JPS5258042A - Dip soldering device - Google Patents

Dip soldering device

Info

Publication number
JPS5258042A
JPS5258042A JP13408775A JP13408775A JPS5258042A JP S5258042 A JPS5258042 A JP S5258042A JP 13408775 A JP13408775 A JP 13408775A JP 13408775 A JP13408775 A JP 13408775A JP S5258042 A JPS5258042 A JP S5258042A
Authority
JP
Japan
Prior art keywords
soldering device
dip soldering
dip
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13408775A
Other languages
Japanese (ja)
Inventor
Yuuji Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13408775A priority Critical patent/JPS5258042A/en
Publication of JPS5258042A publication Critical patent/JPS5258042A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
JP13408775A 1975-11-10 1975-11-10 Dip soldering device Pending JPS5258042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13408775A JPS5258042A (en) 1975-11-10 1975-11-10 Dip soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13408775A JPS5258042A (en) 1975-11-10 1975-11-10 Dip soldering device

Publications (1)

Publication Number Publication Date
JPS5258042A true JPS5258042A (en) 1977-05-13

Family

ID=15120100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13408775A Pending JPS5258042A (en) 1975-11-10 1975-11-10 Dip soldering device

Country Status (1)

Country Link
JP (1) JPS5258042A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63268563A (en) * 1977-12-02 1988-11-07 クーパー　インダストリーズ，インコーポレーテッド Device for matrix-binding printed wiring circuit board by solder
US5110036A (en) * 1990-12-17 1992-05-05 At&T Bell Laboratories Method and apparatus for solder leveling of printed circuit boards
EP1205951A2 (en) * 2000-11-08 2002-05-15 Vacuumschmelze GmbH & Co. KG Process and device for contacting the winding wire of a coil

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63268563A (en) * 1977-12-02 1988-11-07 クーパー　インダストリーズ，インコーポレーテッド Device for matrix-binding printed wiring circuit board by solder
US5110036A (en) * 1990-12-17 1992-05-05 At&T Bell Laboratories Method and apparatus for solder leveling of printed circuit boards
EP1205951A2 (en) * 2000-11-08 2002-05-15 Vacuumschmelze GmbH & Co. KG Process and device for contacting the winding wire of a coil
EP1205951A3 (en) * 2000-11-08 2003-09-24 Vacuumschmelze GmbH & Co. KG Process and device for contacting the winding wire of a coil

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