ATE136686T1 - Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren - Google Patents

Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren

Info

Publication number
ATE136686T1
ATE136686T1 AT92909972T AT92909972T ATE136686T1 AT E136686 T1 ATE136686 T1 AT E136686T1 AT 92909972 T AT92909972 T AT 92909972T AT 92909972 T AT92909972 T AT 92909972T AT E136686 T1 ATE136686 T1 AT E136686T1
Authority
AT
Austria
Prior art keywords
casing
functional device
filling
cavity
arrangement
Prior art date
Application number
AT92909972T
Other languages
English (en)
Inventor
Terje Kvisteroy
Henrik Jacobsen
Original Assignee
Sensonor As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensonor As filed Critical Sensonor As
Application granted granted Critical
Publication of ATE136686T1 publication Critical patent/ATE136686T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/22—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Vending Machines For Individual Products (AREA)
  • Packages (AREA)
AT92909972T 1991-05-06 1992-05-05 Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren ATE136686T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO911774A NO911774D0 (no) 1991-05-06 1991-05-06 Anordning ved innkapsling av et funksjonsorgan, samt fremgangsmaate for fremstilling av samme.

Publications (1)

Publication Number Publication Date
ATE136686T1 true ATE136686T1 (de) 1996-04-15

Family

ID=19894131

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92909972T ATE136686T1 (de) 1991-05-06 1992-05-05 Gehäuseanordnung für ein funktionales bauelement und herstellungsverfahren

Country Status (10)

Country Link
EP (1) EP0539555B1 (de)
JP (1) JPH06500205A (de)
KR (1) KR0134790B1 (de)
AT (1) ATE136686T1 (de)
AU (1) AU649139B2 (de)
BR (1) BR9205261A (de)
CA (1) CA2086825A1 (de)
DE (1) DE69209772T2 (de)
NO (2) NO911774D0 (de)
WO (1) WO1992020096A1 (de)

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US5700697A (en) * 1993-02-01 1997-12-23 Silicon Packaging Technology Method for packaging an integrated circuit using a reconstructed package
DE9312005U1 (de) * 1993-08-11 1993-09-23 Siemens Matsushita Components GmbH & Co. KG, 81541 München Elektrisches bauelement in chip-bauweise
DE4330977C2 (de) * 1993-09-13 1996-04-18 Duerrwaechter E Dr Doduco Gehäuse aus Kunststoff, insbesondere zum Aufnehmen elektrischer Bauteile
DE4340280C2 (de) * 1993-09-13 1996-08-29 Duerrwaechter E Dr Doduco Bauteilesatz für ein Gehäuse aus Kunststoff zum Aufnehmen von elektrischen Bauelementen
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
DE69428578T2 (de) * 1993-12-16 2002-06-27 Sharp Kk Herstellungsverfahren für lichtemittierenden Halbleitervorrichtungen
EP0675363A3 (de) * 1994-03-31 1997-03-05 Delco Electronics Corp Beschleunigungsmessanordnung.
EP0754350A4 (de) * 1994-04-05 1998-10-07 Olin Corp Metallgefüllter hohlraum für elektronische packung
SE502877C2 (sv) * 1994-06-14 1996-02-05 Ericsson Telefon Ab L M Anordning som förhindrar brand i elektronik
WO1996017383A1 (de) * 1994-11-25 1996-06-06 Doduco Gmbh + Co. Dr. Eugen Dürrwächter Zum aufnehmen von elektronischen und/oder mikromechanischen bauteilen bestimmtes gehäuse aus einem kunststoff, in welches leiterbahnen hineinführen
DE19503778C2 (de) * 1995-02-04 2002-10-31 Ami Doduco Gmbh Anordnung aus einem Gehäuse, einer Schaltungsträgerplatte und Zuleitungen
EP0764984B1 (de) * 1995-09-08 1998-10-21 Siemens Aktiengesellschaft Schutzgehäuse für auf einem Schaltungssubstrat mit Bonddrähten angeordnete Halbleiterchips
US6044569A (en) * 1997-02-10 2000-04-04 Mitutoyo Corporation Measuring method and measuring instrument
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US6301966B1 (en) 1999-03-31 2001-10-16 Honeywell International, Inc. Clamshell cover accelerometer
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US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US7075112B2 (en) 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
DE10111657A1 (de) 2001-03-09 2003-01-02 Heraeus Electro Nite Int Verfahren zur Herstellung eines Gehäuses für Sensorelemente, sowie Sensor, insbesondere Temperatur-Sensor
US6429510B1 (en) * 2001-05-30 2002-08-06 Ericsson Inc. Liquid damping of high frequency bond wire vibration
DE10134646A1 (de) * 2001-07-17 2003-02-06 Bosch Gmbh Robert Sensorelement
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DE10233296A1 (de) * 2002-07-22 2004-02-12 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung eines Gehäuses für einen gekapselten Sensor und entsprechendes Gehäuse
EP1720018A3 (de) 2003-02-03 2007-03-21 Denso Corporation Keramikgehäuse für die Montage elektronischer Komponenten
CN100399550C (zh) * 2003-02-03 2008-07-02 株式会社电装 传感器器件以及用于安装电子元件的陶瓷封装外壳
JP4837245B2 (ja) * 2003-06-26 2011-12-14 アール・ビー・コントロールズ株式会社 電子装置およびその製造方法
DE102005013762C5 (de) 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
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US9613911B2 (en) 2013-02-06 2017-04-04 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
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US10497633B2 (en) 2013-02-06 2019-12-03 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with fluid containment
US10840536B2 (en) 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
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Also Published As

Publication number Publication date
AU1747492A (en) 1992-12-21
NO930028L (no) 1993-01-06
AU649139B2 (en) 1994-05-12
NO911774D0 (no) 1991-05-06
JPH06500205A (ja) 1994-01-06
DE69209772T2 (de) 1996-11-07
CA2086825A1 (en) 1992-11-07
DE69209772D1 (de) 1996-05-15
BR9205261A (pt) 1993-07-20
EP0539555A1 (de) 1993-05-05
WO1992020096A1 (en) 1992-11-12
KR0134790B1 (en) 1998-04-20
EP0539555B1 (de) 1996-04-10
NO930028D0 (no) 1993-01-06

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