JPS6433992A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPS6433992A
JPS6433992A JP18883387A JP18883387A JPS6433992A JP S6433992 A JPS6433992 A JP S6433992A JP 18883387 A JP18883387 A JP 18883387A JP 18883387 A JP18883387 A JP 18883387A JP S6433992 A JPS6433992 A JP S6433992A
Authority
JP
Japan
Prior art keywords
external connection
connection lead
protruding part
circuit board
lands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18883387A
Other languages
Japanese (ja)
Inventor
Norio Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP18883387A priority Critical patent/JPS6433992A/en
Publication of JPS6433992A publication Critical patent/JPS6433992A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

PURPOSE:To make it possible to widen a gap between the protruding part of an external connection lead and a neighboring external connection lead inserting land, by making the protruding part of an external connection lead protrude with a space in the cross direction from the arrangement direction of external connection lead inserting lands. CONSTITUTION:An external connection leads 22 is inserted into a land hole 30, and connected electrically to an electronic parts 21. A plurality of external connection lead inserting lands 29 are deposed in an array on a mother circuit board 23. The external connection lead 22 is provided with a protruding part 22a for positioning to regulate the insertion degree with respect to the land hole 30. In this printed circuit board, the protruding part 22a of the above external connection lead 22 is made to protrude with a space in the cross direction from the arrangement direction of external connection lead inserting lands 29. For example, the above protruding part 22a is bent in the vertical direction to the arrangement direction of external connection lead inserting lands 29. A positioning surface 22b of the tip part of the protruding part is brought into contact with the upper surface of an insulating substrate 28 of the mother printed circuit board 23.
JP18883387A 1987-07-30 1987-07-30 Printed circuit board Pending JPS6433992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18883387A JPS6433992A (en) 1987-07-30 1987-07-30 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18883387A JPS6433992A (en) 1987-07-30 1987-07-30 Printed circuit board

Publications (1)

Publication Number Publication Date
JPS6433992A true JPS6433992A (en) 1989-02-03

Family

ID=16230636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18883387A Pending JPS6433992A (en) 1987-07-30 1987-07-30 Printed circuit board

Country Status (1)

Country Link
JP (1) JPS6433992A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252857A (en) * 1991-08-05 1993-10-12 International Business Machines Corporation Stacked DCA memory chips
US5970172A (en) * 1995-12-28 1999-10-19 Nec Corporation Hadamard transform coding/decoding device for image signals
CN102983432A (en) * 2012-11-20 2013-03-20 芜湖通和汽车管路系统有限公司 Terminal structure of circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252857A (en) * 1991-08-05 1993-10-12 International Business Machines Corporation Stacked DCA memory chips
US5970172A (en) * 1995-12-28 1999-10-19 Nec Corporation Hadamard transform coding/decoding device for image signals
CN102983432A (en) * 2012-11-20 2013-03-20 芜湖通和汽车管路系统有限公司 Terminal structure of circuit board

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