GB1018278A - A method of securing components that are mounted on a circuit board - Google Patents

A method of securing components that are mounted on a circuit board

Info

Publication number
GB1018278A
GB1018278A GB48834/63A GB4883463A GB1018278A GB 1018278 A GB1018278 A GB 1018278A GB 48834/63 A GB48834/63 A GB 48834/63A GB 4883463 A GB4883463 A GB 4883463A GB 1018278 A GB1018278 A GB 1018278A
Authority
GB
United Kingdom
Prior art keywords
components
board
dec
circuit board
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB48834/63A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Radio Television SA
Original Assignee
Schneider Radio Television SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schneider Radio Television SA filed Critical Schneider Radio Television SA
Publication of GB1018278A publication Critical patent/GB1018278A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H01L2224/75316—Elastomer inlay with retaining mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

1,018,278. Attaching components to circuit boards; bending cutters. SCHNEIDER RADIO TELEVISION. Dec. 10, 1963 [Dec. 10, 1962], No. 48834/63. Headings B3A and B3W. Components 2 assembled on a circuit board 1 have their wire ends 3 all cut to length on the opposite side of the board in one working sweep of a cutter 6. The latter also partly bends over the severed ends which are subsequently bent against the board by a further sweep tool 8. A third tool may be used to scrape the bent-over ends prior to dipping in a solder bath. Board 1 is preferably a printed circuit in which the components are assembled manually or automatically. During cutting and bending of the wire ends, the components are held in place by a cushion of foam rubber 11, Fig. 6 (not shown), mounted on a piston. The cutter blade 6 is adjustable transversely, Fig. 3 (not shown).
GB48834/63A 1962-12-10 1963-12-10 A method of securing components that are mounted on a circuit board Expired GB1018278A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR918046A FR1353504A (en) 1962-12-10 1962-12-10 Improvements in the manufacture of electrical circuit elements

Publications (1)

Publication Number Publication Date
GB1018278A true GB1018278A (en) 1966-01-26

Family

ID=8792460

Family Applications (1)

Application Number Title Priority Date Filing Date
GB48834/63A Expired GB1018278A (en) 1962-12-10 1963-12-10 A method of securing components that are mounted on a circuit board

Country Status (3)

Country Link
ES (1) ES293750A1 (en)
FR (1) FR1353504A (en)
GB (1) GB1018278A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2221237A1 (en) * 1973-03-16 1974-10-11 Santoni Mario Clamp typically for positioning printed cct. components - holds components steady while automatic soldering is being performed
DE3624652A1 (en) * 1985-07-23 1987-01-29 Siemens Ag Device for the mounting of electrical components, for example double-holed coils and/or annular-core coils (toroidal-core coils) on a connecting supporting board
GB2186825A (en) * 1986-02-19 1987-08-26 Plessey Co Plc Method and apparatus for forming component connections
EP0266700A2 (en) * 1986-10-31 1988-05-11 Max Co., Ltd. Mechanism for cutting staple legs in a stapler
US4817272A (en) * 1987-08-18 1989-04-04 Zenith Electronics Corporation Lead crimping apparatus
US4995156A (en) * 1984-07-04 1991-02-26 Texas Instruments Incorporated Method for assembling components upon printed circuit boards

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347275A (en) * 1965-10-07 1967-10-17 Wiremold Co Raceway

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2221237A1 (en) * 1973-03-16 1974-10-11 Santoni Mario Clamp typically for positioning printed cct. components - holds components steady while automatic soldering is being performed
US4995156A (en) * 1984-07-04 1991-02-26 Texas Instruments Incorporated Method for assembling components upon printed circuit boards
DE3624652A1 (en) * 1985-07-23 1987-01-29 Siemens Ag Device for the mounting of electrical components, for example double-holed coils and/or annular-core coils (toroidal-core coils) on a connecting supporting board
GB2186825A (en) * 1986-02-19 1987-08-26 Plessey Co Plc Method and apparatus for forming component connections
EP0266700A2 (en) * 1986-10-31 1988-05-11 Max Co., Ltd. Mechanism for cutting staple legs in a stapler
EP0266700A3 (en) * 1986-10-31 1990-01-17 Max Co., Ltd. Mechanism for cutting staple legs in a stapler
US4817272A (en) * 1987-08-18 1989-04-04 Zenith Electronics Corporation Lead crimping apparatus

Also Published As

Publication number Publication date
FR1353504A (en) 1964-02-28
ES293750A1 (en) 1964-03-16

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