JPS5684912A - Manufacture of holl0w cylindrical assembled body - Google Patents
Manufacture of holl0w cylindrical assembled bodyInfo
- Publication number
- JPS5684912A JPS5684912A JP16113579A JP16113579A JPS5684912A JP S5684912 A JPS5684912 A JP S5684912A JP 16113579 A JP16113579 A JP 16113579A JP 16113579 A JP16113579 A JP 16113579A JP S5684912 A JPS5684912 A JP S5684912A
- Authority
- JP
- Japan
- Prior art keywords
- soldering alloy
- wires
- melting point
- manufacture
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Diaphragms For Electromechanical Transducers (AREA)
- Laminated Bodies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
PURPOSE: To manufacture a fine core member with a simple process by a method wherein a soldering alloy wires coated with synthetic resin on the surface thereof are fused to integralize themselves, thereafter, the soldering alloy wires are removed by raising the temperature thereof to a temperature higher than the melting point of the soldering alloy.
CONSTITUTION: A compound body 1 consisting of thermoplastic or thermosetting resin and inorganic powder is coated as a thin layer on the surface of the soldering alloy wire 2 while the alloy wires 2 are contacted each other in the longitudinal direction thereof respectively and are heated to a temperature lower than the melting point of the soldering alloy wire to integralize them by thermal fusion or thermal setting of single wires each other. The integralized structure is heated to a temperature higher than the melting point of the soldering alloy to remove the soldering alloy wires from the structure. According to this method, the fine core member may be manufactured by the simple process.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16113579A JPS5684912A (en) | 1979-12-11 | 1979-12-11 | Manufacture of holl0w cylindrical assembled body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16113579A JPS5684912A (en) | 1979-12-11 | 1979-12-11 | Manufacture of holl0w cylindrical assembled body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5684912A true JPS5684912A (en) | 1981-07-10 |
Family
ID=15729254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16113579A Pending JPS5684912A (en) | 1979-12-11 | 1979-12-11 | Manufacture of holl0w cylindrical assembled body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5684912A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58171196A (en) * | 1982-04-01 | 1983-10-07 | Mitsubishi Electric Corp | Diaphragm for speaker |
US5354394A (en) * | 1992-11-10 | 1994-10-11 | Seeton Technologies | Apparatus and method for forming honeycomb core |
-
1979
- 1979-12-11 JP JP16113579A patent/JPS5684912A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58171196A (en) * | 1982-04-01 | 1983-10-07 | Mitsubishi Electric Corp | Diaphragm for speaker |
JPH0126599B2 (en) * | 1982-04-01 | 1989-05-24 | Mitsubishi Electric Corp | |
US5354394A (en) * | 1992-11-10 | 1994-10-11 | Seeton Technologies | Apparatus and method for forming honeycomb core |
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