JPS5258042A - Dip soldering device - Google Patents
Dip soldering deviceInfo
- Publication number
- JPS5258042A JPS5258042A JP13408775A JP13408775A JPS5258042A JP S5258042 A JPS5258042 A JP S5258042A JP 13408775 A JP13408775 A JP 13408775A JP 13408775 A JP13408775 A JP 13408775A JP S5258042 A JPS5258042 A JP S5258042A
- Authority
- JP
- Japan
- Prior art keywords
- soldering device
- dip soldering
- dip
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13408775A JPS5258042A (en) | 1975-11-10 | 1975-11-10 | Dip soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13408775A JPS5258042A (en) | 1975-11-10 | 1975-11-10 | Dip soldering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5258042A true JPS5258042A (en) | 1977-05-13 |
Family
ID=15120100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13408775A Pending JPS5258042A (en) | 1975-11-10 | 1975-11-10 | Dip soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5258042A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63268563A (en) * | 1977-12-02 | 1988-11-07 | クーパー インダストリーズ,インコーポレーテッド | Device for matrix-binding printed wiring circuit board by solder |
US5110036A (en) * | 1990-12-17 | 1992-05-05 | At&T Bell Laboratories | Method and apparatus for solder leveling of printed circuit boards |
EP1205951A2 (en) * | 2000-11-08 | 2002-05-15 | Vacuumschmelze GmbH & Co. KG | Process and device for contacting the winding wire of a coil |
-
1975
- 1975-11-10 JP JP13408775A patent/JPS5258042A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63268563A (en) * | 1977-12-02 | 1988-11-07 | クーパー インダストリーズ,インコーポレーテッド | Device for matrix-binding printed wiring circuit board by solder |
US5110036A (en) * | 1990-12-17 | 1992-05-05 | At&T Bell Laboratories | Method and apparatus for solder leveling of printed circuit boards |
EP1205951A2 (en) * | 2000-11-08 | 2002-05-15 | Vacuumschmelze GmbH & Co. KG | Process and device for contacting the winding wire of a coil |
EP1205951A3 (en) * | 2000-11-08 | 2003-09-24 | Vacuumschmelze GmbH & Co. KG | Process and device for contacting the winding wire of a coil |
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