FR1353504A - Perfectionnements à la fabrication d'éléments de circuits électriques - Google Patents

Perfectionnements à la fabrication d'éléments de circuits électriques

Info

Publication number
FR1353504A
FR1353504A FR918046A FR918046A FR1353504A FR 1353504 A FR1353504 A FR 1353504A FR 918046 A FR918046 A FR 918046A FR 918046 A FR918046 A FR 918046A FR 1353504 A FR1353504 A FR 1353504A
Authority
FR
France
Prior art keywords
manufacture
electrical circuit
circuit elements
elements
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR918046A
Other languages
English (en)
Inventor
Jacques Schneider
Roger Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Radio Television SA
Original Assignee
Schneider Radio Television SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schneider Radio Television SA filed Critical Schneider Radio Television SA
Priority to FR918046A priority Critical patent/FR1353504A/fr
Priority to ES293750A priority patent/ES293750A1/es
Priority to GB48834/63A priority patent/GB1018278A/en
Application granted granted Critical
Publication of FR1353504A publication Critical patent/FR1353504A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H01L2224/75316—Elastomer inlay with retaining mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
FR918046A 1962-12-10 1962-12-10 Perfectionnements à la fabrication d'éléments de circuits électriques Expired FR1353504A (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR918046A FR1353504A (fr) 1962-12-10 1962-12-10 Perfectionnements à la fabrication d'éléments de circuits électriques
ES293750A ES293750A1 (es) 1962-12-10 1963-11-22 Perfeccionamientos en la fabricación de elementos de circuitos eléctricos
GB48834/63A GB1018278A (en) 1962-12-10 1963-12-10 A method of securing components that are mounted on a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR918046A FR1353504A (fr) 1962-12-10 1962-12-10 Perfectionnements à la fabrication d'éléments de circuits électriques

Publications (1)

Publication Number Publication Date
FR1353504A true FR1353504A (fr) 1964-02-28

Family

ID=8792460

Family Applications (1)

Application Number Title Priority Date Filing Date
FR918046A Expired FR1353504A (fr) 1962-12-10 1962-12-10 Perfectionnements à la fabrication d'éléments de circuits électriques

Country Status (3)

Country Link
ES (1) ES293750A1 (fr)
FR (1) FR1353504A (fr)
GB (1) GB1018278A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347275A (en) * 1965-10-07 1967-10-17 Wiremold Co Raceway

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2221237A1 (en) * 1973-03-16 1974-10-11 Santoni Mario Clamp typically for positioning printed cct. components - holds components steady while automatic soldering is being performed
IT1177870B (it) * 1984-07-04 1987-08-26 Texas Instr Semiconduttori Ita Procedimento per il montaggio di componenti,quali m.o.s. e simili,su pannelli di circuiti stampati mediante aggraffatura e pannelli e componenti per l'esecuzione di tale procedimento
DE3624652A1 (de) * 1985-07-23 1987-01-29 Siemens Ag Einrichtung zur montage von elektrischen bauteilen, z.b. doppellochkern- und/oder ringkernspulen, auf einer anschlusstraegerplatte
GB2186825A (en) * 1986-02-19 1987-08-26 Plessey Co Plc Method and apparatus for forming component connections
JPH0325931Y2 (fr) * 1986-10-31 1991-06-05
US4817272A (en) * 1987-08-18 1989-04-04 Zenith Electronics Corporation Lead crimping apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347275A (en) * 1965-10-07 1967-10-17 Wiremold Co Raceway

Also Published As

Publication number Publication date
GB1018278A (en) 1966-01-26
ES293750A1 (es) 1964-03-16

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