JPH1159036A - Non-contact ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing with high efficiency a thin non-contact IC card of high rigidity and high strength to be manufactured at low cost and also provide a method for manufacturing the non-contact IC card with high efficiency. SOLUTION: IC chips 1 and non-contact transmission antenna coils 2 are connected with a metal sheet 3 on which required circuit patterns are formed to manufacture a circuit module 4. Laminate films 6 are bonded on both of surface and back of the circuit module 4 to form a required non-contact IC card. When the IC card is manufacture, the IC chips and antenna coils are mounted respectively on a metal sheet connecting body with a number of metal sheets 3 with required circuit patterns are connected thereon by the given pitch through connecting pieces to manufacture a module connecting body, and laminate film raw fabrics are bonded on both of the surface and back of the circuit module connecting body, and then the module connecting body is cut off on given positions to form required non-contact IC cards in a manufacturing method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a contactless IC card and a method for manufacturing the same, and more particularly, to a circuit module configuration and a method for manufacturing the same.

[0002]

2. Description of the Related Art Contactless IC cards are being considered for use as substitutes for commuter passes, driver's licenses, telephone cards, cash cards, and the like. It is one of the most important technical issues how to reduce the unit price. In addition, non-contact IC cards used for commuter passes, telephone cards, and the like are required to be thin, flexible, and excellent in durability.

In general, a non-contact IC card has a configuration in which a circuit board including a circuit board, an IC chip connected to the circuit board, and a non-contact communication antenna coil is embedded in a card base made of a plastic film or the like. ing. In a conventionally proposed non-contact IC card, a fixed substrate in which a required circuit pattern is formed on a surface of a hard material such as glass epoxy or ceramics, or a polyimide resin or polyethylene terephthalate (PET) is used as the circuit substrate. For example, a film substrate having a required circuit pattern formed on a surface of a plastic film such as a plastic film is used. Further, as a method of connecting the IC chip to the circuit board, a method such as wire bonding or flip chip mounting is employed.

[0004]

The above-mentioned fixed substrate has been widely used as a circuit substrate not only for a non-contact IC card but also for various electronic devices, and has a high reliability but a low ductility. Since it is made of a material, there is a limit to the reduction in thickness in terms of strength, and it cannot be applied to a thin flexible card requiring high bending resistance. In addition, non-contact IC
In order to improve the mass productivity of the card, a large number of predetermined circuit modules are continuously arranged at a constant pitch, and a circuit module connected body in which a roll is wound is manufactured. Although it is desired to adopt a manufacturing method such as feeding into a substrate, it is impossible to adopt such a manufacturing method when a fixed substrate made of a brittle material is used.

On the other hand, since the film substrate can be made thin and flexible, it can be wound into a roll. On the other hand, it can be applied, but on the other hand, it has a disadvantage that it is easily deformed when subjected to heat or an external force, and its handling property during manufacturing is poor due to its low rigidity. Note that when a heat-resistant material such as polyimide is used as the film substrate material, the problem of thermal deformation can be avoided, but there is a disadvantage that the manufacturing cost of the non-contact IC card becomes high.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the disadvantages of the prior art, and it is an object of the present invention to provide a non-contact IC which is thin, has high rigidity, has high strength and can be manufactured at low cost. An object of the present invention is to provide a card and a method for manufacturing such a non-contact IC card with high efficiency.

[0007]

According to the present invention, in order to achieve the above object, an IC card includes a circuit board, an IC chip connected to the circuit board, and an antenna coil for non-contact communication on a card base. In the embedded non-contact IC card, a metal plate on which a required circuit pattern is formed is used as the circuit board.

[0008] The terminal portion of the IC chip and the I
The connection with the C chip connecting portion can be performed by providing a metal bump on a terminal portion of the IC chip and using diffusion bonding between the metal bump and a metal constituting the metal plate. This can also be achieved by interposing an anisotropic conductive material between the bump and the IC chip connection of the metal plate. Further, the bonding between the non-contact communication antenna coil and the metal plate can be performed by soldering.

A metal plate has higher ductility than glass epoxy or ceramics, and has higher rigidity and strength than plastic materials. If the thickness is not more than 100 μm, it can be wound into a roll while maintaining the required rigidity as a circuit board for a non-contact IC card. Further, it is also suitable for diffusion bonding with a bump provided on an IC terminal or bonding via an anisotropic conductive material. Therefore, IC
When a metal plate on which a required circuit pattern is formed is used as a circuit board for connecting a chip and a non-contact communication antenna coil, a non-contact IC card which is thin, flexible, high in strength, and excellent in mass productivity can be obtained. Can be configured.

On the other hand, in the method of manufacturing such a non-contact IC card, a roll-shaped metal plate connected body in which a plurality of metal plates having a required circuit pattern are connected at a constant pitch, a required IC chip and a non-contact communication A step of preparing an antenna coil, and a roll-shaped laminate film having an adhesive layer provided on one side thereof, and successively successively applying the IC chip and the non-contact communication antenna coil to each metal plate constituting the connection body Mounting the IC chip and the non-contact communication antenna coil on the front and back surfaces of the connected body on which the laminated film is continuously bonded, and an IC card manufactured through these steps. Cutting the intermediate body to obtain an IC card of a required shape and dimensions.

Further, as another means relating to the manufacturing method,
A roll-shaped metal plate linked body in which a number of metal plates having a required circuit pattern are connected at a constant pitch, a required IC chip and a non-contact communication antenna coil, and a card size having an adhesive layer provided on one surface. A step of preparing a laminate film;
A step of sequentially and successively mounting the C chip and the antenna coil for non-contact communication, and a step of obtaining a circuit module by cutting individual metal plates from the connected body on which the IC chip and the antenna coil for non-contact communication are mounted. Bonding the laminate film to both the front and back surfaces of the circuit module, and cutting the peripheral portion of the IC card intermediate manufactured through these steps to obtain an IC card of a required shape and dimensions. It was configured.

[0012] Among these non-contact IC card manufacturing methods, the former is to continuously supply a circuit module including a metal plate, an IC chip, and a non-contact communication antenna coil which are connected to a casing process. Therefore, it is possible to improve the mass productivity of the non-contact IC card and to reduce the manufacturing cost. Also, in the latter case, since the metal plate is connected, the productivity of the circuit module can be increased, which is effective in improving the mass productivity of the non-contact IC card and, in turn, reducing the manufacturing cost.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a non-contact IC card according to the present invention will be described below with reference to FIG.

As shown in FIG. 1, the contactless IC card of this embodiment is a circuit comprising an IC chip 1, a contactless communication antenna coil 2, and a metal plate 3 as a circuit board on which a required circuit pattern is formed. Module 4 with adhesive layer 5 on one side
Is laminated with a laminate film 6 provided with

As the IC chip 1, a bare chip having no resin mold is used in order to make a product non-contact IC card thin. Further, as the antenna coil 2, a bulk coil formed by winding a conductive wire coated with an insulating coating is used. Further, the metal plate 3 is made of a highly conductive metal material having a thickness of 100 μm or less. In order to enhance the connectivity with the IC chip 1 and the antenna coil 2,
The one whose surface is plated is used. A bump 7 is provided on a terminal portion of the IC chip 1, and the bump 7 is connected to the IC chip connection portion of the metal plate 3 by diffusion bonding by thermocompression bonding or conductor contact using an anisotropic conductive material. ing. The antenna coil 2 is joined to the antenna coil connection portion of the metal plate 3 by soldering.

Although any plastic film can be used as the laminate film 6, it is excellent in heat resistance and chemical resistance, and does not generate harmful gas such as chlorine gas when incinerated, and is excellent in environmental properties. It is particularly preferable to use a plastic film such as PET, polyethylene terephthalate, PEN (polyethylene naphthalate), and PES (polyether sulfone).

As an adhesive constituting the adhesive layer 5, any adhesive having a predetermined adhesive strength and rigidity after curing can be used.
Any adhesive can be used, but in order to protect the IC chip 1, it has a strong adhesion to a plastic film, excellent moisture resistance and water resistance, and a halogen element, nitrogen,
It does not contain elements that adversely affect the IC chip 1 such as oxygen, or the content of these elements is extremely low even if these elements are included, and is a cross-linking-curable type that can be considered practically free of these elements. It is preferable to use an adhesive, for example, a high-purity epoxy resin or an acrylic silicon resin.

Hereinafter, examples of the non-contact IC card according to the present invention and comparative examples will be shown to clarify the effects of the present invention.

<First Embodiment> A metal plate 3 made of 42 alloy having a thickness of 50 μm and provided with a silver plating layer 8 on a required portion of the surface and a gold bump 7 provided on a terminal portion has a thickness of 50 μm.
IC chip 1 and an antenna coil 2 formed by winding a covered conductor having a wire diameter of 50 μm, and a circuit module 4
Was prepared. The bonding between the IC chip 1 and the metal plate 3 was performed by thermocompression bonding the gold bump 7 and the silver plating layer 8 provided on the IC chip setting portion of the metal plate 3. The pressure bonding conditions were 350 ° C. and 1.5 seconds. The joining between the antenna coil 2 and the metal plate 3 was performed by soldering.

After adhering a 50 μm thick PET film 5 having a high-purity epoxy resin adhesive layer 6 formed on one side from the front and back sides of the circuit module 4, the PE
The required design printing is performed on the surface of the T film 5 and the outer periphery is punched into a required shape and size, so that the total thickness is 5 mm.
A non-contact IC card having the structure shown in FIG.

Second Embodiment The bonding between the IC chip 1 and the metal plate 3 was performed via an anisotropic conductive film. The joining conditions were 200 ° C. and 30 seconds. Others were the same as the non-contact IC card according to the first embodiment.

<First Comparative Example> A non-contact IC card having a total thickness of 570 μm was prepared using a glass epoxy having a copper wiring pattern and a thickness of 120 μm as a circuit board. Others were the same as the contactless IC card according to the second embodiment.

<Second Comparative Example> A circuit board of 18 μm
A non-contact IC card having a total thickness of 500 μm was manufactured using a 50 μm thick polyimide sheet having a thick copper wiring pattern. Others were the same as the non-contact IC card according to the first embodiment.

As for the non-contact IC card according to the first and second embodiments and the non-contact IC card according to the first comparative example, those having a predetermined shape can be manufactured, and good printing can be performed on the surface of the laminate film. Although the non-contact IC card according to the second comparative example was formed, at the casing of the circuit module, the edge of the polyimide sheet serving as the circuit board was rolled up, which caused deformation on the surface of the laminate film, Good printing could not be performed.

The non-contact IC card according to each of the above embodiments and the comparative example was subjected to 100 times of bending tests. As a result, the non-contact IC cards according to the first and second embodiments and the second comparative example were compared. The non-contact IC card according to the first comparative example had a failure rate of zero, whereas the non-contact IC card according to the first comparative example had cracks at 30%.

From these test results, it was confirmed that the non-contact IC card according to the embodiment using the metal plate 3 as the circuit board can produce good products with good yield and has excellent mechanical durability. did it.

Next, a preferred method of manufacturing a non-contact IC card according to the present invention will be described with reference to FIGS.

First, as shown in FIG. 2, a metal plate connector 12 in which a plurality of metal plates 3 each having a required circuit pattern (not shown) are connected at a constant pitch via a connection piece 11 is prepared. As shown in FIG.
It is wound into a roll and supplied to the IC card manufacturing process. At the same time, a required IC chip 1 and a required antenna coil 2 for non-contact communication, and a required adhesive layer provided on one side, and a two-layer laminate film raw material 13 wound in a roll are also prepared. .

Next, as shown in FIG.
2, the IC chip 1 and the antenna coil 2 are mounted in order from the metal plate 3 at the head, and as shown in FIG. Is formed continuously to form a circuit module connected body 16.

Further, the circuit module connector 16
As shown in FIG. 4, the casing 17 of the IC card.
, And the original laminate film 13 is adhered to both front and back surfaces of the circuit module connector 16. In the casing part 17 of the IC card, two rolls of the laminate film raw material 13 are arranged above and below the circuit module connector 16 with the adhesive layer facing inward. Circuit module connected body 1 supplied
6 and the laminated film 13 pulled out from the roll are attached to each other and inserted into the roller 18, so that the laminated film 13 is bonded to both the front and back surfaces of the circuit module connector 16.

Next, the I manufactured through these steps is
After performing a required design printing on the surface of the C card intermediate, a required portion is cut to obtain a non-contact IC card having a required shape and dimensions. In addition, in the non-contact IC card manufactured by the manufacturing method of this example, the connecting piece 11 of the metal plate 3 is integrally embedded in the card base A as shown in FIG.

According to this manufacturing method, the metal plate 3, the IC chip 1, and the antenna coil 2 for non-contact communication
The circuit module connecting body 16 composed of
7, the mass productivity of the non-contact IC card can be improved, and the manufacturing cost of the non-contact IC card can be reduced.

In the above-described embodiment, the desired non-contact IC card is obtained by bonding the raw laminate film 13 to the circuit module connector 16 and then cutting it. Then, after obtaining the individual circuit modules 4, the required non-contact IC card can be obtained by bonding a laminated film.

According to this method, the metal plate 3 can be continuously supplied to the assembly part 14 of the circuit module, so that the productivity of the circuit module 4 can be increased and the mass productivity of the non-contact IC card can be improved. And the manufacturing cost can be reduced.

[0035]

As described above, the non-contact I of the present invention
The C card uses a metal plate on which a required circuit pattern is formed as a circuit board for connecting an IC chip and an antenna coil for non-contact communication, so it is thin and flexible, has high strength, and is excellent in mass productivity. A non-contact IC card.

Further, in the method for manufacturing a non-contact IC card according to the fifth aspect, since the connected circuit modules are continuously supplied to the casing, the mass productivity of the non-contact IC card can be improved. In addition, the manufacturing cost of the non-contact IC card can be reduced.

On the other hand, in the method for manufacturing a non-contact IC card according to the sixth aspect, since the connected metal plate is continuously supplied to the assembly part of the circuit module, the productivity of the circuit module is improved. As a result, it is possible to improve the mass productivity of the non-contact IC card and reduce the manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of a non-contact IC card according to an embodiment.

FIG. 2 is a partial plan view of a connected metal plate.

FIG. 3 is a partial plan view of a connected circuit module;

FIG. 4 is a manufacturing process diagram of the non-contact IC card.

FIG. 5 is a plan view of a non-contact IC card according to another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Non-contact communication antenna coil 3 Metal plate (circuit board) 4 Circuit module 5 Adhesive layer 6 Laminated film 7 Bump 8 Plating layer 11 Connection piece 12 Metal plate connection body 13 Laminated film raw material 14 Assembly of circuit module Part 16 Circuit module connected body 17 IC card casing part 18 Laminating roller 18

Claims (6)

[Claims] 1. A circuit board and an IC connected to the circuit board.
A non-contact IC card in which a C chip and a non-contact communication antenna coil are embedded in a card base, wherein a metal plate on which a required circuit pattern is formed is used as the circuit board. card. 2. The non-contact IC card according to claim 1, wherein a metal bump is provided on a terminal portion of the IC chip, and the metal bump and the IC chip connection portion of the metal plate are placed between two metals by thermocompression bonding. A non-contact IC card, wherein the connection is made using diffusion bonding. 3. The non-contact IC card according to claim 2, wherein a metal bump is provided on a terminal portion of the IC chip, and an IC chip connecting portion between the metal bump and the metal plate is interposed between these two members. Non-contact IC characterized in that it is connected by using a heat-compression bonding method using an anisotropic conductive material provided.
card. 4. The non-contact IC card according to claim 1, wherein the non-contact communication antenna coil and the metal plate are connected by soldering.
C card. 5. A roll-shaped metal plate connector in which a plurality of metal plates having a required circuit pattern are connected at a constant pitch.
A step of preparing a required IC chip, an antenna coil for non-contact communication, and a roll-shaped laminate film raw material provided with an adhesive layer on one side; A step of sequentially and successively mounting the contact communication antenna coil, and a step of continuously bonding the laminate film raw material to both front and back surfaces of the connected body on which the IC chip and the non-contact communication antenna coil are mounted, Cutting the IC card intermediate body manufactured through the step of obtaining an IC card of a required shape and dimensions. 6. A roll-shaped metal plate connecting body in which a plurality of metal plates having a required circuit pattern are connected at a constant pitch.
A step of preparing a required IC chip, an antenna coil for non-contact communication, and a card-size laminate film provided with an adhesive layer on one side; and a step of preparing the IC chip and non-contact communication on each metal plate constituting the connection body. A step of sequentially and successively mounting antenna coils for use, a step of cutting individual metal plates from a connected body on which the IC chip and the antenna coil for non-contact communication are mounted, and obtaining a circuit module, A step of bonding the laminate film to both sides, and an IC manufactured through these steps
Cutting a peripheral portion of the card intermediate body to obtain an IC card having a required shape and dimensions.