JPS56150741A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
JPS56150741A
JPS56150741A JP5435980A JP5435980A JPS56150741A JP S56150741 A JPS56150741 A JP S56150741A JP 5435980 A JP5435980 A JP 5435980A JP 5435980 A JP5435980 A JP 5435980A JP S56150741 A JPS56150741 A JP S56150741A
Authority
JP
Japan
Prior art keywords
resin
structural units
contg
photosensitive resin
units represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5435980A
Other languages
Japanese (ja)
Inventor
Haruyori Tanaka
Shigeo Sugihara
Akira Iwazawa
Katsuhide Onose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP5435980A priority Critical patent/JPS56150741A/en
Publication of JPS56150741A publication Critical patent/JPS56150741A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Abstract

PURPOSE:To obtain a photosensitive resin composition for a printed wiring plate with superior heat resistance and electric insulation by adding a photosensitive resin using polyvinylphenol as the matrix polymer and having specified structural units together with polyimide resin. CONSTITUTION:Polyvinylphenol having structural units represented by formula I is reacted with sinnamic acid chloride to obtain photosensitive resin A contg. structural units represented by formula II as well as structural units represented by formula I. On the other hand, polyvinylphenol is simultaneously reacted with sinnamic acid chloride and epichlorohydrin to obtain photosensitive resin B contg. structural units represented by formulae I, II, III. A coating liq. is then prepared contg. resin A and epoxy resin or contg. polyimide resin as a nonreactive polymer binder soluble in a developing solvent for resin B together with resin A, epoxy resin and resin B. The liq. is applied to a printed wiring plate and used as a photoresist. Thus, a resist pattern with superior heat resistance, insulation, adhesion, etc. is obtd.
JP5435980A 1980-04-25 1980-04-25 Photosensitive resin composition Pending JPS56150741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5435980A JPS56150741A (en) 1980-04-25 1980-04-25 Photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5435980A JPS56150741A (en) 1980-04-25 1980-04-25 Photosensitive resin composition

Publications (1)

Publication Number Publication Date
JPS56150741A true JPS56150741A (en) 1981-11-21

Family

ID=12968434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5435980A Pending JPS56150741A (en) 1980-04-25 1980-04-25 Photosensitive resin composition

Country Status (1)

Country Link
JP (1) JPS56150741A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4971873A (en) * 1989-10-30 1990-11-20 Eastman Kodak Company Solvent soluble polyimides as binders in photoconductor elements
US6258507B1 (en) 1998-03-26 2001-07-10 Sumitomo Chemical Company, Limited Photoresist compositions
US7195858B2 (en) 2003-02-06 2007-03-27 Rohm And Haas Electronic Materials Llc Negative type photosensitive resin composition containing a phenol-biphenylene resin
US7195855B2 (en) 2003-01-30 2007-03-27 Rohm And Haas Electronic Materials Llc Negative-type photosensitive resin composition containing epoxy compound
CN108864341A (en) * 2017-05-12 2018-11-23 湖北固润科技股份有限公司 Poly(4-hydroxystyrene) based epoxy resin, its synthesis and application

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4971873A (en) * 1989-10-30 1990-11-20 Eastman Kodak Company Solvent soluble polyimides as binders in photoconductor elements
US6258507B1 (en) 1998-03-26 2001-07-10 Sumitomo Chemical Company, Limited Photoresist compositions
US7195855B2 (en) 2003-01-30 2007-03-27 Rohm And Haas Electronic Materials Llc Negative-type photosensitive resin composition containing epoxy compound
US7195858B2 (en) 2003-02-06 2007-03-27 Rohm And Haas Electronic Materials Llc Negative type photosensitive resin composition containing a phenol-biphenylene resin
CN108864341A (en) * 2017-05-12 2018-11-23 湖北固润科技股份有限公司 Poly(4-hydroxystyrene) based epoxy resin, its synthesis and application
CN108864341B (en) * 2017-05-12 2020-10-13 湖北固润科技股份有限公司 Poly (p-hydroxystyrene) epoxy resin, and synthesis and application thereof

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