DE20316433U1 - Elektrisches Bauelement - Google Patents

Elektrisches Bauelement Download PDF

Info

Publication number
DE20316433U1
DE20316433U1 DE20316433U DE20316433U DE20316433U1 DE 20316433 U1 DE20316433 U1 DE 20316433U1 DE 20316433 U DE20316433 U DE 20316433U DE 20316433 U DE20316433 U DE 20316433U DE 20316433 U1 DE20316433 U1 DE 20316433U1
Authority
DE
Germany
Prior art keywords
circuit board
molded body
injection molded
plastic material
transparent plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20316433U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HBW-GUBESCH KUNSTSTOFF-ENGINEERING GMBH, DE
NEO-PLASTIC DR. DOETSCH DIESPECK GMBH, DE
Original Assignee
DOETSCH NEO PLASTIC
Gubesch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DOETSCH NEO PLASTIC, Gubesch GmbH filed Critical DOETSCH NEO PLASTIC
Priority to DE20316433U priority Critical patent/DE20316433U1/de
Publication of DE20316433U1 publication Critical patent/DE20316433U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
DE20316433U 2003-10-25 2003-10-25 Elektrisches Bauelement Expired - Lifetime DE20316433U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20316433U DE20316433U1 (de) 2003-10-25 2003-10-25 Elektrisches Bauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20316433U DE20316433U1 (de) 2003-10-25 2003-10-25 Elektrisches Bauelement

Publications (1)

Publication Number Publication Date
DE20316433U1 true DE20316433U1 (de) 2005-03-17

Family

ID=34353527

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20316433U Expired - Lifetime DE20316433U1 (de) 2003-10-25 2003-10-25 Elektrisches Bauelement

Country Status (1)

Country Link
DE (1) DE20316433U1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013034490A1 (en) * 2011-09-05 2013-03-14 Osram Ag A lighting device and an encapsulation method therefor
DE102013001649A1 (de) * 2013-01-31 2014-07-31 Festool Group Gmbh & Co. Kg Elektrogerät in Gestalt einer Hand-Werkzeugmaschine oder eines Sauggeräts
CN111836462A (zh) * 2020-08-03 2020-10-27 Oppo广东移动通信有限公司 穿戴式设备
EP2887778B1 (de) * 2013-12-20 2022-06-08 Zumtobel Lighting GmbH Flexible Leiterplatte mit Kühlkörper und Verfahren zu deren Herstellung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013034490A1 (en) * 2011-09-05 2013-03-14 Osram Ag A lighting device and an encapsulation method therefor
CN102983084A (zh) * 2011-09-05 2013-03-20 欧司朗股份有限公司 发光装置及其封装方法
DE102013001649A1 (de) * 2013-01-31 2014-07-31 Festool Group Gmbh & Co. Kg Elektrogerät in Gestalt einer Hand-Werkzeugmaschine oder eines Sauggeräts
EP2887778B1 (de) * 2013-12-20 2022-06-08 Zumtobel Lighting GmbH Flexible Leiterplatte mit Kühlkörper und Verfahren zu deren Herstellung
CN111836462A (zh) * 2020-08-03 2020-10-27 Oppo广东移动通信有限公司 穿戴式设备

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20050421

R081 Change of applicant/patentee

Owner name: NEO-PLASTIC DR. DOETSCH DIESPECK GMBH, DE

Free format text: FORMER OWNER: GUBESCH GMBH, NEO-PLASTIC DR. DOETSCH DIESPEC, , DE

Effective date: 20051117

Owner name: HBW-GUBESCH KUNSTSTOFF-ENGINEERING GMBH, DE

Free format text: FORMER OWNER: GUBESCH GMBH, NEO-PLASTIC DR. DOETSCH DIESPEC, , DE

Effective date: 20051117

Owner name: NEO-PLASTIC DR. DOETSCH DIESPECK GMBH, DE

Free format text: FORMER OWNER: GUBESCH GMBH, 91489 WILHELMSDORF, DE

Effective date: 20040429

Owner name: HBW-GUBESCH KUNSTSTOFF-ENGINEERING GMBH, DE

Free format text: FORMER OWNER: GUBESCH GMBH, 91489 WILHELMSDORF, DE

Effective date: 20040429

R150 Term of protection extended to 6 years

Effective date: 20060721

R151 Term of protection extended to 8 years

Effective date: 20091006

R152 Term of protection extended to 10 years

Effective date: 20111103

R071 Expiry of right
R071 Expiry of right