ATE96552T1 - Lichtempfindliche waermehaertbare harzzusammensetzung und methode zur herstellung von loetstoppmasken damit. - Google Patents

Lichtempfindliche waermehaertbare harzzusammensetzung und methode zur herstellung von loetstoppmasken damit.

Info

Publication number
ATE96552T1
ATE96552T1 AT88119493T AT88119493T ATE96552T1 AT E96552 T1 ATE96552 T1 AT E96552T1 AT 88119493 T AT88119493 T AT 88119493T AT 88119493 T AT88119493 T AT 88119493T AT E96552 T1 ATE96552 T1 AT E96552T1
Authority
AT
Austria
Prior art keywords
resistance
resin composition
curing resin
photosensitive
excels
Prior art date
Application number
AT88119493T
Other languages
English (en)
Inventor
Yuichi Kamayachi
Kenji Sawazaki
Morio Suzuki
Shoji Inagaki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17879137&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE96552(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Application granted granted Critical
Publication of ATE96552T1 publication Critical patent/ATE96552T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/72—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Polyethers (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT88119493T 1987-11-30 1988-11-23 Lichtempfindliche waermehaertbare harzzusammensetzung und methode zur herstellung von loetstoppmasken damit. ATE96552T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62299967A JPH0717737B2 (ja) 1987-11-30 1987-11-30 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
EP88119493A EP0323563B1 (de) 1987-11-30 1988-11-23 Lichtempfindliche wärmehärtbare Harzzusammensetzung und Methode zur Herstellung von Lötstoppmasken damit

Publications (1)

Publication Number Publication Date
ATE96552T1 true ATE96552T1 (de) 1993-11-15

Family

ID=17879137

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88119493T ATE96552T1 (de) 1987-11-30 1988-11-23 Lichtempfindliche waermehaertbare harzzusammensetzung und methode zur herstellung von loetstoppmasken damit.

Country Status (9)

Country Link
US (1) US4943516A (de)
EP (1) EP0323563B1 (de)
JP (1) JPH0717737B2 (de)
KR (1) KR910008706B1 (de)
CN (2) CN1028535C (de)
AT (1) ATE96552T1 (de)
CA (1) CA1331711C (de)
DE (1) DE3885260T2 (de)
HK (1) HK104495A (de)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3735088A1 (de) * 1987-10-16 1989-04-27 Hoechst Ag Photopolymerisierbares gemisch
GB8822145D0 (en) * 1988-09-21 1988-10-26 Ciba Geigy Ag Method
US5312719A (en) * 1988-10-26 1994-05-17 E. I. Du Pont De Nemours And Company Developing solvent for layers which are crosslinkable by photopolymerization and process for the production of relief forms
DE3836403A1 (de) * 1988-10-26 1990-05-03 Hoechst Ag Entwicklungsloesemittel fuer durch photopolymerisation vernetzbare schichten sowie verfahren zur herstellung von reliefformen
JPH0823695B2 (ja) * 1988-12-27 1996-03-06 タムラ化研株式会社 感光性樹脂組成物
JPH02255714A (ja) * 1989-03-29 1990-10-16 Hitachi Ltd 光硬化性ジアリルフタレート樹脂組成物及びそれを用いたプリント回路板
US5100768A (en) * 1989-05-09 1992-03-31 Kabushiki Kaisha Toshiba Photosensitive composition
JPH0371137A (ja) * 1989-08-11 1991-03-26 Tamura Kaken Kk 感光性樹脂組成物
DE3931467A1 (de) * 1989-09-21 1991-04-04 Hoechst Ag Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske
JP2825558B2 (ja) * 1989-10-25 1998-11-18 株式会社日立製作所 組成物及びこの樹脂組成物を使用した多層プリント回路板の製造方法
JPH03191352A (ja) * 1989-12-15 1991-08-21 W R Grace & Co 感光性樹脂組成物
JPH04136857A (ja) * 1990-09-28 1992-05-11 Hitachi Ltd 光硬化性レジスト組成物およびこれを用いたプリント回路板の製造方法およびプリント回路板
GB9105561D0 (en) * 1991-03-15 1991-05-01 Coates Brothers Plc Image formation
JP2587548B2 (ja) * 1991-05-27 1997-03-05 富山日本電気株式会社 印刷配線板の製造方法
JPH05343837A (ja) * 1992-06-05 1993-12-24 Taiyo Ink Mfg Ltd ソルダーレジストインキ組成物及びソルダーレジストパターン形成方法
KR0126118B1 (ko) * 1992-09-10 1997-12-18 다나카 쇼소 솔더레지스트용 잉크조성물
JP2746009B2 (ja) * 1992-09-11 1998-04-28 東洋インキ製造株式会社 フォトソルダーレジスト組成物
JPH06295060A (ja) * 1992-10-29 1994-10-21 Ajinomoto Co Inc 感光性樹脂組成物又は感光性熱硬化性樹脂組成物及びそれらを使用したフォトソルダ−レジスト組成物
US6017681A (en) * 1992-11-09 2000-01-25 Fujitsu Limited Method of coupling optical parts and method of forming a mirror
KR0126247B1 (en) * 1992-11-09 1997-12-26 Fujitsu Ltd Method of coupling optical parts and refractive index imaging material
US5439779A (en) * 1993-02-22 1995-08-08 International Business Machines Corporation Aqueous soldermask
US6020436A (en) * 1993-03-09 2000-02-01 The Chromaline Corporation Photosensitive resin composition
US6703181B1 (en) * 1993-03-12 2004-03-09 Kabushiki Kaisha Toshiba Photosensitive composition having uniform concentration distribution of components and pattern formation method using the same
JP2877659B2 (ja) * 1993-05-10 1999-03-31 日本化薬株式会社 レジストインキ組成物及びその硬化物
TW290583B (de) * 1993-10-14 1996-11-11 Alpha Metals Ltd
JPH07114183A (ja) * 1993-10-15 1995-05-02 Sony Corp 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法
DE4400931A1 (de) * 1994-01-14 1995-07-20 Huels Chemische Werke Ag Salze der Pyromellitsäure, ein Verfahren zu ihrer Herstellung sowie deren Verwendung
JP3281473B2 (ja) * 1994-01-17 2002-05-13 日本化薬株式会社 フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
TW312700B (de) * 1994-05-17 1997-08-11 Sony Co Ltd
US5504993A (en) * 1994-08-30 1996-04-09 Storage Technology Corporation Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders
JP3134037B2 (ja) * 1995-01-13 2001-02-13 太陽インキ製造株式会社 メラミンの有機酸塩を用いた熱硬化性もしくは光硬化性・熱硬化性コーティング組成物
US5973034A (en) * 1995-10-11 1999-10-26 Nippon Kayaku Kabushiki Kaisha (Oxide or sulfide) powder epoxy (meth) acrylate w/glass and/or metal
US6010768A (en) * 1995-11-10 2000-01-04 Ibiden Co., Ltd. Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
JP3405631B2 (ja) * 1996-02-28 2003-05-12 互応化学工業株式会社 エポキシ樹脂組成物及びフォトソルダーレジストインク並びにプリント配線板及びその製造方法
JP2798053B2 (ja) * 1996-04-19 1998-09-17 日本電気株式会社 プリント配線板の製造方法
JP3254572B2 (ja) 1996-06-28 2002-02-12 バンティコ株式会社 光重合性熱硬化性樹脂組成物
US6190834B1 (en) * 1997-05-15 2001-02-20 Hitachi, Ltd. Photosensitive resin composition, and multilayer printed circuit board using the same
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
EP0980025A1 (de) * 1998-08-12 2000-02-16 Agency Of Industrial Science And Technology Holographische Aufzeichnungszusammensetzung und -Schicht, sowie Verfahren zu deren Herstellung
US6398981B1 (en) 1998-09-18 2002-06-04 Universite Laval Photopolymerizable composition sensitive to light in a green to infrared region of the optical spectrum
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
JP2001056631A (ja) * 1999-08-20 2001-02-27 Agency Of Ind Science & Technol ホログラム記録材料組成物、ホログラム記録媒体およびその製造方法
US6713230B2 (en) * 1999-10-25 2004-03-30 Nan Ya Plastics Corporation Photosensitive ink composition
JP2001151853A (ja) * 1999-11-30 2001-06-05 Hitachi Chem Co Ltd 絶縁樹脂組成物及びそれを用いた多層配線板の製造方法
JP4497610B2 (ja) * 1999-12-22 2010-07-07 太陽インキ製造株式会社 光硬化性樹脂組成物
JP2003522821A (ja) * 2000-02-08 2003-07-29 バンティコ アクチエンゲゼルシャフト 特にステレオリソグラフィーのための液状放射線硬化性組成物
CA2298354C (en) * 2000-02-14 2007-06-05 Universite Laval Photopolymerizable composition sensitive to light in a green to infrared region of the optical spectrum
TWI255393B (en) * 2000-03-21 2006-05-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the same, process for producing resist pattern and process for producing printed wiring board
TW538318B (en) * 2000-11-03 2003-06-21 Ind Tech Res Inst Photo-sensitive composition
JP4382978B2 (ja) * 2000-12-04 2009-12-16 学校法人神奈川大学 光硬化性・熱硬化性樹脂組成物
US6555592B2 (en) * 2001-02-27 2003-04-29 Advance Materials Corporation Photothermosetting composition comprising acrylated epoxy resin
CN1282036C (zh) * 2001-07-04 2006-10-25 昭和电工株式会社 抗蚀性可固化树脂组合物及其固化产品
SG100761A1 (en) * 2001-09-28 2003-12-26 Nanya Plastics Corp Photosensitive thermosetting resin composition
CN100401189C (zh) * 2001-10-22 2008-07-09 太阳油墨制造株式会社 光固化性·热固化性树脂组合物
KR100485962B1 (ko) * 2001-11-14 2005-04-29 정도화성 주식회사 옥외 전기절연물을 위한 고내후성의 에폭시 수지 조성물
US20030225179A1 (en) * 2002-04-26 2003-12-04 Chiu Chingfan Chris Novel morpholinoketone derivatives, and preparation process and uses of the same
US20050215656A1 (en) * 2002-11-28 2005-09-29 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting resin composition and printed circuit boards made by using the same
CN101017324A (zh) * 2003-03-12 2007-08-15 三菱化学株式会社 光敏组合物、光敏着色组合物、滤色器和液晶显示设备
US7323417B2 (en) * 2004-09-21 2008-01-29 Molecular Imprints, Inc. Method of forming a recessed structure employing a reverse tone process
KR20040104144A (ko) * 2003-06-03 2004-12-10 삼성전기주식회사 솔더 레지스트 패턴 형성 방법
KR100929543B1 (ko) * 2003-06-23 2009-12-03 주식회사 코오롱 솔더 레지스트용 잉크 조성물
JP4131864B2 (ja) * 2003-11-25 2008-08-13 東京応化工業株式会社 化学増幅型ポジ型感光性熱硬化性樹脂組成物、硬化物の形成方法、及び機能素子の製造方法
TWI276929B (en) * 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
US20050253307A1 (en) * 2004-05-11 2005-11-17 Molecualr Imprints, Inc. Method of patterning a conductive layer on a substrate
KR101031693B1 (ko) 2004-06-18 2011-04-29 엘지디스플레이 주식회사 패턴형성용 레지스트 및 이를 이용한 패턴형성방법
US7547504B2 (en) * 2004-09-21 2009-06-16 Molecular Imprints, Inc. Pattern reversal employing thick residual layers
US7205244B2 (en) * 2004-09-21 2007-04-17 Molecular Imprints Patterning substrates employing multi-film layers defining etch-differential interfaces
DE102004046745B4 (de) * 2004-09-27 2008-04-24 Atotech Deutschland Gmbh Verfahren zur lösungsmittelfreien Herstellung einer faserverstärkten, mit Harz beschichteten Folie und Verwendung derselben
DE102004046744B4 (de) 2004-09-27 2007-05-24 Atotech Deutschland Gmbh Verfahren zur Übertragung von Pulvern und Pulverlacken auf Substrate und Verwendung zur Herstellung von Leiterplatten und Solarzellen
TW200630447A (en) * 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
WO2007010918A1 (ja) * 2005-07-20 2007-01-25 Toppan Printing Co., Ltd. アルカリ現像型感光性着色組成物
CN1309754C (zh) * 2005-09-10 2007-04-11 江南大学 一种水性光敏树脂乳剂及其制备方法
US7571979B2 (en) * 2005-09-30 2009-08-11 Lexmark International, Inc. Thick film layers and methods relating thereto
US7654637B2 (en) * 2005-09-30 2010-02-02 Lexmark International, Inc Photoimageable nozzle members and methods relating thereto
US20070077763A1 (en) * 2005-09-30 2007-04-05 Molecular Imprints, Inc. Deposition technique to planarize a multi-layer structure
JP4849860B2 (ja) * 2005-10-04 2012-01-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP4577361B2 (ja) * 2005-10-07 2010-11-10 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2007177180A (ja) * 2005-12-28 2007-07-12 Nippon Kayaku Co Ltd エポキシ樹脂ワニス、感光性樹脂組成物、並びにその硬化物
US7838197B2 (en) 2006-11-15 2010-11-23 Taiyo Ink Mfg. Co., Ltd. Photosensitive composition
JP5079310B2 (ja) * 2006-11-15 2012-11-21 太陽ホールディングス株式会社 ソルダーレジスト露光用フォトツール及びそれを用いて露光処理されるソルダーレジストパターンの形成方法
JP2008122845A (ja) * 2006-11-15 2008-05-29 Taiyo Ink Mfg Ltd ソルダーレジストパターンの形成方法
US20110123929A1 (en) 2007-01-23 2011-05-26 Fujifilm Corporation Oxime compound, photosensitive composition, color filter, production method for the color filter, and liquid crystal display element
US8007069B2 (en) * 2007-05-25 2011-08-30 Canon Kabushiki Kaisha Ink jet recording head
US8501391B2 (en) 2007-06-18 2013-08-06 Asahi Kasei E-Materials Corporation Photosensitive resin composition, flexographic printing plate, and method for producing flexographic printing plate
KR101048329B1 (ko) * 2008-10-06 2011-07-14 주식회사 엘지화학 우레탄계 다관능성 모노머, 그의 제조방법 및 이를 포함하는 감광성 수지 조성물
US20110221017A1 (en) * 2008-11-07 2011-09-15 Sumitomo Bakelite Company, Ltd. Photosensitive resin composition, photosensitive adhesive film, and light-receiving device
JP2010219489A (ja) * 2009-02-20 2010-09-30 Toshiba Corp 半導体装置およびその製造方法
KR101101276B1 (ko) * 2009-11-30 2012-01-04 주식회사 태영테크폴 롤스크린 가공용 수용성 아크릴계 접착제 제조방법, 수용성 난연수지 조성물 및 그의 제조방법
KR101225953B1 (ko) * 2009-12-28 2013-01-24 제일모직주식회사 컬러필터 보호막용 감광성 수지 조성물, 이를 이용하여 제조된 컬러필터 보호막 및 이를 포함하는 이미지 센서
JP5481245B2 (ja) * 2010-03-24 2014-04-23 太陽ホールディングス株式会社 活性エネルギー線硬化性白色樹脂組成物及びその硬化物からなる絶縁層を有するプリント配線板
TWI556958B (zh) 2010-09-14 2016-11-11 東京應化工業股份有限公司 基質劑及含嵌段共聚物之層的圖型形成方法
TW201213433A (en) * 2010-09-28 2012-04-01 Dow Global Technologies Llc Epoxy composition with crystallization inhibition
WO2012122628A1 (en) * 2011-03-15 2012-09-20 National Research Council Of Canada Microfluidic system having monolithic nanoplasmonic structures
WO2013089100A1 (ja) 2011-12-16 2013-06-20 株式会社スリーボンド 硬化性樹脂組成物
JP6186116B2 (ja) * 2012-03-09 2017-08-23 東京応化工業株式会社 ブロックコポリマーを含む層のパターン形成方法、及び下地剤
JP5964131B2 (ja) * 2012-05-22 2016-08-03 三洋化成工業株式会社 感光性組成物及び硬化物
KR20140071755A (ko) 2012-12-04 2014-06-12 삼성전기주식회사 인쇄회로기판 및 이의 제조방법
WO2015016360A1 (ja) 2013-08-02 2015-02-05 日立化成株式会社 感光性樹脂組成物
KR102305379B1 (ko) 2013-11-25 2021-09-24 시코쿠가세이고교가부시키가이샤 작용기를 갖는 글리콜우릴류와 그의 이용
WO2015076399A1 (ja) 2013-11-25 2015-05-28 四国化成工業株式会社 官能基を有するグリコールウリル類とその利用
EP2916629B1 (de) * 2014-01-14 2018-06-06 Meiko Electronics Co., Ltd. Leiterplatte
CN104629231B (zh) * 2014-03-03 2017-12-08 青岛中科新材料有限公司 一种光固化3d打印用烯丙基酯树脂复合玻璃纤维光敏树脂的制备方法及应用
EP3214142B1 (de) * 2015-02-12 2021-03-24 Sekisui Chemical Co., Ltd. Härtbare zusammensetzung für tintenstrahl sowie verfahren zur herstellung einer elektronischen komponente
BR112017023446A2 (pt) * 2015-04-29 2018-07-31 3M Innovative Properties Co método para a fabricação de uma rede polimérica a partir de um politiol e um poliepóxido
JP6409951B2 (ja) 2016-01-19 2018-10-24 三菱ケミカル株式会社 エポキシ樹脂組成物、繊維強化複合材料用プリプレグおよび繊維強化複合材料
WO2017126536A1 (ja) * 2016-01-20 2017-07-27 三菱瓦斯化学株式会社 樹脂組成物、支持体付き樹脂シート、多層プリント配線板及び半導体装置
TWI630457B (zh) * 2016-02-05 2018-07-21 南韓商Ｌｇ化學股份有限公司 光固化及熱固化樹脂組成物以及抗焊乾膜
JP5997860B1 (ja) 2016-03-16 2016-09-28 互応化学工業株式会社 液状ソルダーレジスト組成物及びプリント配線板
JP6112691B1 (ja) 2016-03-16 2017-04-12 互応化学工業株式会社 液状ソルダーレジスト組成物及びプリント配線板
CN107300828B (zh) * 2016-04-15 2021-01-15 常州强力电子新材料股份有限公司 一种用于3d打印的光敏树脂
CN109890921B (zh) * 2016-08-25 2022-01-11 莫赛纳实验室公司 一种使用光刻和可粘附地粘结材料制作三维结构的方法
JP6795942B2 (ja) * 2016-09-30 2020-12-02 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR20190082219A (ko) 2016-11-03 2019-07-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 실란트를 항공기 구성요소에 적용하는 방법
US11198757B2 (en) 2016-11-03 2021-12-14 3M Innovative Properties Company Compositions including a photolatent amine, camphorquinone, and coumarin and related methods
CN109776756A (zh) * 2019-01-21 2019-05-21 深圳市道尔顿电子材料有限公司 一种双重改性环氧丙烯酸酯及其光刻胶
KR20200133516A (ko) 2019-05-20 2020-11-30 주식회사 아모그린텍 회로기판 제조방법
KR20230107571A (ko) 2020-11-17 2023-07-17 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물 및 드라이 필름
GB2607007A (en) 2021-05-18 2022-11-30 Makevale Group Ltd Interpenetrational crosslinked networks
CN114525500B (zh) * 2021-12-28 2023-05-05 南通威斯派尔半导体技术有限公司 一种覆铜陶瓷基板局部镀银方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2406400B2 (de) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio Lichtempfindliche harzzusammensetzungen auf der basis von verbindungen mit epoxy- bzw. photopolymerisierbaren acrylgruppen
JPS49107333A (de) * 1973-02-14 1974-10-11
US4039414A (en) * 1974-06-19 1977-08-02 Scm Corporation Ultraviolet curing of electrocoating compositions
JPS5114044A (ja) * 1974-07-25 1976-02-04 Matsushita Electric Ind Co Ltd Ichikenshutsusochi
DE2557408C2 (de) * 1975-12-19 1983-08-25 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung eines in organischen Lösungsmitteln löslichen, vernetzbaren Acryloyl- und/oder Methacryloylgruppen und Carboxylgruppen enthaltenden Urethanharzes und seine Verwendung
GB1588475A (en) * 1977-05-14 1981-04-23 Hitachi Chemical Co Ltd Method of adhesion between insulating substrates and metal deposits electrolessly plated thereon and method of making additive printed circuit boards
US4428807A (en) * 1978-06-30 1984-01-31 The Dow Chemical Company Composition containing polymerizable entities having oxirane groups and terminal olefinic unsaturation in combination with free-radical and cationic photopolymerizations means
EP0008837B1 (de) * 1978-09-07 1982-05-05 Akzo N.V. Durch Strahlung härtbares flüssiges Beschichtungsmittel auf der Basis einer eine Epoxidendgruppe enthaltenden Verbindung und Verfahren zum Auftragen einer derartigen Zusammensetzung auf Substrate
GB2032939B (en) * 1978-11-01 1982-11-17 Coates Brothers & Co Coating compositions
JPS5923723B2 (ja) * 1980-09-19 1984-06-04 日立化成工業株式会社 感光性樹脂組成物および感光性エレメント
DE3134123A1 (de) * 1981-08-28 1983-03-17 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
JPS60208377A (ja) * 1984-04-02 1985-10-19 Asahi Kagaku Kenkyusho:Kk ソルダ−レジストインキ用樹脂組成物
JPS61272A (ja) * 1984-06-12 1986-01-06 Taiyo Ink Seizo Kk インキ組成物
JPS6148800A (ja) * 1984-08-17 1986-03-10 コニカ株式会社 放射線画像変換方法
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPS63205650A (ja) * 1987-02-20 1988-08-25 Unitika Ltd アルカリ現像型感光性樹脂組成物
JPS63289014A (ja) * 1987-05-21 1988-11-25 Tamura Kaken Kk 感光性皮膜組成物

Also Published As

Publication number Publication date
US4943516B1 (de) 1994-01-11
HK104495A (en) 1995-07-07
KR910008706B1 (ko) 1991-10-19
US4943516A (en) 1990-07-24
CN1033389A (zh) 1989-06-14
CA1331711C (en) 1994-08-30
KR890008604A (ko) 1989-07-12
CN1081557A (zh) 1994-02-02
DE3885260D1 (de) 1993-12-02
EP0323563A3 (en) 1989-09-06
JPH0717737B2 (ja) 1995-03-01
CN1028535C (zh) 1995-05-24
DE3885260T2 (de) 1994-05-19
JPH01141904A (ja) 1989-06-02
CN1036693C (zh) 1997-12-10
EP0323563B1 (de) 1993-10-27
EP0323563A2 (de) 1989-07-12

Similar Documents

Publication Publication Date Title
ATE96552T1 (de) Lichtempfindliche waermehaertbare harzzusammensetzung und methode zur herstellung von loetstoppmasken damit.
US3989610A (en) Photosensitive epoxy-acrylate resin compositions
US4025348A (en) Photosensitive resin compositions
US4601973A (en) Photopolymerizable coating agent, a photopolymerizable material and its use
DE3674052D1 (de) Verfahren zum verkleben von oberflaechen mit einem haertbaren epoxidharzgemisch.
DE60103529D1 (de) Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit
US4439517A (en) Process for the formation of images with epoxide resin
US6576382B2 (en) Composition for photoimaging
ATE163021T1 (de) Verfahren zur beschichtung von leiterplatten
US3738835A (en) Electrophoretic photoresist composition and a method of forming etch resistant masks
US4268614A (en) Method of making printed circuit board
KR950000755A (ko) 수지 조성물
ATE199201T1 (de) Verbinden von innenschichten in der leiterplattenherstellung
ATE56828T1 (de) Photolackzusammensetzung und hieraus hergestellte gedruckte schaltungsplatte.
US3752669A (en) Method of producing positive images from epoxy compositions and compositions therefor
DE3751023D1 (de) Verfahren zur selektiven Härtung von flüssigen, lichtempfindlichen Kunststoffen durch Belichtung mittels einer Maske.
KR910009126A (ko) 금속 패턴(pattern)의 제조방법
EP0366333A3 (de) Lötstoffmasken-Harze mit verbesserter Stabilität
CA1048328A (en) Photo-processable coatings
US3726679A (en) Light sensitive epoxy formulation
JPS5816232A (ja) フォトレジスト組成物
JPS61279198A (ja) プリント回路の製造方法
JPS56150741A (en) Photosensitive resin composition
DE3686360D1 (de) Verfahren zur herstellung einer strahlungsempfindlichen schicht auf einem schichttraeger.
KR100209235B1 (ko) 이면로광 차단 효과를 갖는 양면 동시 로광용 감광성 솔더 레지스트 조성물

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EELA Cancelled due to lapse of time