JPS5684912A - Manufacture of holl0w cylindrical assembled body - Google Patents

Manufacture of holl0w cylindrical assembled body

Info

Publication number
JPS5684912A
JPS5684912A JP16113579A JP16113579A JPS5684912A JP S5684912 A JPS5684912 A JP S5684912A JP 16113579 A JP16113579 A JP 16113579A JP 16113579 A JP16113579 A JP 16113579A JP S5684912 A JPS5684912 A JP S5684912A
Authority
JP
Japan
Prior art keywords
soldering alloy
wires
melting point
manufacture
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16113579A
Other languages
Japanese (ja)
Inventor
Takashi Wakabayashi
Yasumasa Komatsu
Tsunenobu Horikoshi
Morihiro Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16113579A priority Critical patent/JPS5684912A/en
Publication of JPS5684912A publication Critical patent/JPS5684912A/en
Pending legal-status Critical Current

Links

Landscapes

  • Diaphragms For Electromechanical Transducers (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE: To manufacture a fine core member with a simple process by a method wherein a soldering alloy wires coated with synthetic resin on the surface thereof are fused to integralize themselves, thereafter, the soldering alloy wires are removed by raising the temperature thereof to a temperature higher than the melting point of the soldering alloy.
CONSTITUTION: A compound body 1 consisting of thermoplastic or thermosetting resin and inorganic powder is coated as a thin layer on the surface of the soldering alloy wire 2 while the alloy wires 2 are contacted each other in the longitudinal direction thereof respectively and are heated to a temperature lower than the melting point of the soldering alloy wire to integralize them by thermal fusion or thermal setting of single wires each other. The integralized structure is heated to a temperature higher than the melting point of the soldering alloy to remove the soldering alloy wires from the structure. According to this method, the fine core member may be manufactured by the simple process.
COPYRIGHT: (C)1981,JPO&Japio
JP16113579A 1979-12-11 1979-12-11 Manufacture of holl0w cylindrical assembled body Pending JPS5684912A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16113579A JPS5684912A (en) 1979-12-11 1979-12-11 Manufacture of holl0w cylindrical assembled body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16113579A JPS5684912A (en) 1979-12-11 1979-12-11 Manufacture of holl0w cylindrical assembled body

Publications (1)

Publication Number Publication Date
JPS5684912A true JPS5684912A (en) 1981-07-10

Family

ID=15729254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16113579A Pending JPS5684912A (en) 1979-12-11 1979-12-11 Manufacture of holl0w cylindrical assembled body

Country Status (1)

Country Link
JP (1) JPS5684912A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58171196A (en) * 1982-04-01 1983-10-07 Mitsubishi Electric Corp Diaphragm for speaker
US5354394A (en) * 1992-11-10 1994-10-11 Seeton Technologies Apparatus and method for forming honeycomb core

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58171196A (en) * 1982-04-01 1983-10-07 Mitsubishi Electric Corp Diaphragm for speaker
JPH0126599B2 (en) * 1982-04-01 1989-05-24 Mitsubishi Electric Corp
US5354394A (en) * 1992-11-10 1994-10-11 Seeton Technologies Apparatus and method for forming honeycomb core

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