EP2927281A4 - Resin composition and use thereof - Google Patents

Resin composition and use thereof

Info

Publication number
EP2927281A4
EP2927281A4 EP13858022.0A EP13858022A EP2927281A4 EP 2927281 A4 EP2927281 A4 EP 2927281A4 EP 13858022 A EP13858022 A EP 13858022A EP 2927281 A4 EP2927281 A4 EP 2927281A4
Authority
EP
European Patent Office
Prior art keywords
use
resin composition
resin
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13858022.0A
Other languages
German (de)
French (fr)
Other versions
EP2927281B1 (en
EP2927281A1 (en
Inventor
Guangbing Chen
Xianping Zeng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengyi Technology Co Ltd
Original Assignee
Shengyi Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201210492434.9A priority Critical patent/CN102993683B/en
Application filed by Shengyi Technology Co Ltd filed Critical Shengyi Technology Co Ltd
Priority to PCT/CN2013/070774 priority patent/WO2014082386A1/en
Publication of EP2927281A1 publication Critical patent/EP2927281A1/en
Publication of EP2927281A4 publication Critical patent/EP2927281A4/en
Application granted granted Critical
Publication of EP2927281B1 publication Critical patent/EP2927281B1/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • C08G65/485Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • C08K5/3417Five-membered rings condensed with carbocyclic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5425Silicon-containing compounds containing oxygen containing at least one C=C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/549Silicon-containing compounds containing silicon in a ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives not used
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives not used from phenols not used
    • C08L71/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives not used
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives not used from phenols not used
    • C08L71/12Polyphenylene oxides
    • C08L71/126Polyphenylene oxides modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Impregnation or embedding of a layer; Bonding a fibrous, filamentary or particulate layer by using a binder
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Impregnation or embedding of a layer; Bonding a fibrous, filamentary or particulate layer by using a binder
    • B32B2260/04Impregnation material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/07Parts immersed or impregnated in a matrix
    • B32B2305/076Prepregs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • B32B2307/3065Flame resistant or retardant, fire resistant or retardant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/012Flame-retardant; Preventing of inflammation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
EP13858022.0A 2012-11-27 2013-01-21 Resin composition and use thereof Active EP2927281B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201210492434.9A CN102993683B (en) 2012-11-27 2012-11-27 Resin composition and use thereof
PCT/CN2013/070774 WO2014082386A1 (en) 2012-11-27 2013-01-21 Resin composition and use thereof

Publications (3)

Publication Number Publication Date
EP2927281A1 EP2927281A1 (en) 2015-10-07
EP2927281A4 true EP2927281A4 (en) 2016-06-22
EP2927281B1 EP2927281B1 (en) 2020-01-08

Family

ID=47922826

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13858022.0A Active EP2927281B1 (en) 2012-11-27 2013-01-21 Resin composition and use thereof

Country Status (6)

Country Link
US (1) US10149380B2 (en)
EP (1) EP2927281B1 (en)
KR (1) KR101754509B1 (en)
CN (1) CN102993683B (en)
TW (1) TWI488916B (en)
WO (1) WO2014082386A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
CN104744892A (en) * 2013-12-27 2015-07-01 台燿科技股份有限公司 Resin composition and uses of the same
TWI506077B (en) * 2013-12-31 2015-11-01 Taiwan Union Technology Corp Resin composition and uses of the same
CN105086417B (en) * 2014-05-06 2017-09-12 广东生益科技股份有限公司 A kind of resin combination and its application in high-frequency circuit board
CN107033343B (en) * 2014-11-06 2019-01-08 江苏雅克科技股份有限公司 Phosphorous functionalized poly (arylene ether) and the curable compositions comprising phosphorous functionalized poly (arylene ether)
CN104650574B (en) * 2015-02-10 2017-02-22 郴州功田电子陶瓷技术有限公司 Polyphenyl ether copper-clad laminate composition
CN106609039B (en) * 2015-10-21 2019-09-13 广东生益科技股份有限公司 A kind of polyphenyl ether resin composition and its application in high-frequency circuit board
CN106609030B (en) * 2015-10-21 2018-12-25 广东生益科技股份有限公司 A kind of polyphenyl ether resin composition and its application in high-frequency circuit board
CN106916267B (en) * 2015-12-25 2019-06-14 广东生益科技股份有限公司 A kind of organic-silicon-modified phenolic resin, Preparation method and use
CN106916293B (en) * 2015-12-25 2019-07-26 广东生益科技股份有限公司 A kind of organic-silicon-modified polyphenylene oxide resin, Preparation method and use
CN106671517A (en) * 2016-07-06 2017-05-17 武汉联恒电子材料有限公司 Composition of fluorine-containing resin and compound ceramic fillers and high-frequency copper-clad laminate manufactured from composition
CN106543686B (en) * 2016-11-25 2018-07-31 苏州生益科技有限公司 A kind of resin combination and prepreg, laminate and interlayer dielectric using its making
CN108148196A (en) * 2016-12-02 2018-06-12 广东生益科技股份有限公司 A kind of styryl siloxy polyphenylene oxide resin and its preparation method and application
CN108727828A (en) * 2017-04-17 2018-11-02 广东生益科技股份有限公司 A kind of thermosetting ethylene alkenyl organosilicon resin composition and its application in high-frequency circuit board
CN108727827A (en) * 2017-04-17 2018-11-02 广东生益科技股份有限公司 Thermosetting ethylene alkenyl organosilicon resin composition and its application in high-frequency circuit board
EP3569655A1 (en) * 2017-05-15 2019-11-20 LG Chem, Ltd. Resin composition for semiconductor package, and prepreg and metal clad laminate, which use same
CN109082019A (en) * 2017-06-13 2018-12-25 广东生益科技股份有限公司 A kind of fluoropolymer resin and its application in high-frequency circuit board
CN109385020A (en) * 2017-08-04 2019-02-26 广东生益科技股份有限公司 A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production
CN107903604A (en) * 2017-12-12 2018-04-13 天津金发新材料有限公司 A kind of PC compositions of new solvent resistant low-density

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916952A (en) * 1991-11-18 1999-06-29 Dow Corning Corporation Poly(phenylene ether) resin modified with silicone rubber powder
EP1242504B1 (en) * 1999-12-06 2007-07-04 General Electric Company Synthesis of poly(arylene ether)-poly(organosiloxane) copolymers
US20080071817A1 (en) * 2006-09-20 2008-03-20 Microsoft Corporation Electronic data interchange (edi) data dictionary management and versioning system
CN101423658A (en) * 2008-11-27 2009-05-06 中国蓝星(集团)股份有限公司 Polyphenylene oxide resin composition and method for inhibiting discoloration of polyphenylene oxide resin
CN101434753A (en) * 2007-11-13 2009-05-20 信越化学工业株式会社 Flame-retardant resin composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09302140A (en) 1996-05-15 1997-11-25 Mitsubishi Eng Plast Kk Flame-retardant thermoplastic resin composition
TWI441866B (en) 2006-02-17 2014-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate
CN101328304A (en) * 2007-06-22 2008-12-24 东丽纤维研究所(中国)有限公司 Flame-retardant anti-dropping thermoplastic resin composition
WO2009011280A1 (en) 2007-07-13 2009-01-22 Mitsubishi Rayon Co., Ltd. Graft copolymer, thermoplastic resin composition, and molded object
CN102161823B (en) * 2010-07-14 2012-09-26 广东生益科技股份有限公司 Composite material, high-frequency circuit substrate therefrom and manufacture method thereof
US9783653B2 (en) * 2010-08-03 2017-10-10 A. Schulman, Inc. Polymer composite foams

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916952A (en) * 1991-11-18 1999-06-29 Dow Corning Corporation Poly(phenylene ether) resin modified with silicone rubber powder
EP1242504B1 (en) * 1999-12-06 2007-07-04 General Electric Company Synthesis of poly(arylene ether)-poly(organosiloxane) copolymers
US20080071817A1 (en) * 2006-09-20 2008-03-20 Microsoft Corporation Electronic data interchange (edi) data dictionary management and versioning system
CN101434753A (en) * 2007-11-13 2009-05-20 信越化学工业株式会社 Flame-retardant resin composition
CN101423658A (en) * 2008-11-27 2009-05-06 中国蓝星(集团)股份有限公司 Polyphenylene oxide resin composition and method for inhibiting discoloration of polyphenylene oxide resin

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200944, Derwent World Patents Index; AN 2009-J84565, XP002757794 *
HUANG W ET AL: "STUDY OF THE PROPERTIES AND TOPOLOGICAL TRAPPING OF CYCLIC POLY(DIMETHYLSILOXANE) IN POLY(2,6-DIMETHYL-1,4-PHENYLENE OXIDE) NETWORKS", JOURNAL OF POLYMER SCIENCE, POLYMER CHEMISTRY EDITION, INTERSCIENCE PUBLISHERS, NEW YORK, NY, US, vol. 28, no. 7, 1 June 1990 (1990-06-01), pages 1807 - 1812, XP000160229, ISSN: 0360-6376 *
See also references of WO2014082386A1 *
WEIYU HUANG ET AL: "POLY(2,6-DIMETHYL-1,4-PHENYLENE OXIDE)/POLY(DIMETHYLSILOXANE) SYSTEM - ARCHITECTURE AND SELECTED PROPERTIES", MAKROMOLEKULARE CHEMIE, MACROMOLECULAR CHEMISTRY AND PHYSICS,SUPPLEMENTS, HUTHIG UND WEPF VERLAG, BASEL, CH, vol. 15, no. SUPPL. 15, 1 June 1989 (1989-06-01), pages 137 - 145, XP000095262 *

Also Published As

Publication number Publication date
KR101754509B1 (en) 2017-07-19
TWI488916B (en) 2015-06-21
WO2014082386A1 (en) 2014-06-05
KR20150089063A (en) 2015-08-04
CN102993683B (en) 2015-04-15
EP2927281B1 (en) 2020-01-08
US10149380B2 (en) 2018-12-04
TW201431950A (en) 2014-08-16
EP2927281A1 (en) 2015-10-07
US20150313012A1 (en) 2015-10-29
CN102993683A (en) 2013-03-27

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Effective date: 20190911