IT1177870B - Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento - Google Patents

Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento

Info

Publication number
IT1177870B
IT1177870B IT8448499A IT4849984A IT1177870B IT 1177870 B IT1177870 B IT 1177870B IT 8448499 A IT8448499 A IT 8448499A IT 4849984 A IT4849984 A IT 4849984A IT 1177870 B IT1177870 B IT 1177870B
Authority
IT
Italy
Prior art keywords
pin
stem
tapered
shoulders
circuit board
Prior art date
Application number
IT8448499A
Other languages
English (en)
Other versions
IT8448499A0 (it
Inventor
Giuseppe Rosario Pinnavaia
Original Assignee
Texas Instr Semiconduttori Ita
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Semiconduttori Ita filed Critical Texas Instr Semiconduttori Ita
Priority to IT8448499A priority Critical patent/IT1177870B/it
Publication of IT8448499A0 publication Critical patent/IT8448499A0/it
Priority to US06/748,390 priority patent/US4995156A/en
Application granted granted Critical
Publication of IT1177870B publication Critical patent/IT1177870B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/091Locally and permanently deformed areas including dielectric material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10757Bent leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10795Details of lead tips, e.g. pointed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10871Leads having an integral insert stop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189Pressing leads, bumps or a die through an insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1446Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1453Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • Y10T29/49833Punching, piercing or reaming part by surface of second part
    • Y10T29/49835Punching, piercing or reaming part by surface of second part with shaping
    • Y10T29/49837Punching, piercing or reaming part by surface of second part with shaping of first part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
IT8448499A 1984-07-04 1984-07-04 Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento IT1177870B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT8448499A IT1177870B (it) 1984-07-04 1984-07-04 Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento
US06/748,390 US4995156A (en) 1984-07-04 1985-06-25 Method for assembling components upon printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8448499A IT1177870B (it) 1984-07-04 1984-07-04 Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento

Publications (2)

Publication Number Publication Date
IT8448499A0 IT8448499A0 (it) 1984-07-04
IT1177870B true IT1177870B (it) 1987-08-26

Family

ID=11266927

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8448499A IT1177870B (it) 1984-07-04 1984-07-04 Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento

Country Status (2)

Country Link
US (1) US4995156A (it)
IT (1) IT1177870B (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419036A (en) * 1994-02-04 1995-05-30 Emd Associates, Inc. Insertion and bending ram and method for its use
DE19614879C1 (de) * 1996-04-16 1997-07-31 Preh Elektro Feinmechanik Verfahren zum lötfreien Befestigen von Bauelementen auf Leiterbahnen und ein nach dem Verfahren hergestelltes elektrisches Bauteil
EP0954208A4 (en) * 1996-12-27 2002-09-11 Matsushita Electric Ind Co Ltd METHOD AND DEVICE FOR FIXING AN ELECTRONIC COMPONENT ON A CIRCUIT BOARD
US20100011660A1 (en) * 2008-07-18 2010-01-21 Clancy Patrick J Water reservoir for plants
KR102337901B1 (ko) 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3061762A (en) * 1962-10-30 figure
GB798130A (en) * 1956-01-13 1958-07-16 Emi Ltd Improvements in or relating to methods of mounting electrical components
US2990533A (en) * 1958-04-09 1961-06-27 Stokes D Hughes Terminal post for circuit board
DE1869736U (de) * 1960-03-24 1963-04-04 Philips Nv Vorrichtung zur anbringung kleiner elektrischer einzelteile, z. b. widerstaende, kondensatoren, roehrenfassungen, brueckendrahte u. dgl. auf einer mit oeffnungen versehenen montageplatte.
US3228091A (en) * 1960-12-30 1966-01-11 Bendix Corp Method of making printed circuit board
FR1353504A (fr) * 1962-12-10 1964-02-28 Schneider Radio Television Perfectionnements à la fabrication d'éléments de circuits électriques
US3443298A (en) * 1966-09-12 1969-05-13 Usm Corp Means for inserting and deflecting components
US4530619A (en) * 1982-09-24 1985-07-23 Buell Industries, Inc. Self-retaining nut and method of applying to a panel

Also Published As

Publication number Publication date
IT8448499A0 (it) 1984-07-04
US4995156A (en) 1991-02-26

Similar Documents

Publication Publication Date Title
EP0193289A3 (en) Electrical connector
JPS5744231B2 (it)
EP0178540A3 (en) Connector for smd technique
GB805378A (en) Improvements in or relating to method and apparatus for applying components to printed circuitry boards
GB2222917A (en) Electrical connector for PCB
IT1177870B (it) Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento
GB1182848A (en) Electrical Contact Pins.
EP0140615A3 (en) Electrical assembly and pin-receptacle for printed circuit board
MY103092A (en) A pin fastened to a printed circuit board by soldering.
MY100046A (en) Printed circuit boards
EP0198697A2 (en) Improvements in or relating to an adaptor for a printed circuit board connector
DE3779157D1 (de) Steckverbinderleiste mit in mindestens zwei parallelen reihen angeordneten kontaktfedern.
ES8309032A1 (es) Un metodo para conectar los bordes de la tarjetas de circuito impreso.
JPS5272166A (en) Coupling of parts
JPS596624Y2 (ja) プリント板直付用コンタクト
JPS6444091A (en) Electronic circuit substrate
JPS6468915A (en) Chip component
JPS6433914A (en) Electronic part
ES272359U (es) Un elemento de contacto electrico.
JPS6433992A (en) Printed circuit board
EP0132704A3 (de) Kontaktstift für elektronische Bauteile, insbesondere Leiterplatten
EP0303370A3 (en) Circuit board component spacer
JPH0521316B2 (it)
JPS6433864A (en) Pin jack
ES478769A1 (es) Componente electrico con alambres de conexion para enchufar-los en taladros de una placa de circuito.

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960712