JPS55103276A - Brazing method by dissimilar diameter wire shaped braze material - Google Patents

Brazing method by dissimilar diameter wire shaped braze material

Info

Publication number
JPS55103276A
JPS55103276A JP946379A JP946379A JPS55103276A JP S55103276 A JPS55103276 A JP S55103276A JP 946379 A JP946379 A JP 946379A JP 946379 A JP946379 A JP 946379A JP S55103276 A JPS55103276 A JP S55103276A
Authority
JP
Japan
Prior art keywords
parts
braze material
portions
diameter
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP946379A
Other languages
Japanese (ja)
Other versions
JPS616748B2 (en
Inventor
Takashi Furusawa
Yasuo Udo
Takeshi Nagai
Koichi Niwa
Yoshiharu Anzai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Fujitsu Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd, Fujitsu Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP946379A priority Critical patent/JPS55103276A/en
Publication of JPS55103276A publication Critical patent/JPS55103276A/en
Publication of JPS616748B2 publication Critical patent/JPS616748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To make brazing of the proximate and continuous bonding portions easy and improve reliability by forming the braze material to a larger diameter for the bonding portions and to a smaller diameter between the pitches which are not bonded. CONSTITUTION:Portions 5' of a large diameter and portions 5'' of a small diameter are provided to the braze material and the large diameter parts 5' are made the same as the bonding pitch of lead terminals 4 and metallized parts 2. Hence, when the bonding parts and the large diameter parts 5' of the wire form braze material 5 are aligned and are set followed by heating, then the portions between the pitches of the metallized parts 2 become the small-diameter parts 5'' and therefore the melted braze material can move readily to the metallized parts 2, whereby the perfect bonded parts 5''' may be made. Hence, it is possible to simultaneously weld the multiple rows of the continuous bonding parts.
JP946379A 1979-01-30 1979-01-30 Brazing method by dissimilar diameter wire shaped braze material Granted JPS55103276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP946379A JPS55103276A (en) 1979-01-30 1979-01-30 Brazing method by dissimilar diameter wire shaped braze material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP946379A JPS55103276A (en) 1979-01-30 1979-01-30 Brazing method by dissimilar diameter wire shaped braze material

Publications (2)

Publication Number Publication Date
JPS55103276A true JPS55103276A (en) 1980-08-07
JPS616748B2 JPS616748B2 (en) 1986-02-28

Family

ID=11720965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP946379A Granted JPS55103276A (en) 1979-01-30 1979-01-30 Brazing method by dissimilar diameter wire shaped braze material

Country Status (1)

Country Link
JP (1) JPS55103276A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180097A (en) * 1989-10-03 1993-01-19 Mitsubishi Denki Kabushiki Kaisha Method of mounting an electronic part onto a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180097A (en) * 1989-10-03 1993-01-19 Mitsubishi Denki Kabushiki Kaisha Method of mounting an electronic part onto a printed circuit board

Also Published As

Publication number Publication date
JPS616748B2 (en) 1986-02-28

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