CN102487020B - 形成引线上凸块互连的半导体器件和方法 - Google Patents

形成引线上凸块互连的半导体器件和方法 Download PDF

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Publication number
CN102487020B
CN102487020B CN201110046082.XA CN201110046082A CN102487020B CN 102487020 B CN102487020 B CN 102487020B CN 201110046082 A CN201110046082 A CN 201110046082A CN 102487020 B CN102487020 B CN 102487020B
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bump
substrate
conductive
die
interconnection structure
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CN102487020A (zh
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R.D.潘德塞
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Stats Chippac Shanghai Co Ltd
Stats Chippac Pte Ltd
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Stats Chippac Shanghai Co Ltd
Stats Chippac Pte Ltd
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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201110046082.XA 2010-12-03 2011-02-25 形成引线上凸块互连的半导体器件和方法 Active CN102487020B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/960,178 US8574959B2 (en) 2003-11-10 2010-12-03 Semiconductor device and method of forming bump-on-lead interconnection
US12/960178 2010-12-03

Publications (2)

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