GB2186825A - Method and apparatus for forming component connections - Google Patents

Method and apparatus for forming component connections Download PDF

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Publication number
GB2186825A
GB2186825A GB08604124A GB8604124A GB2186825A GB 2186825 A GB2186825 A GB 2186825A GB 08604124 A GB08604124 A GB 08604124A GB 8604124 A GB8604124 A GB 8604124A GB 2186825 A GB2186825 A GB 2186825A
Authority
GB
United Kingdom
Prior art keywords
component
forming
support surface
connections
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08604124A
Other versions
GB8604124D0 (en
Inventor
B Schofield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB08604124A priority Critical patent/GB2186825A/en
Publication of GB8604124D0 publication Critical patent/GB8604124D0/en
Publication of GB2186825A publication Critical patent/GB2186825A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/043Feeding one by one by other means than belts
    • H05K13/0443Feeding one by one by other means than belts incorporating means for treating the terminal leads before and after insertion or only after insertion

Abstract

The method concerns forming, by bending, the legs (8,9) of integrated circuits I.C.'s (7) mounted on a printed circuit board p.c.b. (1) to prevent displacement of the I.C.'s (7) during the p.c.b. manufacturing process. The apparatus for preforming the method comprises a jig into which the p.c.b. (1) is positioned. A moveable plate (15) carries a plurality of forming pins 14 arranged in a matrix so that each pin corresponds to the position of a loosely mounted I.C. by longitudinal movement of the moveable plate 15 in opposite directions (A,B) through the intermediary of an actuating arm (17), two pins on the I.C. are formed by bending them outwardly from the vertical. The actuating arm can be operated manually or by automatic machine means. <IMAGE>

Description

SPECIFICATION Method and apparatus for forming component connections The present invention relates to a method and apparatus for forming component connections.
This invention finds particular utility in forming the connections or legs of an integrated circuit (I.C.) mounted upon a support surface eg. a printed circuit board (p.c.b.).
However, the principles of this invention can be extended to forming the connections of other components, for instance, resistors or the like.
An aim of this invention envisages the method for forming component connections and an apparatus enabling the implementation of said method in an efficient and expeditious manner.
According to this invention there is provided a method of forming a plurality of component connections of a plurality of components mounted on one side of a support surface and having their connections projecting through apertures to the other side of the support surface, the forming operation involving the bending of at least two of the connections, or legs of each component in opposing directions on said other side of the support surface to prevent displacement of said component.
According to this invention there is provided apparatus for use in said method comprising a jig for location of the support surface and including support means for supporting the support surface, component retaining means for temporarily retaining the components upon the support surface and moveable component connection forming means, wherein movement of said moveable component connection forming means in opposing directions effects cooperation with the component connections to form them by bending them in opposing directions thereby preventing component displacement from the support surface.
The invention will be better understood from the following description of an exemplary embodiment which should be read in conjunction with the accompanying drawings in which; Figure 1 shows a general view of the apparatus or jig in accordance with this invention; Figure 2 shows a side view of the apparatus or jig, as viewed in the direction of arrow C in Fig. 1, with a printed circuit board secured therein in readiness for the connection forming operation; Figure 3 shows a further view similar to that shown in 2 where the connection forming operation has been performed on one of the connections of the components mounted on the board; and Figure 4 shows yet a further view similar to that shown in Fig. 2 where the connection forming operation has been performed on the other of the connections of the components mounted on the board.
Refering now to the drawings generally showing the apparatus which comprises a jig.
The purpose of the jig is to position a printed circuit board (p.c.b.) within the jig in order to form certain electrical connections or legs, by bending, of a plurality of integrated circuits (I.C.'s) mounted in the board.
The printed circuit board p.c.b. comprises a support surface 1 and is positioned within the jib on a plurality of support means in the form of posts 2 and 3 standing vertically from a base plate 4. Two forward posts 3 include locating pins 5 at their upper ends which pass through apertures 6 in the p.c.b. thereby ensur8ing correct alignment of the p.c.b. within the jig in preparation for the forming of l.C.
legs.
The p.c.b. carries a plurality of loosely mounted integrated circuits (I.C.'s) 7 having their connections or legs 8 and 9 projecting through aperatures 10 and 11 respectively.
The l.C.'s are temporarily held in position by a resilient piece of material 12 such as sponge rubber, which is attached to a backing plate 13 which is hinged in the base plate 4. The hinged backing plate 13 is brought down upon the p.c.b. 1 so that the resilient material 12 presses against the l.C.'s 7. The backing plate 13 is secured in this closed position by a latching means (not shown) which is released upon completion of the leg forming operation to remove the p.c.b. 1.
The leg forming operation is carried out by mans of a plurality of connection forming means or forming pins 14 arranged in a matrix arrangement on a moveable plate 15 which is capable of variable longitudinal movement in opposite directions A and B on the base plate 4, below the p.c.b.1. The longitudinal movement is limited by the use of variable stops (not shown) acting on the actuating arm 17.
Four apertures 16 through which the posts 2 project are provided to permit the movement of the plate 15.
An actuating arm 17 seats in a channel 18 and is secured therein by plates 19 and 20.
The actuating arm 17 is secured to the moveable plate 15 by means (not shown) so that movement of the actuating arm 17 in opposite directions A and B effects movement of the moveable plate 15 and the forming pins 14 on it. Movement can be imparted to the arm 17 by either manual means or automatic means through a pneumatic intermediary forming part of an automatic machine.
The matrix of forming pins 14 in this embodiment is 9x7 with each forming pin 14 being located between two component connections or l.C. legs. Thus, when the actuating arm 17 is moved in direction B (Fig. 3) the forming pins 14 come into contact with the legs 8 causing them to bend away from the vertical. Likewise, when the actuating arm is moved in direction A (Fig. 4) the forming pins 14 come into contact with legs 9 causing them to bend away from the vertical.
Accordingly, when the p.c.b. is removed from the jig the I.C.'s are retained on the board 1 in readiness for further manufacture processing of the p.c.b.
It should be understood that while the present embodiment illustrates a 9 x 7 matrix arrangement of forming pins 14 on the plate 15 any other matrix arrangement can be used to suit the particular component layout on the p.c.b. Indeed the arrangement of the forming pins 14 need not necessarily be uniform as shown in this embodiment. Further, the moveable plate 15 is preferably readily interchangeable to meet the particular requirement of pin layout.

Claims (18)

1. A method of forming a plurality of component connections of a plurality of components mounted on one side of a support surface and having their connections projecting through apertures to the other side of the support surface, the forming operation involving the bending of at least two of the connections, or legs, of each component in opposing directions on said other side of the support surface to prevent displacement of said component.
2. A method as claimed in claim 1, in which the support surface is positioned within apparatus which is adapted for bending the connections.
3. Apparatus for use in said method as claimed in claims 1 and 2, comprising a jig for location of the support surface and including support means for supporting the support surface, component retaining means for tempo rarily retaining the components upon the sup port surface and moveable component con nection forming means, wherein movement of said moveable component connection forming means in opposing directions effects cooperation with the component connections to form them by bending them in opposing directions thereby preventing component displacement from the support surface.
4. Apparatus as claimed in claims 3, in which the support means comprise a plurality of posts standing vertically from a base plate.
5. Apparatus as claimed in claim 4, in which two forward posts include locating pins which are adapted to pass through apertures in the support means for alignment purposes of the support surface when positioned within the jig.
6. Apparatus as claimed in claim 3, in which the component retaining means com prises a resilient piece of material attached to a backing plate.
7. Apparatus as claimed in claim 6, in which the backing plate is hinged on the base plate and is securable in a closed position by latch means.
8. Apparatus as claimed in claim 3, in which the moveable component connection forming means comprises a plurality of pins arranged on a moveable plate which is capable of limited longitudinal movement in opposite directions the movement being limited by variable stops acting on the actuating arm.
9. Apparatus as claimed in claim 8, in which the moveable plate includes an actuating arm which seats in a channel in the base plate, wherein longitudinal movement of the actuating arm in opposite directions effects corresponding movement of the moveable plate and the forming pins.
10. Apparatus as claimed in claim 9, in which forming pins are arranged such that each forming pin is located between two component connections such that movement of the forming pin in both longitudinal directions forms the component connections by bending them from the vertical.
11. Apparatus as claimed in claim 10, in which the forming pins are arranged in a matrix.
12. Apparatus as claimed in claim 11, in which the moveable plate is interchangeable.
13. Apparatus as claimed in claim 9, in which movement is imparted to the actuating arm by manual means.
14. Apparatus as claimed in claim 9, in which movement is imparted to the actuating arm from automatic machine means.
15. Apparatus as claimed in any one preceding claim, in which the components are integrated circuits and the component connections are integrated circuit legs.
16. Apparatus as claimed in any one of claims 1 to 14, in which the support surface is a printed circuit board.
17. A method substantially as described herein, with reference to, and as shown, in the accompanying drawings.
18. Apparatus substantially as described herein with reference to, and as shown, in the accompanying drawings.
GB08604124A 1986-02-19 1986-02-19 Method and apparatus for forming component connections Withdrawn GB2186825A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08604124A GB2186825A (en) 1986-02-19 1986-02-19 Method and apparatus for forming component connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08604124A GB2186825A (en) 1986-02-19 1986-02-19 Method and apparatus for forming component connections

Publications (2)

Publication Number Publication Date
GB8604124D0 GB8604124D0 (en) 1986-03-26
GB2186825A true GB2186825A (en) 1987-08-26

Family

ID=10593334

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08604124A Withdrawn GB2186825A (en) 1986-02-19 1986-02-19 Method and apparatus for forming component connections

Country Status (1)

Country Link
GB (1) GB2186825A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4817272A (en) * 1987-08-18 1989-04-04 Zenith Electronics Corporation Lead crimping apparatus
EP0542095A1 (en) * 1991-11-11 1993-05-19 Siemens Aktiengesellschaft Apparatus for securing components to multipole printed circuit boards

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB784276A (en) * 1954-12-28 1957-10-09 Gen Mills Inc Improvements in or relating to assembly machine for circuit components
GB1018278A (en) * 1962-12-10 1966-01-26 Schneider Radio Television A method of securing components that are mounted on a circuit board
US3732898A (en) * 1971-10-06 1973-05-15 Westinghouse Electric Corp Bending apparatus for multiple wire-like articles
GB1364528A (en) * 1972-09-06 1974-08-21 Elite Eng Ltd Method and machine for securing a wired component to a printed circuit board
GB1539840A (en) * 1976-09-07 1979-02-07 Usm Corp Machines adapted for use in automatically assembling articles on workpieces
GB1562413A (en) * 1975-11-26 1980-03-12 Usm Corp Mechanism for cutting and clinching leads of electronic components
GB1589543A (en) * 1976-09-17 1981-05-13 Matsushita Electric Ind Co Ltd Automatic component assembling apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB784276A (en) * 1954-12-28 1957-10-09 Gen Mills Inc Improvements in or relating to assembly machine for circuit components
GB1018278A (en) * 1962-12-10 1966-01-26 Schneider Radio Television A method of securing components that are mounted on a circuit board
US3732898A (en) * 1971-10-06 1973-05-15 Westinghouse Electric Corp Bending apparatus for multiple wire-like articles
GB1364528A (en) * 1972-09-06 1974-08-21 Elite Eng Ltd Method and machine for securing a wired component to a printed circuit board
GB1562413A (en) * 1975-11-26 1980-03-12 Usm Corp Mechanism for cutting and clinching leads of electronic components
GB1539840A (en) * 1976-09-07 1979-02-07 Usm Corp Machines adapted for use in automatically assembling articles on workpieces
GB1589543A (en) * 1976-09-17 1981-05-13 Matsushita Electric Ind Co Ltd Automatic component assembling apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4817272A (en) * 1987-08-18 1989-04-04 Zenith Electronics Corporation Lead crimping apparatus
EP0542095A1 (en) * 1991-11-11 1993-05-19 Siemens Aktiengesellschaft Apparatus for securing components to multipole printed circuit boards

Also Published As

Publication number Publication date
GB8604124D0 (en) 1986-03-26

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)