductor chip

Also Published As

Publication number Publication date
KR0134790B1 (en) 1998-04-20
AU1747492A (en) 1992-12-21
AU649139B2 (en) 1994-05-12
EP0539555A1 (de) 1993-05-05
DE69209772D1 (de) 1996-05-15
CA2086825A1 (en) 1992-11-07
ATE136686T1 (de) 1996-04-15
BR9205261A (pt) 1993-07-20
NO930028D0 (no) 1993-01-06
WO1992020096A1 (en) 1992-11-12
NO930028L (no) 1993-01-06
JPH06500205A (ja) 1994-01-06
NO911774D0 (no) 1991-05-06
EP0539555B1 (de) 1996-04-10

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