SG11201405096WA - Photosensitive black resin composition and resin black matrix substrate - Google Patents

Photosensitive black resin composition and resin black matrix substrate

Info

Publication number
SG11201405096WA
SG11201405096WA SG11201405096WA SG11201405096WA SG11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA
Authority
SG
Singapore
Prior art keywords
resin
black
matrix substrate
resin composition
photosensitive
Prior art date
Application number
SG11201405096WA
Inventor
Ryosuke Aihara
Yoshihiko Inoue
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201405096WA publication Critical patent/SG11201405096WA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
SG11201405096WA 2012-03-26 2013-03-08 Photosensitive black resin composition and resin black matrix substrate SG11201405096WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012068902 2012-03-26
PCT/JP2013/056437 WO2013146183A1 (en) 2012-03-26 2013-03-08 Photosensitive black resin composition and resin black matrix substrate

Publications (1)

Publication Number Publication Date
SG11201405096WA true SG11201405096WA (en) 2014-11-27

Family

ID=49259451

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201405096WA SG11201405096WA (en) 2012-03-26 2013-03-08 Photosensitive black resin composition and resin black matrix substrate

Country Status (6)

Country Link
JP (1) JP5333696B1 (en)
KR (1) KR101998449B1 (en)
CN (1) CN104204945B (en)
SG (1) SG11201405096WA (en)
TW (1) TWI575314B (en)
WO (1) WO2013146183A1 (en)

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Publication number Priority date Publication date Assignee Title
TWI544281B (en) * 2014-11-25 2016-08-01 奇美實業股份有限公司 Photosensitive resin composition for black matrix and application thereof
TWI613486B (en) * 2014-08-01 2018-02-01 Toppan Printing Co Ltd Black electrode substrate, method of manufacturing black electrode substrate, and display device
TWI564657B (en) * 2014-08-28 2017-01-01 Chi Mei Corp Photosensitive resin composition for color filter and its application
JP6607682B2 (en) * 2015-03-05 2019-11-20 日鉄ケミカル&マテリアル株式会社 Black resin composition for light-shielding film, substrate with light-shielding film having light-shielding film obtained by curing said composition, and color filter and touch panel having said substrate with light-shielding film
CN107615167A (en) * 2015-05-29 2018-01-19 住友电木株式会社 The manufacture method of photosensitive composition, colored pattern or black matrix, colour filter, liquid crystal display device or solid-state imager and colour filter
KR102431444B1 (en) 2015-07-14 2022-08-11 삼성디스플레이 주식회사 Liquid crystal display device and method of manufacturing the same
WO2019059169A1 (en) * 2017-09-22 2019-03-28 東レ株式会社 Transparent photosensitive resin composition, photospacer, liquid crystal display device, method for producing photospacer, method for producing liquid crystal display device, and use of transparent photosensitive resin composition for lens scan exposure
KR102442301B1 (en) * 2017-09-26 2022-09-13 후지필름 가부시키가이샤 Structure, composition for forming barrier ribs, solid-state imaging device, and image display device
KR102229633B1 (en) * 2017-12-26 2021-03-17 삼성에스디아이 주식회사 Photosensitive resin composition, photosensitive resin layer using the same and color filter
KR102284582B1 (en) * 2018-04-04 2021-08-02 삼성에스디아이 주식회사 Red photosensitive resin composition, photosensitive resin layer using the same and color filter
KR20210115795A (en) * 2020-03-16 2021-09-27 동우 화인켐 주식회사 Black Photosensitive Resin Composition, Black Matrix and Display Device
TWI744014B (en) 2020-09-29 2021-10-21 新應材股份有限公司 Black resin composition, cured film, and black filter

Family Cites Families (19)

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JP3230800B2 (en) 1997-03-06 2001-11-19 日本化薬株式会社 Black radiation-sensitive resin composition, black cured film and black matrix
JP3921730B2 (en) 1997-04-08 2007-05-30 三菱化学株式会社 Photopolymerizable composition for color filter
JP2005258460A (en) 1999-09-17 2005-09-22 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element using the same, process for producing resist pattern, and process for producing printed circuit board
JP2001228610A (en) 2000-02-15 2001-08-24 Showa Denko Kk Photosensitive resin composition and method for producing cured film
CN100454142C (en) * 2000-03-29 2009-01-21 学校法人神奈川大学 Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with same
JP4034588B2 (en) * 2001-12-25 2008-01-16 旭化成ケミカルズ株式会社 Photosensitive coloring composition and cured product thereof
JP2004347916A (en) 2003-05-23 2004-12-09 Toyo Ink Mfg Co Ltd Photosensitive color composition for forming color filter, and color filter
JP2006008740A (en) * 2004-06-22 2006-01-12 Nitto Denko Corp Ultraviolet curable resin composition
JP4809006B2 (en) * 2005-07-05 2011-11-02 太陽ホールディングス株式会社 Colored photosensitive resin composition and cured product thereof
JP4763390B2 (en) * 2005-09-05 2011-08-31 東京応化工業株式会社 Photosensitive resin composition
JP4706560B2 (en) 2006-05-29 2011-06-22 Jsr株式会社 Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display element
JP4947300B2 (en) * 2007-06-14 2012-06-06 Jsr株式会社 Radiation-sensitive resin composition, interlayer insulating film, microlens and method for forming them
KR101602005B1 (en) * 2009-03-30 2016-03-17 제이에스알 가부시끼가이샤 Coloring composition, color filter, and color liquid crystal display element
JP2011048064A (en) * 2009-08-26 2011-03-10 Asahi Kasei E-Materials Corp Photosensitive resin composition and laminate, and electromagnetic wave shield and transparent conductive substrate using the same
JP5515714B2 (en) * 2009-12-16 2014-06-11 Jsr株式会社 Coloring composition, color filter and color liquid crystal display element
KR20110130151A (en) * 2010-05-27 2011-12-05 동우 화인켐 주식회사 A black photosensitive resin composition, color filter and liquid crystal display device having the same
JP2012008262A (en) * 2010-06-23 2012-01-12 Fujifilm Corp Colored photosensitive resin composition, pattern forming method, manufacturing method of color filter, color filter, and display device comprising the same
KR20120002864A (en) * 2010-07-01 2012-01-09 동우 화인켐 주식회사 A black photosensitive resin composition, color filter and liquid crystal display device having the same
WO2012002134A1 (en) * 2010-07-02 2012-01-05 東レ株式会社 Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film

Also Published As

Publication number Publication date
KR20140148377A (en) 2014-12-31
JPWO2013146183A1 (en) 2015-12-10
WO2013146183A1 (en) 2013-10-03
CN104204945A (en) 2014-12-10
KR101998449B1 (en) 2019-07-09
TW201348864A (en) 2013-12-01
TWI575314B (en) 2017-03-21
JP5333696B1 (en) 2013-11-06
CN104204945B (en) 2017-10-03

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