KR950003920A - 광중합성 조성물 - Google Patents

광중합성 조성물 Download PDF

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Publication number
KR950003920A
KR950003920A KR1019940015453A KR19940015453A KR950003920A KR 950003920 A KR950003920 A KR 950003920A KR 1019940015453 A KR1019940015453 A KR 1019940015453A KR 19940015453 A KR19940015453 A KR 19940015453A KR 950003920 A KR950003920 A KR 950003920A
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KR
South Korea
Prior art keywords
photopolymerizable composition
weight
component
composition
printed circuit
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KR1019940015453A
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English (en)
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KR100299264B1 (ko
Inventor
피에르 엘리 살빈 로저
로쓰 마틴
Original Assignee
에른스트 알테르
시바-가이기 아게
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Application filed by 에른스트 알테르, 시바-가이기 아게 filed Critical 에른스트 알테르
Publication of KR950003920A publication Critical patent/KR950003920A/ko
Application granted granted Critical
Publication of KR100299264B1 publication Critical patent/KR100299264B1/ko

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12Production of screen printing forms or similar printing forms, e.g. stencils

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
  • Materials For Photolithography (AREA)

Abstract

추가의 고분자량 중합체 결합제를 함유하지 않고 또 수성 도포가능한 포토레지스트 조성물로서, 바람직하게는 인쇄회로판을 코팅하는데 사용될 수 있는 제 1 항에 청구된 광중합성 조성물. 그로부터 수득한 코팅은 건조후에도 비점착성이고 모서리 피복율이 우수하다.

Description

광중합성 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. a) 10중량% 이상의 비스페놀 및 에틸렌성 불포화 모노카르복시산과 반응한 다음 유기 폴리카르복시산의 고리상 무수물과의 반응으로 사슬연장도니 고분자량 에폭시 수지의 반응생성물로부터 유도된 고분자량의 아크릴레이트로 구성된, 암모니아 또는 아민 또는 무기 염기로 중화된 특수 필름형성성, 산 기-함유 고분자량 아크릴레이트 20 내지 80중량%, b) 광개시제 0.1 내지 15중량%, c) 임의 성분 1 내지 25중량% 및 d) 물, 뿐만 아니라 e) 광에 의해 가교될 수 있는 한개 이상의 임의의 추가적인 (메트)아크릴레이트 단량체 또는 (메트)아크릴레이트 올리고머 또는 비닐 화합물을 포함하는 광중합성 조성물.
  2. 제 1 항에 있어서, 성분 a)는 비스페놀로 사슬연장되고 또 폴리카르복시산의고리상 무수물과 반응된 에폭시 수지의 아크릴화된 유도체인 광중합성 조성물.
  3. 제 1 항에 있어서, 성분 c)가 열적 경화제 및/또는 안료 또는 수불용성 염료 및/또는 충전제 및/또는 수성 코팅 조성물용 첨가제(코팅 첨가제)인 광중합성 조성물.
  4. 제 1 항에 있어서, 성분 d)로서 물 이외에 15중량%까지의 유기 용매를 포함하는 광중합성 조성물.
  5. 제 1 항에 있어서, 성분 b)가 Irgacure 907 및/또는 Quantacure ITX인 광중합성 조성물.
  6. 제 1 항에 있어서, 성분 a),b) 및 d) 및 임의 성분 c) 및 e)가 실온에서 교바에 의해 혼합되어 균일한 유제 또는 분산액을 형성하는 광중합성 조성물.
  7. 제 1 항에 따른 광중합성 조성물의 수성 도포가능한 포토레지스트 시스템으로서의 용도.
  8. 제 7 항에 있어서, 인쇄회로판을 코팅하기 위한 용도.
  9. 제 7 항에 있어서, 인쇄회로판용 땜납 레지스트로서 또는 인쇄횔로판을 제조하기 위한 에칭 레지스트 또는 갈바노레지스트로서의 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940015453A 1993-07-02 1994-06-30 광중합성조성물 KR100299264B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH93-4/2005 1993-07-02
CH200593 1993-07-02

Publications (2)

Publication Number Publication Date
KR950003920A true KR950003920A (ko) 1995-02-17
KR100299264B1 KR100299264B1 (ko) 2001-11-30

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Family Applications (1)

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KR1019940015453A KR100299264B1 (ko) 1993-07-02 1994-06-30 광중합성조성물

Country Status (9)

Country Link
US (2) US5942371A (ko)
EP (1) EP0633503B1 (ko)
JP (1) JP3511146B2 (ko)
KR (1) KR100299264B1 (ko)
CN (1) CN1070211C (ko)
AT (1) ATE155260T1 (ko)
CA (1) CA2127238C (ko)
DE (1) DE59403284D1 (ko)
TW (1) TW268031B (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131158B1 (en) 2020-07-08 2021-09-28 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11256273B2 (en) 2020-07-08 2022-02-22 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11274501B2 (en) 2020-07-08 2022-03-15 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11294401B2 (en) 2020-07-08 2022-04-05 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11314266B2 (en) 2020-07-08 2022-04-26 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11802645B2 (en) 2020-07-08 2023-10-31 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications

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TW268031B (ko) * 1993-07-02 1996-01-11 Ciba Geigy
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US6207346B1 (en) * 1997-04-09 2001-03-27 Advanced Coatings International Waterborne photoresists made from urethane acrylates
JP3711198B2 (ja) * 1998-04-23 2005-10-26 東京応化工業株式会社 レジストパターンの形成方法
US6602651B1 (en) 1998-07-07 2003-08-05 Kansai Paint Co., Ltd. Water-based solder resist composition
JP2001222103A (ja) 1999-08-05 2001-08-17 Nippon Paint Co Ltd 水性フォトソルダーレジスト組成物
GB0117155D0 (en) * 2001-07-13 2001-09-05 Coates Electrographics Ltd Improvement in or relating to photocurable resist inks
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CN1298796C (zh) * 2003-10-17 2007-02-07 财团法人工业技术研究院 光学涂布层合物及其制造方法
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KR101048329B1 (ko) 2008-10-06 2011-07-14 주식회사 엘지화학 우레탄계 다관능성 모노머, 그의 제조방법 및 이를 포함하는 감광성 수지 조성물
CN102585556A (zh) * 2011-12-31 2012-07-18 上海东升新材料有限公司 光引发聚合制备抗盐性分散剂的方法
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WO2017126536A1 (ja) * 2016-01-20 2017-07-27 三菱瓦斯化学株式会社 樹脂組成物、支持体付き樹脂シート、多層プリント配線板及び半導体装置

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131158B1 (en) 2020-07-08 2021-09-28 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11256273B2 (en) 2020-07-08 2022-02-22 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11274501B2 (en) 2020-07-08 2022-03-15 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11294401B2 (en) 2020-07-08 2022-04-05 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11314266B2 (en) 2020-07-08 2022-04-26 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications
US11802645B2 (en) 2020-07-08 2023-10-31 Saudi Arabian Oil Company Flow management systems and related methods for oil and gas applications

Also Published As

Publication number Publication date
KR100299264B1 (ko) 2001-11-30
EP0633503A1 (de) 1995-01-11
TW268031B (ko) 1996-01-11
DE59403284D1 (de) 1997-08-14
ATE155260T1 (de) 1997-07-15
US5942371A (en) 1999-08-24
CN1070211C (zh) 2001-08-29
JPH0756337A (ja) 1995-03-03
US6045972A (en) 2000-04-04
CA2127238C (en) 2006-03-21
EP0633503B1 (de) 1997-07-09
JP3511146B2 (ja) 2004-03-29
CN1103077A (zh) 1995-05-31
CA2127238A1 (en) 1995-01-03

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