DE69109253T2 - Verfahren und Vorrichtung zum Nivellieren von Lötzinn auf Leiterplatten. - Google Patents

Verfahren und Vorrichtung zum Nivellieren von Lötzinn auf Leiterplatten.

Info

Publication number
DE69109253T2
DE69109253T2 DE69109253T DE69109253T DE69109253T2 DE 69109253 T2 DE69109253 T2 DE 69109253T2 DE 69109253 T DE69109253 T DE 69109253T DE 69109253 T DE69109253 T DE 69109253T DE 69109253 T2 DE69109253 T2 DE 69109253T2
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
leveling
solder
leveling solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69109253T
Other languages
English (en)
Other versions
DE69109253D1 (de
Inventor
John Leroy Parker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69109253D1 publication Critical patent/DE69109253D1/de
Publication of DE69109253T2 publication Critical patent/DE69109253T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/045—Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Molten Solder (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE69109253T 1990-12-17 1991-12-02 Verfahren und Vorrichtung zum Nivellieren von Lötzinn auf Leiterplatten. Expired - Fee Related DE69109253T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/628,789 US5110036A (en) 1990-12-17 1990-12-17 Method and apparatus for solder leveling of printed circuit boards

Publications (2)

Publication Number Publication Date
DE69109253D1 DE69109253D1 (de) 1995-06-01
DE69109253T2 true DE69109253T2 (de) 1995-12-21

Family

ID=24520312

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69109253T Expired - Fee Related DE69109253T2 (de) 1990-12-17 1991-12-02 Verfahren und Vorrichtung zum Nivellieren von Lötzinn auf Leiterplatten.

Country Status (6)

Country Link
US (1) US5110036A (de)
EP (1) EP0491492B1 (de)
JP (1) JP3062330B2 (de)
KR (1) KR920014380A (de)
CA (1) CA2054407C (de)
DE (1) DE69109253T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5379943A (en) * 1993-10-19 1995-01-10 Ncr Corporation Hot air circulation apparatus and method for wave soldering machines
US5388756A (en) * 1993-12-27 1995-02-14 At&T Corp. Method and apparatus for removing contaminants from solder
DE19609678C2 (de) * 1996-03-12 2003-04-17 Infineon Technologies Ag Speicherzellenanordnung mit streifenförmigen, parallel verlaufenden Gräben und vertikalen MOS-Transistoren und Verfahren zu deren Herstellung
US7918383B2 (en) * 2004-09-01 2011-04-05 Micron Technology, Inc. Methods for placing substrates in contact with molten solder
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
US7845540B2 (en) * 2005-08-30 2010-12-07 Micron Technology, Inc. Systems and methods for depositing conductive material into openings in microfeature workpieces
CN102695372A (zh) * 2011-03-24 2012-09-26 代芳 一种喷液态金属焊料微颗粒的喷锡技术
CN102689068A (zh) * 2011-03-24 2012-09-26 代芳 一种增加喷焊料微颗粒的喷锡技术
US20140036427A1 (en) * 2012-08-02 2014-02-06 Tanigurogumi Corporation Component having an electrode corrosion preventing layer and a method for manufacturing the component

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661315A (en) * 1969-06-13 1972-05-09 North American Rockwell Material removing device
US3924794A (en) * 1973-08-14 1975-12-09 Us Energy Solder leveling process
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
JPS5258042A (en) * 1975-11-10 1977-05-13 Hitachi Ltd Dip soldering device
US4356840A (en) * 1976-05-24 1982-11-02 Powell Industries, Inc. Digital fluid flow control system
US4619841A (en) * 1982-09-13 1986-10-28 Schwerin Thomas E Solder leveler
FR2550185B1 (fr) * 1983-08-05 1986-06-20 Saint Gobain Vitrage Trempe de volumes de verre par jet diphasique
US4776731A (en) * 1986-11-26 1988-10-11 Briggs Technology, Inc. Method and apparatus for conveying solids using a high velocity vacuum
US4847043A (en) * 1988-01-25 1989-07-11 General Electric Company Steam-assisted jet pump
US4995411A (en) * 1988-10-07 1991-02-26 Hollis Automation, Inc. Mass soldering system providing an improved fluid blast
US4958052A (en) * 1989-02-14 1990-09-18 Mahieu William R ARC severing and displacement method and apparatus for fault current interruption

Also Published As

Publication number Publication date
EP0491492B1 (de) 1995-04-26
US5110036A (en) 1992-05-05
KR920014380A (ko) 1992-07-30
CA2054407A1 (en) 1992-06-18
CA2054407C (en) 1996-07-02
JP3062330B2 (ja) 2000-07-10
JPH04291990A (ja) 1992-10-16
DE69109253D1 (de) 1995-06-01
EP0491492A2 (de) 1992-06-24
EP0491492A3 (en) 1993-05-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee