KR950000755A - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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KR950000755A
KR950000755A KR1019940012701A KR19940012701A KR950000755A KR 950000755 A KR950000755 A KR 950000755A KR 1019940012701 A KR1019940012701 A KR 1019940012701A KR 19940012701 A KR19940012701 A KR 19940012701A KR 950000755 A KR950000755 A KR 950000755A
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alkali
compound
group
resin composition
phenolic hydroxyl
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KR100325670B1 (ko
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시게오 나카무라
마사히코 오시무라
겐이치 모리
다다히코 요코타
히로야스 고토
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도바 다다스
아지노모토 가부시키가이샤
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    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/54—Polycondensates of aldehydes
    • C08G18/542—Polycondensates of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8141—Unsaturated isocyanates or isothiocyanates masked
    • C08G18/815—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen
    • C08G18/8158—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8141—Unsaturated isocyanates or isothiocyanates masked
    • C08G18/815—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen
    • C08G18/8158—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen
    • C08G18/8175—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen with esters of acrylic or alkylacrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

접착성, 솔더 내열성 및 내도금성, 특히 알칼리성 조건하에서의 내도금성이 양호한 알칼리 가용성 수지 및 솔더 레지스트로서 유용한 이의 수지 조성물에 대해 기술하였다.
위의 수지 조성물은 (1) 분자량이 300 내지 30,000인, 페놀계 하이드록실 그룹을 포함하는 알칼리 가용성 중합체와 (2) 분자내에 a) 하나 이상의 중합가능한 이중결합과 b) 이소시아네이트 그룹 또는 에폭시 그룹을 포함하는 화합물을 화합물(1)의 하이드록실 당량에 대한 화합물(2)의 이소시아네이트 또는 에폭시 당량의 비율이 0.1 내지 0.8의 범위로 되도록 반응시킴으로써 수득된 알칼리 가용성 수지 성분(A) 및 가열시 페놀계 하이드록실 그룹과 반응할 수 있는 하나 이상의 작용성 그룹을 포함하는 화합물인 성분(B)를 필수성분으로서 포함한다.

Description

수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. (1) 분자량이 300 내지 30,000인, 페놀계 하이드록실 그룹을 포함하는 알칼리 가용성 중합체와 (2) 분자내에 a) 두개 이상의 중합가능한 이중결합과 b) 이소시아네이트 그룹 또는 에폭시 그룹을 포함하는 화합물을 화합물(1)의 하이드록실 당량에 대한 화합물(2)의 이소시아네이트 또는 에폭시 당량의 비율이 0.1 내지 0.8의 범위로 되도록 반응시킴으로써 수득된 알칼리 가용성 수지.
  2. (1) 분자량이 300 내지 30,000인, 페놀계 하이드록실 그룹을 포함하는 알칼리 가용성 중합체와 (2) 분자내에 a) 하나 이상의 중합가능한 이중결합과 b) 이소시아네이트 그룹 또는 에폭시 그룹을 포함하는 화합물을 화합물(1)의 하이드록실 당량에 대한 화합물(2)의 이소시아네이트 또는 에폭시 당량의 비율이 0.1 내지 0.8의 범위로 되도록 반응시킴으로써 수득된 알칼리 가용성 수지 성분(A) 및 가열시 페놀계 하이드록실 그룹과 반응할 수 있는 하나 이상의 작용성 그룹을 포함하는 화합물인 성분(B)를 필수 성분으로서 포함하는 수지 조성물.
  3. (1) 분자량이 300 내지 30,000인, 페놀계 하이드록실 그룹을 포함하는 알칼리 가용성 중합체와 (2) 분자내에 a) 하나 이상의 중합가능한 이중결합과 b) 이소시아네이트 그룹 또는 에폭시 그룹을 포함하는 화합물을 화합물(1)의 하이드록실 당량에 대한 화합물(2)의 이소시아네이트 또는 에폭시 당량의 비율이 0.1 내지 0.8의 범위로 되도록 반응시킴으로써 수득된 알칼리 가용성 수지 성분(A), 가열시 페 놀계 하이드록실 그룹과 반응할 수 있는 하나 이상의 작용성 그룹을 포함하는 화합물인 성분(B)및 광중합반응 개시제인 성분(C)를 필수성분으로서 포함하는 광경화성 수지 조성물.
  4. 제1항 내지 제3항 중의 어느 한 항에 있어서, 페놀계 하이드록실 그룹을 포함하는 알칼리 가용성 중합체가 폴리비닐 페놀인 알칼리 가용성 수지, 수지 조성물 및 광경화성 수지 조성물.
  5. 제1항 내지 제3항 중의 어느 한 항에 있어서, 페놀계 하이드록실 그룹을 포함하는 알칼리 가용성 중합체가 페놀 노볼락 수지인 알칼리 가용성 수지, 수지 조성물 및 광경화성 수지 조성물.
  6. 제1항 내지 제3항 중의 어느 한 항에 있어서, 화합물(2)내에 있는 중합가능한 이중결합이 아크릴계 그룹인 알칼리 가용성 수지, 수지 조성물 또는 광경화성 수지 조성물.
  7. 제2항 또는 제3항에 있어서, 페놀계 하이드록실 그룹과 반응할 수 있는 성분 B의 화합물내의 작용성 그룹이 에폭시 그룹인 조성물 또는 광경화성 수지 조성물.
  8. 제2항 또는 제7항 중의 어느 한항에 있어서, 솔더 레지스트 조성물(solder resist composition)인 수지 조성물.
  9. 제3항 내지 제7항 중의 어느 한 항에 있어서, 광 솔더 레지스트 조성물인 광경화성 수지 조성물.
  10. 회로가 형성되어 있는 구리 도금된 적층판을 제9항에 따르는 광 솔더 레지스트로 피복시키는 단계, 이를 건조시키는 단계, 이를 광노출시키는 단계, 이를 알칼리 수용액중에서 현상시키는 단계, 이를 가열 및 경화시키는 단계 및 경우에 따라, 후노출시키는 단계를 포함하여, 인쇄 배선반을 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940012701A 1993-06-07 1994-06-07 수지조성물 KR100325670B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP93-135892 1993-06-07
JP13589293 1993-06-07
JP6100903A JPH0756336A (ja) 1993-06-07 1994-05-16 樹脂組成物
JP94-100903 1994-05-16

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KR950000755A true KR950000755A (ko) 1995-01-03
KR100325670B1 KR100325670B1 (ko) 2002-06-20

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US (1) US5723262A (ko)
JP (1) JPH0756336A (ko)
KR (1) KR100325670B1 (ko)
DE (1) DE4419874A1 (ko)
GB (1) GB2278845B (ko)
TW (1) TW319786B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100760459B1 (ko) * 2000-07-27 2007-09-20 제이에스알 가부시끼가이샤 박막 트랜지스터 방식 칼라 액정 표시 장치의 구동용 기판 상에 스페이서를 형성하기 위한 감광성 조성물, 스페이서를 갖는 구동용 기판, 그의 제조 방법 및 칼라 액정 표시 장치

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US6132588A (en) * 1996-08-09 2000-10-17 Matsushita Electric Works, Ltd. Method for plating independent conductor circuit
US6088471A (en) * 1997-05-16 2000-07-11 Authentec, Inc. Fingerprint sensor including an anisotropic dielectric coating and associated methods
CN1275095C (zh) * 1997-09-22 2006-09-13 Az电子材料（日本）株式会社 用于制备抗蚀剂的方法
JP4654544B2 (ja) * 2000-07-12 2011-03-23 日産化学工業株式会社 リソグラフィー用ギャップフィル材形成組成物
JP4217886B2 (ja) * 2003-06-25 2009-02-04 Ｊｓｒ株式会社 感放射線性屈折率変化性組成物、パターン形成法および光学材料
JP5108210B2 (ja) * 2004-06-21 2012-12-26 三星電子株式会社 有機絶縁膜組成物およびこれを用いた有機絶縁膜のパターン形成方法および有機薄膜トランジスタおよびこれを含む表示素子
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JP2007114604A (ja) * 2005-10-21 2007-05-10 Fujifilm Electronic Materials Co Ltd 感光性組成物及びカラーフィルタ
KR101430533B1 (ko) * 2008-01-04 2014-08-22 솔브레인 주식회사 네거티브 포토레지스트 조성물 및 이를 이용한 어레이기판의 제조 방법
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JP5096272B2 (ja) * 2008-09-10 2012-12-12 丸善石油化学株式会社 フェノール系硬化剤及び該フェノール系硬化剤を用いたエポキシ樹脂組成物
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TWI516871B (zh) * 2013-10-25 2016-01-11 臺灣永光化學工業股份有限公司 負型厚膜光阻組成物及其用途
JP6606823B2 (ja) * 2014-12-03 2019-11-20 味の素株式会社 層間絶縁用樹脂組成物、支持体付き感光性フィルム、プリント配線板、半導体装置、及びプリント配線板の製造方法
JP6368380B2 (ja) * 2014-12-10 2018-08-01 互応化学工業株式会社 ソルダーレジスト組成物及び被覆プリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1063907B (it) * 1976-04-30 1985-02-18 Sir Soc Italiana Resine Spa Perfezionamenti nelle composizioni che comprendono un epossiestere insaturo ed un monomero etilenicamente insaturo
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
DE3785277D1 (de) * 1986-09-11 1993-05-13 Siemens Ag Verfahren zur herstellung waermebestaendiger strukturierter schichten.
JPH02285354A (ja) * 1989-04-27 1990-11-22 Mitsubishi Kasei Corp 感光性組成物
JPH03106925A (ja) * 1989-09-20 1991-05-07 Hitachi Chem Co Ltd 感光性樹脂組成物，感光性エレメントおよびプリント配線板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100760459B1 (ko) * 2000-07-27 2007-09-20 제이에스알 가부시끼가이샤 박막 트랜지스터 방식 칼라 액정 표시 장치의 구동용 기판 상에 스페이서를 형성하기 위한 감광성 조성물, 스페이서를 갖는 구동용 기판, 그의 제조 방법 및 칼라 액정 표시 장치

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GB9411382D0 (en) 1994-07-27
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KR100325670B1 (ko) 2002-06-20
DE4419874A1 (de) 1994-12-22
GB2278845A (en) 1994-12-14

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