DE69410737T2 - Vorrichtung und Verfahren zum Löten von elektronischen Baugruppen auf Leiterplatten - Google Patents
Vorrichtung und Verfahren zum Löten von elektronischen Baugruppen auf LeiterplattenInfo
- Publication number
- DE69410737T2 DE69410737T2 DE69410737T DE69410737T DE69410737T2 DE 69410737 T2 DE69410737 T2 DE 69410737T2 DE 69410737 T DE69410737 T DE 69410737T DE 69410737 T DE69410737 T DE 69410737T DE 69410737 T2 DE69410737 T2 DE 69410737T2
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- circuit boards
- electronic assemblies
- soldering electronic
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/286—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26528193 | 1993-10-25 | ||
JP26669093 | 1993-10-26 | ||
JP4579894 | 1994-03-16 | ||
JP13592694 | 1994-06-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
DE69410737D1 DE69410737D1 (de) | 1998-07-09 |
DE69410737T2 true DE69410737T2 (de) | 1998-10-01 |
DE69410737T3 DE69410737T3 (de) | 2001-04-19 |
Family
ID=27461782
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69431001T Expired - Lifetime DE69431001T2 (de) | 1993-10-25 | 1994-10-25 | Lötpaste |
DE69429633T Expired - Lifetime DE69429633T2 (de) | 1993-10-25 | 1994-10-25 | Infrarotheizvorrichtung |
DE69410737T Expired - Lifetime DE69410737T3 (de) | 1993-10-25 | 1994-10-25 | Vorrichtung und Verfahren zum Löten von elektronischen Baugruppen auf Leiterplatten |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69431001T Expired - Lifetime DE69431001T2 (de) | 1993-10-25 | 1994-10-25 | Lötpaste |
DE69429633T Expired - Lifetime DE69429633T2 (de) | 1993-10-25 | 1994-10-25 | Infrarotheizvorrichtung |
Country Status (3)
Country | Link |
---|---|
US (2) | US5607609A (de) |
EP (3) | EP0649699B2 (de) |
DE (3) | DE69431001T2 (de) |
Families Citing this family (65)
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JPH02129884A (ja) * | 1988-11-08 | 1990-05-17 | Nkk Corp | 赤外線放射体 |
JPH02144990A (ja) * | 1988-11-28 | 1990-06-04 | Nec Corp | ベーパーソルダリング方法 |
DE3841447C1 (de) * | 1988-12-09 | 1990-08-02 | Heraeus Quarzschmelze Gmbh, 6450 Hanau, De | |
DE8906375U1 (de) * | 1989-05-23 | 1989-09-07 | Inter Control Hermann Koehler Elektrik Gmbh & Co Kg, 8500 Nuernberg, De | |
JPH03214688A (ja) * | 1990-01-18 | 1991-09-19 | Matsushita Electric Ind Co Ltd | 電子部品の加熱処理装置 |
US5154338A (en) * | 1990-06-06 | 1992-10-13 | Senju Metal Industry Co., Ltd. | Solder reflow furnace |
US5262594A (en) * | 1990-10-12 | 1993-11-16 | Compaq Computer Corporation | Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same |
JPH04209671A (ja) * | 1990-12-05 | 1992-07-31 | Fujitsu Ltd | ソルダーレジストインキ |
US5345061A (en) * | 1992-09-15 | 1994-09-06 | Vitronics Corporation | Convection/infrared solder reflow apparatus utilizing controlled gas flow |
DE4238597A1 (de) * | 1992-11-16 | 1994-05-19 | Lothar Himmelreich | Heizstrahler insbesondere für Lötofen zum Aufschmelzlöten von elektronischen Bauelementen |
US5607609A (en) * | 1993-10-25 | 1997-03-04 | Fujitsu Ltd. | Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering |
-
1994
- 1994-10-24 US US08/327,907 patent/US5607609A/en not_active Expired - Lifetime
- 1994-10-25 EP EP94307796A patent/EP0649699B2/de not_active Expired - Lifetime
- 1994-10-25 DE DE69431001T patent/DE69431001T2/de not_active Expired - Lifetime
- 1994-10-25 EP EP97120071A patent/EP0829323B1/de not_active Expired - Lifetime
- 1994-10-25 DE DE69429633T patent/DE69429633T2/de not_active Expired - Lifetime
- 1994-10-25 DE DE69410737T patent/DE69410737T3/de not_active Expired - Lifetime
- 1994-10-25 EP EP97120070A patent/EP0829324B1/de not_active Expired - Lifetime
-
1997
- 1997-01-07 US US08/779,523 patent/US5770835A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0649699A2 (de) | 1995-04-26 |
EP0829324B1 (de) | 2002-07-17 |
US5770835A (en) | 1998-06-23 |
EP0649699B2 (de) | 2000-12-13 |
EP0829323A3 (de) | 1998-05-06 |
US5607609A (en) | 1997-03-04 |
EP0829324A1 (de) | 1998-03-18 |
DE69431001D1 (de) | 2002-08-22 |
DE69429633T2 (de) | 2002-06-20 |
DE69410737D1 (de) | 1998-07-09 |
EP0649699B1 (de) | 1998-06-03 |
DE69429633D1 (de) | 2002-02-14 |
EP0649699A3 (de) | 1995-07-12 |
DE69431001T2 (de) | 2002-10-31 |
EP0829323B1 (de) | 2002-01-09 |
EP0829323A2 (de) | 1998-03-18 |
DE69410737T3 (de) | 2001-04-19 |
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8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE |