JP2007007888A - Non-contact ic chip mount body mounting corrugated cardboard and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC chip mount body mounting corrugated cardboared constituted by easily attaching the non-contact IC chip mount body to corrugated cardboard and capable of avoiding the collision and abrasion due to an external article and content. <P>SOLUTION: The non-contact IC chip mount body mounting corrugated cardboard is constituted by providing the non-contact IC chip mount body 4 to the gap part V2 between at least one liners 1 and 3 and the corrugated inner medium 2 bonded to the surfaces of the liners. By this constitution, the non-contact IC chip mount body can be easily mounted and the collision and abrasion due to the external article and content with respect to the non-contact IC chip mount body can be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact IC chip mounting body mounted cardboard on which a non-contact IC chip mounting body capable of reading and / or writing data without contact is mounted, a manufacturing method thereof, and a cardboard box using the cardboard. It is. Needless to say, the non-contact IC chip mounted body here may be one that can newly record information data on the user side.

  Corrugated cardboard boxes are essential in modern life as containers for many logistics applications. The cardboard box is printed with product name, manufacturer, lot number, handling precautions, optical bar code, etc. on the surface, and humans can directly check the optical information or read the information with a bar code reader. In other words, it is used for management such as loading / unloading, delivery, and inventory.

  Such a barcode is used by printing directly on a cardboard box or affixed to a cardboard box as a printed label by a method such as offset printing, flexographic printing, or gravure printing.

  However, in order to further streamline logistics, in recent years, there has been an increasing demand for large-scale and precise management systems that can be used across companies related to logistics, such as SCM (Supply Chain Management). As a means for doing this, logistics management is proposed in which a non-contact non-contact IC chip mounting body using a non-contact IC chip mounting body called an IC tag or RFID instead of a conventional bar code is mounted.

Ideally, it is best to assign a non-contact IC chip mounting body to each product and manage each product individually, but if the management quantity increases too much, the burden on the management system becomes very large, and the speed is increased. It will be sacrificed and the system construction and operation costs will be enormous.
If the product unit price is low, it is difficult to absorb the cost of the non-contact IC chip mounting body. In such a case, the non-contact IC chip mounting body is attached and managed in a cardboard box unit including a plurality of products. Is realistic.

  In the current verification test, it is said that the mounting cost is 5 for a unit price of 1 for a non-contact IC chip mounting body. By automatically mounting the non-contact IC chip mounting body on cardboard paper, the mounting cost can be greatly reduced. It can be expected that the SCM can be greatly contributed to by the non-contact IC chip mounting body.

  The non-contact IC chip mounting body can read / write information stored in the internal memory from various angles by exchanging electromagnetic waves with the reader / writer. It differs from existing bar codes in that information can be written in the middle of logistics. Further, since the barcode uses an optical system, information may not be readable if the barcode portion on the surface becomes dirty due to rubbing or the like, but this does not cause a problem in the non-contact IC chip mounting body.

  Many cases in which a non-contact non-contact IC chip mounting body is mounted on a cardboard box often attempt to attach a non-contact non-contact IC chip mounting body processed into a label type to the cardboard box. In general, when such a method is used, the non-contact IC chip mounting body is often affixed to the outside of the cardboard box in order to be used as a display label. However, functional problems have been pointed out, such as damage to the IC chip, which is an electronic component, due to collision or abrasion with other articles being transported, and instability in the connection between the IC chip and the antenna. .

  In order to prevent this, it has also been proposed to attach a non-contact IC chip mounting body inside the cardboard box. However, even in this case, collisions and scratches with the contents stored in the cardboard box are unavoidable, causing a malfunction of the non-contact IC chip mounting body.

  Further, it has been proposed to attach a non-contact IC chip mounting body to a cardboard paper overlapping portion or a joint portion. For example, Patent Document 1 discloses a cardboard container with an IC memory tag, characterized in that an IC memory tag is attached to a cardboard superposition section or a cardboard joint section for box-making assembly of a cardboard container body such as paperboard or cardboard. Has been proposed.

However, in this case, it is basically assumed that a label-shaped non-contact IC chip mounting body is attached. The risk of damaging the non-contact IC chip mounting body cannot be wiped off.
Since the attachment site of the non-contact IC chip mounting body is limited to the cardboard overlapping portion or the cardboard joint portion, the non-contact IC chip mounting body can be installed only at a predetermined position. When a non-contact IC chip mounting body is attached to the cardboard superimposing section or cardboard joint section, the location of the non-contact IC chip mounting body is limited near the top, bottom, and side corners, so the location of the reading antenna is limited. There are many matters.

In addition, a non-contact IC chip mounting body can be installed only at the time of cardboard box production, and a large-scale non-contact IC chip mounting body transfer device has been transferred in order to cope with cases such as when a user specifies a mounting site. There was a problem that it took time and effort to change the setup for creating cardboard boxes.
JP 2003-137267 A

  It is an object of the present invention to provide a non-contact IC chip mounting body-mounted cardboard in which a non-contact IC chip mounting body can be easily attached to the cardboard, and collision and scratching by external articles and contents can be avoided.

A non-contact IC chip mounting body mounting cardboard according to the present invention comprises at least one liner,
Corrugated shin glued to the surface of the liner,
A non-contact IC chip mounting body disposed in a gap formed by the liner and the inner core is provided.

It is preferable that the shape of the non-contact IC chip mounting body is a cylindrical shape or a flat shape because it can be easily inserted when placed in the gap.
It is preferable that at least one of the non-contact IC chip mounting body and the liner or the center rod is fixed, because the position of the non-contact IC chip mounting body does not change during movement or movement.
It is preferable to provide a mark indicating the presence of the non-contact IC chip mounting body at the portion where the non-contact IC chip mounting body of the liner is present, because this is a mark when the reader / writer is applied.

A non-contact IC chip mounting body may be provided that includes a portion where the non-contact IC chip mounting body exists and a portion where the non-contact IC chip mounting body exists around the portion where the non-contact IC chip mounting body of the liner and the inner core exists. It is preferable in terms of recovery and reuse.
The non-contact IC chip mounting body is a non-contact IC chip mounting body having a cylindrical outer shape and a substantially screw-like spiral groove in the cylindrical outer shape. It is more preferable for fixing.
It is more preferable that the non-contact IC chip mounting body is a non-contact IC chip mounting body having an engagement shape portion at least at a part of the outer shape portion in order to fix it to the gap portion of the cardboard.
The cardboard box assembled using the non-contact IC chip mounting body cardboard is preferable because the non-contact IC chip mounting body is mounted.

  The non-contact IC chip mounting body mounting cardboard manufacturing method according to the present invention includes a substantially cylindrical container tip in at least one of the voids formed by at least one liner and a corrugated shin bonded to the surface of the liner. A non-contact IC chip mounting body that is inserted in the substantially cylindrical container, and the non-contact IC chip mounting body is disposed in the at least one gap portion. Can be arranged at a desired position in a desired gap.

  Another method of manufacturing a non-contact IC chip mounting body corrugated board according to the present invention is to insert a substantially syringe-like tip from the wall surface side at an angle close to parallel to the wall surface, from the wall surface side of the liner or inner shin. Non-contact IC chip mounting body which is inserted into a substantially cylindrical container connected to the substantially syringe-like tip portion through at least one of the voids formed by corrugated shins adhered to the surface of The non-contact IC chip mounting body is disposed in the at least one gap portion. A non-contact IC chip mounting body can be arranged at a desired position in a desired gap from the outside of the cardboard. Therefore, the non-contact IC chip mounting body can be arranged even after the cardboard box is completed.

  The non-contact IC chip mounting body corrugated cardboard according to the present invention can be easily attached with the non-contact IC chip mounting body, and can avoid collision / scratching with respect to the non-contact IC chip mounting body itself due to external articles and contents. It is an IC chip mounting body mounted cardboard.

  An embodiment of a non-contact IC chip mounting body mounted cardboard according to the present invention will be described with reference to the drawings. One example of the non-contact IC chip mounting body cardboard of the present invention is shown in FIG. FIG. 1 is a sectional view of a part of a non-contact IC chip mounting body mounting cardboard according to the present invention. As shown in FIG. 1, generally a corrugated cardboard sheet (referred to as a corrugated cardboard sheet before cutting) is integrally formed by partially adhering an upper liner paper 1, corrugated intermediate paper 2, and lower liner paper 3. Is done. This shape of cardboard is called double-sided cardboard. A non-contact IC chip mounting body 4 is inserted into at least one of the gaps V1, V2,... Formed by the upper liner paper 1 and the corrugated medium paper 2 or the lower liner paper 3 and the corrugated medium paper 2. is doing.

  The present invention is a corrugated cardboard in which a non-contact IC chip mounting body is mounted in a gap unique to the corrugated cardboard sheet. By accommodating the non-contact IC chip mounting body in such a gap, the damage due to the impact from the inside and outside of the cardboard box and the scratches on the non-contact IC chip mounting body can be greatly reduced by utilizing the cushioning property of the cardboard. Therefore, it is possible to sufficiently maintain the reliability of the non-contact IC chip mounting body.

  Depending on the application, such as for heavy machinery export, like the upper liner paper 1, the upper corrugated medium paper 2a, the middle liner paper 5, the lower corrugated medium paper 2b, and the lower liner paper 3 as shown in FIG. There are some cardboard sheets with a multi-layer structure, which are given rigidity, but the basic configuration is the same. FIG. 2 is a partial cross-sectional view of another example of a non-contact IC chip mounting body mounted cardboard according to the present invention. Even in the case of such a cardboard, for example, the non-contact IC chip mounting body 4 can be formed by inserting the non-contact IC chip mounting body 4 into the gap portion V3. In this case, for example, if the lower liner paper 3 is to form the outer surface of the cardboard box, it is possible to insert a non-contact IC chip mounting body into the gap such as V4 or V5 from the outside mechanical force. It is preferable because it becomes stronger. In some cases, the intermediate paper and the liner paper are made of synthetic resin or synthetic paper, and therefore, in the claims including those cases, they are expressed as liner and intermediate paper.

  Further, in FIG. 1, for example, if there is at least one liner paper of the upper liner paper 1 or the lower liner paper 3 and it is joined to the corrugated intermediate paper 2, the above-mentioned gap portion into which the non-contact IC chip mounting body is inserted. It goes without saying that can be created. This shape of corrugated cardboard is what is called single-sided cardboard.

  Corrugated cardboard boxes assembled using such cardboards are favored for almost all logistics applications such as fruits and vegetables, various electrical products, cloth products, etc., but this is because the corrugated cardboard sheet has cushioning properties. By preventing impact damage. This cushioning property ensures a void V in the corrugated cardboard sheet by joining only the corrugated apex portion of the corrugated medium paper to the upper and lower liner papers, and the corrugated medium paper is deformed against shear stress. It comes from having a restoring ability.

  A partially transparent perspective view of a general non-contact IC chip mounting body used in the present invention is shown in FIG. FIG. 3 is a partially transparent perspective view of an example of a cylindrical non-contact IC chip mounting body. The basic structure of the non-contact IC chip mounting body has a structure in which at least an IC chip 21 which is a dedicated LSI is joined to antennas 22a and 22b. In general, the antenna and the dedicated LSI are provided on a support 23 made of resin, paper, or the like. The antenna is formed by a known method such as forming a copper wire in a coil shape, etching a metal foil, or printing with a conductive ink. Through this antenna, operating power is supplied to the LSI through electromagnetic waves and digital information is exchanged. The dedicated LSI needs to have a unique number called a unique ID in at least a memory. The antenna and the LSI are kept conductive by a known method such as adhesive or physical bonding. This non-contact IC chip mounting body eventually takes the form in which these dedicated LSI and antenna are embedded in the resin, or a flat plate made of a thin resin film, metal foil, paper or a laminate of these as shown in this figure For example, a special LSI and an antenna are mounted on the substrate 23. Further, in the example of this figure, the dedicated LSI and the antenna are integrated with the flat substrate 23 and accommodated in a thin shaft-like cylinder 24, and the periphery of the flat substrate 23 and the IC chip 21 is sealed with a resin 25. A cylindrical non-contact IC chip mounting body 26 is formed.

  In addition, the non-contact IC chip mounting body in the form embedded in the resin described above is a preferable form for making the outer shape cylindrical. Further, without using the cylinder 24, the resin 25 itself that seals the periphery of the flat substrate 23 and the IC chip 21 can be processed and molded into a cylindrical shape.

  The cross-sectional area of the cylindrical non-contact IC chip mounting body is not particularly limited as long as it can be accommodated in the gap portion V of the cardboard paper. However, in order to utilize the cushioning property utilizing the gap portion of the cardboard paper, It is preferable that the contact is light or not. In particular, it is preferable to contact the liner, the middle shin, etc. at two places or less. The length of the cylindrical portion of the non-contact IC chip mounting body is not particularly limited as long as an antenna suitable for the wavelength region used by the non-contact IC chip mounting body to be used can be stored. The material of the cylinder is not particularly limited as long as it is a material or shape that does not shield or absorb electromagnetic waves, such as paper, cloth, resin, ceramic, glass, and net.

  In addition, a dedicated LSI and antenna are mounted in a slender form on a part of a flat plate of a flexible resin film, metal foil, paper, or a laminate of these, and the remaining flat plate portion is wound around the dedicated LSI. As a result, a non-contact IC chip mounting body having a cylindrical outer shape can be obtained. A perspective view of an example of such a non-contact IC chip mounting body is shown in FIG. FIG. 4 is a perspective view in the middle of assembly when an example of a non-contact IC chip mounting body having a cylindrical outer shape is obtained. An IC chip 21 and antennas 22a and 22b connected thereto are mounted on the end of a resin film 31 as a flat substrate, and the flat resin film 31 is wound in a cylindrical shape with the IC chip and the antenna portion as a core. It is a state in the middle of turning. The flat substrate is not particularly limited as long as it is a material or shape that does not shield or absorb electromagnetic waves, such as paper, cloth, resin film, nets made of these materials, and laminates thereof. The ends are preferably fixed with an adhesive or the like as necessary.

  In the 135KHz band, etc., a cylindrical non-contact IC is formed by forming a coil with a copper wire or the like around a core material of a low coercivity magnetic material that passes a magnetic flux processed into a cylindrical shape and the like, and joining both ends of the coil to an LSI. It is also possible to form a chip mounting body. This type is preferably used because of its high sensitivity.

  The feature of the non-contact IC chip mounting body having such a cylindrical outer shape is that the buckling strength is strong because of the cylindrical shape. As a result, when the non-contact IC chip mounting body is inserted into the gap portion of the cardboard paper, the mounting body is unlikely to be bent or bent, so that insertion by an automatic machine is facilitated.

  In addition, since most cardboards that are currently used have 30 to 100 steps per 30 cm, the preferable range of the cylindrical outer diameter of the non-contact IC chip mounting body is 1 to 10 mm. Among these, a particularly preferable range is 1 mm to 5 mm. Those in this range have a wide variety of applicable cardboard types and quantities. A non-contact IC chip mounting body that is sealed with resin within this range is easy to give itself flexibility, easy to insert along a slightly bent gap, and advantageous in terms of excellent impact resistance. It is.

  A non-contact IC chip mounting body having a flat outer shape and a flat shape is also preferable for inserting the non-contact IC chip mounting body into a specific gap of the cardboard as in the present invention. In such a case, a rectangular non-contact IC chip mounting body having a width of several millimeters and a length of several centimeters or more is obtained. Structurally, as described above, a dedicated LSI and an antenna are mounted on a flat substrate made of a thin resin film, metal foil, paper, or a laminate thereof. An example of such a flat non-contact IC chip mounting body is shown in FIG. FIG. 5 is a plan view of an example of a flat non-contact IC chip mounting body. An IC chip 21 and antennas 22a and 22b connected to the IC chip 21 are mounted on a flat substrate 33 made of a resin film. When such a flat non-contact IC chip mounting body is inserted, it is preferable to use a resin film having a relatively low waist as a flat substrate in order to facilitate the insertion of the non-contact IC chip mounting body. Examples of such a resin film material include resins such as PP (polypropylene), PE (polyethylene), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and PC (polycarbonate). The thickness is preferably about 20 μm or more. Furthermore, it is preferable to use a jig such as a thin spatula or slide for easily inserting a flat non-contact IC chip mounting body.

  The present invention is a corrugated cardboard in which a non-contact IC chip mounting body having a cylindrical shape or a flat shape is preferably mounted in a space unique to the corrugated cardboard sheet. Since this gap is a gap formed by the liner and the corrugated core, it has a substantially triangular cross-sectional shape, so it is strong against external pressure, and naturally the non-contact IC chip mounting body accommodated therein is also strong. This is very preferable because it is protected.

When the amount of information is relatively small and it is not necessary to read / write information to the LSI in the middle of distribution, it is possible to use an inexpensive LSI with a small scale that holds only a read-only unique ID (UID). It is. In this case, the reader / writer (R / W) may be read-only.
Information on LSI UID, mounted article, shipping date, destination, etc. of each non-contact IC chip mounting body is registered in the system server in advance, and the non-contact IC chip mounting body mounted on the article at each stage of distribution It is possible to read the UID and manage when and where the corresponding article exists. In this case, it is possible to reduce the unit price of the non-contact IC chip mounting body itself, but it is necessary to connect the R / W installed at each distribution stage and the system server online, and a large amount of information can be processed at high speed. Since a high-performance system that can be used is required, the system construction cost increases.

  When the amount of information is large and additional writing or rewriting is necessary in the process of use, or when encryption processing for security is necessary, it is necessary to use a large scale LSI. The operating power also increases, and a large antenna is required to secure a communication distance, so that the non-contact IC chip mounting body itself is relatively enlarged. Of course, the R / W output used tends to increase.

  In this case, since the rewritable memory is stored in the non-contact IC chip mounting body itself, infrastructure such as a high-performance and large-scale system server is not necessary, but the unit price of the LSI is relatively high. It is preferable to reuse the mounting body.

  As the non-contact IC chip mounting body used in the present invention, those in a generally known band can be used, and there is no particular limitation. Typical examples include 135 KHz, 13.56 MHz, 800 to 1000 MHz (so-called UHF band), 2.45 GHz (so-called microwave), etc. As the shape of the non-contact IC chip mounting body, the gap of the cardboard sheet Those that are easy to finish into a thin shape such as a substantially filament shape, a rod shape, or a needle shape that can be inserted into the portion are preferable.

  From this point of view, it is preferable to use an elongate diball antenna such as UHF or microwave band, rather than 13.56 MHz where the antenna opening of the non-contact IC chip mounting body tends to be wide. Moreover, 135 KHz etc. which can make an opening part comparatively small by increasing the frequency | count of winding of an antenna are also preferable.

  It is preferable that at least one of the non-contact IC chip mounting body and the first liner, the second liner, or the inner core is bonded and fixed. That is, it is preferable to prevent the position of the non-contact IC chip mounting body from being displaced during use or movement, or from slipping out to the outside when it is serious. An example of such fixation is shown in FIG. 6 is a cross-sectional view taken along the line A-A ′ of the non-contact IC chip mounting body mounted cardboard of FIG. 1. It is sectional drawing of the orthogonal | vertical direction of the axial direction of the non-contact IC chip mounting body in the state in which the non-contact IC chip mounting body is inserted into the liner and the center. In the figure, a non-contact IC chip mounting body 4 is inserted to a predetermined position in the gap V2, and the front and rear are fixed to the lower liner paper 3 by adhesives 35a and 35b, respectively. In this case, it is not necessary to fix both front and rear, and only one side may be used. Further, in the drawing, it is fixed only to the lower liner paper 3, but it may be fixed to the corrugated medium paper 2 or may be fixed to both. As a method for adhesion and fixation, known methods such as an adhesive, a pressure-sensitive adhesive, and a pressure-sensitive adhesive tape can be used.

Specifically, the following methods are mentioned.
(1) A hot melt adhesive is added to a part of the non-contact IC chip mounting body, and after inserting the non-contact IC chip mounting body into the gap, hot air is sent over the liner paper or from the edge of the gap. A method in which hot-melt adhesive is melted and fixed.
(2) A method of adhering and fixing the non-contact IC chip mounting body by inserting a tube capable of discharging an adhesive into the space after inserting the non-contact IC chip mounting body into the space.
(3) A water-soluble adhesive is applied in advance to at least a part of the non-contact IC chip mounting body, and after inserting the non-contact IC chip mounting body into the gap, a tube or the like is inserted into the gap to A method of adhering and fixing a non-contact IC chip mounting body by spraying.

In any of the methods, the sensitivity of the R / W device is lowered as much as possible to detect that the non-contact IC chip mounting body is inserted into a predetermined position, and then the non-contact IC chip mounting body is used by the method described above. By fixing, the non-contact IC chip mounting body can be fixed at a desired position.
Further, it is preferable to mark the portion according to the fixed position. The mark may be printed in advance, or may be applied at the time of fixing by a stamp, ink jet printing or the like. Details are also described later.

Further, it is also preferable to provide an easily cut portion as a kind of mark on the liner paper on the front side where the non-contact IC chip mounting body exists. This easily cut portion is also described in detail later.
When reading / writing information of the non-contact IC chip mounting body using the R / W, if the relative position of the R / W and the non-contact IC chip mounting body is deviated from the appropriate range, the communication becomes unstable, Communication distance is shortened and communication reliability cannot be ensured. For this reason, it is extremely important to fix the position of the non-contact IC chip mounting body. By bonding and fixing at a specific position, the position of the non-contact IC chip mounting body in the cardboard box can be determined, and the R / W position can be set. This is particularly effective when using a small non-contact IC chip mounting body that is shorter than the length of the gap of the cardboard paper.

  One method for fixing the position of the non-contact IC chip mounting body is to cause one or more mechanical deformations at a specific position in the gap of the cardboard paper to be inserted, and non-contact to a place outside that range. For example, the IC chip mounting body is prevented from entering.

  The method of forming the mechanical deformation is a method of forming an indentation from the liner paper or corrugated medium paper with a substantially hemispherical protrusion, and a mechanical deformation is formed by piercing the liner paper with a cone or drill-like protrusion. The method etc. are mentioned. Further, this method can also specify the position of the non-contact IC chip mounting body from the outside.

  Furthermore, as a specific non-contact IC chip mounting body insertion method, after forming the first mechanical deformation, inserting the non-contact IC chip mounting body until it stops at the first deformation site, There is also a method of forming a second mechanical deformation on the opposite side between the first mechanical deformation and the non-contact IC chip mounting body.

  For example, a mechanical deformation at two locations is formed in advance at intervals slightly longer than the length of the non-contact IC chip mounting body, and a non-contact IC chip mounting body is inserted between them. If there is a mechanical deformation, it is difficult to insert the non-contact IC chip mounting body a little, but if it is cylindrical, it will not pass through the mechanical deformation portion, and once fixed, it can be fixed to some extent.

  In the above, an example in which some processing or the like is performed on the cardboard side to fix the non-contact IC chip mounting body is given. In the following, an example of fixing by performing some processing on the non-contact IC chip mounting body side will be described.

  For example, a spiral groove is formed so as to have a substantially screw shape as the outer shape of the non-contact IC chip mounting body. Actually, in a non-contact IC chip mounting body in a form embedded in the resin, the groove can be processed in the resin. It can also be set as the substantially screw-shaped molding which included the non-contact IC chip mounting body by injection molding.

  An example of such a non-contact IC chip mounting body is shown in FIG. FIG. 7 is a cross-sectional view of one embodiment of the non-contact IC chip mounting body mounted cardboard of the present invention. As shown in the figure, the non-contact IC chip mounting body is fixed to a specific position on the corrugated paper by screwing the screw-shaped non-contact IC chip mounting body 44 into the space V2 of the cardboard. That is, a spiral groove is formed in the outer shape of the non-contact IC chip mounting body, and the mounting body itself is screwed. It is more preferable for the non-contact IC chip mounting body to be sharpened like a wood screw in order to mechanically insert the non-contact IC chip mounting body into the gap.

  Another example of securing the non-contact IC chip mounting body is to make the non-contact IC chip mounting body wedge-shaped. An example of such a non-contact IC chip mounting body is shown in FIG. FIG. 8 is a cross-sectional view of one embodiment of the non-contact IC chip mounting body mounted cardboard of the present invention. Since the outer shape of the non-contact IC chip mounting body illustrated in FIG. 8 is formed in a substantially wedge shape, in the example in the figure, the wedge-shaped portions 45a and 45b are fixed at predetermined positions in the gap V2. The That is, it is only necessary to have an engagement shape portion that engages with a portion of the cardboard paper that is slightly thicker than the gap portion, that is, the liner or the inner lining of the gap portion, in the middle of the shape of the non-contact IC chip mounting body. Examples of the engaging shape portion are not limited to the so-called wedge-shaped triangular pyramid shape or a combination thereof, but may be various shapes such as an abacus ball shape or a portion where a part of the cylindrical portion is simply thickened. Further, these portions do not have to be present all around the peripheral portion of the cylindrical non-contact IC chip mounting body, and may be located in various places. That is, at least one engagement shape portion is formed, preferably a plurality of locations. When the non-contact IC chip mounting body is pushed in, the non-contact IC chip mounting body is fixed by the frictional resistance between the engagement shape portion and the wall surface of the gap portion.

  An example of an apparatus for inserting the non-contact IC chip mounting body into the gap is shown in FIG. FIG. 9 is a schematic cross-sectional view for explaining the insertion device in the cardboard cross-sectional direction in the B-B ′ direction of FIG. 1. The state which inserts a non-contact IC chip mounting body from the paper surface front side of FIG. 1 is shown. The piston portion in the insertion device is not shown in cross section for easy understanding. A cylinder 51 is inserted into a gap V <b> 2 formed by the corrugated medium paper 2 and the lower liner paper 3. When the position of the cylinder 51 is determined, the non-contact IC chip mounting body 4 is pushed out by the piston 52. Note that non-contact IC chip mounting bodies 4a, 4b,... For subsequent insertion are sequentially accommodated in a folder portion (not shown) under the non-contact IC chip mounting body 4. FIG. 10 shows a state where the non-contact IC chip mounting body is inserted into a predetermined position after the extrusion. FIG. 10 is a schematic cross-sectional view showing a state after the non-contact IC chip mounting body of FIG. 9 is pushed out. As shown in the drawing, the non-contact IC chip mounting body 4 is pushed out and arranged by the piston 52 to a predetermined position of the gap portion V2. Thereafter, the corrugated medium paper 2 and the lower liner paper 3 are fixed by the method as described above, that is, by an adhesive or the like. The operating force of the piston can be obtained by using a mechanical force such as a spring or a fluid force such as air, gas or oil.

  In the example as described above, it is more efficient to have a mechanism for automatically loading the next non-contact IC chip mounting body after the non-contact IC chip mounting body is pushed out as in the so-called pistol. In order to prevent the cardboard paper from shifting in the Y-axis direction, a guide like a half-open bird cage is attached to the muzzle part, and in order to prevent the target gap from shifting in the X-axis direction, It is also preferable to attach needle-shaped guide pins that can be easily inserted into other gaps located on both sides of the gap. It is of course possible to determine the position with a CCD camera in order to accurately capture the gap.

  If the location where the non-contact IC chip mounting body exists can be easily seen by visual observation from the outside when assembled as a cardboard box, it is possible to easily hold the R / W. From this point of view, it is preferable to provide a mark on the liner where the non-contact IC chip mounting body is present. The mark may be provided by a method such as printing a square mark in accordance with an arrow or the shape of the non-contact IC chip mounting body, an ink jet print, or a sticker.

  A so-called perforation, string, or threaded processing part as an easy-to-cut processing part including a portion where the non-contact IC chip mounting body is present around a portion where the non-contact IC chip mounting body of the liner and middle shin exists. It is preferable to provide a tear tape. That is, since there is this perforation, there is a possibility that at least a part of the corrugated cardboard of the non-contact IC chip mounting body adheres to the non-contact IC chip mounting body by this perforation when used as a corrugated cardboard box and put out on used paper. However, it can be collected and the non-contact IC chip mounting body can be reused. Similarly to the marks described above, using a perforation or the like as a guide, it is also convenient because it can be easily seen where the non-contact IC chip mounting body is present from the outside when assembled as a cardboard box.

  An example of a mounting method of a further non-contact IC chip mounting body will be described with reference to the drawings. FIG. 11 is a partial schematic cross-sectional view of an example of an apparatus for manufacturing a non-contact IC chip mounting body corrugated cardboard even when the entrance of the gap does not appear outside the corrugated cardboard box after the corrugated cardboard is assembled. That is, the non-contact IC chip mounting body is disposed between the first liner or the second liner and the inner lining of the box-made cardboard box. In this case, it is preferable to mount the non-contact IC chip mounting body on the corrugated cardboard of the flap plate portion that stores the product in the cardboard box. In the figure, a cylinder 53 provided with a substantially syringe-like tip 53s is pierced from the cardboard wall surface W side into the lower liner paper 3 forming the outer surface of the cardboard box at an angle parallel to the wall surface W, and only the lower liner paper 3 or The corrugated medium paper 2 is also penetrated, and then the non-contact IC chip mounting body 4 is inserted between the lower liner paper 3 and the corrugated medium paper 2 or between the corrugated medium paper 2 and the upper liner paper 1 through the inside of the cylinder. The non-contact IC chip mounting body 4 can be disposed on the surface. The cylinder 51a bends freely like a catheter, and the tip is pointed so as to easily break through liner paper or the like like an injection needle. The piston 54 bends freely like the cylinder and slides in the cylinder to carry and arrange the non-contact IC chip mounting body. Also in this case, the operating force of the piston can be obtained by using a mechanical force such as a spring or a force of a fluid such as air, gas or oil. This figure shows an example in which the non-contact IC chip mounting body 4 is disposed between the lower liner paper 3 and the corrugated medium paper 2. In such a case, the non-contact IC chip mounting body used preferably has flexibility.

Example An example of the present invention will be described with reference to the drawings.

Example 1
Tape type TCP inlet (length 53mm * width 1.5mm * thickness 0.25mm; operating frequency 2.45GHz) made by Renaissance Technology Co., Ltd. is affixed onto 60g / square meter paper, and the paper is placed in a cylinder together with the inlet Rolled into a shape. This state is as in the non-contact IC chip mounting body shown in FIG. The end surface of the cylindrical paper was joined with a polyvinyl acetate adhesive to prevent unwinding. The cylinder was further cut to a length of 60 mm to obtain a cylindrical IC tag having a diameter of 2 mm * length of 60 mm.
After applying a water-soluble adhesive (starch glue) to the cylindrical part of this IC tag, it is inserted with a rod-shaped jig up to a depth of 10 cm in the gap of the cardboard box, and then naturally dried for 2 days, and the cardboard with the IC tag Created a box.
As a result of reading with a suitable reader / writer, the communicable distance was 20 cm or more, and it was confirmed that it could withstand practical use.

Example 2
Apply and cool a polyester hot melt adhesive on the exterior of a glass tag (GLASS TAG UNIQUE 2.12X12) (diameter 2.12 mm * length 12 mm capsule; use frequency 125 KHz) manufactured by SOKYMAT, Switzerland. An IC tag with a melt adhesive was obtained.
The cardboard box was inserted with a rod-shaped jig up to a depth of 10 cm, and the hot melt adhesive was heated and melted with a hair dryer from the liner paper, and then cooled to prepare a cardboard box with an IC tag.
As a result of reading with a suitable reader / writer, the communicable distance was 20 cm or more, and it was confirmed that it was practically usable.

  As described above, according to the present invention, a non-contact IC chip mounting body can be easily mounted, and collision / scratching by an external article / content to the mounting body can be prevented.

  A series of the present invention is a cardboard sheet (cardboard paper before cutting) stage by mounting a non-contact IC chip mounting body in a gap formed by corrugated medium paper and upper and lower liner papers existing in cardboard paper. Cardboard sheet / cardboard box manufacturers and cardboard box users can easily dispose of cardboard boxes in any processing stage, such as cardboard boxes in the folded shape immediately after punching, completed cardboard boxes that have been made, and cardboard boxes after filling the contents. It is possible to mount a contact IC chip mounting body and to contribute to rationalization of physical distribution using a cardboard box.

  If a cardboard having a non-contact IC chip mounting body mounted in the gap of the present invention or a cardboard box using the cardboard is used, it becomes possible to mount the non-contact IC chip mounting body at an arbitrary position of the cardboard box. It is possible to manage and disclose various information related to products and various information other than product information. In addition, by rewriting the information of the non-contact IC chip mounting body, the cardboard box can be diverted for outlet delivery without labeling in the clothing industry, for example.

In recent years, supply chain management (SCM) has become a hot topic, but there is a debate about who will mount non-contact IC chip mounting at each stage of logistics such as packing companies, manufacturers, distributors, and transporters. It has become. The use of the corrugated cardboard of the present invention on which a standardized non-contact IC chip mounting body is mounted is considered to greatly help solve this problem.
The present invention can also provide a non-contact IC chip mounting body cardboard by installing a non-contact IC chip mounting body even at a user level handling a completed cardboard box without any restrictions on the installation location.

Sectional drawing of a part of non-contact IC chip mounting body mounting | wearing cardboard of this invention. Sectional drawing of a part of another example of the non-contact IC chip mounting body mounting | wearing cardboard of this invention. The partially transparent perspective view of an example of a cylindrical non-contact IC chip mounting body. The perspective view in the middle of an assembly at the time of obtaining an example of the non-contact IC chip mounting body which made the external shape cylindrical. The top view of an example of a flat non-contact IC chip mounting body. FIG. 2 is a cross-sectional view taken along the line A-A ′ of the non-contact IC chip mounting body mounted cardboard of FIG. 1. Sectional drawing of one Embodiment of the non-contact IC chip mounting body mounting | wearing cardboard of this invention. Sectional drawing of one Embodiment of the non-contact IC chip mounting body mounting | wearing cardboard of this invention. The schematic sectional drawing explaining an insertion apparatus in the corrugated cardboard cross-sectional direction of the B-B 'direction of FIG. FIG. 10 is a schematic cross-sectional view showing a state after the non-contact IC chip mounting body of FIG. 9 is pushed out. The partial schematic sectional drawing of an example of the apparatus which manufactures a non-contact IC chip mounting body mounting | wearing cardboard.

Explanation of symbols

1 Upper liner paper 2 Corrugated medium paper 3 Lower liner paper 4 Non-contact IC chip mounting body

Claims (10)

At least one liner,
Corrugated shin glued to the surface of the liner,
A non-contact IC chip mounting body mounted cardboard comprising a non-contact IC chip mounting body disposed in a gap formed by the liner and the inner core.   The non-contact IC chip mounting body mounting cardboard according to claim 1, wherein the shape of the non-contact IC chip mounting body is cylindrical or flat.   The non-contact IC chip mounting body mounting cardboard according to claim 1 or 2, wherein at least one of the non-contact IC chip mounting body and the liner or inner shin is fixed.   The non-contact IC chip mounting body according to any one of claims 1 to 3, wherein a mark indicating that the non-contact IC chip mounting body exists is provided at a portion of the liner where the non-contact IC chip mounting body exists. Cardboard.   5. An easily cuttable cutting portion including a portion where the non-contact IC chip mounting body is present is provided around a portion where the non-contact IC chip mounting body of the liner and the inner core is present. The non-contact IC chip mounting body mounting cardboard according to one item.   6. The non-contact IC chip mounting body according to claim 1, wherein the non-contact IC chip mounting body is a non-contact IC chip mounting body having a cylindrical outer shape and having a substantially screw-shaped spiral groove in the cylindrical outer shape. The non-contact IC chip mounting body mounting cardboard described.   The non-contact IC chip mounting body mounting cardboard according to any one of claims 1 to 5, wherein the non-contact IC chip mounting body is a non-contact IC chip mounting body having an engagement shape portion at least at a part of an outer shape portion. .   A cardboard box assembled using at least one non-contact IC chip mounting body mounted cardboard according to claim 1.   A substantially cylindrical container tip is inserted into at least one of the gaps formed by at least one liner and a corrugated shin adhered to the surface of the liner, and the non-cylindrical material loaded in the substantially cylindrical container is inserted. The manufacturing method of the non-contact IC chip mounting body mounting | wearing cardboard as described in any one of Claim 1 to 7 which extrudes a contact IC chip mounting body and arrange | positions this non-contact IC chip mounting body in the said at least 1 space | gap part. From the wall surface side of the liner or middle shin, insert a substantially syringe-like tip from the wall surface side at an angle parallel to the wall surface, and the void formed by the corrugated medium shin bonded to the liner and the surface of the liner The non-contact IC chip mounting body is pushed through at least one and is loaded in a substantially cylindrical container connected to the substantially syringe-like tip, and the non-contact IC chip mounting body is disposed in the at least one gap. The manufacturing method of the non-contact IC chip mounting body mounting | wearing cardboard as described in any one of Claim 1 to 7.

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