ATE427519T1 - Uv-aushartbare harzzusammensetzung und photolít- resistfarbstoff mit der zusammensetzung - Google Patents

Uv-aushartbare harzzusammensetzung und photolít- resistfarbstoff mit der zusammensetzung

Info

Publication number
ATE427519T1
ATE427519T1 AT01965640T AT01965640T ATE427519T1 AT E427519 T1 ATE427519 T1 AT E427519T1 AT 01965640 T AT01965640 T AT 01965640T AT 01965640 T AT01965640 T AT 01965640T AT E427519 T1 ATE427519 T1 AT E427519T1
Authority
AT
Austria
Prior art keywords
resin composition
ultraviolet curable
curable resin
ethylenically unsaturated
unsaturated monomer
Prior art date
Application number
AT01965640T
Other languages
English (en)
Inventor
Hiroko Daido
Soichi Hashimoto
Original Assignee
Goo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Co Ltd filed Critical Goo Chemical Co Ltd
Application granted granted Critical
Publication of ATE427519T1 publication Critical patent/ATE427519T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/064—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AT01965640T 2000-09-16 2001-09-14 Uv-aushartbare harzzusammensetzung und photolít- resistfarbstoff mit der zusammensetzung ATE427519T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000321976 2000-09-16
JP2000282545 2000-09-18
JP2000375131 2000-12-08

Publications (1)

Publication Number Publication Date
ATE427519T1 true ATE427519T1 (de) 2009-04-15

Family

ID=27344652

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01965640T ATE427519T1 (de) 2000-09-16 2001-09-14 Uv-aushartbare harzzusammensetzung und photolít- resistfarbstoff mit der zusammensetzung

Country Status (9)

Country Link
US (1) US6896967B2 (de)
EP (1) EP1324135B1 (de)
JP (1) JP4847670B2 (de)
CN (1) CN1210620C (de)
AT (1) ATE427519T1 (de)
AU (1) AU2001286239A1 (de)
DE (1) DE60138202D1 (de)
TW (1) TW521547B (de)
WO (1) WO2002025378A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1233679C (zh) * 2000-12-14 2005-12-28 互応化学工业株式会社 紫外线可固化树脂组合物及含该组合物的光防焊油墨
US7846622B2 (en) * 2004-09-17 2010-12-07 Toppan Printing Co., Ltd. Alkali-developable, colored photosensitive resin composition and color filter using the alkali-developable, colored photosensitive resin composition
KR20080003764A (ko) * 2005-05-11 2008-01-08 도판 인사츠 가부시키가이샤 알칼리 현상형 감광성 수지 조성물, 그것을 사용해서형성한 액정 분할 배향제어 돌기 부착 기판 및 컬러필터,및 액정표시장치
JP4641861B2 (ja) * 2005-05-11 2011-03-02 株式会社Ａｄｅｋａ アルカリ現像性樹脂組成物
CN101133363B (zh) * 2005-06-20 2011-04-20 凸版印刷株式会社 着色碱性显影型感光性树脂组合物、及使用了该着色碱性显影型感光性树脂组合物的滤色器
JP4916224B2 (ja) * 2005-06-20 2012-04-11 株式会社Ａｄｅｋａ アルカリ現像性感光性樹脂組成物
JP4464907B2 (ja) * 2005-11-16 2010-05-19 株式会社日本触媒 感光性樹脂組成物
KR100788556B1 (ko) * 2007-01-03 2007-12-26 삼성에스디아이 주식회사 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판
JP4660507B2 (ja) * 2007-01-03 2011-03-30 三星モバイルディスプレイ株式會社 フレキシブル回路基板及びこれを有する液晶表示装置
KR100788557B1 (ko) * 2007-01-03 2007-12-26 삼성에스디아이 주식회사 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판
CN101465408B (zh) * 2008-12-31 2010-12-29 电子科技大学 一种柔性有机光电子器件用基板及其制备方法
CN102164458A (zh) * 2010-02-24 2011-08-24 苏州群策科技有限公司 密集线路板的防旱涂布方法
KR101569156B1 (ko) * 2014-01-14 2015-11-13 메이코 일렉트로닉스 컴파니 리미티드 프린트 배선 기판

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693221A (ja) * 1992-09-09 1994-04-05 Goou Kagaku Kogyo Kk 液状レジストインク組成物及びプリント回路基板
JP3329877B2 (ja) 1993-03-02 2002-09-30 互応化学工業株式会社 プリント回路基板製造用レジストインク組成物、それを用いたレジスト膜及びプリント回路基板
JPH0772624A (ja) * 1993-09-02 1995-03-17 Goou Kagaku Kogyo Kk 感光性樹脂組成物並びにそれを用いた被膜、レジストインク、レジスト、ソルダーレジスト及びプリント回路基板
EP0864926A4 (de) 1993-09-02 1999-07-14 Goo Chemical Ind Co Ltd Photoempfindliche harzzusammensetzung und beschichtungsfilm, resisttinte, resist, lötstoppresist und gedruckte leiterplatte, die aus der zusammensetzung hergestellt werden
JP3281473B2 (ja) 1994-01-17 2002-05-13 日本化薬株式会社 フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
WO1996011239A1 (fr) 1994-10-05 1996-04-18 Goo Chemical Co., Ltd. Encre resist de photosoudure, carte a circuit imprime et procede de fabrication
JP3686699B2 (ja) 1995-03-31 2005-08-24 太陽インキ製造株式会社 アルカリ現像型の光硬化性・熱硬化性樹脂組成物
JPH095997A (ja) 1995-06-14 1997-01-10 Tamura Kaken Kk 感光性樹脂組成物、その硬化塗膜及び回路基板
US5858618A (en) * 1996-12-02 1999-01-12 Nan Ya Plastics Corporation Photopolymerizable resinous composition
US6583198B2 (en) 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
JPH11258789A (ja) * 1998-01-08 1999-09-24 Mitsui Chem Inc 硬化性樹脂組成物
JP4081217B2 (ja) * 1999-03-17 2008-04-23 互応化学工業株式会社 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板

Also Published As

Publication number Publication date
JPWO2002025378A1 (ja) 2004-01-29
EP1324135B1 (de) 2009-04-01
AU2001286239A1 (en) 2002-04-02
EP1324135A4 (de) 2005-02-02
JP4847670B2 (ja) 2011-12-28
CN1210620C (zh) 2005-07-13
TW521547B (en) 2003-02-21
DE60138202D1 (de) 2009-05-14
US20040006161A1 (en) 2004-01-08
WO2002025378A1 (fr) 2002-03-28
US6896967B2 (en) 2005-05-24
CN1459049A (zh) 2003-11-26
EP1324135A1 (de) 2003-07-02

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