DE60103529D1 - Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit - Google Patents

Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit

Info

Publication number
DE60103529D1
DE60103529D1 DE60103529T DE60103529T DE60103529D1 DE 60103529 D1 DE60103529 D1 DE 60103529D1 DE 60103529 T DE60103529 T DE 60103529T DE 60103529 T DE60103529 T DE 60103529T DE 60103529 D1 DE60103529 D1 DE 60103529D1
Authority
DE
Germany
Prior art keywords
light
resin composition
dry film
cured
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60103529T
Other languages
English (en)
Other versions
DE60103529T2 (de
Inventor
Seiya Di Onodera
Tadatomi Nishikubo
Atsushi Kameyama
Masaki Sasaki
Masatoshi Kusama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanagawa University
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Kanagawa University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd, Kanagawa University filed Critical Taiyo Ink Mfg Co Ltd
Publication of DE60103529D1 publication Critical patent/DE60103529D1/de
Application granted granted Critical
Publication of DE60103529T2 publication Critical patent/DE60103529T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
DE60103529T 2000-03-29 2001-03-28 Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit Expired - Fee Related DE60103529T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000090906 2000-03-29
JP2000090906 2000-03-29
JP2000373410 2000-12-07
JP2000373410 2000-12-07
PCT/JP2001/002590 WO2001073510A1 (fr) 2000-03-29 2001-03-28 Composition de resine photodurcissante/thermodurcissante, couche seche photosensible preparee au moyen de cette resine et procede de creation de configurations

Publications (2)

Publication Number Publication Date
DE60103529D1 true DE60103529D1 (de) 2004-07-01
DE60103529T2 DE60103529T2 (de) 2005-06-02

Family

ID=26588697

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60103529T Expired - Fee Related DE60103529T2 (de) 2000-03-29 2001-03-28 Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit

Country Status (9)

Country Link
US (2) US6844130B2 (de)
EP (1) EP1276011B1 (de)
JP (1) JP4606684B2 (de)
KR (1) KR100748219B1 (de)
CN (1) CN100454142C (de)
AT (1) ATE268015T1 (de)
DE (1) DE60103529T2 (de)
TW (1) TWI284780B (de)
WO (1) WO2001073510A1 (de)

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JP6886782B2 (ja) * 2016-06-30 2021-06-16 東京応化工業株式会社 感光性樹脂組成物、硬化膜、有機ｅｌ素子における発光層の区画用のバンク、有機ｅｌ素子用の基板、有機ｅｌ素子、硬化膜の製造方法、バンクの製造方法、及び有機ｅｌ素子の製造方法
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CN110982398B (zh) * 2019-12-20 2021-11-23 北京印刷学院 Uv光油及其应用
CN112126274A (zh) * 2020-09-16 2020-12-25 四川乐凯新材料有限公司 含链烯基醚和/或氧杂环丁烷类化合物的pcb用光固化性组合物
CN112159639B (zh) * 2020-11-09 2022-05-06 珠海市能动科技光学产业有限公司 一种改性高分子粘合剂及含有该粘合剂的干膜光阻剂
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CN114380809B (zh) * 2021-12-30 2023-06-02 同济大学 一类含阳离子可聚合基团的离子液体及制备方法和应用

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KR100796405B1 (ko) 2000-09-20 2008-01-21 다이요 잉키 세이조 가부시키가이샤 카르복실기 함유 감광성 수지, 이것을 함유하는 알칼리현상 가능 광경화성ㆍ열경화성 조성물 및 그 경화물

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CN1420998A (zh) 2003-05-28
JP4606684B2 (ja) 2011-01-05
EP1276011A4 (de) 2003-05-14
ATE268015T1 (de) 2004-06-15
WO2001073510A1 (fr) 2001-10-04
US6844130B2 (en) 2005-01-18
KR100748219B1 (ko) 2007-08-09
DE60103529T2 (de) 2005-06-02
US20040023120A1 (en) 2004-02-05
KR20030051419A (ko) 2003-06-25
TWI284780B (en) 2007-08-01
EP1276011A1 (de) 2003-01-15
US7226710B2 (en) 2007-06-05
CN100454142C (zh) 2009-01-21
EP1276011B1 (de) 2004-05-26

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