JP2004280390A - Rf-id media and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a decrease in conductivity between an antenna and an IC chip. <P>SOLUTION: The surface of the antenna 112 is covered with a thin coating 117 made of an inert noble metal to prevent oxidation of the surface of the antenna 112. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an RF-ID medium such as a non-contact type IC card capable of writing and reading information in a non-contact state, and a method of manufacturing the RF-ID medium.
[0002]
[Prior art]
In recent years, with the progress of the information society, information is recorded on a card, and information management, settlement, and the like using the card are performed. Further, information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag.
[0003]
In information management using such a card, label, or tag, a non-contact type IC mounted with an IC capable of writing and reading information in a non-contact state with respect to the card, label, or tag Cards, non-contact IC labels, and non-contact IC tags are rapidly spreading due to their excellent convenience.
[0004]
5A and 5B are views showing an example of the structure of a general non-contact type IC tag. FIG. 5A is a view showing an internal structure, and FIG. It is.
[0005]
As shown in FIG. 5, the non-contact type IC tag in this conventional example has an IC chip 511 capable of writing and reading information from outside, mounted on a resin sheet 515 via an adhesive 516, and both ends. Is connected to an IC chip 511 via a connection terminal 514 at a pad portion provided on the IC chip 511, and supplies a current to the IC chip 511 by electromagnetic induction from an externally provided information writing / reading device (not shown). An inlet 510 having a coiled conductive antenna 512 for writing and reading information to and from the chip 511 in a non-contact state, and an adhesive layer 550 on a surface of the inlet 510 on which the IC chip 511 is mounted. A surface on which information is printed while protecting the IC chip 511 and the antenna 512 It is constructed from over door 520 Metropolitan.
[0006]
In the non-contact type IC tag 500 configured as described above, the antenna 512 is connected to the IC chip 511 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. Current is supplied to the IC chip 511 in the non-contact state, and the information written in the IC chip 511 is read by the information writing / reading device in the non-contact state. Or be done.
[0007]
Hereinafter, a method of manufacturing the above-described non-contact type IC tag 500 will be described.
[0008]
FIG. 6 is a diagram for explaining a method of manufacturing the non-contact type IC tag 500 shown in FIG.
[0009]
First, a coil-shaped antenna 512 having pad portions at both ends is formed on a resin sheet 515 by etching, printing, or the like (FIG. 6A). In addition, as a material of the antenna 512, copper, silver, aluminum, or the like is given as an example. However, when aluminum is used, manufacturing cost can be reduced.
[0010]
Next, the IC chip 511 is placed on the resin sheet 515 via an adhesive 516 containing conductive particles so that the connection terminal 514 of the IC chip 511 comes into contact with a pad portion of the antenna 512 which is a connection portion with the IC chip 511. Mounted on top (FIG. 6 (b)). Here, the connection terminals 514 of the IC chip 511 are made of a noble metal base such as gold, silver, or palladium.
[0011]
Next, the IC chip 511 and the resin sheet 515 are heated by applying a predetermined pressure to the IC chip 511 in a direction toward the resin sheet 515 so that the IC chip 511 is bonded to the resin sheet 515 with an adhesive 516. The antenna 512 and the IC chip 511 are electrically connected via the provided connection terminal 514 to complete the inlet 510 (FIG. 6C). Here, the adhesive 516 contains minute conductive particles, and the adhesive 516 alone does not have conductivity, and only those that come into contact through the conductive particles conduct. Therefore, only the connection between the antenna 512 and the connection terminal 514 is conducted.
[0012]
After that, the topsheet 520 is laminated on the inlet 510 via the adhesive layer 550 to complete the non-contact type IC tag 500 (FIG. 6D).
[0013]
In the non-contact type IC tag 500 manufactured by the above-described process, the antenna 512 and the IC chip 511 are electrically connected to each other at the pad portion of the antenna 512 and the connection terminal 514 of the IC chip 511 via the conductive adhesive 516. For example, when aluminum is used as the material of the antenna 512, the surface of the antenna 512 is oxidized because aluminum has high activity and is easily oxidized. The resistance value may increase, and the conductivity between the antenna 512 and the IC chip 511 may be reduced. In particular, if aluminum is left in a high-temperature and high-humidity environment, oxides on the surface of aluminum increase, and a connection failure between the antenna 512 and the IC module 511 due to an increase in resistance may occur. .
[0014]
Here, a technique has been considered in which the antenna 512 is covered with a resin composition containing a compound having an antioxidant function, thereby preventing the antenna 512 from being oxidized (for example, see Patent Document 1).
[0015]
[Patent Document 1]
JP-A-11-306306
[Problems to be solved by the invention]
However, as described above, when the antenna is covered with the resin composition containing the compound having an antioxidant function, thereby preventing the antenna from being oxidized, the portion of the antenna connected to the IC chip has conductivity. It is not coated with a resin composition to secure it, and therefore, the connection portion of the antenna with the IC chip is oxidized, thereby reducing the conductivity between the antenna and the IC chip, as described above. There is a risk of doing this.
[0017]
The present invention has been made in view of the above-mentioned problems of the conventional technology, and has been made in consideration of the RF-ID media and the RF-ID media capable of preventing a decrease in conductivity between an antenna and an IC chip. An object of the present invention is to provide a method for manufacturing an ID medium.
[0018]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides
An antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. At least an IC chip from which information can be read is connected to the antenna by the connection terminal. An RF-ID medium comprising at least a base material mounted on the base sheet so that reading of information from the IC chip via the antenna is performed in a non-contact state.
The antenna is characterized in that the antenna is covered with a material made of an inert noble metal.
[0019]
Further, the antenna is characterized in that only a region connected to the connection terminal is covered with the material made of the inactive noble metal.
[0020]
Further, a eutectic layer composed of the material forming the antenna and the material composed of the inert noble metal is provided between the antenna and the material composed of the inert noble metal.
[0021]
In addition, an antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. An IC chip from which information can be read at least is connected to the antenna by the connection terminal. A method of manufacturing an RF-ID medium, comprising at least a base material mounted on the base sheet so as to be connected, and reading information from the IC chip through the antenna in a non-contact state. So,
Forming the antenna on the base sheet;
Coating the antenna with a material made of an inert noble metal,
Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. It is characterized by having.
[0022]
In addition, an antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided, and an IC chip capable of writing and reading information is connected to the antenna by the connection terminal. A base material mounted on the base sheet so as to be connected to the RF-ID medium, in which writing and reading of information to and from the IC chip are performed in a non-contact state via the antenna. A manufacturing method,
Forming the antenna on the base sheet;
A step of coating only a region of the antenna connected to the connection terminal with a material made of an inert noble metal,
Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. It is characterized by having.
[0023]
In addition, after the antenna is coated with the material made of the inert noble metal, the material forming the antenna and the inert noble metal are formed between the antenna and the material made of the inert noble metal by annealing. Forming a eutectic layer composed of a material.
[0024]
(Action)
In the present invention configured as described above, since the antenna is covered with the inert noble metal material, the surface of the antenna is prevented from being oxidized. Here, when the surface of the antenna is oxidized, the resistance value of the surface of the antenna increases, thereby reducing the conductivity between the antenna and a connection terminal connected to the antenna. Therefore, as in the present invention, the antenna is covered with a material made of an inert noble metal, and the antenna and the connection terminal of the IC chip are connected via the material made of the inert noble metal. Thus, the surface of the antenna is prevented from being oxidized, and the conductivity between the antenna and the connection terminal does not decrease, whereby the conductivity between the antenna and the IC chip can be prevented from decreasing. In addition, when aluminum is used as a material for forming the antenna, the manufacturing cost can be reduced. However, since aluminum has high activity, the surface is easily oxidized. Therefore, by adopting a structure capable of preventing the surface of the antenna from being oxidized as in the present invention, the manufacturing cost can be reduced.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0026]
(First Embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact type IC tag according to the present invention, wherein FIG. 1A shows an internal structure, and FIG. 1B shows an AA ′ portion shown in FIG. FIG.
[0027]
In this embodiment, as shown in FIG. 1, an IC chip 111 capable of externally writing and reading information is mounted on a resin sheet 115 serving as a base sheet via an adhesive 116 and provided at both ends. The pad portion is connected to the IC chip 111 via the connection terminal 114 at the pad portion, and supplies a current to the IC chip 111 by electromagnetic induction from an externally provided information writing / reading device (not shown). A coiled conductive antenna 112 for writing and reading information in a non-contact state is formed, and a coating thin film 117 made of an inert noble metal is formed on the antenna 112 by a method such as plating. Through the adhesive layer 150 on the surface of the inlet 110 on which the IC chip 111 is mounted. It protects the IC chip 111 and the antenna 112, information on the surface and a surface sheet 120. to be printed.
[0028]
In the non-contact type IC tag 100 configured as described above, the antenna 112 approaches the IC chip 111 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. Current is supplied to the IC chip 111 in the non-contact state, and the information written in the IC chip 111 is read by the information writing / reading device in the non-contact state. Or be done.
[0029]
Hereinafter, a method for manufacturing the above-described non-contact IC tag 100 will be described.
[0030]
FIG. 2 is a view for explaining a method of manufacturing the non-contact type IC tag 100 shown in FIG.
[0031]
First, a coil-shaped antenna 112 made of copper, silver, or aluminum and having pad portions at both ends is formed on a resin sheet 115 (FIG. 2A). As a method for forming the antenna 112, when the antenna 112 is formed from copper, a method such as etching or printing is considered. When the antenna 112 is formed from silver, a method such as screen printing of silver paste is used. Can be considered. When the antenna 112 is formed from aluminum, an aluminum foil is adhered to the resin sheet 115 with an adhesive, and then formed using a photoresist coating-exposure phenomenon, or an aluminum wire is formed on the resin sheet 115. A method of forming the antenna 112 by arranging it in a coil shape and then rolling both ends of the coiled aluminum wire to be the pad portion of the antenna 112 is conceivable. When aluminum is used as the material of the antenna 112, the manufacturing cost can be reduced.
[0032]
Next, a coating thin film 117 made of an inactive noble metal such as gold, silver, or palladium is formed on the antenna 112 by a method such as plating (FIG. 2B). The coating thin film 117 is formed by, for example, a general zinc-substitution type electric nickel-gold plating method using nickel as a base, but may be composed of only nickel. It is also conceivable to form a gold wire by arranging it on the antenna 112 and rolling the gold wire. In addition, the antenna 112 is formed from aluminum, and as a forming method, an aluminum wire is arranged in a coil shape on the resin sheet 115, and then both ends of the coil-shaped aluminum wire serving as a pad portion of the antenna 112 are rolled. When the antenna 112 is formed by the method described above, a gold foil is wrapped around the aluminum wire before rolling, and both ends of the aluminum wire on which the gold foil is wrapped, which are pad portions of the antenna 112, are rolled to cover the antenna 112 with the coating thin film 117. It is possible to do.
[0033]
In this state, when the resin sheet 115 on which the coating thin film 117 is formed on the antenna 112 is overheat-annealed in an atmosphere of an inert gas such as nitrogen, the antenna 112 is formed between the antenna 112 and the coating thin film 117. A eutectic layer is formed by fusing the crystal of the material and the crystal of the material constituting the coating thin film 117.
[0034]
Next, via an adhesive 116 containing conductive particles, the connection terminal 114 of the IC chip 111 is brought into contact with the coating thin film 117 formed on a pad portion serving as a connection portion of the antenna 112 with the IC chip 111. The IC chip 111 is mounted on the resin sheet 115 (FIG. 2C). Here, the connection terminals 114 of the IC chip 111 are made of a noble metal base such as gold, silver, or palladium.
[0035]
Next, by heating the IC chip 111 in a direction toward the resin sheet 115 while applying a predetermined pressure, the IC chip 111 and the resin sheet 115 are adhered by the adhesive 116 and the IC chip 111 The antenna 112 and the IC chip 111 are electrically connected via the provided connection terminals 114 and the covering thin film 117 formed on the antenna 112, thereby completing the inlet 110 (FIG. 2D). Here, the adhesive 116 contains minute conductive particles, and the adhesive 116 alone does not have conductivity, and only those that come into contact through the conductive particles conduct. Therefore, only the antenna 112 and the connection terminal 114 conduct through the coating thin film 117.
[0036]
After that, the topsheet 120 is laminated on the inlet 110 via the adhesive layer 150 to complete the non-contact type IC tag 100 (FIG. 2E).
[0037]
In the non-contact type IC tag 100 manufactured in the above-described process, since the antenna 112 is covered with the coating thin film 117 made of an inert noble metal, the surface of the antenna 112 is not oxidized. A decrease in conductivity between the antenna 112 and the IC chip 111 can be prevented. In particular, even when, for example, highly active aluminum or the like is used for the antenna 112, oxidation of the surface of the antenna 112 can be prevented, so that manufacturing cost can be reduced.
[0038]
(Second embodiment)
3A and 3B are views showing a second embodiment of the non-contact type IC tag according to the present invention, wherein FIG. 3A shows the internal structure, and FIG. 3B shows the AA 'part shown in FIG. FIG.
[0039]
In this embodiment, as shown in FIG. 3, an IC chip 211 capable of writing and reading information from the outside is mounted on a resin sheet 215 as a base sheet via an adhesive 216 and provided at both ends. The pad portion is connected to the IC chip 211 via the connection terminal 214 and supplies a current to the IC chip 211 by electromagnetic induction from an externally provided information writing / reading device (not shown). A coil-shaped conductive antenna 212 for writing and reading information in a non-contact state is formed, and furthermore, only a pad portion which is a region connected to the connection terminal 214 on the antenna 212 is inactive. The inlet 210 provided with the coating thin film 217 made of a noble metal, and the surface of the inlet 210 on which the IC chip 211 is mounted. Are stacked through a Chakuzaiso 250 protects the IC chip 211 and the antenna 212, information on the surface and a surface sheet 220. to be printed.
[0040]
In the non-contact type IC tag 200 configured as described above, the antenna 212 is connected to the IC chip 211 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. Current is supplied to the IC chip 211 in the non-contact state, and the information written in the IC chip 211 is read by the information writing / reading device in the non-contact state. Or be done.
[0041]
Hereinafter, a method for manufacturing the above-described non-contact type IC tag 200 will be described.
[0042]
FIG. 4 is a diagram for explaining a method of manufacturing the non-contact type IC tag 200 shown in FIG.
[0043]
First, a coil-shaped antenna 212 made of copper, silver, or aluminum and having pad portions at both ends is formed on a resin sheet 215 (FIG. 4A). As a method for forming the antenna 212, when the antenna 212 is formed from copper, a method such as etching or printing is considered, and when the antenna 212 is formed from silver, a method such as screen printing of silver paste is used. Can be considered. When the antenna 212 is formed from aluminum, an aluminum foil is adhered onto the resin sheet 215 with an adhesive, and then formed using a photoresist coating-exposure phenomenon, or an aluminum wire is formed on the resin sheet 215 by using an aluminum wire. A method of forming the antenna 212 by arranging it in a coil shape and then rolling both ends of a coiled aluminum wire to be a pad portion of the antenna 212 is conceivable. When aluminum is used as the material of the antenna 212, the manufacturing cost can be reduced.
[0044]
Next, a coating thin film 217 made of an inert noble metal such as gold, silver, or palladium is formed on a pad portion of the antenna 212 that is to be connected to the connection terminal 214 on the antenna 212 (FIG. 4B). )). The formation of the coating thin film 217 may be performed by, for example, arranging a gold foil on the pad portion of the antenna 212 or arranging a gold ball on the pad portion of the antenna 212 and rolling.
[0045]
In this state, when the resin sheet 215 in which the coating thin film 217 is formed on the pad portion of the antenna 212 is overheat-annealed in an atmosphere of an inert gas such as nitrogen, the antenna 212 is placed between the antenna 212 and the coating thin film 217. The eutectic layer is formed by fusing the crystal of the material constituting the material and the crystal of the material constituting the coating thin film 217.
[0046]
Next, the IC chip 211 is placed on the resin sheet 215 via the adhesive 216 containing conductive particles so that the connection terminal 214 of the IC chip 211 comes into contact with the coating thin film 217 formed on the pad portion of the antenna 212. (FIG. 4C). Here, the connection terminals 214 of the IC chip 211 are made of a noble metal base such as gold, silver, or palladium.
[0047]
Next, by heating the IC chip 211 while applying a predetermined pressure in a direction toward the resin sheet 215, the IC chip 211 and the resin sheet 215 are bonded to each other with an adhesive 216, and the IC chip 211 The antenna 212 and the IC chip 211 are electrically connected via the provided connection terminal 214 and the coating thin film 217 formed on the pad portion of the antenna 212, thereby completing the inlet 210 (FIG. 4D). Here, the adhesive 216 contains minute conductive particles, and the adhesive 216 alone does not have conductivity, and only those that come into contact via the conductive particles conduct. Therefore, only the connection between the antenna 212 and the connection terminal 214 is conducted through the coating thin film 217.
[0048]
Then, the topsheet 220 is laminated on the inlet 210 via the adhesive layer 250 to complete the non-contact type IC tag 200 (FIG. 4E).
[0049]
In the non-contact type IC tag 200 manufactured in the above-described process, the pad portion which is a region connected to the connection terminal 214 of the antenna 212 is covered with the coating thin film 217 made of an inert noble metal. A pad portion which is a region connected to the connection terminal 214 on the surface of the 212 is not oxidized, so that a decrease in conductivity between the antenna 212 and the IC chip 211 can be prevented. In particular, even when, for example, highly active aluminum or the like is used for the antenna 212, oxidation of a pad portion which is a region connected to the connection terminal 214 of the antenna 212 can be prevented, so that manufacturing cost is reduced. be able to.
[0050]
In the above-described embodiment, a non-contact type IC tag has been described as an example of the RF-ID medium in which information can be written and read in a non-contact state. The same effect can be obtained with an IC chip capable of performing the above operation. Furthermore, the IC chip is not limited to a non-contact type IC tag, but may be a non-contact type IC label or a non-contact type IC card. The present invention can be applied to any configuration including an inlet mounted so as to be connected to the antenna via the antenna.
[0051]
【The invention's effect】
As described above, in the present invention, an antenna having conductivity is formed on a base sheet, and a connection terminal for connecting to the antenna is provided. An RF-ID medium including at least a base material mounted on a base sheet so as to be connected to an antenna by a connection terminal, and reading information from an IC chip through the antenna in a non-contact state, Since the antenna is configured to be covered with an inert noble metal material, a decrease in conductivity between the antenna and the IC chip can be prevented.
[Brief description of the drawings]
FIG. 1 is a view showing a first embodiment of a non-contact type IC tag according to the present invention, in which (a) shows an internal structure, and (b) shows an AA ′ part shown in (a). FIG.
FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
3A and 3B are diagrams showing a second embodiment of the non-contact type IC tag according to the present invention, wherein FIG. 3A shows an internal structure, and FIG. 3B shows an AA ′ portion shown in FIG. FIG.
FIG. 4 is a view for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
5A and 5B are diagrams illustrating an example of the structure of a general non-contact type IC tag, wherein FIG. 5A illustrates an internal structure, and FIG. 5B is a cross-sectional view taken along the line AA ′ illustrated in FIG. It is.
FIG. 6 is a diagram for explaining a method of manufacturing the non-contact type IC tag shown in FIG.
[Explanation of symbols]
100, 200 Non-contact type IC tag 110, 200 Inlet 111, 211 IC chip 112, 212 Antenna 114, 214 Connection terminal 115, 215 Resin sheet 116, 216 Adhesive 117, 217 Coating thin film 120, 220 Surface sheet 150, 250 Adhesion Agent layer

Claims (6)

An antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. At least an IC chip from which information can be read is connected to the antenna by the connection terminal. An RF-ID medium comprising at least a base material mounted on the base sheet so that reading of information from the IC chip via the antenna is performed in a non-contact state.
The said antenna is coated with the material which consists of inert noble metals, The RF-ID medium characterized by the above-mentioned. The RF-ID medium according to claim 1,
The RF-ID medium according to claim 1, wherein only a region of the antenna connected to the connection terminal is coated with the material made of the inactive noble metal. In the RF-ID medium according to claim 1 or claim 2,
An RF-ID medium comprising, between the antenna and the material made of the inert noble metal, a eutectic layer made of a material made up of the antenna and a material made of the inert noble metal. . An antenna having conductivity is formed over the base sheet, and a connection terminal for connecting to the antenna is provided. At least an IC chip from which information can be read is connected to the antenna by the connection terminal. A base material mounted on the base sheet so as to read information from the IC chip via the antenna in a non-contact state. ,
Forming the antenna on the base sheet;
Coating the antenna with a material made of an inert noble metal,
Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. A method for manufacturing an RF-ID medium, comprising: An antenna having conductivity is formed over a base sheet, and a connection terminal for connecting to the antenna is provided. An IC chip capable of writing and reading information is connected to the antenna by the connection terminal. At least a base material mounted on the base sheet so that writing and reading of information to and from the IC chip via the antenna are performed in a non-contact state. And
Forming the antenna on the base sheet;
A step of coating only a region of the antenna connected to the connection terminal with a material made of an inert noble metal,
Mounting the IC chip on the base sheet so that the connection terminal and the antenna are connected via a material made of the inert noble metal;
Connecting the connection terminal and the antenna via the inert noble metal material by applying pressure to the IC chip mounted on the base sheet in a direction toward the base sheet. A method for manufacturing an RF-ID medium, comprising: In the method for manufacturing an RF-ID medium according to claim 4 or 5,
After covering the antenna with the material made of the inert noble metal, the material forming the antenna and the material made of the inert noble metal between the antenna and the material made of the inert noble metal by annealing treatment. Forming an eutectic layer composed of: an RF-ID medium.

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