KR890011063A - 진동발생소자를 가진 밀봉부품의 제조방법 - Google Patents

진동발생소자를 가진 밀봉부품의 제조방법 Download PDF

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Publication number
KR890011063A
KR890011063A KR1019880016549A KR880016549A KR890011063A KR 890011063 A KR890011063 A KR 890011063A KR 1019880016549 A KR1019880016549 A KR 1019880016549A KR 880016549 A KR880016549 A KR 880016549A KR 890011063 A KR890011063 A KR 890011063A
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KR
South Korea
Prior art keywords
mold
sealing resin
vibration generating
generating element
sealing
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Application number
KR1019880016549A
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English (en)
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KR940000430B1 (ko
Inventor
가즈히꼬 나스
가즈에이 켄모찌
도모히꼬 니이가와
아쯔시 마쯔이
Original Assignee
다니이 아끼오
마쯔시다덴기산교 가부시기가이샤
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Application filed by 다니이 아끼오, 마쯔시다덴기산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR890011063A publication Critical patent/KR890011063A/ko
Application granted granted Critical
Publication of KR940000430B1 publication Critical patent/KR940000430B1/ko

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/7343—Heating or cooling of the mould heating or cooling different mould parts at different temperatures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

진동발생소자를 가진 밀봉부품의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도(a)(h)는 본 발명의 제 1 실시예에 있어서의 표면과 필터의 제조공정을 도시한 개략도.
제 2 도는 봉지수지의 수축방향을 표시한 설명도.
제 3 도(a),(b)는 본 발명의 제 3 실시예의 금형의 공동(cavity) 형상을 도시한 종단정면도와 종단측면도.

Claims (4)

  1. 진동발생소자를 배설한 리이드프레임을 금형속에 배치하고, 성형수축성이 있고 또한 저접착성의 밀봉수지를 사용해서 사출성형에 의해 밀봉하는 공정과, 상기 진동발생소자의 성형품을 금형속으로부터 꺼낸후에, 상기 리이드와 밀봉수지의 계면에 진공함침에 의해 액상밀봉수지를 함침시키고, 그후, 상기 액상밀봉수지를 경화시키는 공정으로 이루어진 진동 발생소자를 가진 밀봉부품의 제조방법.
  2. 진동발생소자를 배설한 리이드프레임을, 금형 상하의 온도가 다르고, 소자면에 대향하는 금형쪽이 낮은 온도의 금형속에 배치하고, 성형 수축성이 있고 또한 저접착성의 밀봉수지를 사용해서 사출성형에 의해 밀봉하는 공정과, 상기 진동발생소자의 성형품을 금형속으로부터 꺼낸후에, 상기 리이드와 밀봉수의 계면에 진공함침에 의해 액상 밀봉수지를 함침시키고, 그후, 상기 액상밀봉수지를 경화시키는 공정으로 이루어진 진동발생소자를 가진 밀봉부품의 제조방법.
  3. 진공발생소자를 배설한 리이드프레임을, 금형의 수지충전 부분의 소자면에 대향하는 부분의 형상이, 오목형상을 발생하지 않는 R형상 또는 볼록형상을 한 금속형속에 배치하고, 성형수축성이 있고 또한 저접착성의 밀봉수지를 사용해서 사출성형에 의해 밀봉하는 공정과, 상기 진동발생소자의 성형품을 금형속으로부터 꺼낸후에, 상기 리이드와 밀봉수지의 계면에 진공함침에 의해 액상밀봉수지를 함침시키고, 그후, 상기 액상밀봉수지를 경화시키는 공정으로 이루어진 진동발생소자를 가진 밀봉부품의 제조방법.
  4. 진동발생소자를 배설한 리이드프레임을, 금형 상하의 온도가 다르고, 소자면에 대향하는 금형쪽이 낮은 금형이고, 또한 수지충전부분의 소자면에 대향하는 부분의 형상이 오목형상을 발생하지 않는 R형상 또는 볼록형상을 한 금형속에, 상기 진동발생소자를 배치하고, 성형 수축성이 있고 또한 저접착성의 밀봉수지를 사용하여 사출성형에 의해 밀봉하는 공정과, 상기 진동발생소자의 성형물을 금형속으로부터 꺼낸후에, 상기 리이드와 밀봉수지의 계면에 진공함침에 의해 액상밀봉수지를 함침시키고, 그후, 상기 액상밀봉수지를 경화시키는 공정으로 이루어진 진동발생소자를 가진 밀봉부품의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880016549A 1987-12-15 1988-12-13 진동발생소자를 가진 전자부품의 제조방법 KR940000430B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62316613A JPH01157610A (ja) 1987-12-15 1987-12-15 振動発生素子を有する封止部品の製造方法
JP62-316613 1987-12-15

Publications (2)

Publication Number Publication Date
KR890011063A true KR890011063A (ko) 1989-08-12
KR940000430B1 KR940000430B1 (ko) 1994-01-20

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KR1019880016549A KR940000430B1 (ko) 1987-12-15 1988-12-13 진동발생소자를 가진 전자부품의 제조방법

Country Status (3)

Country Link
US (1) US4927580A (ko)
JP (1) JPH01157610A (ko)
KR (1) KR940000430B1 (ko)

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JPH0322543A (ja) * 1989-06-05 1991-01-30 Siemens Ag 電子デバイスの被覆方法及び装置
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US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
JP2596616Y2 (ja) * 1991-09-30 1999-06-21 京セラ株式会社 ラダー型フィルタ
US5368805A (en) * 1992-03-24 1994-11-29 Fuji Electric Co., Ltd. Method for producing resin sealed type semiconductor device
US5768813A (en) * 1992-05-13 1998-06-23 Reboul; Jerome Carrier for an electronic identification device
US5248467A (en) * 1992-07-27 1993-09-28 Cushman William B Injection of molding material into molds that may contain cores and/or fibers
JPH06325322A (ja) * 1993-03-16 1994-11-25 Sharp Corp 薄膜磁気ヘッドおよびその製造方法
JPH07183317A (ja) * 1993-12-22 1995-07-21 Matsushita Electric Ind Co Ltd 電子部品の製造装置及び製造方法
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
US5702775A (en) * 1995-12-26 1997-12-30 Motorola, Inc. Microelectronic device package and method
US5892417A (en) * 1996-12-27 1999-04-06 Motorola Inc. Saw device package and method
DE19926181C1 (de) * 1999-06-09 2000-12-14 Inst Mikrotechnik Mainz Gmbh Magazin für mikrostrukturierte Formteile und Verfahren zu dessen Herstellung
NL1026407C2 (nl) * 2004-06-11 2005-12-14 Fico Bv Werkwijze en inrichting voor het beheersbaar omhullen van elektronische componenten.
US7162388B2 (en) * 2004-06-17 2007-01-09 Fci Americas Technology, Inc. Vehicle air bag electrical system
US7905650B2 (en) 2006-08-25 2011-03-15 3M Innovative Properties Company Backlight suitable for display devices
CN103994845B (zh) * 2013-02-19 2019-09-10 精工爱普生株式会社 力检测装置、机械手、以及移动体
JP2015184005A (ja) * 2014-03-20 2015-10-22 セイコーエプソン株式会社 力検出装置、およびロボット
US11503893B2 (en) * 2020-03-20 2022-11-22 Crystal International (Group) Shock absorbing cosmetic compact

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IL42363A0 (en) * 1972-07-04 1973-07-30 Lepetit Spa 1,2,4-oxadiazole derivatives
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Also Published As

Publication number Publication date
US4927580A (en) 1990-05-22
KR940000430B1 (ko) 1994-01-20
JPH01157610A (ja) 1989-06-20

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