WO2010087429A1 - Antenna and wireless ic device - Google Patents
Antenna and wireless ic device Download PDFInfo
- Publication number
- WO2010087429A1 WO2010087429A1 PCT/JP2010/051205 JP2010051205W WO2010087429A1 WO 2010087429 A1 WO2010087429 A1 WO 2010087429A1 JP 2010051205 W JP2010051205 W JP 2010051205W WO 2010087429 A1 WO2010087429 A1 WO 2010087429A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pattern
- wireless
- antenna
- coupling
- patterns
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
- H01Q9/285—Planar dipole
Definitions
- the present invention relates to an antenna and a wireless IC device, and more particularly to an antenna for a wireless IC device used in an RFID (Radio Frequency Identification) system and a wireless IC device including the antenna.
- RFID Radio Frequency Identification
- a reader / writer that generates electromagnetic waves communicates with a wireless IC (referred to as an IC tag or wireless IC device) that stores predetermined information attached to an article or a container in a non-contact manner.
- RFID systems that transmit information have been developed.
- the wireless IC can communicate with a reader / writer by being coupled with an antenna (radiation plate).
- the coil L11 of the ID module 100 and the coil L12 of the coil module 110 are coupled and resonated at a predetermined frequency.
- the ID module 100 causes the primary coil L11 and the capacitor C11 to resonate in parallel.
- the coil module 110 is configured in a closed loop by electrically connecting both ends of the two coils L12 and L13, and energy is transmitted between the two coils L12 and L13 by current. That is, the magnetic field is radiated by the current generated by the coil L12 coupled to the primary coil L11 passing through the coil L13.
- the inductance value of the radiation coil L13 is increased and the inductance value of the coupling coil L12 is decreased in order to increase the received magnetic field energy from the reader / writer, the voltage across the coil L12 decreases. Therefore, the amount of current flowing between the two coils L12 and L13 is reduced, and sufficient energy is not transmitted from the IC to the radiating coil L13, resulting in a problem that the communication distance is reduced. Further, when the radiating coil L13 is close to the reader / writer antenna or close to another wireless IC, its value changes due to mutual inductance, and the resonance frequency of the primary coil L11 also changes. As a result, there is a possibility that reading with a reader / writer becomes impossible.
- an object of the present invention is to provide an antenna for a wireless IC device having high energy transmission efficiency with the wireless IC, and a wireless IC device including the antenna.
- the antenna according to the first aspect of the present invention is: With antenna pattern, A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other; It is provided with.
- the wireless IC device is With antenna pattern, A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other; A coupling module comprising a wireless IC and a power feeding circuit board having a power feeding circuit coupled to the wireless IC; With The power supply circuit includes an inductor; The coupling module is mounted on the coupling pattern; It is characterized by.
- the spiral coupling patterns coupled to the antenna pattern are arranged to face each other to form one LC resonator. That is, a capacitance is formed between the spiral coupling patterns arranged opposite to each other, and LC resonance is caused by the inductance formed by the capacitance and the spiral coupling pattern. Due to this LC resonance, the impedance becomes infinite, and energy concentrates on the coupling pattern. As a result, energy transmission efficiency between the antenna and the wireless IC mounted thereon is improved.
- the antenna pattern may be a single coiled pattern, two coiled patterns arranged opposite to each other, or at least a pair of end portions. And two dipole patterns disposed opposite to each other and having a dipole-type radiator coupled to the ring pattern.
- the antenna pattern is disposed so as to face two layers, more magnetic fields can be generated.
- two antenna patterns and two coupling patterns are connected to each other, even if a plurality of wireless IC devices are close to each other or a dielectric such as a human hand is close to the pattern, The occurrence of stray capacitance is suppressed, and fluctuations in the resonance frequency are prevented.
- the transmission efficiency between the antenna and the wireless IC is improved, and energy is transmitted efficiently.
- the wireless IC device 1 ⁇ / b> A includes a substrate 10, a coupling module 20, and an antenna 30.
- the coupling module 20 includes a wireless IC chip 21 and a power feeding circuit board 25 having a power feeding circuit coupled to the wireless IC chip 21.
- the antenna 30 includes a coiled pattern 31 and spiral coupling patterns 32a and 32b that are formed at both ends of the coiled pattern 31 and are arranged to face each other.
- the substrate 10 is made of a dielectric material such as a PET film.
- the coil pattern 31 is formed in a coil shape on the surface of the substrate 10 as shown in FIG. 2, and a spiral coupling pattern 32a is formed at one end.
- a spiral coupling pattern 32 b is disposed on the back surface of the substrate 10 so as to face the coupling pattern 32 a, and an end 32 c of the coupling pattern 32 b is connected to the other side of the coiled pattern 31 via the via-hole conductor 33. Is electrically connected to the end portion 31c.
- the wireless IC chip 21 includes a clock circuit, a logic circuit, a memory circuit, and the like, and stores necessary information. An input terminal electrode, an output terminal electrode, and a mounting terminal (not shown) An electrode is provided.
- the power supply circuit board 25 is a laminated board including a power supply circuit including an inductor, and is mounted (adhered) on the coupling pattern 32 a.
- the coupling module 20 may be one in which the wireless IC chip 21 and the power feeding circuit board 25 are separately formed, or the wireless IC and the power feeding circuit may be integrally formed on one board. Good.
- the feeder circuit board 25 is a laminate of a plurality of sheets 41a to 41g each having an electrode, and each of the sheets 41a to 41g is made of ceramic or resin.
- electrodes 42a to 42d and via-hole conductors 43a and 43b are formed.
- electrodes 44 and via-hole conductors 43c and 43d are formed.
- An electrode 44 is formed on the sheet 41g.
- the respective electrodes 44 are electrically connected via the via-hole conductors 43d to form inductors.
- One end of the inductor (one end 44a of the electrode 44 on the sheet 41b) is connected to the electrode 42b on the sheet 41a via the via-hole conductor 43b.
- the other end of the inductor (one end 44b of the electrode 44 on the sheet 41g) is connected to the electrode 42a on the sheet 41a via the via-hole conductors 43c and 43a.
- the inductor resonates at a predetermined resonance frequency with its own inductance and the capacitance between the electrodes 44.
- the electrodes 42a and 42b on the sheet 41a are connected to the input terminal electrode and the output terminal electrode of the wireless IC chip 21, respectively.
- the electrodes 42c and 42d on the sheet 41a are connected to the mounting terminal electrodes of the wireless IC chip 21.
- the inductor is magnetically coupled to the coupling patterns 32a and 32b.
- a high frequency signal (for example, UHF frequency band or HF frequency band) radiated from the reader / writer is received by the coiled pattern 31 and magnetically coupled to the coupling patterns 32a and 32b.
- the power feeding circuit is resonated, and only the reception signal having a predetermined frequency is supplied to the wireless IC chip 21.
- the wireless IC chip 21 takes out predetermined energy from the received signal, reads out information stored in memory using this energy as a drive source, matches it with a predetermined frequency by a power feeding circuit, and then passes through the coupling patterns 32a and 32b.
- the signal is radiated from the coiled pattern 31 as a transmission signal and transmitted to the reader / writer.
- the coiled pattern 31 is an open type, and the coupling patterns 32a and 32b located at both ends of the coiled pattern 31 are close to each other, and the coupling patterns 32a and 32b form an LC resonator (see FIG. 7). That is, a capacitor C is formed between the spiral coupling patterns 32a and 32b arranged opposite to each other, and LC resonance is caused by the capacitors C and the inductances L1 and L2 formed by the spiral coupling patterns 32a and 32b. . Due to this LC resonance, the impedance becomes infinite, and energy concentrates on the coupling patterns 32a and 32b. As a result, the energy transfer efficiency between the antenna 30 and the wireless IC chip 21 mounted thereon is improved. In addition, the two coupling patterns 32a and 32b that face each other are wound in opposite directions from each other in the plan view, so that the directions of current flow are the same and the directions of the magnetic fields coincide with each other. The degree is improved.
- the resonance frequency of the power feeding circuit substantially corresponds to the resonance frequency of the transmission / reception signal. That is, the resonance frequency of the wireless IC device 1A is determined by the resonance frequency of the resonance circuit. Therefore, communication at the resonance frequency of the resonance circuit is possible regardless of the resonance frequency of the coiled pattern 31, and the power supply circuit board 25 having various resonance frequencies can be combined with one type of antenna 30. In addition, since the resonance frequency of the resonance circuit does not change due to the influence from others, the communication with the reader / writer is stable.
- the resonance frequency of the coiled pattern 31 is preferably set higher than the resonance frequency of the resonance circuit included in the power supply circuit board 25.
- the resonance frequency of the coiled pattern 31 is set to 14 MHz.
- the power feeding circuit and the coiled pattern 31 are always magnetically coupled. If the antenna 30 is viewed alone, the communication distance becomes longer when the resonance frequency is close to the resonance frequency of the resonance circuit.
- the resonance frequency of the coiled pattern 31 is preferably set on the high frequency side.
- the coupling patterns 32a and 32b are arranged immediately below the magnetic field radiated from the power supply circuit board 25, and the inductor in the power supply circuit board 25 spirals so that current flows in the same direction as the coupling patterns 32a and 32b. Since it is formed (FIG. 4 shows the direction A of the current flowing through the inductor and FIG. 3 shows the direction B of the current flowing through the coupling patterns 32a and 32b), energy can be transmitted more efficiently.
- the wireless IC chip 21 and the power supply circuit board 25 are electrically connected, but the power supply circuit board 25 and the antenna 30 need only be joined with an insulating adhesive.
- the direction of bonding is also arbitrary, and the area of the coupling patterns 32a and 32b is larger than the area of the feeder circuit board 25. Therefore, alignment when the coupling module 20 is mounted on the coupling pattern 32a is extremely easy.
- the power supply circuit board 25 is preferably made of a material containing a magnetic material. Even if the built-in inductor is small, the Q value becomes high, so that the feeder circuit board 25 can be made small.
- the feeder circuit board 25 is formed of a plurality of layers, it is preferable that the permeability of the layer on the mounting surface side to the coupling pattern 32a is low (for example, a nonmagnetic layer). When the magnetic permeability is low, a magnetic field is likely to be generated in the vicinity of the outside, and the coupling is strong only with the coupling patterns 32a and 32b, and also strong against interference from others.
- the wireless IC device 1B includes a substrate (not shown) (same as the substrate 10 in the first embodiment), the coupling module 20, and the antenna 50 shown in FIG.
- the antenna 50 is formed at two end portions of the coiled patterns 51a and 51b disposed opposite to each other on the front and back surfaces of the substrate, and at one end of the coiled patterns 51a and 51b, and disposed opposite to each other. It consists of spiral coupling patterns 52a and 52b.
- the coupling module 20 is as described in the first embodiment, and is mounted (adhered) on the coupling pattern 52a.
- the communication mode between the wireless IC device 1B and the reader / writer is the same as that in the first embodiment.
- the coiled patterns 51a and 51b are of an open type, and are arranged between the coiled patterns 51a and 51b arranged in opposition and between the spiral coupling patterns 52a and 52b.
- a capacitor C is formed, and LC resonance is caused by inductances L1 and L2 formed entirely by the capacitor C, the two coiled patterns 51a and 51b, and the coupling patterns 52a and 52b (see FIG. 8).
- This LC resonance makes the impedance infinite, and energy concentrates on the coiled patterns 51a and 51b and the coupling patterns 52a and 52b. As a result, energy transmission efficiency between the antenna 50 and the wireless IC chip 21 mounted thereon is improved.
- the two coil-like patterns 51a and 51b and the coupling patterns 52a and 52b are coupled to each other, a plurality of wireless IC devices are close to each other or a dielectric such as a human hand is present. Even if they are close to each other, stray capacitance is suppressed from occurring between patterns, and fluctuations in resonance frequency are prevented. Other functions and effects are the same as those of the first embodiment.
- the entire antenna 50 resonates at a predetermined frequency. Therefore, when the coupling module 20 is mounted on the coupling patterns 52a and 52b that are part of the antenna 50, the antenna 50 and the coupling module 20 are coupled only by a magnetic field at a predetermined frequency.
- the antenna 50 and the reader / writer are electromagnetic couplings.
- the wireless IC device 1 ⁇ / b> C includes a substrate 110, a coupling module 120, and an antenna 130.
- the coupling module 120 includes a wireless IC chip 21 and a power feeding circuit board 125 having a power feeding circuit coupled to the wireless IC chip 21.
- the antenna 130 (the front side is shown in FIG. 10 and the back side is shown in FIG. 11) has two annular patterns 131a and 131b that have a pair of ends and are opposed to each other on the front and back surfaces of the substrate 110.
- the spiral coupling patterns 132a and 132b which are formed at one end portions of the annular patterns 131a and 131b and are arranged to face each other, are extended laterally from a part of the annular pattern 131a.
- two radiators 133 are coupled to the annular pattern 131a and functions as a meandering dipole antenna.
- the power supply circuit board 125 is a laminate of a plurality of sheets 141a to 141d each having an electrode, and each of the sheets 141a to 141d is made of ceramic or resin.
- Electrodes 142a to 142d and via-hole conductors 143a and 143b are formed in the sheet 141a.
- Sheets 141b and 141c are formed with electrodes 144 and via-hole conductors 143c and 143d.
- An electrode 144 is formed on the sheet 141d.
- the respective electrodes 144 are electrically connected via the via-hole conductor 143c to form an inductor.
- One end of the inductor (one end 144a of the electrode 144 on the sheet 141b) is connected to the electrode 142b on the sheet 141a via the via-hole conductor 143b.
- the other end of the inductor (one end 144b of the electrode 144 on the sheet 141d) is connected to the electrode 142a on the sheet 141a via the via-hole conductors 143d and 143a.
- the inductor resonates at a predetermined resonance frequency with its own inductance and the capacitance between the electrodes 144.
- the electrodes 142a and 142b on the sheet 141a are connected to the input terminal electrode and the output terminal electrode of the wireless IC chip 21, respectively.
- the electrodes 142c and 142d on the sheet 141a are connected to the mounting terminal electrodes of the wireless IC chip 21.
- the inductor is magnetically coupled to the coupling patterns 132a and 132b.
- the annular patterns 131a and 131b are open-type, and a capacitance is provided between the annular patterns 131a and 131b arranged opposite to each other and between the spiral coupling patterns 132a and 132b.
- C is formed, and LC resonance is caused by inductances L1 and L2 formed entirely by the capacitor C, the two annular patterns 131a and 131b, and the coupling patterns 132a and 132b. That is, the same equivalent circuit as in FIG. 8 is configured. Due to this LC resonance, the impedance becomes infinite, and energy concentrates on the annular patterns 131a and 131b and the coupling patterns 132a and 132b.
- the energy transmission efficiency between the antenna 130 and the wireless IC chip 21 mounted thereon is improved. Therefore, the high-frequency signal is efficiently radiated from the radiator 133, and the high-frequency signal received by the radiator 133 is efficiently transmitted to the power feeding circuit.
- the loss of the signal transmitted to the radiator 133 is reduced by arranging the annular patterns 131a and 131b so as to be coupled to the power feeding circuit and the radiator 133. And a high gain can be obtained.
- the gain of the wireless IC device 1C with respect to the frequency of the high frequency signal is as shown in FIG. 13, and a high gain is achieved in the UHF frequency band.
- the annular pattern 131 may be a meander pattern or a spiral pattern.
- annular patterns 131a and 131b are arranged in two layers, more magnetic fields can be generated. Furthermore, since two annular patterns 131a and 131b and two coupling patterns 132a and 132b are coupled to each other, a plurality of wireless IC devices are close to each other, and a dielectric such as a human hand is close to each other. Even so, the stray capacitance between the patterns is suppressed, and the resonance frequency is prevented from changing. Other functions and effects are the same as those of the first embodiment.
- the entire antenna 130 resonates at a predetermined frequency. Therefore, when the coupling module 120 is mounted on the coupling patterns 132a and 132b that are part of the antenna 130, the antenna 130 and the coupling module 120 are coupled only by a magnetic field at a predetermined frequency.
- the antenna 130 and the reader / writer are electromagnetic couplings.
- the antenna and the wireless IC device according to the present invention are not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.
- the present invention is useful for an antenna and a wireless IC device used in an RFID system, and is particularly excellent in that energy transmission efficiency with the wireless IC is good.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
Disclosed are an antenna for wireless IC devices that has good energy transmission efficiency with wireless ICs, and a wireless IC device that is equipped with said antenna.
An antenna (30) comprises a coil pattern (31) and spiral coupling patterns (32a, 32b), which are formed at both ends of said coil pattern (31) and are disposed facing one another. A wireless IC device (1A) is configured by installing a coupling module (20), comprising a wireless IC chip (21) and a power supply circuit substrate (25) which has a power supply circuit that couples with said wireless IC chip (21), on the coupling pattern (32a). The coil pattern (31) is an open type that, with the adjacent coupling patterns (32a, 32b), overall forms a single LC resonator, which improves the energy transmission efficiency between the antenna (30) and wireless IC chip (21) by focusing energy to the coupling patterns (32a, 32b).
Description
本発明は、アンテナ及び無線ICデバイス、特に、RFID(Radio Frequency Identification)システムに用いられる無線ICデバイス用のアンテナ及び該アンテナを備えた無線ICデバイスに関する。
The present invention relates to an antenna and a wireless IC device, and more particularly to an antenna for a wireless IC device used in an RFID (Radio Frequency Identification) system and a wireless IC device including the antenna.
従来、物品の管理システムとして、電磁波を発生するリーダライタと物品や容器などに付された所定の情報を記憶した無線IC(ICタグ、無線ICデバイスなどと称する)とを非接触方式で通信し、情報を伝達するRFIDシステムが開発されている。無線ICはアンテナ(放射板)と結合されることによりリーダライタとの通信が可能になる。
2. Description of the Related Art Conventionally, as an article management system, a reader / writer that generates electromagnetic waves communicates with a wireless IC (referred to as an IC tag or wireless IC device) that stores predetermined information attached to an article or a container in a non-contact manner. RFID systems that transmit information have been developed. The wireless IC can communicate with a reader / writer by being coupled with an antenna (radiation plate).
この種の無線ICとして、特許文献1には、図14に示すように、IDモジュール100のコイルL11とコイルモジュール110のコイルL12とを結合させ、所定の周波数で共振するように設定したものが記載されている。IDモジュール100は1次コイルL11とコンデンサC11を並列共振させている。コイルモジュール110は二つのコイルL12,L13の両端を互いに電気的に接続して閉ループに構成され、二つのコイルL12,L13間は電流によってエネルギーが伝達される。即ち、1次コイルL11と結合するコイルL12により発生する電流がコイルL13を通ることで磁界を放射している。
As this type of wireless IC, in Patent Document 1, as shown in FIG. 14, the coil L11 of the ID module 100 and the coil L12 of the coil module 110 are coupled and resonated at a predetermined frequency. Are listed. The ID module 100 causes the primary coil L11 and the capacitor C11 to resonate in parallel. The coil module 110 is configured in a closed loop by electrically connecting both ends of the two coils L12 and L13, and energy is transmitted between the two coils L12 and L13 by current. That is, the magnetic field is radiated by the current generated by the coil L12 coupled to the primary coil L11 passing through the coil L13.
しかしながら、リーダライタからの受信磁界エネルギーを大きくするために、放射用コイルL13のインダクタンス値を大きくし、結合コイルL12のインダクタンス値を小さくすると、コイルL12の両端の電圧が小さくなる。そのため、二つのコイルL12,L13間に流れる電流の量が少なくなり、ICから放射用コイルL13に十分なエネルギーが伝達されず、通信距離が低下するという問題点を有していた。また、放射用コイルL13がリーダライタのアンテナに近接したり、他の無線ICに近接すると、相互インダクタンスによりその値が変化し、1次コイルL11の共振周波数も変化してしまう。その結果、リーダライタでの読取りが不能になるおそれも有していた。
However, if the inductance value of the radiation coil L13 is increased and the inductance value of the coupling coil L12 is decreased in order to increase the received magnetic field energy from the reader / writer, the voltage across the coil L12 decreases. Therefore, the amount of current flowing between the two coils L12 and L13 is reduced, and sufficient energy is not transmitted from the IC to the radiating coil L13, resulting in a problem that the communication distance is reduced. Further, when the radiating coil L13 is close to the reader / writer antenna or close to another wireless IC, its value changes due to mutual inductance, and the resonance frequency of the primary coil L11 also changes. As a result, there is a possibility that reading with a reader / writer becomes impossible.
そこで、本発明の目的は、無線ICとのエネルギーの伝達効率のよい無線ICデバイス用のアンテナ、及び、該アンテナを備えた無線ICデバイスを提供することにある。
Therefore, an object of the present invention is to provide an antenna for a wireless IC device having high energy transmission efficiency with the wireless IC, and a wireless IC device including the antenna.
以上の目的を達成するため、本発明の第1の形態であるアンテナは、
アンテナパターンと、
前記アンテナパターンに結合され、かつ、互いに対向して配置されているスパイラル状の結合用パターンと、
を備えたことを特徴とする。 In order to achieve the above object, the antenna according to the first aspect of the present invention is:
With antenna pattern,
A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other;
It is provided with.
アンテナパターンと、
前記アンテナパターンに結合され、かつ、互いに対向して配置されているスパイラル状の結合用パターンと、
を備えたことを特徴とする。 In order to achieve the above object, the antenna according to the first aspect of the present invention is:
With antenna pattern,
A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other;
It is provided with.
本発明の第2の形態である無線ICデバイスは、
アンテナパターンと、
前記アンテナパターンに結合され、かつ、互いに対向して配置されているスパイラル状の結合用パターンと、
無線ICと、該無線ICと結合される給電回路を有する給電回路基板とからなる結合モジュールと、
を備え、
前記給電回路はインダクタを含み、
前記結合モジュールは前記結合用パターン上に搭載されていること、
を特徴とする。 The wireless IC device according to the second aspect of the present invention is
With antenna pattern,
A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other;
A coupling module comprising a wireless IC and a power feeding circuit board having a power feeding circuit coupled to the wireless IC;
With
The power supply circuit includes an inductor;
The coupling module is mounted on the coupling pattern;
It is characterized by.
アンテナパターンと、
前記アンテナパターンに結合され、かつ、互いに対向して配置されているスパイラル状の結合用パターンと、
無線ICと、該無線ICと結合される給電回路を有する給電回路基板とからなる結合モジュールと、
を備え、
前記給電回路はインダクタを含み、
前記結合モジュールは前記結合用パターン上に搭載されていること、
を特徴とする。 The wireless IC device according to the second aspect of the present invention is
With antenna pattern,
A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other;
A coupling module comprising a wireless IC and a power feeding circuit board having a power feeding circuit coupled to the wireless IC;
With
The power supply circuit includes an inductor;
The coupling module is mounted on the coupling pattern;
It is characterized by.
前記アンテナ及び無線ICデバイスにおいて、アンテナパターンに結合されているスパイラル状の結合用パターンは、互いに対向して配置されていることによって一つのLC共振器を形成する。即ち、対向して配置されたスパイラル状の結合用パターン間に容量が形成され、この容量とスパイラル状の結合用パターンで形成されるインダクタンスによってLC共振する。このLC共振によってインピーダンスが無限大となり、結合用パターンにエネルギーが集中する。この結果、アンテナとそれに搭載される無線ICとのエネルギーの伝達効率が向上する。
In the antenna and the wireless IC device, the spiral coupling patterns coupled to the antenna pattern are arranged to face each other to form one LC resonator. That is, a capacitance is formed between the spiral coupling patterns arranged opposite to each other, and LC resonance is caused by the inductance formed by the capacitance and the spiral coupling pattern. Due to this LC resonance, the impedance becomes infinite, and energy concentrates on the coupling pattern. As a result, energy transmission efficiency between the antenna and the wireless IC mounted thereon is improved.
前記アンテナ及び無線ICデバイスにおいて、アンテナパターンは、単一のコイル状パターンであってもよく、互いに対向して配置されている二つのコイル状パターンであってもよく、あるいは、少なくとも一対の端部を有して互いに対向して配置されている二つの環状パターンであり、かつ、該環状パターンと結合したダイポール型の放射体を有していてもよい。特に、アンテナパターンが2層対向して配置されていれば、磁界をより多く発生させることができる。さらに、それぞれ二つずつ配置されているアンテナパターン同士、結合用パターン同士が結合していれば、複数の無線ICデバイスが近接したり、人間の手などの誘電体が近接してもパターン間に浮遊容量が生じることが抑制され、共振周波数の変動が防止される。
In the antenna and the wireless IC device, the antenna pattern may be a single coiled pattern, two coiled patterns arranged opposite to each other, or at least a pair of end portions. And two dipole patterns disposed opposite to each other and having a dipole-type radiator coupled to the ring pattern. In particular, if the antenna pattern is disposed so as to face two layers, more magnetic fields can be generated. Furthermore, if two antenna patterns and two coupling patterns are connected to each other, even if a plurality of wireless IC devices are close to each other or a dielectric such as a human hand is close to the pattern, The occurrence of stray capacitance is suppressed, and fluctuations in the resonance frequency are prevented.
本発明によれば、アンテナと無線ICとの伝達効率が向上し、エネルギーが効率よく伝達される。
According to the present invention, the transmission efficiency between the antenna and the wireless IC is improved, and energy is transmitted efficiently.
以下、本発明に係るアンテナ及び無線ICデバイスの実施例について、添付図面を参照して説明する。なお、各図面において、同じ部材、部分には共通する符号を付し、重複する説明は省略する。
Embodiments of an antenna and a wireless IC device according to the present invention will be described below with reference to the accompanying drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same member and part, and the overlapping description is abbreviate | omitted.
(第1実施例、図1~図4及び図7参照)
第1実施例である無線ICデバイス1Aは、図1及び図2に示すように、基板10と結合モジュール20とアンテナ30とで構成されている。結合モジュール20は、無線ICチップ21と、該無線ICチップ21と結合される給電回路を有する給電回路基板25とからなる。アンテナ30は、コイル状パターン31と、該コイル状パターン31の両端部に形成され、かつ、互いに対向して配置されているスパイラル状の結合用パターン32a,32bとからなる。 (Refer to the first embodiment, FIGS. 1 to 4 and 7)
As shown in FIGS. 1 and 2, thewireless IC device 1 </ b> A according to the first embodiment includes a substrate 10, a coupling module 20, and an antenna 30. The coupling module 20 includes a wireless IC chip 21 and a power feeding circuit board 25 having a power feeding circuit coupled to the wireless IC chip 21. The antenna 30 includes a coiled pattern 31 and spiral coupling patterns 32a and 32b that are formed at both ends of the coiled pattern 31 and are arranged to face each other.
第1実施例である無線ICデバイス1Aは、図1及び図2に示すように、基板10と結合モジュール20とアンテナ30とで構成されている。結合モジュール20は、無線ICチップ21と、該無線ICチップ21と結合される給電回路を有する給電回路基板25とからなる。アンテナ30は、コイル状パターン31と、該コイル状パターン31の両端部に形成され、かつ、互いに対向して配置されているスパイラル状の結合用パターン32a,32bとからなる。 (Refer to the first embodiment, FIGS. 1 to 4 and 7)
As shown in FIGS. 1 and 2, the
基板10はPETフィルムなどの誘電体からなる。コイル状パターン31は、基板10の表面に図2に示すようにコイル状に形成されており、一方の端部にはスパイラル状の結合用パターン32aが形成されている。基板10の裏面にはスパイラル状の結合用パターン32bが前記結合用パターン32aと対向して配置されており、この結合用パターン32bの端部32cはビアホール導体33を介してコイル状パターン31の他方の端部31cと電気的に接続されている。
The substrate 10 is made of a dielectric material such as a PET film. The coil pattern 31 is formed in a coil shape on the surface of the substrate 10 as shown in FIG. 2, and a spiral coupling pattern 32a is formed at one end. A spiral coupling pattern 32 b is disposed on the back surface of the substrate 10 so as to face the coupling pattern 32 a, and an end 32 c of the coupling pattern 32 b is connected to the other side of the coiled pattern 31 via the via-hole conductor 33. Is electrically connected to the end portion 31c.
無線ICチップ21は、従来から知られているように、クロック回路、ロジック回路、メモリ回路などを含み、必要な情報がメモリされており、図示しない入力端子電極、出力端子電極及び実装用の端子電極が設けられている。給電回路基板25は、以下に図4を参照して説明するように、インダクタを含む給電回路を内蔵した積層基板であり、前記結合用パターン32a上に搭載(接着)されている。なお、結合モジュール20としては、無線ICチップ21と給電回路基板25とが別体に構成したもの以外に、無線ICと給電回路とが一つの基板に一体的に形成されたものであってもよい。
As is conventionally known, the wireless IC chip 21 includes a clock circuit, a logic circuit, a memory circuit, and the like, and stores necessary information. An input terminal electrode, an output terminal electrode, and a mounting terminal (not shown) An electrode is provided. As will be described below with reference to FIG. 4, the power supply circuit board 25 is a laminated board including a power supply circuit including an inductor, and is mounted (adhered) on the coupling pattern 32 a. The coupling module 20 may be one in which the wireless IC chip 21 and the power feeding circuit board 25 are separately formed, or the wireless IC and the power feeding circuit may be integrally formed on one board. Good.
ここで、給電回路基板25に内蔵された給電回路の一例について図4を参照して説明する。給電回路基板25は、それぞれ電極を形成した複数枚のシート41a~41gを積層したもので、各シート41a~41gはセラミック製あるいは樹脂製である。
Here, an example of a power feeding circuit built in the power feeding circuit board 25 will be described with reference to FIG. The feeder circuit board 25 is a laminate of a plurality of sheets 41a to 41g each having an electrode, and each of the sheets 41a to 41g is made of ceramic or resin.
シート41aには電極42a~42dとビアホール導体43a,43bが形成されている。シート41b~41fには電極44とビアホール導体43c、43dが形成されている。シート41gには電極44が形成されている。
In the sheet 41a, electrodes 42a to 42d and via-hole conductors 43a and 43b are formed. On the sheets 41b to 41f, electrodes 44 and via-hole conductors 43c and 43d are formed. An electrode 44 is formed on the sheet 41g.
各シート41a~41gを積層することにより、それぞれの電極44がビアホール導体43dを介して電気的に接続され、インダクタが形成される。インダクタの一端(シート41b上の電極44の一端44a)はビアホール導体43bを介してシート41a上の電極42bに接続される。インダクタの他端(シート41g上の電極44の一端44b)はビアホール導体43c,43aを介してシート41a上の電極42aに接続される。インダクタはそれ自身のインダクタンスと電極44の線間容量とで所定の共振周波数で共振する。
By laminating the sheets 41a to 41g, the respective electrodes 44 are electrically connected via the via-hole conductors 43d to form inductors. One end of the inductor (one end 44a of the electrode 44 on the sheet 41b) is connected to the electrode 42b on the sheet 41a via the via-hole conductor 43b. The other end of the inductor (one end 44b of the electrode 44 on the sheet 41g) is connected to the electrode 42a on the sheet 41a via the via-hole conductors 43c and 43a. The inductor resonates at a predetermined resonance frequency with its own inductance and the capacitance between the electrodes 44.
シート41a上の電極42a,42bはそれぞれ無線ICチップ21の入力端子電極及び出力端子電極に接続される。シート41a上の電極42c,42dは無線ICチップ21の実装用端子電極に接続される。また、インダクタは結合用パターン32a,32bと磁気的に結合する。
The electrodes 42a and 42b on the sheet 41a are connected to the input terminal electrode and the output terminal electrode of the wireless IC chip 21, respectively. The electrodes 42c and 42d on the sheet 41a are connected to the mounting terminal electrodes of the wireless IC chip 21. The inductor is magnetically coupled to the coupling patterns 32a and 32b.
以上の構成からなる無線ICデバイス1Aにおいて、リーダライタから放射される高周波信号(例えば、UHF周波数帯やHF周波数帯)をコイル状パターン31で受信し、結合用パターン32a,32bと磁気的に結合している給電回路を共振させ、所定の周波数の受信信号のみを無線ICチップ21に供給する。無線ICチップ21は受信信号から所定のエネルギーを取り出し、このエネルギーを駆動源としてメモリされている情報を読み出し、給電回路にて所定の周波数に整合させた後、結合用パターン32a,32bを介して送信信号としてコイル状パターン31から放射し、リーダライタに送信する。
In the wireless IC device 1A having the above configuration, a high frequency signal (for example, UHF frequency band or HF frequency band) radiated from the reader / writer is received by the coiled pattern 31 and magnetically coupled to the coupling patterns 32a and 32b. The power feeding circuit is resonated, and only the reception signal having a predetermined frequency is supplied to the wireless IC chip 21. The wireless IC chip 21 takes out predetermined energy from the received signal, reads out information stored in memory using this energy as a drive source, matches it with a predetermined frequency by a power feeding circuit, and then passes through the coupling patterns 32a and 32b. The signal is radiated from the coiled pattern 31 as a transmission signal and transmitted to the reader / writer.
コイル状パターン31は開放型であり、コイル状パターン31の両端に位置する結合用パターン32a,32bが近接し、結合用パターン32a,32bでLC共振器を形成している(図7参照)。即ち、対向して配置されたスパイラル状の結合用パターン32a,32b間に容量Cが形成され、この容量Cとスパイラル状の結合用パターン32a,32bで形成されるインダクタンスL1,L2によってLC共振する。このLC共振によってインピーダンスが無限大となり、結合用パターン32a,32bにエネルギーが集中する。この結果、アンテナ30とそれに搭載される無線ICチップ21とのエネルギーの伝達効率が向上する。また、対向する二つの結合用パターン32a,32bは、平面視で、中心部から互いに逆方向に巻回していることにより、電流が流れる方向が同じになり、磁界の向きが一致するために結合度が向上する。
The coiled pattern 31 is an open type, and the coupling patterns 32a and 32b located at both ends of the coiled pattern 31 are close to each other, and the coupling patterns 32a and 32b form an LC resonator (see FIG. 7). That is, a capacitor C is formed between the spiral coupling patterns 32a and 32b arranged opposite to each other, and LC resonance is caused by the capacitors C and the inductances L1 and L2 formed by the spiral coupling patterns 32a and 32b. . Due to this LC resonance, the impedance becomes infinite, and energy concentrates on the coupling patterns 32a and 32b. As a result, the energy transfer efficiency between the antenna 30 and the wireless IC chip 21 mounted thereon is improved. In addition, the two coupling patterns 32a and 32b that face each other are wound in opposite directions from each other in the plan view, so that the directions of current flow are the same and the directions of the magnetic fields coincide with each other. The degree is improved.
そして、給電回路の共振周波数は送受信信号の共振周波数に実質的に相当している。即ち、共振回路の共振周波数で無線ICデバイス1Aとしての共振周波数を決定している。従って、コイル状パターン31の共振周波数とは関係なく共振回路の共振周波数による通信が可能であり、1種類のアンテナ30に対して種々の共振周波数の給電回路基板25を組み合わせることができる。また、他からの影響で共振回路の共振周波数が変化することはないので、リーダライタとの通信は安定している。
The resonance frequency of the power feeding circuit substantially corresponds to the resonance frequency of the transmission / reception signal. That is, the resonance frequency of the wireless IC device 1A is determined by the resonance frequency of the resonance circuit. Therefore, communication at the resonance frequency of the resonance circuit is possible regardless of the resonance frequency of the coiled pattern 31, and the power supply circuit board 25 having various resonance frequencies can be combined with one type of antenna 30. In addition, since the resonance frequency of the resonance circuit does not change due to the influence from others, the communication with the reader / writer is stable.
コイル状パターン31の共振周波数は給電回路基板25に含まれる共振回路の共振周波数よりも高く設定されていることが好ましい。例えば、給電回路の共振周波数が13.56MHzの場合、コイル状パターン31の共振周波数は14MHzに設定する。これにて、給電回路とコイル状パターン31とが常に磁界結合することになる。アンテナ30単体で見れば、その共振周波数が共振回路の共振周波数と近接すると通信距離が長くなる。しかし、他の無線ICデバイスと近接したり、人間の手などの誘電体が近接した場合の通信障害を考慮すると、コイル状パターン31の共振周波数は高周波側に設定することが好ましい。
The resonance frequency of the coiled pattern 31 is preferably set higher than the resonance frequency of the resonance circuit included in the power supply circuit board 25. For example, when the resonance frequency of the power feeding circuit is 13.56 MHz, the resonance frequency of the coiled pattern 31 is set to 14 MHz. As a result, the power feeding circuit and the coiled pattern 31 are always magnetically coupled. If the antenna 30 is viewed alone, the communication distance becomes longer when the resonance frequency is close to the resonance frequency of the resonance circuit. However, in consideration of communication failure in the case of proximity to other wireless IC devices or proximity of a dielectric such as a human hand, the resonance frequency of the coiled pattern 31 is preferably set on the high frequency side.
また、結合用パターン32a,32bは給電回路基板25から放射される磁場の直下に配置され、給電回路基板25内のインダクタは結合用パターン32a,32bと同方向に電流が流れるようにスパイラル状に形成されているため(図4にインダクタに流れる電流の方向Aを示し、図3に結合用パターン32a,32bに流れる電流の方向Bを示す)、より効率的にエネルギーを伝達することができる。
The coupling patterns 32a and 32b are arranged immediately below the magnetic field radiated from the power supply circuit board 25, and the inductor in the power supply circuit board 25 spirals so that current flows in the same direction as the coupling patterns 32a and 32b. Since it is formed (FIG. 4 shows the direction A of the current flowing through the inductor and FIG. 3 shows the direction B of the current flowing through the coupling patterns 32a and 32b), energy can be transmitted more efficiently.
無線ICチップ21と給電回路基板25とは電気的に接続されているが、給電回路基板25とアンテナ30とは絶縁性の接着剤で接合するだけでよい。接合の向きも任意であり、結合用パターン32a,32bの面積は給電回路基板25の面積よりも大きいので、結合モジュール20を結合用パターン32a上に実装する場合の位置合わせは極めて容易である。
The wireless IC chip 21 and the power supply circuit board 25 are electrically connected, but the power supply circuit board 25 and the antenna 30 need only be joined with an insulating adhesive. The direction of bonding is also arbitrary, and the area of the coupling patterns 32a and 32b is larger than the area of the feeder circuit board 25. Therefore, alignment when the coupling module 20 is mounted on the coupling pattern 32a is extremely easy.
前記給電回路基板25は磁性体を含む材料で形成されていることが好ましい。内蔵されるインダクタが小型であってもQ値が高くなるので給電回路基板25を小型にすることができる。給電回路基板25が複数の層で形成されている場合、結合用パターン32aへの搭載面側の層の透磁率が低いこと(例えば、非磁性層とすること)が好ましい。透磁率が低いと近接した外部に磁界が出やすく、結合用パターン32a,32bとのみ結合が強くなり、他からの干渉にも強くなる。
The power supply circuit board 25 is preferably made of a material containing a magnetic material. Even if the built-in inductor is small, the Q value becomes high, so that the feeder circuit board 25 can be made small. When the feeder circuit board 25 is formed of a plurality of layers, it is preferable that the permeability of the layer on the mounting surface side to the coupling pattern 32a is low (for example, a nonmagnetic layer). When the magnetic permeability is low, a magnetic field is likely to be generated in the vicinity of the outside, and the coupling is strong only with the coupling patterns 32a and 32b, and also strong against interference from others.
(第2実施例、図5、図6及び図8参照)
第2実施例である無線ICデバイス1Bは、図示しない基板(第1実施例での基板10と同じ)と、結合モジュール20と、図5に示すアンテナ50とで構成されている。アンテナ50は、基板の表裏面に互いに対向して配置された二つのコイル状パターン51a,51bと、コイル状パターン51a,51bの一端部にそれぞれ形成され、かつ、互いに対向して配置されているスパイラル状の結合用パターン52a,52bとからなる。結合モジュール20は前記第1実施例で説明したとおりであり、結合用パターン52a上に搭載(接着)される。また、本無線ICデバイス1Bとリーダライタとの通信形態も第1実施例と同様である。 (Refer to the second embodiment, FIG. 5, FIG. 6 and FIG. 8)
Thewireless IC device 1B according to the second embodiment includes a substrate (not shown) (same as the substrate 10 in the first embodiment), the coupling module 20, and the antenna 50 shown in FIG. The antenna 50 is formed at two end portions of the coiled patterns 51a and 51b disposed opposite to each other on the front and back surfaces of the substrate, and at one end of the coiled patterns 51a and 51b, and disposed opposite to each other. It consists of spiral coupling patterns 52a and 52b. The coupling module 20 is as described in the first embodiment, and is mounted (adhered) on the coupling pattern 52a. The communication mode between the wireless IC device 1B and the reader / writer is the same as that in the first embodiment.
第2実施例である無線ICデバイス1Bは、図示しない基板(第1実施例での基板10と同じ)と、結合モジュール20と、図5に示すアンテナ50とで構成されている。アンテナ50は、基板の表裏面に互いに対向して配置された二つのコイル状パターン51a,51bと、コイル状パターン51a,51bの一端部にそれぞれ形成され、かつ、互いに対向して配置されているスパイラル状の結合用パターン52a,52bとからなる。結合モジュール20は前記第1実施例で説明したとおりであり、結合用パターン52a上に搭載(接着)される。また、本無線ICデバイス1Bとリーダライタとの通信形態も第1実施例と同様である。 (Refer to the second embodiment, FIG. 5, FIG. 6 and FIG. 8)
The
本第2実施例である無線ICデバイス1Bにおいても、コイル状パターン51a,51bは開放型であり、対向して配置されたコイル状パターン51a,51b間及びスパイラル状の結合用パターン52a,52b間に容量Cが形成され、この容量Cと二つのコイル状パターン51a,51b及び結合用パターン52a,52bで全体的に形成されるインダクタンスL1,L2によってLC共振する(図8参照)。このLC共振によってインピーダンスが無限大となり、コイル状パターン51a,51b及び結合用パターン52a,52bにエネルギーが集中する。この結果、アンテナ50とそれに搭載される無線ICチップ21とのエネルギーの伝達効率が向上する。また、コイル状パターン51a,51bが2層配置されているので、磁界をより多く発生させることができる。さらに、それぞれ二つずつ配置されているコイル状パターン51a,51b同士、結合用パターン52a,52b同士が結合しているので、複数の無線ICデバイスが近接したり、人間の手などの誘電体が近接してもパターン間に浮遊容量が生じることが抑制され、共振周波数の変動が防止される。その他の作用効果は前記第1実施例と同様である。
Also in the wireless IC device 1B according to the second embodiment, the coiled patterns 51a and 51b are of an open type, and are arranged between the coiled patterns 51a and 51b arranged in opposition and between the spiral coupling patterns 52a and 52b. A capacitor C is formed, and LC resonance is caused by inductances L1 and L2 formed entirely by the capacitor C, the two coiled patterns 51a and 51b, and the coupling patterns 52a and 52b (see FIG. 8). This LC resonance makes the impedance infinite, and energy concentrates on the coiled patterns 51a and 51b and the coupling patterns 52a and 52b. As a result, energy transmission efficiency between the antenna 50 and the wireless IC chip 21 mounted thereon is improved. Further, since two layers of the coiled patterns 51a and 51b are arranged, more magnetic fields can be generated. Furthermore, since the two coil- like patterns 51a and 51b and the coupling patterns 52a and 52b are coupled to each other, a plurality of wireless IC devices are close to each other or a dielectric such as a human hand is present. Even if they are close to each other, stray capacitance is suppressed from occurring between patterns, and fluctuations in resonance frequency are prevented. Other functions and effects are the same as those of the first embodiment.
ちなみに、本第2実施例では、アンテナ50の全体が所定周波数で共振する。よって、アンテナ50の一部である結合用パターン52a,52b上に結合モジュール20を搭載すると、アンテナ50と結合モジュール20とは所定周波数で磁界によってのみ結合する。アンテナ50とリーダライタとは電磁界結合である。
Incidentally, in the second embodiment, the entire antenna 50 resonates at a predetermined frequency. Therefore, when the coupling module 20 is mounted on the coupling patterns 52a and 52b that are part of the antenna 50, the antenna 50 and the coupling module 20 are coupled only by a magnetic field at a predetermined frequency. The antenna 50 and the reader / writer are electromagnetic couplings.
(第3実施例、図9~図13参照)
第3実施例である無線ICデバイス1Cは、図9に示すように、基板110と結合モジュール120とアンテナ130とで構成されている。結合モジュール120は、無線ICチップ21と、該無線ICチップ21と結合される給電回路を有する給電回路基板125とからなる。 (Refer to the third embodiment, FIGS. 9 to 13)
As shown in FIG. 9, thewireless IC device 1 </ b> C according to the third embodiment includes a substrate 110, a coupling module 120, and an antenna 130. The coupling module 120 includes a wireless IC chip 21 and a power feeding circuit board 125 having a power feeding circuit coupled to the wireless IC chip 21.
第3実施例である無線ICデバイス1Cは、図9に示すように、基板110と結合モジュール120とアンテナ130とで構成されている。結合モジュール120は、無線ICチップ21と、該無線ICチップ21と結合される給電回路を有する給電回路基板125とからなる。 (Refer to the third embodiment, FIGS. 9 to 13)
As shown in FIG. 9, the
アンテナ130は(表面側を図10に示し、裏面側を図11に示す)、一対の端部を有して基板110の表裏面に互いに対向して配置された二つの環状パターン131a,131bと、環状パターン131a,131bの一端部にそれぞれ形成され、かつ、互いに対向して配置されているスパイラル状の結合用パターンと132a,132bと、環状パターン131aの一部から側方に延在されている二つの放射体133とからなる。放射体133はそれぞれ環状パターン131aと結合しており、ミアンダ状をなすダイポール型アンテナとして機能する。
The antenna 130 (the front side is shown in FIG. 10 and the back side is shown in FIG. 11) has two annular patterns 131a and 131b that have a pair of ends and are opposed to each other on the front and back surfaces of the substrate 110. The spiral coupling patterns 132a and 132b, which are formed at one end portions of the annular patterns 131a and 131b and are arranged to face each other, are extended laterally from a part of the annular pattern 131a. And two radiators 133. Each of the radiators 133 is coupled to the annular pattern 131a and functions as a meandering dipole antenna.
給電回路基板125に内蔵された給電回路基板の一例について図12を参照して説明する。給電回路基板125は、それぞれ電極を形成した複数枚のシート141a~141dを積層したもので、各シート141a~141dはセラミック製あるいは樹脂製である。
An example of the power supply circuit board built in the power supply circuit board 125 will be described with reference to FIG. The power supply circuit board 125 is a laminate of a plurality of sheets 141a to 141d each having an electrode, and each of the sheets 141a to 141d is made of ceramic or resin.
シート141aには電極142a~142dとビアホール導体143a,143bが形成されている。シート141b,141cには電極144とビアホール導体143c、143dが形成されている。シート141dには電極144が形成されている。
In the sheet 141a, electrodes 142a to 142d and via-hole conductors 143a and 143b are formed. Sheets 141b and 141c are formed with electrodes 144 and via-hole conductors 143c and 143d. An electrode 144 is formed on the sheet 141d.
各シート141a~141dを積層することにより、それぞれの電極144がビアホール導体143cを介して電気的に接続され、インダクタが形成される。インダクタの一端(シート141b上の電極144の一端144a)はビアホール導体143bを介してシート141a上の電極142bに接続される。インダクタの他端(シート141d上の電極144の一端144b)はビアホール導体143d,143aを介してシート141a上の電極142aに接続される。インダクタはそれ自身のインダクタンスと電極144の線間容量とで所定の共振周波数で共振する。
By laminating the sheets 141a to 141d, the respective electrodes 144 are electrically connected via the via-hole conductor 143c to form an inductor. One end of the inductor (one end 144a of the electrode 144 on the sheet 141b) is connected to the electrode 142b on the sheet 141a via the via-hole conductor 143b. The other end of the inductor (one end 144b of the electrode 144 on the sheet 141d) is connected to the electrode 142a on the sheet 141a via the via-hole conductors 143d and 143a. The inductor resonates at a predetermined resonance frequency with its own inductance and the capacitance between the electrodes 144.
シート141a上の電極142a,142bはそれぞれ無線ICチップ21の入力端子電極及び出力端子電極に接続される。シート141a上の電極142c,142dは無線ICチップ21の実装用端子電極に接続される。また、インダクタは結合用パターン132a,132bと磁気的に結合する。
The electrodes 142a and 142b on the sheet 141a are connected to the input terminal electrode and the output terminal electrode of the wireless IC chip 21, respectively. The electrodes 142c and 142d on the sheet 141a are connected to the mounting terminal electrodes of the wireless IC chip 21. The inductor is magnetically coupled to the coupling patterns 132a and 132b.
本第3実施例である無線ICデバイス1Cにおいても、環状パターン131a,131bは開放型であり、対向して配置された環状パターン131a,131b間及びスパイラル状の結合用パターン132a,132b間に容量Cが形成され、この容量Cと二つの環状パターン131a,131b及び結合用パターン132a,132bで全体的に形成されるインダクタンスL1,L2によってLC共振する。即ち、図8と同じ等価回路を構成する。このLC共振によってインピーダンスが無限大となり、環状パターン131a,131b及び結合用パターン132a,132bにエネルギーが集中する。この結果、アンテナ130とそれに搭載される無線ICチップ21とのエネルギーの伝達効率が向上する。それゆえ、放射体133から高周波信号が効率よく放射され、また、放射体133で受信された高周波信号が効率よく給電回路へ伝達される。本第3実施例の無線ICデバイス1Cにおいては、給電回路と放射体133とに結合するように環状パターン131a,131bを配置することにより、放射体133へ伝達される信号の損失を小さくすることができ、高い利得を得ることができる。本無線ICデバイス1Cの高周波信号の周波数に対する利得は図13に示すとおりであり、UHF周波数帯で高い利得を達成している。
Also in the wireless IC device 1C according to the third embodiment, the annular patterns 131a and 131b are open-type, and a capacitance is provided between the annular patterns 131a and 131b arranged opposite to each other and between the spiral coupling patterns 132a and 132b. C is formed, and LC resonance is caused by inductances L1 and L2 formed entirely by the capacitor C, the two annular patterns 131a and 131b, and the coupling patterns 132a and 132b. That is, the same equivalent circuit as in FIG. 8 is configured. Due to this LC resonance, the impedance becomes infinite, and energy concentrates on the annular patterns 131a and 131b and the coupling patterns 132a and 132b. As a result, the energy transmission efficiency between the antenna 130 and the wireless IC chip 21 mounted thereon is improved. Therefore, the high-frequency signal is efficiently radiated from the radiator 133, and the high-frequency signal received by the radiator 133 is efficiently transmitted to the power feeding circuit. In the wireless IC device 1C of the third embodiment, the loss of the signal transmitted to the radiator 133 is reduced by arranging the annular patterns 131a and 131b so as to be coupled to the power feeding circuit and the radiator 133. And a high gain can be obtained. The gain of the wireless IC device 1C with respect to the frequency of the high frequency signal is as shown in FIG. 13, and a high gain is achieved in the UHF frequency band.
利得に関しては、環状パターン131と放射体133との結合点K(図9参照)の位置を変更することにより、広帯域化することができる。例えば、結合点Kの位置を結合用パターン132aに近づけて、結合点K間のインダクタンス値を大きくすることで、広帯域化することができる。結合点K間のインダクタンス値が大きければ、放射体133により形成される2個の共振点間の帯域が広くなるからである。なお、結合点K間のインダクタンス値を大きくするために、環状パターン131をミアンダパターンやスパイラルパターンにしてもよい。
Regarding the gain, it is possible to widen the band by changing the position of the coupling point K (see FIG. 9) between the annular pattern 131 and the radiator 133. For example, by setting the position of the coupling point K close to the coupling pattern 132a and increasing the inductance value between the coupling points K, the bandwidth can be increased. This is because if the inductance value between the coupling points K is large, the band between the two resonance points formed by the radiator 133 is widened. In order to increase the inductance value between the coupling points K, the annular pattern 131 may be a meander pattern or a spiral pattern.
また、環状パターン131a,131bが2層配置されているので、磁界をより多く発生させることができる。さらに、それぞれ二つずつ配置されている環状パターン131a,131b同士、結合用パターン132a,132b同士が結合しているので、複数の無線ICデバイスが近接したり、人間の手などの誘電体が近接してもパターン間に浮遊容量が生じることが抑制され、共振周波数の変動が防止される。その他の作用効果は前記第1実施例と同様である。
Further, since the annular patterns 131a and 131b are arranged in two layers, more magnetic fields can be generated. Furthermore, since two annular patterns 131a and 131b and two coupling patterns 132a and 132b are coupled to each other, a plurality of wireless IC devices are close to each other, and a dielectric such as a human hand is close to each other. Even so, the stray capacitance between the patterns is suppressed, and the resonance frequency is prevented from changing. Other functions and effects are the same as those of the first embodiment.
ちなみに、本第3実施例では、アンテナ130の全体が所定周波数で共振する。よって、アンテナ130の一部である結合用パターン132a,132b上に結合モジュール120を搭載すると、アンテナ130と結合モジュール120とは所定周波数で磁界によってのみ結合する。アンテナ130とリーダライタとは電磁界結合である。
Incidentally, in the third embodiment, the entire antenna 130 resonates at a predetermined frequency. Therefore, when the coupling module 120 is mounted on the coupling patterns 132a and 132b that are part of the antenna 130, the antenna 130 and the coupling module 120 are coupled only by a magnetic field at a predetermined frequency. The antenna 130 and the reader / writer are electromagnetic couplings.
(他の実施例)
なお、本発明に係るアンテナ及び無線ICデバイスは前記実施例に限定するものではなく、その要旨の範囲内で種々に変更できることは勿論である。 (Other examples)
Of course, the antenna and the wireless IC device according to the present invention are not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.
なお、本発明に係るアンテナ及び無線ICデバイスは前記実施例に限定するものではなく、その要旨の範囲内で種々に変更できることは勿論である。 (Other examples)
Of course, the antenna and the wireless IC device according to the present invention are not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.
以上のように、本発明は、RFIDシステムに用いるアンテナ及び無線ICデバイスに有用であり、特に、無線ICとのエネルギーの伝達効率がよい点で優れている。
As described above, the present invention is useful for an antenna and a wireless IC device used in an RFID system, and is particularly excellent in that energy transmission efficiency with the wireless IC is good.
1A,1B,1C…無線ICデバイス
10,110…基板
20,120…結合モジュール
21…無線ICチップ
25,125…給電回路基板
30,50,130…アンテナ
31,51a,51b…コイル状パターン
32a,32b,52a,52b,132a,132b…結合用パターン
131a,131b…環状パターン
133…放射体 1A, 1B, 1C ... wireless IC device 10, 110 ... substrate 20, 120 ... coupling module 21 ... wireless IC chip 25, 125 ... feeder circuit substrate 30, 50, 130 ... antenna 31, 51a, 51b ... coiled pattern 32a, 32b, 52a, 52b, 132a, 132b ... pattern for coupling 131a, 131b ... annular pattern 133 ... radiator
10,110…基板
20,120…結合モジュール
21…無線ICチップ
25,125…給電回路基板
30,50,130…アンテナ
31,51a,51b…コイル状パターン
32a,32b,52a,52b,132a,132b…結合用パターン
131a,131b…環状パターン
133…放射体 1A, 1B, 1C ...
Claims (15)
- アンテナパターンと、
前記アンテナパターンに結合され、かつ、互いに対向して配置されているスパイラル状の結合用パターンと、
を備えたことを特徴とするアンテナ。 With antenna pattern,
A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other;
An antenna comprising: - 前記アンテナパターンはコイル状パターンであり、
前記結合用パターンは前記コイル状パターンの両端部に形成されていること、
を特徴とする請求項1に記載のアンテナ。 The antenna pattern is a coiled pattern,
The coupling pattern is formed at both ends of the coiled pattern;
The antenna according to claim 1. - 前記アンテナパターンは互いに対向して配置されている二つのコイル状パターンであり、
前記結合用パターンは前記二つのコイル状パターンの一端部にそれぞれ形成されていること、
を特徴とする請求項1に記載のアンテナ。 The antenna pattern is two coiled patterns arranged to face each other,
The coupling pattern is formed at one end of each of the two coiled patterns;
The antenna according to claim 1. - 前記アンテナパターンは、少なくとも一対の端部を有して互いに対向して配置されている二つの環状パターンであり、かつ、該環状パターンと結合したダイポール型の放射体を有し、
前記結合用パターンは前記二つの環状パターンの一端部にそれぞれ形成されていること、
を特徴とする請求項1に記載のアンテナ。 The antenna pattern is two annular patterns having at least a pair of end portions and arranged to face each other, and has a dipole-type radiator coupled to the annular pattern,
The coupling pattern is formed at one end of each of the two annular patterns;
The antenna according to claim 1. - アンテナパターンと、
前記アンテナパターンに結合され、かつ、互いに対向して配置されているスパイラル状の結合用パターンと、
無線ICと、該無線ICと結合される給電回路を有する給電回路基板とからなる結合モジュールと、
を備え、
前記給電回路はインダクタを含み、
前記結合モジュールは前記結合用パターン上に搭載されていること、
を特徴とする無線ICデバイス。 With antenna pattern,
A spiral coupling pattern coupled to the antenna pattern and disposed opposite to each other;
A coupling module comprising a wireless IC and a power feeding circuit board having a power feeding circuit coupled to the wireless IC;
With
The power supply circuit includes an inductor;
The coupling module is mounted on the coupling pattern;
A wireless IC device characterized by the above. - 前記アンテナパターンはコイル状パターンであり、
前記結合用パターンは前記コイル状パターンの両端部に形成されていること、
を特徴とする請求項5に記載の無線ICデバイス。 The antenna pattern is a coiled pattern,
The coupling pattern is formed at both ends of the coiled pattern;
The wireless IC device according to claim 5. - 前記アンテナパターンは互いに対向して配置されている二つのコイル状パターンであり、
前記結合用パターンは前記二つのコイル状パターンの一端部にそれぞれ形成されていること、
を特徴とする請求項5に記載の無線ICデバイス。 The antenna pattern is two coiled patterns arranged to face each other,
The coupling pattern is formed at one end of each of the two coiled patterns;
The wireless IC device according to claim 5. - 前記アンテナパターンは、少なくとも一対の端部を有して互いに対向して配置されている二つの環状パターンであり、かつ、該環状パターンと結合したダイポール型の放射体を有し、
前記結合用パターンは前記二つの環状パターンの一端部にそれぞれ形成されていること、
を特徴とする請求項5に記載の無線ICデバイス。 The antenna pattern is two annular patterns having at least a pair of end portions and arranged to face each other, and has a dipole-type radiator coupled to the annular pattern,
The coupling pattern is formed at one end of each of the two annular patterns;
The wireless IC device according to claim 5. - 前記結合モジュールと前記結合用パターンとは磁気結合していること、を特徴とする請求項5ないし請求項8のいずれかに記載の無線ICデバイス。 The wireless IC device according to any one of claims 5 to 8, wherein the coupling module and the coupling pattern are magnetically coupled.
- 前記インダクタは前記結合用パターンと同方向に電流が流れるようにスパイラル状に形成されていること、を特徴とする請求項5ないし請求項9のいずれかに記載の無線ICデバイス。 10. The wireless IC device according to claim 5, wherein the inductor is formed in a spiral shape so that a current flows in the same direction as the coupling pattern.
- 前記給電回路の共振周波数が送受信信号の共振周波数に実質的に相当していること、を特徴とする請求項9又は請求項10記載の無線ICデバイス。 The wireless IC device according to claim 9 or 10, wherein a resonance frequency of the power feeding circuit substantially corresponds to a resonance frequency of a transmission / reception signal.
- 前記アンテナパターンの共振周波数は前記給電回路の共振周波数よりも高いこと、を特徴とする請求項5ないし請求項11のいずれかに記載の無線ICデバイス。 The wireless IC device according to any one of claims 5 to 11, wherein a resonance frequency of the antenna pattern is higher than a resonance frequency of the power feeding circuit.
- 前記結合用パターンの面積は前記給電回路基板の面積よりも大きいこと、を特徴とする請求項5ないし請求項12のいずれかに記載の無線ICデバイス。 13. The wireless IC device according to claim 5, wherein an area of the coupling pattern is larger than an area of the power supply circuit board.
- 前記給電回路基板は磁性体を含む材料で形成されていること、を特徴とする請求項5ないし請求項13のいずれかに記載の無線ICデバイス。 14. The wireless IC device according to claim 5, wherein the power supply circuit board is made of a material containing a magnetic material.
- 前記給電回路基板は複数の層で形成されており、前記結合用パターンへの搭載面側の層の透磁率が低いこと、を特徴とする請求項14に記載の無線ICデバイス。 15. The wireless IC device according to claim 14, wherein the power supply circuit board is formed of a plurality of layers, and the magnetic permeability of the layer on the mounting surface side to the coupling pattern is low.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10735891.3A EP2385580B1 (en) | 2009-01-30 | 2010-01-29 | Antenna and wireless ic device |
CN201080006406.0A CN102301528B (en) | 2009-01-30 | 2010-01-29 | Antenna and wireless ic device |
JP2010548559A JP5267578B2 (en) | 2009-01-30 | 2010-01-29 | Antenna and wireless IC device |
US13/190,670 US9104950B2 (en) | 2009-01-30 | 2011-07-26 | Antenna and wireless IC device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-020934 | 2009-01-30 | ||
JP2009020934 | 2009-01-30 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/190,670 Continuation US9104950B2 (en) | 2009-01-30 | 2011-07-26 | Antenna and wireless IC device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010087429A1 true WO2010087429A1 (en) | 2010-08-05 |
Family
ID=42395683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/051205 WO2010087429A1 (en) | 2009-01-30 | 2010-01-29 | Antenna and wireless ic device |
Country Status (5)
Country | Link |
---|---|
US (1) | US9104950B2 (en) |
EP (1) | EP2385580B1 (en) |
JP (1) | JP5267578B2 (en) |
CN (1) | CN102301528B (en) |
WO (1) | WO2010087429A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016127396A (en) * | 2014-12-26 | 2016-07-11 | 株式会社村田製作所 | Antenna device |
WO2016114180A1 (en) * | 2015-01-15 | 2016-07-21 | 株式会社村田製作所 | Antenna device, and manufacturing method for same |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101230416B1 (en) * | 2008-12-15 | 2013-02-06 | 가부시키가이샤 무라타 세이사쿠쇼 | High-frequency coupler and communication device |
KR101859575B1 (en) * | 2012-03-21 | 2018-05-18 | 삼성전자 주식회사 | Antenna device for near field wireless communication and electric device having the same |
TWI579783B (en) * | 2013-05-10 | 2017-04-21 | 博弈合夥國際股份有限公司 | Value token with slug having rfid and electromagnetic detection features |
TWI532351B (en) * | 2013-11-07 | 2016-05-01 | 國立交通大學 | Broadband interconnection structure and method of interconnection thereof, transmission device and method of transmitting broadband signal |
USD776070S1 (en) * | 2014-03-18 | 2017-01-10 | Sony Corporation | Non-contact type data carrier |
USD762197S1 (en) * | 2014-09-12 | 2016-07-26 | Taoglas Group Holdings Limited | GPS antenna assembly |
CN105633563B (en) * | 2014-10-30 | 2019-02-26 | 比亚迪股份有限公司 | Near field communication antenna |
CN114781570A (en) * | 2017-04-20 | 2022-07-22 | 株式会社村田制作所 | Wireless communication device |
JP6473210B1 (en) | 2017-11-02 | 2019-02-20 | 株式会社エスケーエレクトロニクス | LC resonant antenna |
US10810480B2 (en) * | 2018-06-25 | 2020-10-20 | Microelectronics Technology, Inc. | Electronic tag and electronic system using the same |
CN110429386A (en) * | 2019-08-30 | 2019-11-08 | 安徽华米信息科技有限公司 | Smart machine |
US11329371B2 (en) * | 2019-10-17 | 2022-05-10 | Mediatek Inc. | Antenna device including antenna and substrate generated with non-opaque material |
JP2022133597A (en) * | 2021-03-02 | 2022-09-14 | Tdk株式会社 | Antenna device and antennae module provided with the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000510271A (en) * | 1997-01-28 | 2000-08-08 | アマテック アドヴァンスト マイクロメカニック アンド オートメーション テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー.コマンディト ゲゼルシャフト | Transmission module for transponder device, transponder device, and method of operating transponder device |
JP2003332820A (en) * | 2002-05-10 | 2003-11-21 | Fec Inc | Booster antenna for ic card |
WO2008081699A1 (en) * | 2006-12-28 | 2008-07-10 | Philtech Inc. | Base sheet |
Family Cites Families (545)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3364564A (en) | 1965-06-28 | 1968-01-23 | Gregory Ind Inc | Method of producing welding studs dischargeable in end-to-end relationship |
JPS5754964B2 (en) | 1974-05-08 | 1982-11-20 | ||
JPS6193701A (en) | 1984-10-13 | 1986-05-12 | Toyota Motor Corp | Antenna system for automobile |
JPS61284102A (en) | 1985-06-11 | 1986-12-15 | Oki Electric Ind Co Ltd | Antenna for portable radio equipment |
JPS62127140U (en) | 1986-02-03 | 1987-08-12 | ||
JPH01212035A (en) | 1987-08-13 | 1989-08-25 | Secom Co Ltd | Electromagnetic field diversity reception system |
JPH03503467A (en) | 1988-02-04 | 1991-08-01 | ユニスキャン リミティド | magnetic field concentrator |
JPH0744114B2 (en) | 1988-12-16 | 1995-05-15 | 株式会社村田製作所 | Multilayer chip coil |
JPH02164105A (en) | 1988-12-19 | 1990-06-25 | Mitsubishi Electric Corp | Spiral antenna |
US5253969A (en) | 1989-03-10 | 1993-10-19 | Sms Schloemann-Siemag Aktiengesellschaft | Feeding system for strip material, particularly in treatment plants for metal strips |
JPH03171385A (en) | 1989-11-30 | 1991-07-24 | Sony Corp | Information card |
JP2662742B2 (en) | 1990-03-13 | 1997-10-15 | 株式会社村田製作所 | Bandpass filter |
JP2763664B2 (en) | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | Wiring board for distributed constant circuit |
JPH04150011A (en) | 1990-10-12 | 1992-05-22 | Tdk Corp | Composite electronic component |
JPH04167500A (en) | 1990-10-30 | 1992-06-15 | Omron Corp | Printed-circuit board management system |
JP2539367Y2 (en) | 1991-01-30 | 1997-06-25 | 株式会社村田製作所 | Multilayer electronic components |
NL9100176A (en) | 1991-02-01 | 1992-03-02 | Nedap Nv | Antenna configuration for contactless identification label - forms part of tuned circuit of ID or credit card interrogated via inductive coupling |
JP2558330Y2 (en) | 1991-02-06 | 1997-12-24 | オムロン株式会社 | Electromagnetic coupling type electronic equipment |
NL9100347A (en) | 1991-02-26 | 1992-03-02 | Nedap Nv | Integrated transformer circuit for ID or credit card - is interrogated via contactless inductive coupling using capacitor to form tuned circuit |
JPH04321190A (en) | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | Antenna circuit and its production for non-contact type portable storage |
JPH0745933Y2 (en) | 1991-06-07 | 1995-10-18 | 太陽誘電株式会社 | Multilayer ceramic inductance element |
DE69215283T2 (en) | 1991-07-08 | 1997-03-20 | Nippon Telegraph & Telephone | Extendable antenna system |
JP2839782B2 (en) | 1992-02-14 | 1998-12-16 | 三菱電機株式会社 | Printed slot antenna |
JPH05327331A (en) | 1992-05-15 | 1993-12-10 | Matsushita Electric Works Ltd | Printed antenna |
JP3186235B2 (en) | 1992-07-30 | 2001-07-11 | 株式会社村田製作所 | Resonator antenna |
JPH0677729A (en) | 1992-08-25 | 1994-03-18 | Mitsubishi Electric Corp | Antenna integrated microwave circuit |
JPH06177635A (en) | 1992-12-07 | 1994-06-24 | Mitsubishi Electric Corp | Cross dipole antenna system |
JPH06260949A (en) | 1993-03-03 | 1994-09-16 | Seiko Instr Inc | Radio equipment |
JPH07183836A (en) | 1993-12-22 | 1995-07-21 | San'eisha Mfg Co Ltd | Coupling filter device for distribution line carrier communication |
US5491483A (en) | 1994-01-05 | 1996-02-13 | Texas Instruments Incorporated | Single loop transponder system and method |
US6096431A (en) | 1994-07-25 | 2000-08-01 | Toppan Printing Co., Ltd. | Biodegradable cards |
JP3427527B2 (en) | 1994-12-26 | 2003-07-22 | 凸版印刷株式会社 | Biodegradable laminate and biodegradable card |
JP2999374B2 (en) | 1994-08-10 | 2000-01-17 | 太陽誘電株式会社 | Multilayer chip inductor |
JP3141692B2 (en) | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | Millimeter wave detector |
DE4431754C1 (en) | 1994-09-06 | 1995-11-23 | Siemens Ag | Carrier element for ic module of chip card |
US5528222A (en) | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
JPH0887580A (en) | 1994-09-14 | 1996-04-02 | Omron Corp | Data carrier and ball game |
JP3064840B2 (en) | 1994-12-22 | 2000-07-12 | ソニー株式会社 | IC card |
JP2837829B2 (en) | 1995-03-31 | 1998-12-16 | 松下電器産業株式会社 | Inspection method for semiconductor device |
JPH08279027A (en) | 1995-04-04 | 1996-10-22 | Toshiba Corp | Radio communication card |
US5955723A (en) | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
JPH08307126A (en) | 1995-05-09 | 1996-11-22 | Kyocera Corp | Container structure of antenna |
JP3637982B2 (en) | 1995-06-27 | 2005-04-13 | 株式会社荏原電産 | Inverter-driven pump control system |
US5629241A (en) | 1995-07-07 | 1997-05-13 | Hughes Aircraft Company | Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
JP3150575B2 (en) | 1995-07-18 | 2001-03-26 | 沖電気工業株式会社 | Tag device and manufacturing method thereof |
GB2305075A (en) | 1995-09-05 | 1997-03-26 | Ibm | Radio Frequency Tag for Electronic Apparatus |
DE19534229A1 (en) | 1995-09-15 | 1997-03-20 | Licentia Gmbh | Transponder arrangement |
JPH0993029A (en) | 1995-09-21 | 1997-04-04 | Matsushita Electric Ind Co Ltd | Antenna device |
JP3882218B2 (en) | 1996-03-04 | 2007-02-14 | ソニー株式会社 | optical disk |
US5754110A (en) * | 1996-03-07 | 1998-05-19 | Checkpoint Systems, Inc. | Security tag and manufacturing method |
JP3471160B2 (en) | 1996-03-18 | 2003-11-25 | 株式会社東芝 | Monolithic antenna |
JPH09270623A (en) | 1996-03-29 | 1997-10-14 | Murata Mfg Co Ltd | Antenna system |
JPH09284038A (en) | 1996-04-17 | 1997-10-31 | Nhk Spring Co Ltd | Antenna equipment of non-contact data carrier |
JPH09294374A (en) | 1996-04-26 | 1997-11-11 | Hitachi Ltd | Power supply circuit |
JP3427663B2 (en) | 1996-06-18 | 2003-07-22 | 凸版印刷株式会社 | Non-contact IC card |
AUPO055296A0 (en) | 1996-06-19 | 1996-07-11 | Integrated Silicon Design Pty Ltd | Enhanced range transponder system |
US6104311A (en) | 1996-08-26 | 2000-08-15 | Addison Technologies | Information storage and identification tag |
JP3767030B2 (en) | 1996-09-09 | 2006-04-19 | 三菱電機株式会社 | Foldable wireless communication device |
BR9711887A (en) | 1996-10-09 | 2002-01-02 | Pav Card Gmbh | Connective arrangement and process for producing a smart card |
JPH10171954A (en) | 1996-12-05 | 1998-06-26 | Hitachi Maxell Ltd | Non-contact type ic card |
JP3279205B2 (en) | 1996-12-10 | 2002-04-30 | 株式会社村田製作所 | Surface mount antenna and communication equipment |
JPH10193849A (en) | 1996-12-27 | 1998-07-28 | Rohm Co Ltd | Circuit chip-mounted card and circuit chip module |
JPH10193851A (en) | 1997-01-08 | 1998-07-28 | Denso Corp | Non-contact card |
JPH10242742A (en) | 1997-02-26 | 1998-09-11 | Harada Ind Co Ltd | Transmission reception antenna |
JP2001514777A (en) | 1997-03-10 | 2001-09-11 | プレシジョン ダイナミクス コーポレイション | Reactively connected elements of a circuit provided on a flexible substrate |
JPH10293828A (en) | 1997-04-18 | 1998-11-04 | Omron Corp | Data carrier, coil module, reader-writer, and clothing data acquiring method |
JP3900593B2 (en) | 1997-05-27 | 2007-04-04 | 凸版印刷株式会社 | IC card and IC module |
JPH11346114A (en) | 1997-06-11 | 1999-12-14 | Matsushita Electric Ind Co Ltd | Antenna device |
JPH1125244A (en) | 1997-06-27 | 1999-01-29 | Toshiba Chem Corp | Non-contact data carrier package |
JP3621560B2 (en) | 1997-07-24 | 2005-02-16 | 三菱電機株式会社 | Electromagnetic induction data carrier system |
JPH1175329A (en) | 1997-08-29 | 1999-03-16 | Hitachi Ltd | Non-contact type ic card system |
JPH1185937A (en) | 1997-09-02 | 1999-03-30 | Nippon Lsi Card Kk | Non-contact lsi card and method for inspecting the same |
JPH1188241A (en) | 1997-09-04 | 1999-03-30 | Nippon Steel Corp | Data carrier system |
JP3853930B2 (en) | 1997-09-26 | 2006-12-06 | 株式会社マースエンジニアリング | Non-contact data carrier package and manufacturing method thereof |
JPH11103209A (en) | 1997-09-26 | 1999-04-13 | Fujitsu Ten Ltd | Radio wave reception equipment |
EP1031939B1 (en) * | 1997-11-14 | 2005-09-14 | Toppan Printing Co., Ltd. | Composite ic card |
JPH11149536A (en) | 1997-11-14 | 1999-06-02 | Toppan Printing Co Ltd | Composite ic card |
JP3800765B2 (en) | 1997-11-14 | 2006-07-26 | 凸版印刷株式会社 | Compound IC card |
JP3800766B2 (en) | 1997-11-14 | 2006-07-26 | 凸版印刷株式会社 | Compound IC module and compound IC card |
JPH11175678A (en) | 1997-12-09 | 1999-07-02 | Toppan Printing Co Ltd | Ic module and ic card on which the module is loaded |
JPH11220319A (en) | 1998-01-30 | 1999-08-10 | Sharp Corp | Antenna system |
JPH11219420A (en) | 1998-02-03 | 1999-08-10 | Tokin Corp | Ic card module, ic card and their manufacture |
JP2001084463A (en) | 1999-09-14 | 2001-03-30 | Miyake:Kk | Resonance circuit |
JPH11261325A (en) | 1998-03-10 | 1999-09-24 | Shiro Sugimura | Coil element and its manufacture |
EP0987789A4 (en) | 1998-03-31 | 2004-09-22 | Matsushita Electric Ind Co Ltd | Antenna unit and digital television receiver |
JP4260917B2 (en) | 1998-03-31 | 2009-04-30 | 株式会社東芝 | Loop antenna |
US5936150A (en) | 1998-04-13 | 1999-08-10 | Rockwell Science Center, Llc | Thin film resonant chemical sensor with resonant acoustic isolator |
CA2293228A1 (en) | 1998-04-14 | 1999-10-21 | Robert A. Katchmazenski | Container for compressors and other goods |
JP4030651B2 (en) | 1998-05-12 | 2008-01-09 | 三菱電機株式会社 | Mobile phone |
JPH11328352A (en) | 1998-05-19 | 1999-11-30 | Tokin Corp | Connection structure between antenna and ic chip, and ic card |
US6107920A (en) | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6018299A (en) | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
JP2000021639A (en) | 1998-07-02 | 2000-01-21 | Sharp Corp | Inductor, resonance circuit using the same, matching circuit, antenna circuit, and oscillation circuit |
JP2000021128A (en) | 1998-07-03 | 2000-01-21 | Nippon Steel Corp | Disk-shaped storage medium and its accommodation case |
JP2000022421A (en) | 1998-07-03 | 2000-01-21 | Murata Mfg Co Ltd | Chip antenna and radio device mounted with it |
AUPP473898A0 (en) | 1998-07-20 | 1998-08-13 | Integrated Silicon Design Pty Ltd | Metal screened electronic labelling system |
EP0977145A3 (en) | 1998-07-28 | 2002-11-06 | Kabushiki Kaisha Toshiba | Radio IC card |
JP2000311226A (en) | 1998-07-28 | 2000-11-07 | Toshiba Corp | Radio ic card and its production and read and write system of the same |
JP3956172B2 (en) | 1998-07-31 | 2007-08-08 | 吉川アールエフシステム株式会社 | Data carrier and antenna for data carrier |
JP2000059260A (en) | 1998-08-04 | 2000-02-25 | Sony Corp | Storage device |
EP1298573A3 (en) | 1998-08-14 | 2003-09-17 | 3M Innovative Properties Company | Radio frequency identification system comprising a plurality of antennas |
DE69938671D1 (en) | 1998-08-14 | 2008-06-19 | 3M Innovative Properties Co | APPLICATIONS FOR RF IDENTIFICATION SYSTEMS |
JP4411670B2 (en) | 1998-09-08 | 2010-02-10 | 凸版印刷株式会社 | Non-contact IC card manufacturing method |
JP4508301B2 (en) | 1998-09-16 | 2010-07-21 | 大日本印刷株式会社 | Non-contact IC card |
JP3632466B2 (en) | 1998-10-23 | 2005-03-23 | 凸版印刷株式会社 | Inspection device and inspection method for non-contact IC card |
US6837438B1 (en) | 1998-10-30 | 2005-01-04 | Hitachi Maxell, Ltd. | Non-contact information medium and communication system utilizing the same |
JP3924962B2 (en) | 1998-10-30 | 2007-06-06 | 株式会社デンソー | ID tag for dishes |
JP2000137785A (en) | 1998-10-30 | 2000-05-16 | Sony Corp | Manufacture of noncontact type ic card and noncontact type ic card |
JP2000137779A (en) | 1998-10-30 | 2000-05-16 | Hitachi Maxell Ltd | Non-contact information medium and production thereof |
JP2000148948A (en) | 1998-11-05 | 2000-05-30 | Sony Corp | Non-contact ic label and its manufacture |
JP2000172812A (en) | 1998-12-08 | 2000-06-23 | Hitachi Maxell Ltd | Noncontact information medium |
FR2787640B1 (en) | 1998-12-22 | 2003-02-14 | Gemplus Card Int | ARRANGEMENT OF AN ANTENNA IN A METALLIC ENVIRONMENT |
JP3088404B2 (en) | 1999-01-14 | 2000-09-18 | 埼玉日本電気株式会社 | Mobile radio terminal and built-in antenna |
JP2000222540A (en) | 1999-02-03 | 2000-08-11 | Hitachi Maxell Ltd | Non-contact type semiconductor tag |
JP2000228602A (en) | 1999-02-08 | 2000-08-15 | Alps Electric Co Ltd | Resonance line |
JP2000243797A (en) | 1999-02-18 | 2000-09-08 | Sanken Electric Co Ltd | Semiconductor wafer, and cutting method thereof, and semiconductor wafer assembly and cutting method thereof |
JP3967487B2 (en) | 1999-02-23 | 2007-08-29 | 株式会社東芝 | IC card |
EP1031940A1 (en) * | 1999-02-24 | 2000-08-30 | Sihl GmbH | Device comprising a plurality of electronic circuits |
JP2000251049A (en) | 1999-03-03 | 2000-09-14 | Konica Corp | Card and production thereof |
JP4106673B2 (en) | 1999-03-05 | 2008-06-25 | 株式会社エフ・イー・シー | Antenna device using coil unit, printed circuit board |
JP4349597B2 (en) | 1999-03-26 | 2009-10-21 | 大日本印刷株式会社 | IC chip manufacturing method and memory medium manufacturing method incorporating the same |
JP2000286634A (en) | 1999-03-30 | 2000-10-13 | Ngk Insulators Ltd | Antenna system and its manufacture |
JP3751178B2 (en) | 1999-03-30 | 2006-03-01 | 日本碍子株式会社 | Transceiver |
US6542050B1 (en) | 1999-03-30 | 2003-04-01 | Ngk Insulators, Ltd. | Transmitter-receiver |
JP3067764B1 (en) | 1999-03-31 | 2000-07-24 | 株式会社豊田自動織機製作所 | Mobile communication coupler, mobile body, and mobile communication method |
JP2000321984A (en) | 1999-05-12 | 2000-11-24 | Hitachi Ltd | Label with rf-id tag |
JP4286977B2 (en) | 1999-07-02 | 2009-07-01 | 大日本印刷株式会社 | Non-contact type IC card and its antenna characteristic adjustment method |
JP3557130B2 (en) | 1999-07-14 | 2004-08-25 | 新光電気工業株式会社 | Method for manufacturing semiconductor device |
JP2001043340A (en) | 1999-07-29 | 2001-02-16 | Toppan Printing Co Ltd | Composite ic card |
JP2001066990A (en) | 1999-08-31 | 2001-03-16 | Sumitomo Bakelite Co Ltd | Protective filter and protection method of ic tag |
US6259369B1 (en) | 1999-09-30 | 2001-07-10 | Moore North America, Inc. | Low cost long distance RFID reading |
JP2001101369A (en) | 1999-10-01 | 2001-04-13 | Matsushita Electric Ind Co Ltd | Rf tag |
JP4205823B2 (en) * | 1999-10-04 | 2009-01-07 | 大日本印刷株式会社 | IC card |
JP3451373B2 (en) | 1999-11-24 | 2003-09-29 | オムロン株式会社 | Manufacturing method of data carrier capable of reading electromagnetic wave |
JP4186149B2 (en) | 1999-12-06 | 2008-11-26 | 株式会社エフ・イー・シー | Auxiliary antenna for IC card |
JP2001188890A (en) | 2000-01-05 | 2001-07-10 | Omron Corp | Non-contact tag |
US7334734B2 (en) | 2000-01-27 | 2008-02-26 | Hitachi Maxwell, Ltd. | Non-contact IC module |
JP2001209767A (en) | 2000-01-27 | 2001-08-03 | Hitachi Maxell Ltd | Object to be accessed provided with non-contact ic module |
JP2001240046A (en) | 2000-02-25 | 2001-09-04 | Toppan Forms Co Ltd | Container and manufacturing method thereof |
JP4514880B2 (en) | 2000-02-28 | 2010-07-28 | 大日本印刷株式会社 | Book delivery, returns and inventory management system |
JP2001257292A (en) | 2000-03-10 | 2001-09-21 | Hitachi Maxell Ltd | Semiconductor device |
JP2001256457A (en) | 2000-03-13 | 2001-09-21 | Toshiba Corp | Semiconductor device, its manufacture and ic card communication system |
US6400271B1 (en) * | 2000-03-20 | 2002-06-04 | Checkpoint Systems, Inc. | Activate/deactiveable security tag with enhanced electronic protection for use with an electronic security system |
JP2003529163A (en) | 2000-03-28 | 2003-09-30 | ルカトロン アーゲー | RFID label having member for adjusting resonance frequency |
JP4624537B2 (en) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | Non-contact data carrier device, storage |
JP4624536B2 (en) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | Non-contact data carrier device |
JP2001291181A (en) | 2000-04-07 | 2001-10-19 | Ricoh Elemex Corp | Sensor and sensor system |
JP2001319380A (en) | 2000-05-11 | 2001-11-16 | Mitsubishi Materials Corp | Optical disk with rfid |
JP4688396B2 (en) * | 2000-05-12 | 2011-05-25 | 大日本印刷株式会社 | Non-contact data carrier device |
JP2001331976A (en) | 2000-05-17 | 2001-11-30 | Casio Comput Co Ltd | Optical recording type recording medium |
JP4223174B2 (en) | 2000-05-19 | 2009-02-12 | Dxアンテナ株式会社 | Film antenna |
JP2001339226A (en) | 2000-05-26 | 2001-12-07 | Nec Saitama Ltd | Antenna system |
JP2001344574A (en) | 2000-05-30 | 2001-12-14 | Mitsubishi Materials Corp | Antenna device for interrogator |
JP2001352176A (en) | 2000-06-05 | 2001-12-21 | Fuji Xerox Co Ltd | Multilayer printed wiring board and manufacturing method of multilayer printed wiring board |
JP2003536302A (en) | 2000-06-06 | 2003-12-02 | バッテル メモリアル インスティテュート | Telecommunications systems and methods |
JP2001358527A (en) | 2000-06-12 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Antenna device |
JP2002007985A (en) * | 2000-06-20 | 2002-01-11 | Dainippon Printing Co Ltd | Noncontact ic card substrate, noncontact ic card and manufacturing method of the same |
JP2002157564A (en) | 2000-11-21 | 2002-05-31 | Toyo Aluminium Kk | Antenna coil for ic card and its manufacturing method |
US6400323B2 (en) | 2000-06-23 | 2002-06-04 | Toyo Aluminium Kabushiki Kaisha | Antenna coil for IC card and manufacturing method thereof |
CN1604492A (en) | 2000-07-04 | 2005-04-06 | 克里蒂帕斯株式会社 | Credit-card type transponder |
JP4138211B2 (en) | 2000-07-06 | 2008-08-27 | 株式会社村田製作所 | Electronic component and manufacturing method thereof, collective electronic component, mounting structure of electronic component, and electronic apparatus |
JP2002024776A (en) | 2000-07-07 | 2002-01-25 | Nippon Signal Co Ltd:The | Ic card reader/writer |
JP2001076111A (en) | 2000-07-12 | 2001-03-23 | Hitachi Kokusai Electric Inc | Resonance circuit |
JP2002032731A (en) | 2000-07-14 | 2002-01-31 | Sony Corp | Non-contact information exchange card |
WO2002007078A1 (en) | 2000-07-19 | 2002-01-24 | Hanex Co., Ltd. | Rfid tag housing structure, rfid tag installation structure and rfid tag communication method |
RU2163739C1 (en) | 2000-07-20 | 2001-02-27 | Криштопов Александр Владимирович | Antenna |
JP2002042076A (en) | 2000-07-21 | 2002-02-08 | Dainippon Printing Co Ltd | Non-contact data carrier and booklet therewith |
JP2002042083A (en) | 2000-07-27 | 2002-02-08 | Hitachi Maxell Ltd | Non-contact communication type information carrier |
JP3075400U (en) | 2000-08-03 | 2001-02-16 | 昌栄印刷株式会社 | Non-contact IC card |
US6466007B1 (en) | 2000-08-14 | 2002-10-15 | Teradyne, Inc. | Test system for smart card and indentification devices and the like |
JP2002063557A (en) | 2000-08-21 | 2002-02-28 | Mitsubishi Materials Corp | Tag for rfid |
JP2002076750A (en) | 2000-08-24 | 2002-03-15 | Murata Mfg Co Ltd | Antenna device and radio equipment equipped with it |
JP2002143826A (en) | 2000-08-30 | 2002-05-21 | Denso Corp | System for recycling waste and system for detecting unlawful dumping |
JP3481575B2 (en) | 2000-09-28 | 2003-12-22 | 寛児 川上 | antenna |
JP4615695B2 (en) | 2000-10-19 | 2011-01-19 | 三星エスディーエス株式会社 | IC module for IC card and IC card using it |
US6634564B2 (en) | 2000-10-24 | 2003-10-21 | Dai Nippon Printing Co., Ltd. | Contact/noncontact type data carrier module |
JP4628611B2 (en) | 2000-10-27 | 2011-02-09 | 三菱マテリアル株式会社 | antenna |
JP4432254B2 (en) | 2000-11-20 | 2010-03-17 | 株式会社村田製作所 | Surface mount antenna structure and communication device including the same |
JP2002185358A (en) | 2000-11-24 | 2002-06-28 | Supersensor Pty Ltd | Method for fitting rf transponder to container |
JP4641096B2 (en) | 2000-12-07 | 2011-03-02 | 大日本印刷株式会社 | Non-contact data carrier device and wiring member for booster antenna |
JP2002175920A (en) | 2000-12-08 | 2002-06-21 | Murata Mfg Co Ltd | High-frequency filter element |
JP2002183676A (en) | 2000-12-08 | 2002-06-28 | Hitachi Ltd | Information reader |
JP2002183690A (en) | 2000-12-11 | 2002-06-28 | Hitachi Maxell Ltd | Noncontact ic tag device |
WO2002048980A1 (en) | 2000-12-15 | 2002-06-20 | Electrox Corp. | Process for the manufacture of novel, inexpensive radio frequency identification devices |
JP3788325B2 (en) | 2000-12-19 | 2006-06-21 | 株式会社村田製作所 | Multilayer coil component and manufacturing method thereof |
JP3621655B2 (en) | 2001-04-23 | 2005-02-16 | 株式会社ハネックス中央研究所 | RFID tag structure and manufacturing method thereof |
TW531976B (en) | 2001-01-11 | 2003-05-11 | Hanex Co Ltd | Communication apparatus and installing structure, manufacturing method and communication method |
JP2002280821A (en) | 2001-01-12 | 2002-09-27 | Furukawa Electric Co Ltd:The | Antenna system and terminal equipment |
KR20020061103A (en) | 2001-01-12 | 2002-07-22 | 후루까와덴끼고오교 가부시끼가이샤 | Antenna device and terminal with the antenna device |
JP2002222398A (en) | 2001-01-25 | 2002-08-09 | Jstm Kk | Non-contact data carrier |
JP2002232221A (en) | 2001-01-30 | 2002-08-16 | Alps Electric Co Ltd | Transmission and reception unit |
JPWO2002061675A1 (en) | 2001-01-31 | 2004-06-03 | 株式会社ルネサステクノロジ | Non-contact identification medium |
JP4662400B2 (en) | 2001-02-05 | 2011-03-30 | 大日本印刷株式会社 | Articles with coil-on-chip semiconductor modules |
JP2002246828A (en) | 2001-02-15 | 2002-08-30 | Mitsubishi Materials Corp | Antenna for transponder |
EP1368858B1 (en) | 2001-03-02 | 2011-02-23 | Nxp B.V. | Module and electronic device |
JP4712986B2 (en) | 2001-03-06 | 2011-06-29 | 大日本印刷株式会社 | Liquid container with RFID tag |
JP2002290130A (en) | 2001-03-28 | 2002-10-04 | Aiwa Co Ltd | Radio communication unit |
JP3570386B2 (en) | 2001-03-30 | 2004-09-29 | 松下電器産業株式会社 | Portable information terminal with built-in wireless function |
JP2002298109A (en) | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | Contactless ic medium and manufacturing method thereof |
JP3772778B2 (en) | 2001-03-30 | 2006-05-10 | 三菱マテリアル株式会社 | Antenna coil, identification tag using the same, reader / writer device, reader device and writer device |
JP2002308437A (en) | 2001-04-16 | 2002-10-23 | Dainippon Printing Co Ltd | Inspection system using rfid tag |
JP2002319812A (en) | 2001-04-20 | 2002-10-31 | Oji Paper Co Ltd | Data carrier adhesion method |
JP4700831B2 (en) | 2001-04-23 | 2011-06-15 | 株式会社ハネックス | RFID tag communication distance expansion method |
JP2002325013A (en) | 2001-04-26 | 2002-11-08 | Mitsubishi Materials Corp | Antenna coil |
JP2005236339A (en) | 2001-07-19 | 2005-09-02 | Oji Paper Co Ltd | Ic chip mounted body |
FI112550B (en) | 2001-05-31 | 2003-12-15 | Rafsec Oy | Smart label and smart label path |
JP2002362613A (en) | 2001-06-07 | 2002-12-18 | Toppan Printing Co Ltd | Laminated packaging material having non-contact ic, packaging container using laminated packaging material and method for detecting opened seal of packaging container |
JP2002366917A (en) | 2001-06-07 | 2002-12-20 | Hitachi Ltd | Ic card incorporating antenna |
JP4710174B2 (en) | 2001-06-13 | 2011-06-29 | 株式会社村田製作所 | Balanced LC filter |
JP2002373029A (en) | 2001-06-18 | 2002-12-26 | Hitachi Ltd | Method for preventing illegal copy of software by using ic tag |
JP4882167B2 (en) | 2001-06-18 | 2012-02-22 | 大日本印刷株式会社 | Card-integrated form with non-contact IC chip |
JP4759854B2 (en) | 2001-06-19 | 2011-08-31 | 株式会社寺岡精工 | Mounting method of IC tag to metal object and IC tag built-in marker |
JP2003087008A (en) | 2001-07-02 | 2003-03-20 | Ngk Insulators Ltd | Laminated type dielectric filter |
JP4058919B2 (en) | 2001-07-03 | 2008-03-12 | 日立化成工業株式会社 | Non-contact IC label, non-contact IC card, non-contact IC label or IC module for non-contact IC card |
JP2003026177A (en) | 2001-07-12 | 2003-01-29 | Toppan Printing Co Ltd | Packaging member with non-contact type ic chip |
JP2003030612A (en) | 2001-07-19 | 2003-01-31 | Oji Paper Co Ltd | Ic chip mounting body |
JP4670195B2 (en) | 2001-07-23 | 2011-04-13 | 凸版印刷株式会社 | Mobile phone case with non-contact IC card |
US7274285B2 (en) | 2001-07-24 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | System and method for improved object identification |
ES2295105T3 (en) | 2001-07-26 | 2008-04-16 | Irdeto Access B.V. | SYSTEM FOR THE VALIDATION OF TIME TIME. |
JP3629448B2 (en) | 2001-07-27 | 2005-03-16 | Tdk株式会社 | ANTENNA DEVICE AND ELECTRONIC DEVICE HAVING THE SAME |
JP4731060B2 (en) | 2001-07-31 | 2011-07-20 | トッパン・フォームズ株式会社 | RF-ID inspection method and inspection system |
JP2003058840A (en) | 2001-08-14 | 2003-02-28 | Hirano Design Sekkei:Kk | Information protection management program utilizing rfid-loaded computer recording medium |
JP2003069335A (en) | 2001-08-28 | 2003-03-07 | Hitachi Kokusai Electric Inc | Auxiliary antenna |
JP2003067711A (en) | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Article provided with ic chip mounting body or antenna part |
JP2003078333A (en) | 2001-08-30 | 2003-03-14 | Murata Mfg Co Ltd | Radio communication apparatus |
JP2003078336A (en) | 2001-08-30 | 2003-03-14 | Tokai Univ | Laminated spiral antenna |
JP4843885B2 (en) | 2001-08-31 | 2011-12-21 | 凸版印刷株式会社 | Fraud prevention label with IC memory chip |
JP4514374B2 (en) | 2001-09-05 | 2010-07-28 | トッパン・フォームズ株式会社 | RF-ID inspection system |
JP4747467B2 (en) | 2001-09-07 | 2011-08-17 | 大日本印刷株式会社 | Non-contact IC tag |
JP2003085520A (en) | 2001-09-11 | 2003-03-20 | Oji Paper Co Ltd | Manufacturing method for ic card |
JP2003087044A (en) | 2001-09-12 | 2003-03-20 | Mitsubishi Materials Corp | Antenna for rfid and rfid system having the antenna |
JP4845306B2 (en) | 2001-09-25 | 2011-12-28 | トッパン・フォームズ株式会社 | RF-ID inspection system |
JP2003099184A (en) | 2001-09-25 | 2003-04-04 | Sharp Corp | Information system and information processor and input pen to be used for the same system |
JP4698096B2 (en) | 2001-09-25 | 2011-06-08 | トッパン・フォームズ株式会社 | RF-ID inspection system |
JP2003110344A (en) | 2001-09-26 | 2003-04-11 | Hitachi Metals Ltd | Surface-mounting type antenna and antenna device mounting the same |
JP2003132330A (en) | 2001-10-25 | 2003-05-09 | Sato Corp | Rfid label printer |
JP2003134007A (en) | 2001-10-30 | 2003-05-09 | Auto Network Gijutsu Kenkyusho:Kk | System and method for exchanging signal between on- vehicle equipment |
JP3984458B2 (en) | 2001-11-20 | 2007-10-03 | 大日本印刷株式会社 | Manufacturing method of package with IC tag |
JP3908514B2 (en) | 2001-11-20 | 2007-04-25 | 大日本印刷株式会社 | Package with IC tag and method of manufacturing package with IC tag |
US6812707B2 (en) | 2001-11-27 | 2004-11-02 | Mitsubishi Materials Corporation | Detection element for objects and detection device using the same |
JP3894540B2 (en) | 2001-11-30 | 2007-03-22 | トッパン・フォームズ株式会社 | Interposer with conductive connection |
JP2003188338A (en) | 2001-12-13 | 2003-07-04 | Sony Corp | Circuit board and its manufacturing method |
JP3700777B2 (en) | 2001-12-17 | 2005-09-28 | 三菱マテリアル株式会社 | Electrode structure of RFID tag and method for adjusting resonance frequency using the electrode |
JP2003188620A (en) | 2001-12-19 | 2003-07-04 | Murata Mfg Co Ltd | Antenna integral with module |
JP4028224B2 (en) | 2001-12-20 | 2007-12-26 | 大日本印刷株式会社 | Paper IC card substrate having non-contact communication function |
JP3895175B2 (en) | 2001-12-28 | 2007-03-22 | Ntn株式会社 | Dielectric resin integrated antenna |
JP2003209421A (en) | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | Rfid tag having transparent antenna and production method therefor |
JP3915092B2 (en) | 2002-01-21 | 2007-05-16 | 株式会社エフ・イー・シー | Booster antenna for IC card |
JP2003216919A (en) | 2002-01-23 | 2003-07-31 | Toppan Forms Co Ltd | Rf-id media |
JP2003233780A (en) | 2002-02-06 | 2003-08-22 | Mitsubishi Electric Corp | Data communication device |
JP3998992B2 (en) | 2002-02-14 | 2007-10-31 | 大日本印刷株式会社 | Method for forming antenna pattern on IC chip mounted on web and package with IC tag |
JP2003243918A (en) | 2002-02-18 | 2003-08-29 | Dainippon Printing Co Ltd | Antenna for non-contact ic tag, and non-contact ic tag |
JP2003249813A (en) | 2002-02-25 | 2003-09-05 | Tecdia Kk | Tag for rfid with loop antenna |
US7119693B1 (en) | 2002-03-13 | 2006-10-10 | Celis Semiconductor Corp. | Integrated circuit with enhanced coupling |
JP2003288560A (en) | 2002-03-27 | 2003-10-10 | Toppan Forms Co Ltd | Interposer and inlet sheet with antistatic function |
US7129834B2 (en) | 2002-03-28 | 2006-10-31 | Kabushiki Kaisha Toshiba | String wireless sensor and its manufacturing method |
JP2003309418A (en) | 2002-04-17 | 2003-10-31 | Alps Electric Co Ltd | Dipole antenna |
JP2003308363A (en) | 2002-04-18 | 2003-10-31 | Oki Electric Ind Co Ltd | Product and related information management method |
JP2003317060A (en) | 2002-04-22 | 2003-11-07 | Dainippon Printing Co Ltd | Ic card |
US7135974B2 (en) | 2002-04-22 | 2006-11-14 | Symbol Technologies, Inc. | Power source system for RF location/identification tags |
JP2003317052A (en) | 2002-04-24 | 2003-11-07 | Smart Card:Kk | Ic tag system |
JP3979178B2 (en) | 2002-05-14 | 2007-09-19 | 凸版印刷株式会社 | Non-contact IC medium module and non-contact IC medium |
US6753814B2 (en) | 2002-06-27 | 2004-06-22 | Harris Corporation | Dipole arrangements using dielectric substrates of meta-materials |
JP3863464B2 (en) | 2002-07-05 | 2006-12-27 | 株式会社ヨコオ | Filter built-in antenna |
JP3803085B2 (en) | 2002-08-08 | 2006-08-02 | 株式会社日立製作所 | Wireless IC tag |
JP4100993B2 (en) | 2002-08-09 | 2008-06-11 | キヤノン株式会社 | Electronics |
JP4107381B2 (en) | 2002-08-23 | 2008-06-25 | 横浜ゴム株式会社 | Pneumatic tire |
JP2004088218A (en) | 2002-08-23 | 2004-03-18 | Tokai Univ | Planar antenna |
JP4273724B2 (en) | 2002-08-29 | 2009-06-03 | カシオ電子工業株式会社 | Consumables unauthorized use prevention system |
JP2004096566A (en) | 2002-09-02 | 2004-03-25 | Toenec Corp | Inductive communication equipment |
JP3925364B2 (en) | 2002-09-03 | 2007-06-06 | 株式会社豊田中央研究所 | Antenna and diversity receiver |
JP3645239B2 (en) | 2002-09-06 | 2005-05-11 | シャープ株式会社 | Dipole antenna, tag and moving object identification system using the same |
WO2004027681A2 (en) | 2002-09-20 | 2004-04-01 | Fairchild Semiconductor Corporation | Rfid tag wide bandwidth logarithmic spiral antenna method and system |
JP3975918B2 (en) | 2002-09-27 | 2007-09-12 | ソニー株式会社 | Antenna device |
JP2004126750A (en) | 2002-09-30 | 2004-04-22 | Toppan Forms Co Ltd | Information write/read device, antenna and rf-id medium |
JP2004121412A (en) | 2002-09-30 | 2004-04-22 | Toppan Printing Co Ltd | Surgical gauze, and its management device |
JP3958667B2 (en) | 2002-10-16 | 2007-08-15 | 株式会社日立国際電気 | Loop antenna for reader / writer, and article management shelf and book management system provided with the loop antenna |
CA2502547C (en) | 2002-10-17 | 2012-01-17 | Ambient Corporation | Highly insulated inductive data couplers |
JP4158483B2 (en) | 2002-10-22 | 2008-10-01 | ソニー株式会社 | IC module |
JP3659956B2 (en) | 2002-11-11 | 2005-06-15 | 松下電器産業株式会社 | Pressure measuring device and pressure measuring system |
JP2004213582A (en) | 2003-01-09 | 2004-07-29 | Mitsubishi Materials Corp | Rfid tag, reader/writer and rfid system with tag |
JP2004234595A (en) | 2003-02-03 | 2004-08-19 | Matsushita Electric Ind Co Ltd | Information recording medium reader |
JP3735635B2 (en) | 2003-02-03 | 2006-01-18 | 松下電器産業株式会社 | ANTENNA DEVICE AND RADIO COMMUNICATION DEVICE USING THE SAME |
EP1445821A1 (en) | 2003-02-06 | 2004-08-11 | Matsushita Electric Industrial Co., Ltd. | Portable radio communication apparatus provided with a boom portion |
US7225992B2 (en) | 2003-02-13 | 2007-06-05 | Avery Dennison Corporation | RFID device tester and method |
JP2004253858A (en) | 2003-02-18 | 2004-09-09 | Minerva:Kk | Booster antenna device for ic tag |
JP2004280390A (en) | 2003-03-14 | 2004-10-07 | Toppan Forms Co Ltd | Rf-id media and method for manufacturing the same |
JP4010263B2 (en) | 2003-03-14 | 2007-11-21 | 富士電機ホールディングス株式会社 | Antenna and data reader |
JP4034676B2 (en) | 2003-03-20 | 2008-01-16 | 日立マクセル株式会社 | Non-contact communication type information carrier |
JP4097139B2 (en) | 2003-03-26 | 2008-06-11 | Necトーキン株式会社 | Wireless tag |
JP2004297249A (en) | 2003-03-26 | 2004-10-21 | Matsushita Electric Ind Co Ltd | Coupler between different phase lines, mounting method therefor, and coupling method between different phase lines |
JP2004297681A (en) | 2003-03-28 | 2004-10-21 | Toppan Forms Co Ltd | Non-contact information recording medium |
JP2004304370A (en) | 2003-03-28 | 2004-10-28 | Sony Corp | Antenna coil and communication equipment |
JP4208631B2 (en) | 2003-04-17 | 2009-01-14 | 日本ミクロン株式会社 | Manufacturing method of semiconductor device |
JP2004326380A (en) | 2003-04-24 | 2004-11-18 | Dainippon Printing Co Ltd | Rfid tag |
JP2004334268A (en) | 2003-04-30 | 2004-11-25 | Dainippon Printing Co Ltd | Paper slip ic tag, book/magazine with it, and book with it |
JP2004336250A (en) | 2003-05-02 | 2004-11-25 | Taiyo Yuden Co Ltd | Antenna matching circuit, and mobile communication apparatus and dielectric antenna having the same |
JP2004343000A (en) | 2003-05-19 | 2004-12-02 | Fujikura Ltd | Semiconductor module, non-contact integrated circuit tag having the semiconductor module, and method of manufacturing semiconductor module |
JP2004362190A (en) | 2003-06-04 | 2004-12-24 | Hitachi Ltd | Semiconductor device |
JP4828088B2 (en) | 2003-06-05 | 2011-11-30 | 凸版印刷株式会社 | IC tag |
JP2005005866A (en) | 2003-06-10 | 2005-01-06 | Alps Electric Co Ltd | Antenna-integrated module |
JP4210559B2 (en) | 2003-06-23 | 2009-01-21 | 大日本印刷株式会社 | Sheet with IC tag and manufacturing method thereof |
JP2005033461A (en) | 2003-07-11 | 2005-02-03 | Mitsubishi Materials Corp | Rfid system and structure of antenna therein |
JP2005050581A (en) | 2003-07-30 | 2005-02-24 | Seiko Epson Corp | Power supply cord, power supply code inspection device, and power supply code inspection method |
JP2005064799A (en) | 2003-08-11 | 2005-03-10 | Toppan Printing Co Ltd | Rfid antenna for portable information terminal unit |
JP3982476B2 (en) | 2003-10-01 | 2007-09-26 | ソニー株式会社 | Communications system |
JP4062233B2 (en) | 2003-10-20 | 2008-03-19 | トヨタ自動車株式会社 | Loop antenna device |
JP4680489B2 (en) | 2003-10-21 | 2011-05-11 | 三菱電機株式会社 | Information record reading system |
JP2005134942A (en) | 2003-10-28 | 2005-05-26 | Mitsubishi Materials Corp | Rfid reader/writer and structure of antenna |
JP3570430B1 (en) | 2003-10-29 | 2004-09-29 | オムロン株式会社 | Loop coil antenna |
JP4402426B2 (en) | 2003-10-30 | 2010-01-20 | 大日本印刷株式会社 | Temperature change detection system |
JP4343655B2 (en) | 2003-11-12 | 2009-10-14 | 株式会社日立製作所 | antenna |
JP4451125B2 (en) | 2003-11-28 | 2010-04-14 | シャープ株式会社 | Small antenna |
JP4177241B2 (en) | 2003-12-04 | 2008-11-05 | 株式会社日立情報制御ソリューションズ | Wireless IC tag antenna, wireless IC tag, and container with wireless IC tag |
JP2005165839A (en) | 2003-12-04 | 2005-06-23 | Nippon Signal Co Ltd:The | Reader/writer, ic tag, article control device, and optical disk device |
JP4916658B2 (en) | 2003-12-19 | 2012-04-18 | 株式会社半導体エネルギー研究所 | Semiconductor device |
US7494066B2 (en) | 2003-12-19 | 2009-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US6999028B2 (en) | 2003-12-23 | 2006-02-14 | 3M Innovative Properties Company | Ultra high frequency radio frequency identification tag |
JP4326936B2 (en) | 2003-12-24 | 2009-09-09 | シャープ株式会社 | Wireless tag |
EP1548674A1 (en) | 2003-12-25 | 2005-06-29 | Hitachi, Ltd. | Radio IC tag, method and apparatus for manufacturing the same |
JP2005210676A (en) | 2003-12-25 | 2005-08-04 | Hitachi Ltd | Wireless ic tag, and method and apparatus for manufacturing the same |
JP4089680B2 (en) | 2003-12-25 | 2008-05-28 | 三菱マテリアル株式会社 | Antenna device |
KR100995265B1 (en) | 2003-12-25 | 2010-11-19 | 미쓰비시 마테리알 가부시키가이샤 | Antenna device and communication apparatus |
JP4218519B2 (en) | 2003-12-26 | 2009-02-04 | 戸田工業株式会社 | Magnetic field antenna, wireless system and communication system using the same |
JP2005190417A (en) | 2003-12-26 | 2005-07-14 | Taketani Shoji:Kk | Fixed object management system and individual identifier for use therein |
JP4174801B2 (en) | 2004-01-15 | 2008-11-05 | 株式会社エフ・イー・シー | Identification tag reader / writer antenna |
FR2865329B1 (en) | 2004-01-19 | 2006-04-21 | Pygmalyon | PASSIVE RECEIVER-RECEIVER DEVICE POWERED BY AN ELECTROMAGNETIC WAVE |
JP2005210223A (en) | 2004-01-20 | 2005-08-04 | Tdk Corp | Antenna device |
KR101107555B1 (en) | 2004-01-22 | 2012-01-31 | 미코 코포레이션 | A modular radio frequency identification tagging method |
KR101270180B1 (en) | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | An inspection apparatus, inspenction method, and method for manufacturing a semiconductor device |
JP4271591B2 (en) | 2004-01-30 | 2009-06-03 | 双信電機株式会社 | Antenna device |
JP2005229474A (en) | 2004-02-16 | 2005-08-25 | Olympus Corp | Information terminal device |
JP4393228B2 (en) | 2004-02-27 | 2010-01-06 | シャープ株式会社 | Small antenna and wireless tag provided with the same |
JP2005252853A (en) | 2004-03-05 | 2005-09-15 | Fec Inc | Antenna for rf-id |
JP2005277579A (en) | 2004-03-23 | 2005-10-06 | Kyocera Corp | High frequency module and communication apparatus employing the same |
WO2005091434A1 (en) | 2004-03-24 | 2005-09-29 | Uchida Yoko Co.,Ltd. | Recording medium ic tag sticking sheet and recording medium |
JP2005275870A (en) | 2004-03-25 | 2005-10-06 | Matsushita Electric Ind Co Ltd | Insertion type radio communication medium device and electronic equipment |
JP2005284352A (en) | 2004-03-26 | 2005-10-13 | Toshiba Corp | Portable electronic equipment |
JP2005284455A (en) | 2004-03-29 | 2005-10-13 | Fujita Denki Seisakusho:Kk | Rfid system |
JP4067510B2 (en) | 2004-03-31 | 2008-03-26 | シャープ株式会社 | Television receiver |
JP2005293537A (en) | 2004-04-05 | 2005-10-20 | Fuji Xynetics Kk | Cardboard with ic tag |
US8139759B2 (en) | 2004-04-16 | 2012-03-20 | Panasonic Corporation | Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system |
JP2005311205A (en) | 2004-04-23 | 2005-11-04 | Nec Corp | Semiconductor device |
JP2005306696A (en) | 2004-04-26 | 2005-11-04 | Matsushita Electric Ind Co Ltd | Magnetic ferrite, and common mode noise filter and chip transformer using the same |
JP2005340759A (en) | 2004-04-27 | 2005-12-08 | Sony Corp | Magnetic core member for antenna module, antenna module, and personal digital assistant equipped with this |
JP2005322119A (en) | 2004-05-11 | 2005-11-17 | Ic Brains Co Ltd | Device for preventing illegal taking of article equipped with ic tag |
JP2005321305A (en) | 2004-05-10 | 2005-11-17 | Murata Mfg Co Ltd | Electronic component measurement jig |
JP3867085B2 (en) | 2004-05-13 | 2007-01-10 | 東芝テック株式会社 | Wireless communication device, RF tag reader / writer, and printer |
JP4191088B2 (en) | 2004-05-14 | 2008-12-03 | 株式会社デンソー | Electronic equipment |
JP2005333244A (en) | 2004-05-18 | 2005-12-02 | Mitsubishi Electric Corp | Mobile telephone set |
JP4551122B2 (en) | 2004-05-26 | 2010-09-22 | 株式会社岩田レーベル | RFID label affixing device |
US7317396B2 (en) | 2004-05-26 | 2008-01-08 | Funai Electric Co., Ltd. | Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying |
JP4360276B2 (en) | 2004-06-02 | 2009-11-11 | 船井電機株式会社 | Optical disc having wireless IC tag and optical disc reproducing apparatus |
JP2005345802A (en) | 2004-06-03 | 2005-12-15 | Casio Comput Co Ltd | Imaging device, replacement unit used for the imaging device, and replacement unit use control method and program |
JP2005352858A (en) * | 2004-06-11 | 2005-12-22 | Hitachi Maxell Ltd | Communication type recording medium |
JP4348282B2 (en) | 2004-06-11 | 2009-10-21 | 株式会社日立製作所 | Wireless IC tag and method of manufacturing wireless IC tag |
JP4530140B2 (en) | 2004-06-28 | 2010-08-25 | Tdk株式会社 | Soft magnetic material and antenna device using the same |
JP4359198B2 (en) | 2004-06-30 | 2009-11-04 | 株式会社日立製作所 | IC tag mounting substrate manufacturing method |
JP4328682B2 (en) | 2004-07-13 | 2009-09-09 | 富士通株式会社 | Radio tag antenna structure for optical recording medium and optical recording medium housing case with radio tag antenna |
JP2006033312A (en) | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | Antenna and antenna fitting method |
JP2004362602A (en) | 2004-07-26 | 2004-12-24 | Hitachi Ltd | Rfid tag |
JP2006039902A (en) | 2004-07-27 | 2006-02-09 | Ntn Corp | Uhf band radio ic tag |
JP2006039947A (en) | 2004-07-27 | 2006-02-09 | Daido Steel Co Ltd | Composite magnetic sheet |
JP2006042059A (en) | 2004-07-28 | 2006-02-09 | Tdk Corp | Radio communication apparatus and impedance controlling method thereof |
JP2006042097A (en) | 2004-07-29 | 2006-02-09 | Kyocera Corp | Antenna wiring board |
JP2006050200A (en) | 2004-08-04 | 2006-02-16 | Matsushita Electric Ind Co Ltd | Reader/writer |
JP4653440B2 (en) | 2004-08-13 | 2011-03-16 | 富士通株式会社 | RFID tag and manufacturing method thereof |
JP4482403B2 (en) | 2004-08-30 | 2010-06-16 | 日本発條株式会社 | Non-contact information medium |
JP4186895B2 (en) | 2004-09-01 | 2008-11-26 | 株式会社デンソーウェーブ | Coil antenna for non-contact communication device and manufacturing method thereof |
US7158033B2 (en) * | 2004-09-01 | 2007-01-02 | Avery Dennison Corporation | RFID device with combined reactive coupler |
JP4125275B2 (en) | 2004-09-02 | 2008-07-30 | 日本電信電話株式会社 | Non-contact IC medium control system |
JP2005129019A (en) | 2004-09-03 | 2005-05-19 | Sony Chem Corp | Ic card |
JP2006080367A (en) | 2004-09-10 | 2006-03-23 | Brother Ind Ltd | Inductance element, radio tag circuit element, tagged tape roll, and manufacturing method of inductance element |
US20060055531A1 (en) | 2004-09-14 | 2006-03-16 | Honeywell International, Inc. | Combined RF tag and SAW sensor |
JP2006092630A (en) | 2004-09-22 | 2006-04-06 | Sony Corp | Optical disk and manufacturing method therefor |
JP4600742B2 (en) | 2004-09-30 | 2010-12-15 | ブラザー工業株式会社 | Print head and tag label producing apparatus |
JP2006107296A (en) | 2004-10-08 | 2006-04-20 | Dainippon Printing Co Ltd | Non-contact ic tag and antenna for non-contact ic tag |
GB2419779A (en) | 2004-10-29 | 2006-05-03 | Hewlett Packard Development Co | Document having conductive tracks for coupling to a memory tag and a reader |
JP2008519347A (en) | 2004-11-05 | 2008-06-05 | キネテイツク・リミテツド | Detunable radio frequency tag |
WO2006049068A1 (en) | 2004-11-08 | 2006-05-11 | Matsushita Electric Industrial Co., Ltd. | Antenna assembly and wireless communication system employing same |
JP4088797B2 (en) | 2004-11-18 | 2008-05-21 | 日本電気株式会社 | RFID tag |
JP2006148518A (en) | 2004-11-19 | 2006-06-08 | Matsushita Electric Works Ltd | Adjuster and adjusting method of non-contact ic card |
JP2006151402A (en) | 2004-11-25 | 2006-06-15 | Rengo Co Ltd | Corrugated box with radio tag |
US7545328B2 (en) | 2004-12-08 | 2009-06-09 | Electronics And Telecommunications Research Institute | Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof |
JP4281683B2 (en) | 2004-12-16 | 2009-06-17 | 株式会社デンソー | IC tag mounting structure |
JP4541246B2 (en) | 2004-12-24 | 2010-09-08 | トッパン・フォームズ株式会社 | Non-contact IC module |
JP4942998B2 (en) | 2004-12-24 | 2012-05-30 | 株式会社半導体エネルギー研究所 | Semiconductor device and manufacturing method of semiconductor device |
EP1829102A4 (en) | 2004-12-24 | 2014-08-13 | Semiconductor Energy Lab | Semiconductor device |
JP4737505B2 (en) | 2005-01-14 | 2011-08-03 | 日立化成工業株式会社 | IC tag inlet and manufacturing method of IC tag inlet |
US7714794B2 (en) | 2005-01-19 | 2010-05-11 | Behzad Tavassoli Hozouri | RFID antenna |
JP4711692B2 (en) | 2005-02-01 | 2011-06-29 | 富士通株式会社 | Meander line antenna |
JP2006232292A (en) | 2005-02-22 | 2006-09-07 | Nippon Sheet Glass Co Ltd | Container with electronic tag, and rfid system |
JP2006237674A (en) | 2005-02-22 | 2006-09-07 | Suncall Corp | Patch antenna and rfid inlet |
JP2006238282A (en) | 2005-02-28 | 2006-09-07 | Matsushita Electric Ind Co Ltd | Antenna unit, transmitter/receiver, wireless tag reading apparatus, and wireless tag read system |
JP4639857B2 (en) | 2005-03-07 | 2011-02-23 | 富士ゼロックス株式会社 | A storage box for storing articles to which RFID tags are attached, an arrangement method thereof, a communication method, a communication confirmation method, and a packaging structure. |
US7964413B2 (en) | 2005-03-10 | 2011-06-21 | Gen-Probe Incorporated | Method for continuous mode processing of multiple reaction receptacles in a real-time amplification assay |
JP4330575B2 (en) | 2005-03-17 | 2009-09-16 | 富士通株式会社 | Tag antenna |
JP4437965B2 (en) | 2005-03-22 | 2010-03-24 | Necトーキン株式会社 | Wireless tag |
JP4087859B2 (en) | 2005-03-25 | 2008-05-21 | 東芝テック株式会社 | Wireless tag |
JP2006270681A (en) | 2005-03-25 | 2006-10-05 | Sony Corp | Portable equipment |
JP2006287659A (en) | 2005-03-31 | 2006-10-19 | Tdk Corp | Antenna device |
EP1865574B1 (en) | 2005-04-01 | 2015-06-17 | Fujitsu Frontech Limited | Rfid tag applicable to metal and rfid tag section of the same |
JP4750450B2 (en) | 2005-04-05 | 2011-08-17 | 富士通株式会社 | RFID tag |
JP2006302219A (en) | 2005-04-25 | 2006-11-02 | Fujita Denki Seisakusho:Kk | Rfid tag communication range setting device |
WO2006115363A1 (en) | 2005-04-26 | 2006-11-02 | E.M.W. Antenna Co., Ltd. | Ultra-wideband antenna having a band notch characteristic |
JP4771115B2 (en) | 2005-04-27 | 2011-09-14 | 日立化成工業株式会社 | IC tag |
JP4529786B2 (en) | 2005-04-28 | 2010-08-25 | 株式会社日立製作所 | Signal processing circuit and non-contact IC card and tag using the same |
JP4452865B2 (en) | 2005-04-28 | 2010-04-21 | 智三 太田 | Wireless IC tag device and RFID system |
US8111143B2 (en) | 2005-04-29 | 2012-02-07 | Hewlett-Packard Development Company, L.P. | Assembly for monitoring an environment |
JP4740645B2 (en) | 2005-05-17 | 2011-08-03 | 富士通株式会社 | Manufacturing method of semiconductor device |
US7688272B2 (en) | 2005-05-30 | 2010-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2007013120A (en) | 2005-05-30 | 2007-01-18 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
JP4255931B2 (en) | 2005-06-01 | 2009-04-22 | 日本電信電話株式会社 | Non-contact IC medium and control device |
JP2007007888A (en) | 2005-06-28 | 2007-01-18 | Oji Paper Co Ltd | Non-contact ic chip mount body mounting corrugated cardboard and its manufacturing method |
JP2007018067A (en) | 2005-07-05 | 2007-01-25 | Kobayashi Kirokushi Co Ltd | Rfid tag and rfid system |
JP4286813B2 (en) | 2005-07-08 | 2009-07-01 | 富士通株式会社 | Antenna and RFID tag equipped with the same |
JP2007028002A (en) | 2005-07-13 | 2007-02-01 | Matsushita Electric Ind Co Ltd | Antenna of reader/writer, and communication system |
WO2007013168A1 (en) | 2005-07-29 | 2007-02-01 | Fujitsu Limited | Rf tag and rf tag manufacturing method |
JP2007040702A (en) | 2005-07-29 | 2007-02-15 | Oki Electric Ind Co Ltd | Semiconductor ic, wireless ic tag and sensor |
JP4720348B2 (en) | 2005-08-04 | 2011-07-13 | パナソニック株式会社 | Antenna for RF-ID reader / writer device, RF-ID reader / writer device using the antenna, and RF-ID system |
JP4737716B2 (en) | 2005-08-11 | 2011-08-03 | ブラザー工業株式会社 | RFID tag IC circuit holder, tag tape roll, RFID tag cartridge |
JP4801951B2 (en) | 2005-08-18 | 2011-10-26 | 富士通フロンテック株式会社 | RFID tag |
JP2007065822A (en) | 2005-08-30 | 2007-03-15 | Sofueru:Kk | Radio ic tag, intermediate ic tag body, intermediate ic tag body set and method for manufacturing radio ic tag |
DE102005042444B4 (en) | 2005-09-06 | 2007-10-11 | Ksw Microtec Ag | Arrangement for an RFID transponder antenna |
JP4725261B2 (en) | 2005-09-12 | 2011-07-13 | オムロン株式会社 | RFID tag inspection method |
JP4384102B2 (en) | 2005-09-13 | 2009-12-16 | 株式会社東芝 | Portable radio device and antenna device |
JP2007096655A (en) | 2005-09-28 | 2007-04-12 | Oji Paper Co Ltd | Antenna for rfid tag and rfid tag |
JP4075919B2 (en) | 2005-09-29 | 2008-04-16 | オムロン株式会社 | Antenna unit and non-contact IC tag |
JP4826195B2 (en) | 2005-09-30 | 2011-11-30 | 大日本印刷株式会社 | RFID tag |
JP2007116347A (en) | 2005-10-19 | 2007-05-10 | Mitsubishi Materials Corp | Tag antenna and mobile radio equipment |
JP4774273B2 (en) | 2005-10-31 | 2011-09-14 | 株式会社サトー | RFID label and RFID label attaching method |
JP2007159083A (en) | 2005-11-09 | 2007-06-21 | Alps Electric Co Ltd | Antenna matching circuit |
JP4899446B2 (en) | 2005-11-24 | 2012-03-21 | Tdk株式会社 | Composite electronic component and manufacturing method thereof |
JP2007150642A (en) | 2005-11-28 | 2007-06-14 | Hitachi Ulsi Systems Co Ltd | Interrogator for wireless tag, antenna for wireless tag, wireless tag system, and wireless tag selector |
JP2007150868A (en) | 2005-11-29 | 2007-06-14 | Renesas Technology Corp | Electronic equipment and method of manufacturing the same |
US7573388B2 (en) | 2005-12-08 | 2009-08-11 | The Kennedy Group, Inc. | RFID device with augmented grain |
JP4560480B2 (en) | 2005-12-13 | 2010-10-13 | Necトーキン株式会社 | Wireless tag |
JP4815211B2 (en) | 2005-12-22 | 2011-11-16 | 株式会社サトー | RFID label and RFID label attaching method |
JP4848764B2 (en) | 2005-12-26 | 2011-12-28 | 大日本印刷株式会社 | Non-contact data carrier device |
CN106599980A (en) * | 2006-01-19 | 2017-04-26 | 株式会社村田制作所 | Radio IC device |
US7519328B2 (en) * | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
WO2007083575A1 (en) | 2006-01-19 | 2007-07-26 | Murata Manufacturing Co., Ltd. | Radio ic device |
EP1976056A4 (en) | 2006-01-19 | 2008-12-24 | Murata Manufacturing Co | Radio ic device and radio ic device part |
WO2007086130A1 (en) | 2006-01-27 | 2007-08-02 | Totoku Electric Co., Ltd. | Tag device, transceiver device and tag system |
KR101061648B1 (en) | 2006-02-19 | 2011-09-01 | 니폰샤신인사츠가부시키가이샤 | Feeding structure of the housing with antenna |
KR101314036B1 (en) | 2006-02-22 | 2013-10-01 | 도요세이칸 그룹 홀딩스 가부시키가이샤 | Base material for rfid tag adapted to metallic material |
JP4524674B2 (en) | 2006-02-23 | 2010-08-18 | ブラザー工業株式会社 | Interrogator for RFID tag communication system |
JP4026080B2 (en) | 2006-02-24 | 2007-12-26 | オムロン株式会社 | Antenna and RFID tag |
JP4755921B2 (en) | 2006-02-24 | 2011-08-24 | 富士通株式会社 | RFID tag |
JP5055478B2 (en) | 2006-02-28 | 2012-10-24 | 凸版印刷株式会社 | IC tag |
WO2007099602A1 (en) | 2006-02-28 | 2007-09-07 | Matsushita Electric Industrial Co., Ltd. | Portable radio apparatus |
JP3121577U (en) | 2006-03-02 | 2006-05-18 | 株式会社スマート | Eccentric magnetic coil system |
EP1993170A4 (en) | 2006-03-06 | 2011-11-16 | Mitsubishi Electric Corp | Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag |
JP2007241789A (en) | 2006-03-10 | 2007-09-20 | Ic Brains Co Ltd | Radio tag reader/writer, communication device and communication system |
JP3933191B1 (en) | 2006-03-13 | 2007-06-20 | 株式会社村田製作所 | Portable electronic devices |
JP2007249620A (en) | 2006-03-16 | 2007-09-27 | Nec Tokin Corp | Wireless tag |
JP2007287128A (en) | 2006-03-22 | 2007-11-01 | Orient Sokki Computer Kk | Non-contact ic medium |
JP4735368B2 (en) | 2006-03-28 | 2011-07-27 | 富士通株式会社 | Planar antenna |
JP4854362B2 (en) | 2006-03-30 | 2012-01-18 | 富士通株式会社 | RFID tag and manufacturing method thereof |
JP4927625B2 (en) | 2006-03-31 | 2012-05-09 | ニッタ株式会社 | Magnetic shield sheet, non-contact IC card communication improving method, and non-contact IC card container |
JP2007279782A (en) | 2006-04-03 | 2007-10-25 | Dainippon Printing Co Ltd | Non-contact ic tag having ic chip breakdown prevention structure, connecting element of the non-contact ic tag, and manufacturing method of the non-contact ic tag connecting element |
CN101416353B (en) | 2006-04-10 | 2013-04-10 | 株式会社村田制作所 | Wireless IC device |
JP4572983B2 (en) | 2006-04-14 | 2010-11-04 | 株式会社村田製作所 | Wireless IC device |
WO2007119310A1 (en) | 2006-04-14 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Antenna |
JP4853095B2 (en) | 2006-04-24 | 2012-01-11 | 大日本印刷株式会社 | Non-contact data carrier, wiring board for non-contact data carrier |
JP2007295395A (en) | 2006-04-26 | 2007-11-08 | Fujitsu Ltd | Antenna for tag, and tag using the same |
EP2012388B1 (en) | 2006-04-26 | 2011-12-28 | Murata Manufacturing Co. Ltd. | Article provided with feed circuit board |
US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
JP4674638B2 (en) | 2006-04-26 | 2011-04-20 | 株式会社村田製作所 | Article with electromagnetic coupling module |
US20080068132A1 (en) | 2006-05-16 | 2008-03-20 | Georges Kayanakis | Contactless radiofrequency device featuring several antennas and related antenna selection circuit |
US7589675B2 (en) | 2006-05-19 | 2009-09-15 | Industrial Technology Research Institute | Broadband antenna |
JP2007324865A (en) | 2006-05-31 | 2007-12-13 | Sony Chemical & Information Device Corp | Antenna circuit, and transponder |
WO2007138857A1 (en) | 2006-06-01 | 2007-12-06 | Murata Manufacturing Co., Ltd. | Radio frequency ic device and composite component for radio frequency ic device |
CN101467209B (en) | 2006-06-30 | 2012-03-21 | 株式会社村田制作所 | Optical disc |
WO2008007606A1 (en) | 2006-07-11 | 2008-01-17 | Murata Manufacturing Co., Ltd. | Antenna and radio ic device |
JP2008033716A (en) | 2006-07-31 | 2008-02-14 | Sankyo Kk | Coin type rfid tag |
KR100797172B1 (en) | 2006-08-08 | 2008-01-23 | 삼성전자주식회사 | Loop-antenna having a matching circuit on it |
US7981528B2 (en) | 2006-09-05 | 2011-07-19 | Panasonic Corporation | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same |
JP4836899B2 (en) | 2006-09-05 | 2011-12-14 | パナソニック株式会社 | Magnetic striped array sheet, RFID magnetic sheet, electromagnetic shielding sheet, and manufacturing method thereof |
JP4770655B2 (en) | 2006-09-12 | 2011-09-14 | 株式会社村田製作所 | Wireless IC device |
US8120462B2 (en) | 2006-09-25 | 2012-02-21 | Sensomatic Electronics, LLC | Method and system for standing wave detection for radio frequency identification marker readers |
JP2008083867A (en) | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | Memory card socket |
JP2008092131A (en) | 2006-09-29 | 2008-04-17 | Tdk Corp | Antenna element and mobile information terminal |
JP2008098993A (en) | 2006-10-12 | 2008-04-24 | Dx Antenna Co Ltd | Antenna |
JP4913529B2 (en) | 2006-10-13 | 2012-04-11 | トッパン・フォームズ株式会社 | RFID media |
JP2008107947A (en) | 2006-10-24 | 2008-05-08 | Toppan Printing Co Ltd | Rfid tag |
US7605761B2 (en) | 2006-11-30 | 2009-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Antenna and semiconductor device having the same |
DE102006057369A1 (en) | 2006-12-04 | 2008-06-05 | Airbus Deutschland Gmbh | Radio frequency identification tag for e.g. identifying metal container, has radio frequency identification scanning antenna with conductor loop that is aligned diagonally or perpendicularly to attachment surface |
JP2008167190A (en) | 2006-12-28 | 2008-07-17 | Philtech Inc | Base body sheet |
JP2008182438A (en) | 2007-01-24 | 2008-08-07 | Nec Tokin Corp | Radio tag |
US7886315B2 (en) | 2007-01-30 | 2011-02-08 | Sony Corporation | Optical disc case, optical disc tray, card member, and manufacturing method |
JP2008207875A (en) | 2007-01-30 | 2008-09-11 | Sony Corp | Optical disk case, optical disk tray, card member and manufacturing method |
JP2008197714A (en) | 2007-02-08 | 2008-08-28 | Dainippon Printing Co Ltd | Non-contact data carrier device, and auxiliary antenna for non-contact data carrier |
JP4872713B2 (en) | 2007-02-27 | 2012-02-08 | 大日本印刷株式会社 | Non-contact data carrier device |
JP5061657B2 (en) | 2007-03-05 | 2012-10-31 | 大日本印刷株式会社 | Non-contact data carrier device |
JP2008226099A (en) | 2007-03-15 | 2008-09-25 | Dainippon Printing Co Ltd | Noncontact data carrier device |
JP4867753B2 (en) | 2007-03-30 | 2012-02-01 | Tdk株式会社 | ANTENNA DEVICE AND RADIO COMMUNICATION DEVICE USING THE SAME |
JP5024372B2 (en) | 2007-04-06 | 2012-09-12 | 株式会社村田製作所 | Wireless IC device |
GB2485318B (en) | 2007-04-13 | 2012-10-10 | Murata Manufacturing Co | Magnetic field coupling antenna module and magnetic field coupling antenna device |
CN101568934A (en) | 2007-05-10 | 2009-10-28 | 株式会社村田制作所 | Wireless IC device |
EP2148449B1 (en) | 2007-05-11 | 2012-12-12 | Murata Manufacturing Co., Ltd. | Wireless ic device |
JP4770792B2 (en) | 2007-05-18 | 2011-09-14 | パナソニック電工株式会社 | Antenna device |
JP4867787B2 (en) | 2007-05-22 | 2012-02-01 | Tdk株式会社 | Antenna device |
JP4885093B2 (en) | 2007-06-11 | 2012-02-29 | 株式会社タムラ製作所 | Booster antenna coil |
JP2009017284A (en) | 2007-07-05 | 2009-01-22 | Panasonic Corp | Antenna device |
JP4466795B2 (en) | 2007-07-09 | 2010-05-26 | 株式会社村田製作所 | Wireless IC device |
JP5167709B2 (en) | 2007-07-17 | 2013-03-21 | 株式会社村田製作所 | Wireless IC device, inspection system thereof, and method of manufacturing wireless IC device using the inspection system |
EP2166490B1 (en) | 2007-07-17 | 2015-04-01 | Murata Manufacturing Co. Ltd. | Wireless ic device and electronic apparatus |
JP4867830B2 (en) | 2007-07-18 | 2012-02-01 | 株式会社村田製作所 | Wireless IC device |
US7830311B2 (en) | 2007-07-18 | 2010-11-09 | Murata Manufacturing Co., Ltd. | Wireless IC device and electronic device |
CN102915462B (en) | 2007-07-18 | 2017-03-01 | 株式会社村田制作所 | Wireless IC device |
US20090021352A1 (en) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Radio frequency ic device and electronic apparatus |
JP4561932B2 (en) | 2007-07-18 | 2010-10-13 | 株式会社村田製作所 | Wireless IC device |
JP2009037413A (en) | 2007-08-01 | 2009-02-19 | Murata Mfg Co Ltd | Radio ic device |
JP4702336B2 (en) | 2007-08-10 | 2011-06-15 | 株式会社デンソーウェーブ | Portable RFID tag reader |
JP4885092B2 (en) | 2007-09-06 | 2012-02-29 | 株式会社タムラ製作所 | Booster antenna coil |
US8717244B2 (en) | 2007-10-11 | 2014-05-06 | 3M Innovative Properties Company | RFID tag with a modified dipole antenna |
JP2009110144A (en) | 2007-10-29 | 2009-05-21 | Oji Paper Co Ltd | Coin-shaped rfid tag |
TW200919327A (en) | 2007-10-29 | 2009-05-01 | China Steel Corp | Three-dimensional wireless identification label adhered onto metal |
JP5155642B2 (en) | 2007-11-28 | 2013-03-06 | ルネサスエレクトロニクス株式会社 | ID tag |
JP2009135166A (en) | 2007-11-29 | 2009-06-18 | Nikon Corp | Exposure method and exposure device, exposure unit, and device manufacturing method |
EP2096709B1 (en) | 2007-12-20 | 2012-04-25 | Murata Manufacturing Co., Ltd. | Radio ic device |
JP2009181246A (en) | 2008-01-29 | 2009-08-13 | Toppan Forms Co Ltd | Rfid inspection system |
JP2009182630A (en) | 2008-01-30 | 2009-08-13 | Dainippon Printing Co Ltd | Booster antenna board, booster antenna board sheet and non-contact type data carrier device |
EP2251933A4 (en) | 2008-03-03 | 2012-09-12 | Murata Manufacturing Co | Composite antenna |
EP2251934B1 (en) | 2008-03-03 | 2018-05-02 | Murata Manufacturing Co. Ltd. | Wireless ic device and wireless communication system |
CN101960665B (en) | 2008-03-26 | 2014-03-26 | 株式会社村田制作所 | Radio IC device |
CN101953025A (en) | 2008-04-14 | 2011-01-19 | 株式会社村田制作所 | Radio IC device, electronic device, and method for adjusting resonance frequency of radio IC device |
JP2009260758A (en) | 2008-04-18 | 2009-11-05 | Murata Mfg Co Ltd | Radio ic device |
US9178387B2 (en) | 2008-05-13 | 2015-11-03 | Qualcomm Incorporated | Receive antenna for wireless power transfer |
EP2284949B1 (en) | 2008-05-21 | 2016-08-03 | Murata Manufacturing Co. Ltd. | Wireless ic device |
JP5078022B2 (en) | 2008-05-22 | 2012-11-21 | Necトーキン株式会社 | Wireless tag and method of using wireless tag |
JP4557186B2 (en) | 2008-06-25 | 2010-10-06 | 株式会社村田製作所 | Wireless IC device and manufacturing method thereof |
JP2010015342A (en) | 2008-07-03 | 2010-01-21 | Dainippon Printing Co Ltd | Antenna sheet, inlet, and ic tag |
JP2010050844A (en) | 2008-08-22 | 2010-03-04 | Sony Corp | Loop antenna and communication device |
JP5319313B2 (en) | 2008-08-29 | 2013-10-16 | 峰光電子株式会社 | Loop antenna |
JP4618459B2 (en) | 2008-09-05 | 2011-01-26 | オムロン株式会社 | RFID tag, RFID tag set and RFID system |
JP3148168U (en) | 2008-10-21 | 2009-02-05 | 株式会社村田製作所 | Wireless IC device |
CN102197537B (en) | 2008-10-29 | 2014-06-18 | 株式会社村田制作所 | Wireless IC device |
JP5041075B2 (en) | 2009-01-09 | 2012-10-03 | 株式会社村田製作所 | Wireless IC device and wireless IC module |
JP5510450B2 (en) | 2009-04-14 | 2014-06-04 | 株式会社村田製作所 | Wireless IC device |
JP2011015395A (en) | 2009-06-03 | 2011-01-20 | Nippon Information System:Kk | Cloth with rfid tag, and system for managing cloth with rfid tag |
WO2011062274A1 (en) | 2009-11-20 | 2011-05-26 | 日立金属株式会社 | Antenna |
JP5521686B2 (en) | 2010-03-25 | 2014-06-18 | 株式会社村田製作所 | Antenna apparatus and wireless communication device |
JP5558960B2 (en) | 2010-07-30 | 2014-07-23 | トッパン・フォームズ株式会社 | RF-ID media inspection device |
-
2010
- 2010-01-29 EP EP10735891.3A patent/EP2385580B1/en not_active Not-in-force
- 2010-01-29 CN CN201080006406.0A patent/CN102301528B/en not_active Expired - Fee Related
- 2010-01-29 WO PCT/JP2010/051205 patent/WO2010087429A1/en active Application Filing
- 2010-01-29 JP JP2010548559A patent/JP5267578B2/en not_active Expired - Fee Related
-
2011
- 2011-07-26 US US13/190,670 patent/US9104950B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000510271A (en) * | 1997-01-28 | 2000-08-08 | アマテック アドヴァンスト マイクロメカニック アンド オートメーション テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー.コマンディト ゲゼルシャフト | Transmission module for transponder device, transponder device, and method of operating transponder device |
JP2003332820A (en) * | 2002-05-10 | 2003-11-21 | Fec Inc | Booster antenna for ic card |
WO2008081699A1 (en) * | 2006-12-28 | 2008-07-10 | Philtech Inc. | Base sheet |
Non-Patent Citations (1)
Title |
---|
See also references of EP2385580A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016127396A (en) * | 2014-12-26 | 2016-07-11 | 株式会社村田製作所 | Antenna device |
WO2016114180A1 (en) * | 2015-01-15 | 2016-07-21 | 株式会社村田製作所 | Antenna device, and manufacturing method for same |
JPWO2016114180A1 (en) * | 2015-01-15 | 2017-06-15 | 株式会社村田製作所 | Antenna device and manufacturing method thereof |
US10476147B2 (en) | 2015-01-15 | 2019-11-12 | Murata Manufacturing Co., Ltd. | Antenna device and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JP5267578B2 (en) | 2013-08-21 |
CN102301528B (en) | 2015-01-28 |
CN102301528A (en) | 2011-12-28 |
EP2385580A1 (en) | 2011-11-09 |
JPWO2010087429A1 (en) | 2012-08-02 |
EP2385580B1 (en) | 2014-04-09 |
EP2385580A4 (en) | 2012-08-08 |
US9104950B2 (en) | 2015-08-11 |
US20110279340A1 (en) | 2011-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5267578B2 (en) | Antenna and wireless IC device | |
JP5240050B2 (en) | Coupling substrate, electromagnetic coupling module, and wireless IC device | |
US8177138B2 (en) | Radio IC device | |
US8360325B2 (en) | Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device | |
JP5482824B2 (en) | Wireless IC device | |
US9117157B2 (en) | Wireless IC device and electromagnetic coupling module | |
JP5024171B2 (en) | Wireless IC device and electronic apparatus | |
US9016592B2 (en) | Antenna device and communication terminal apparatus | |
US8668151B2 (en) | Wireless IC device | |
JP5418737B2 (en) | Antenna apparatus and wireless device | |
JP5505505B2 (en) | Resonant circuit and antenna device | |
WO2012005278A1 (en) | Antenna and rfid device | |
JPWO2011055702A1 (en) | Information processing system | |
US20140231528A1 (en) | Antenna, method of manufacturing the antenna, and wireless ic device | |
JP4666101B2 (en) | Wireless IC device | |
US8810456B2 (en) | Wireless IC device and coupling method for power feeding circuit and radiation plate | |
JP5630166B2 (en) | Wireless IC tag and RFID system | |
JP2009025855A (en) | Wireless ic device | |
WO2020003568A1 (en) | Rfid tag and rfid attached material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080006406.0 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10735891 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010548559 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010735891 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |