AU2001286239A1 - Ultraviolet-curable resin composition and photosolder resist ink containing the composition - Google Patents

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Info

Publication number
AU2001286239A1
AU2001286239A1 AU2001286239A AU8623901A AU2001286239A1 AU 2001286239 A1 AU2001286239 A1 AU 2001286239A1 AU 2001286239 A AU2001286239 A AU 2001286239A AU 8623901 A AU8623901 A AU 8623901A AU 2001286239 A1 AU2001286239 A1 AU 2001286239A1
Authority
AU
Australia
Prior art keywords
curable resin
resin composition
ultraviolet curable
ethylenically unsaturated
unsaturated monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286239A
Inventor
Hiroko Daido
Soichi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goo Chemical Industries Co Ltd
Original Assignee
Goo Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Industries Co Ltd filed Critical Goo Chemical Industries Co Ltd
Publication of AU2001286239A1 publication Critical patent/AU2001286239A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/064—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Abstract

An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.
AU2001286239A 2000-09-16 2001-09-14 Ultraviolet-curable resin composition and photosolder resist ink containing the composition Abandoned AU2001286239A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2000-321976 2000-09-16
JP2000321976 2000-09-16
JP2000-282545 2000-09-18
JP2000282545 2000-09-18
JP2000375131 2000-12-08
JP2000-375131 2000-12-08
PCT/JP2001/007986 WO2002025378A1 (en) 2000-09-16 2001-09-14 Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Publications (1)

Publication Number Publication Date
AU2001286239A1 true AU2001286239A1 (en) 2002-04-02

Family

ID=27344652

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286239A Abandoned AU2001286239A1 (en) 2000-09-16 2001-09-14 Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Country Status (9)

Country Link
US (1) US6896967B2 (en)
EP (1) EP1324135B1 (en)
JP (1) JP4847670B2 (en)
CN (1) CN1210620C (en)
AT (1) ATE427519T1 (en)
AU (1) AU2001286239A1 (en)
DE (1) DE60138202D1 (en)
TW (1) TW521547B (en)
WO (1) WO2002025378A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1359172B1 (en) * 2000-12-14 2009-05-27 Goo Chemical Co., Ltd. Ultraviolet-curable resin composition and photosolder resist ink containing the composition
JP4198173B2 (en) * 2004-09-17 2008-12-17 凸版印刷株式会社 Colored alkali-developable photosensitive resin composition and color filter using the colored alkali-developable photosensitive resin composition
CN101006393B (en) * 2005-05-11 2011-11-30 凸版印刷株式会社 Alkali development-type photosensitive resin composition, substrate with protrusions for liquid crystal split orientational control and color filter formed using the same, and liquid crystal display device
JP4641861B2 (en) * 2005-05-11 2011-03-02 株式会社Ａｄｅｋａ Alkali developable resin composition
JP4916224B2 (en) * 2005-06-20 2012-04-11 株式会社Ａｄｅｋａ Alkali-developable photosensitive resin composition
JP4684293B2 (en) * 2005-06-20 2011-05-18 凸版印刷株式会社 Colored alkali-developable photosensitive resin composition and color filter using the colored alkali-developable photosensitive resin composition
JP4464907B2 (en) * 2005-11-16 2010-05-19 株式会社日本触媒 Photosensitive resin composition
JP4660507B2 (en) * 2007-01-03 2011-03-30 三星モバイルディスプレイ株式會社 Flexible circuit board and liquid crystal display device having the same
KR100788556B1 (en) * 2007-01-03 2007-12-26 삼성에스디아이 주식회사 Flexible circuit board for liquid crystal display having light absorbing layer
KR100788557B1 (en) * 2007-01-03 2007-12-26 삼성에스디아이 주식회사 Flexible circuit board for liquid crystal display having light absorbing layer
CN101465408B (en) * 2008-12-31 2010-12-29 电子科技大学 Substrate for flexible organic optoelectronic device and preparation method thereof
CN102164458A (en) * 2010-02-24 2011-08-24 苏州群策科技有限公司 Drought-proof coating method for dense circuit boards
CN104919907A (en) * 2014-01-14 2015-09-16 名幸电子有限公司 Printed circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693221A (en) 1992-09-09 1994-04-05 Goou Kagaku Kogyo Kk Liquid resist ink composition and printed circuit board
JP3329877B2 (en) * 1993-03-02 2002-09-30 互応化学工業株式会社 Resist ink composition for manufacturing printed circuit board, resist film using the same, and printed circuit board
EP0864926A4 (en) 1993-09-02 1999-07-14 Goo Chemical Ind Co Ltd Photosensitive resin composition, and coating film, resist ink, resist, solder resist and printed circuit board each produced therefrom
JPH0772624A (en) * 1993-09-02 1995-03-17 Goou Kagaku Kogyo Kk Photosensitive resin composition as well as film, resist ink, resist, solder resist and printed circuit board formed by using the same
JP3281473B2 (en) 1994-01-17 2002-05-13 日本化薬株式会社 Resist ink composition for flexible printed wiring board and cured product thereof
JP3580429B2 (en) 1994-10-05 2004-10-20 互応化学工業株式会社 Photo solder resist ink, printed circuit board and method of manufacturing the same
JP3686699B2 (en) 1995-03-31 2005-08-24 太陽インキ製造株式会社 Alkali-developable photocurable / thermosetting resin composition
JPH095997A (en) 1995-06-14 1997-01-10 Tamura Kaken Kk Photosensitive resin composition, its hardened coating film and circuit board
US5858618A (en) 1996-12-02 1999-01-12 Nan Ya Plastics Corporation Photopolymerizable resinous composition
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
JPH11258789A (en) * 1998-01-08 1999-09-24 Mitsui Chem Inc Curable resin composition
JP4081217B2 (en) * 1999-03-17 2008-04-23 互応化学工業株式会社 UV curable resin composition, photo solder resist ink, pre-dried film, substrate and printed wiring board

Also Published As

Publication number Publication date
EP1324135A4 (en) 2005-02-02
US6896967B2 (en) 2005-05-24
DE60138202D1 (en) 2009-05-14
WO2002025378A1 (en) 2002-03-28
JP4847670B2 (en) 2011-12-28
EP1324135A1 (en) 2003-07-02
ATE427519T1 (en) 2009-04-15
TW521547B (en) 2003-02-21
CN1459049A (en) 2003-11-26
JPWO2002025378A1 (en) 2004-01-29
CN1210620C (en) 2005-07-13
EP1324135B1 (en) 2009-04-01
US20040006161A1 (en) 2004-01-08

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