JPH0677729A - Antenna integrated microwave circuit - Google Patents

Abstract

PURPOSE:To separate a microwave circuit and an antenna and to prevent the radiation pattern of the antenna from being disordered by constituting the microwave circuit on the reverse surface across the earth conductor of the radiation conductor of the antenna. CONSTITUTION:An incident high-frequency signal is inputted to a low noise amplifier 30 through the microstrip line composed of a coupling hole 5, the earth conductor 2, and a strip conductor 6, and amplified in a small noise state. The amplified high-frequency signal is inputted to a frequency converter 31 through the microstrip line, passed through a band-pass filter 20a, and inputted to a semiconductor element 8. A local oscillation signal from an input terminal 11, on the other hand, passes through the filter 20a and excites a semiconductor element 8 and is mixed with the high-frequency signal to generate an intermediate-frequency signal. The intermediate-frequency signal passes through a band-stopping filter 21 and is outputted from an output terminal 9. Neither the local oscillation signal nor the intermediate-frequency signal does not leak out to the filter 20a and neither the high-frequency signal nor the intermediate- frequency signal leaks out to the filter 20b; and none of the passing intermediate-frequency signal leaks out to the filter 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave circuit integrated with an antenna, which is used in a microwave / millimeter wave band or the like and is a combination of an antenna and a microwave circuit including a semiconductor element.

[0002]

2. Description of the Related Art FIG. 8 shows, for example, "MICROWAVE J
OURRNA ", March 1988, p. 116, Fi
g. It is a block diagram of the conventional antenna integrated microwave circuit shown in FIG. In the figure, 3 is a radiating element of an antenna formed on a thin dielectric film, 4 is a semiconductor substrate having a ground conductor on the back surface, 6 is a strip conductor, 8 is a semiconductor element, 9 is an output terminal, and 15 is a Lange. A coupler, 30 is a low noise amplifier, and 32 is a phase shifter. A high frequency signal input to a microstrip antenna composed of a semiconductor substrate 4 having a ground conductor on the back surface and a radiating element 3 is composed of a strip conductor 6 and a semiconductor substrate 4 having a ground conductor on the back surface, and is orthogonal to each other. And is input to the Lange coupler 15 via two microstrip lines coupled to the radiating element 3. The Lange coupler 15 combines the high-frequency signals from the two microstrip lines so that the high-frequency signal input to the antenna is circularly polarized and the efficiency of the antenna is improved. The synthesized high frequency signal is input to the low noise amplifier 30 via a microstrip line composed of a strip conductor 6 and a semiconductor substrate 4 having a ground conductor on the back surface. The high frequency signal input to the low noise amplifier 30 is amplified with low noise and output to the phase shifter 32. The high frequency signal whose phase has been changed by the phase shifter 32 is output from the output terminal 9 via a microstrip line composed of the strip conductor 6 and the semiconductor substrate 4 having the ground conductor on the back surface.

Although one antenna and a circuit connected to the antenna are shown here, a large number of circuits shown in FIG. 8 are two-dimensionally arranged and a phase shifter connected to each antenna is shifted. It can be used as a phased array by changing the phase amount.

[0004]

The conventional microwave circuit integrated with an antenna is constructed as described above, and unnecessary radiation from the microwave circuit on the same plane as the antenna is
There was a problem of disturbing the radiation pattern of the antenna.
In addition, since the radiating element of the antenna and the microwave circuit are two-dimensionally arranged, an area corresponding to the sum of the antenna and the microwave circuit is required, and the required performance is obtained when the phased array is configured. Therefore, there is a problem in that the space between the radiating elements cannot be narrowed.

The present invention has been made to solve the above problems, and the antenna and the microwave circuit do not interfere with each other, and the antenna interval can be sufficiently narrowed even when a phased array antenna is constructed. The objective is to obtain a compact microwave circuit with integrated antenna.

[0006]

An antenna integrated microwave circuit according to a first aspect of the present invention comprises a first substrate made of a dielectric material or a semiconductor, and a ground conductor formed on one surface of the first substrate. A microwave circuit using a coupling hole provided in the ground conductor, a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric or a semiconductor, and the second substrate. A radiation housing formed on one surface of the substrate, and a metal housing that is electrically continuous with the ground conductor and is provided with a notch for avoiding the second substrate. The other surface of the first substrate and the second substrate are laminated with the other surface thereof facing the ground conductor, and the radiation conductor and the microwave circuit are electromagnetically coupled through the coupling hole. .

An antenna-integrated microwave circuit according to a second aspect is provided with a first substrate made of a dielectric or a semiconductor, a ground conductor formed on one surface of the first substrate, and the ground conductor. And a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric material or a semiconductor, and one surface of the second substrate. And a ground conductor formed on the other surface of the second substrate, a dielectric or semiconductor, and a third substrate provided with a notch for avoiding the first substrate. And a ground conductor formed on one surface of the third substrate, a microwave circuit formed on the other surface of the third substrate, and electrically continuous with the ground conductor of the third substrate. And a metal housing provided with a notch for avoiding the second substrate. , The ground conductor of the second substrate is opposed to the ground conductor of the first substrate and the ground conductor of the third substrate so as to be electrically continuous, and the first substrate, the second substrate, and the third substrate A substrate is laminated, and the radiation conductor is electromagnetically coupled to the microwave circuit formed on the first substrate through the coupling hole.

An antenna-integrated microwave circuit according to a third aspect of the present invention is provided with a first substrate made of a dielectric or a semiconductor, a ground conductor formed on one surface of the first substrate, and the ground conductor. And a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric material or a semiconductor, and one surface of the second substrate. A radiation conductor formed on the second substrate, a ground conductor formed on the other surface of the second substrate, a semiconductor element arranged on the ground conductor of the second substrate, a dielectric or a semiconductor, A third substrate provided with a notch for avoiding the first substrate and the semiconductor element, a ground conductor formed on one surface of the third substrate, and the other surface of the third substrate And the microwave circuit formed on the And a metal casing provided with a notch for avoiding the second substrate, wherein the ground conductor of the second substrate is electrically connected to the ground conductor of the third substrate. The first substrate, the second substrate, and the third substrate, which are opposed to each other so as to be continuous, and the microwave is formed on the radiation conductor and the first substrate through the coupling hole. The circuit is electromagnetically coupled.

An antenna-integrated microwave circuit according to a fourth aspect is provided with a first substrate made of a dielectric or a semiconductor, a ground conductor formed on one surface of the first substrate, and the ground conductor. And a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric material or a semiconductor, and one surface of the second substrate. A radiation conductor formed on the second substrate, the other surface of the second substrate is opposed to the ground conductor, the first substrate and the second substrate are laminated, and the radiation conductor is provided through the coupling hole. In a microwave circuit integrated with an antenna for electromagnetically coupling a microwave circuit and a microwave circuit, a length of coupling the microwave circuit to the radiation conductor through the coupling hole is λ / 2 (λ: on a strip conductor). 1st wavelength of antenna signal wave) One terminal was connected to both ends of the trip conductor and the first strip conductor, and the other terminal was connected to two common semiconductor elements and the common terminals of the two semiconductor elements. And a frequency converter configured with a second strip conductor.

An antenna-integrated microwave circuit according to a fifth aspect is provided with a first substrate made of a dielectric or a semiconductor, a ground conductor formed on one surface of the first substrate, and the ground conductor. And a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric material or a semiconductor, and one surface of the second substrate. A radiation conductor formed on the second substrate, the other surface of the second substrate is opposed to the ground conductor, the first substrate and the second substrate are laminated, and the radiation conductor is provided through the coupling hole. In an antenna-integrated microwave circuit that electromagnetically couples a microwave circuit with a microwave circuit, the microwave circuit includes an annular first strip conductor coupled to the radiation conductor via the coupling hole, and the first strip conductor. Symmetric with the above coupling hole of the strip conductor Position away from the position where the second strip conductor connected to the second conductor and the second strip conductor of the first strip conductor are connected by λ / 4 (λ: 1 wavelength of the antenna signal wave on the strip conductor) To a semiconductor element, one terminal of which is connected to each other and the other terminal of which is connected to a ground conductor.

[0011]

According to the present invention, since the microwave circuit is formed on the back surface via the ground conductor of the radiation conductor of the antenna, the microwave circuit and the antenna can be separated and do not interfere with each other. In addition, since the radiating element and the microwave circuit are located on the front and back at the same position, the unit of the microwave circuit with integrated antenna can be made small, and when the phased array antenna is configured, the spacing between the radiating elements is the required value. Can be set to.

Further, since the ground conductor of the semiconductor substrate and the metal casing are electrically continuous, the mechanical strength and heat diffusion of the semiconductor substrate are improved, and the continuity of the ground conductor is improved even when connecting to an external circuit. Is easy to keep. Further, by forming the periphery of the semiconductor substrate with a dielectric substrate and connecting the ground conductor continuously, it is possible to reduce the size of the expensive semiconductor substrate and reduce the cost without deteriorating the electrical performance.

Further, by using a plurality of semiconductor substrates, different kinds of semiconductor elements can be used, and the degree of freedom in design is improved.

Further, since the required microwave circuit can be made small, the interval between the microwave circuits can be narrowed even when the phased array antenna is constructed, so that the antenna interval can be sufficiently narrowed.

[0015]

EXAMPLES Example 1. FIG. 1A shows a first embodiment of the present invention.
FIG. 1 (b) is a cross-sectional view taken along line BB of FIG. 1 (a). In the figure, 1 is a dielectric substrate, 2 is a ground conductor, 3 is a radiating element, 4 is a semiconductor substrate, 5 is a coupling hole, 6 is a strip conductor, 7 is a matching stub, 8 is a semiconductor element, 9 is an output terminal, 10 is a metal casing, 11 is a local signal input terminal, 20
Reference numerals a and 20b are band pass filters, 21 is a band stop filter, 30 is a low noise amplifier, and 31 is a frequency converter.

Next, the operation will be described. The high frequency signal incident on the microstrip antenna composed of the ground conductor 2 and the radiating element 3 is input to the low noise amplifier 30 via the coupling hole 5 and the microstrip line composed of the ground conductor 2 and the strip conductor 6. To be done. The low noise amplifier 30 is composed of the semiconductor element 8 and the matching stub 7, and amplifies the input high frequency signal with low noise. The high frequency signal amplified by the low noise amplifier is input to the frequency converter 31 via the microstrip line including the ground conductor 2 and the strip conductor 6. Frequency converter 3
At 1, the high frequency signal passes through the band pass filter 20a and is input to the semiconductor element 8. On the other hand, the local oscillator signal input from the local oscillator signal input terminal 11 receives the bandpass filter 20b.
To excite the semiconductor element 8. In the semiconductor element 8, the local oscillation signal and the high frequency signal are mixed in frequency to generate an intermediate frequency signal. The generated intermediate frequency signal passes through the band elimination filter 21 and is output from the output terminal 9. Here, since the band pass filter 20a is configured to pass only the high frequency signal, the local oscillation signal and the intermediate frequency signal do not leak out. Further, since the bandpass filter 20b is configured to pass only the local oscillation signal, the high frequency signal and the intermediate frequency signal do not leak out. Further, since the band elimination filter 21 is configured not to pass the high frequency signal and the intermediate frequency signal, the intermediate frequency signal passes and the high frequency signal and the intermediate frequency signal do not leak out.

Example 2. Second Embodiment FIG. 2A is a perspective view showing a second embodiment of the present invention, and FIG. 2B is a CC sectional view of FIG. 2A. In the figure, 1a and 1b are dielectric substrates, and 12 is a wire.

Next, the operation will be described. The high frequency signal incident on the microstrip antenna composed of the ground conductor 2 and the radiating element 3 is input to the low noise amplifier 30 via the coupling hole 5 and the microstrip line composed of the ground conductor 2 and the strip conductor 6. To be done. The high frequency signal amplified by the low noise amplifier 30 is composed of the microstrip line composed of the ground conductor 2 and the strip conductor 6 and the strip conductor 6 and the ground conductor 2 on the dielectric substrate 1b via the wire 12. Input to the microstrip line. The high frequency signal input to the microstrip line on the dielectric substrate 1b is output from the output terminal 9.

Example 3. 3A is a perspective view showing a third embodiment of the present invention, and FIG. 3B is a DD sectional view of FIG. 3A. In the figure, 13a and 13b are semiconductor elements.

Next, the operation will be described. The low noise amplifier 30a includes the semiconductor element 8 and amplifies the input high frequency signal with low noise. Low noise amplifier 30a
The high-frequency signal input to the
It is input to the low noise amplifier 30b via the microstrip line composed of the strip conductor 6 and the strip conductor 6. The low-noise amplifier 30b is composed of a semiconductor element 13a that has a structure different from that of the semiconductor substrate 4, and amplifies the input high-frequency signal with low noise. The high frequency signal amplified by the low noise amplifier 30b is input to the frequency converter 31 via the microstrip line composed of the ground conductor 2 and the strip conductor 6 on the dielectric substrate 1b. Frequency converter 31
Is composed of two band pass filters 20a and 20b arranged on the dielectric substrate 1b, a band stop filter 21, and a semiconductor element 13b arranged on a different substrate. In the frequency converter 31, the high frequency signal passes through the band pass filter 20a and is input to the semiconductor element 13b. On the other hand, the local oscillator signal input from the local oscillator signal input terminal 11 passes through the band pass filter 20b, and the semiconductor element 13b
Excite. In the semiconductor element 13b, the local oscillation signal and the high frequency signal are mixed in frequency to generate an intermediate frequency signal. The generated intermediate frequency signal passes through the band elimination filter 21,
It is output from the output terminal 9.

Example 4. In the above embodiment, the metal casing only supports the dielectric substrate, but a lid may be provided on the upper portion of the circuit to form an airtight structure.

FIG. 4 is a sectional view showing Embodiment 4 of the present invention. In the figure, 10 is a metal housing and 40 is a connector.

Next, the operation will be described. The signal output to the output terminal 9 is output from the connector 40.

Here, the connector 40 is made airtight, and the connecting portions of the ground conductors of the dielectric substrate 1a and the dielectric substrate 1b and between the dielectric substrate 1b and the metal casing 10 are soldered or the like. If airtight, the inside of the metal housing 10 is sealed,
The semiconductor substrate 4 is never exposed to the outside air.

Here, the metal casing 10 does not have to be integrated, and may have a structure in which a lid is attached after the substrate is mounted. The signal output section may be a microstrip line, a coplanar line, or the like, instead of the connector.

Example 5. 5 is a plan view showing a microwave circuit according to a fifth embodiment of the present invention. In the figure, 6a,
6b is a strip conductor, 8a and 8b are semiconductor elements, 22
Is a high pass filter. On the back surface of this microwave circuit, a microstrip antenna composed of a ground conductor 2 and a radiating element 3 which are coupled to the microwave circuit through a coupling hole 5 is provided as in the above embodiment.

Next, the operation will be described. The high frequency signal incident on the microstrip antenna composed of the ground conductor 2 and the radiating element 3 is transmitted to the semiconductor elements 8a and 8b via the coupling hole 5 and the microstrip line composed of the ground conductor 2 and the strip conductor 6a. input. Here, the distance from the coupling hole 5 to the semiconductor element 8a and the distance to the semiconductor element are both λ / 4. However, since the directions from the coupling hole are different, the high-frequency signal is opposite to the semiconductor element 8a and the semiconductor element 8b. Input in phase. Further, the band elimination filter 21 is configured not to pass a high frequency signal. In addition, the high frequency signal from the semiconductor element 8a and the semiconductor element 8
Since the high frequency signal from b is in opposite phase, the impedance at the intermediate feeding point is short-circuited and the high frequency signal
It is efficiently applied to a and 8b. On the other hand, the local oscillator signal input from the local oscillator signal input terminal 11 is input to the high-pass filter 22 via the microstrip line composed of the strip conductor 6b and the ground conductor 2. Here, the high pass filter 22 is configured to pass the local oscillation signal. Further, since the band elimination filter 21 is configured not to pass the local oscillation signal, the local oscillation signal does not leak to the output terminal 9 side. The local signal that has passed through the high-pass filter 22 is input to the semiconductor elements 8a and 8b via a microstrip line composed of a strip conductor 6b and a ground conductor, and excites the semiconductor elements 8a and 8b. At this time, the local oscillation signal becomes an open end of the standing wave in the coupling hole portion of the strip conductor 6a, so that the semiconductor element 8a and the semiconductor element 8 which are λ / 4 apart from each other.
From b, it becomes a short-circuited end, and the local oscillation signal is efficiently applied to the semiconductor elements 8a and 8b by the impedance of the microstrip line composed of the ground conductor 2 and the strip conductor 6b. Further, the local oscillation signals leaked from the semiconductor elements 8a and 8b are in phase with each other in the coupling hole portion of the strip conductor 6a and therefore are not coupled to the radiating element 3,
The local signal does not leak from the radiating element 3. The local signal and the high frequency signal are frequency mixed to generate an intermediate frequency signal. The generated intermediate frequency signal is output from the output terminal 9 via the band strip filter 21 and the microstrip line composed of the ground conductor 2 and the strip conductor 6b. Here, the band elimination filter 21 is configured to pass the intermediate frequency signal, and since the passed intermediate frequency signal is grounded, the intermediate frequency signal does not leak to the strip conductor 6a. Further, since the high-pass filter 22 is configured not to pass the intermediate frequency signal, the intermediate frequency signal does not leak to the local oscillator signal input terminal 11 side.

Example 6. 6 is a plan view showing a microwave circuit according to a sixth embodiment of the present invention. On the back surface of this microwave circuit, a microstrip antenna composed of a ground conductor 2 and a radiating element 3 which are coupled to the microwave circuit through a coupling hole 5 is provided as in the above embodiment.

Next, the operation will be described. A high frequency signal incident on a microstrip antenna composed of the ground conductor 2 and the radiating element 3 is grounded at one terminal through the coupling hole 5 and the microstrip line composed of the ground conductor 2 and the strip conductor 6a. Input to the semiconductor elements 8a and 8b. Here, the semiconductor element 8
Since a and the semiconductor element 8b are connected to the opposite sides of the coupling hole 5, the high frequency signal has a phase opposite to that of the semiconductor element 8a and the semiconductor element 8b and the annular strip conductor 6a.
The high frequency signal transmitted through the
At the connection part with b, the high frequency signal is not coupled to the strip conductor 6b because it becomes a node of the standing wave and the impedance is short-circuited. In addition, from the coupling hole 5 to the strip conductor 6
Since the distance to the connection portion of b is both λ / 4, the impedance becomes open when viewed from the connection portion of the semiconductor elements 8a and 8b, and the high frequency signal is efficiently applied to the semiconductor elements 8a and 8b. On the other hand, the local oscillator signal input from the local oscillator signal input terminal 11 is the strip conductor 6
It is input to the high-pass filter 22 via a microstrip line composed of b and the ground conductor 2. Here, the high pass filter 22 is configured to pass the local oscillation signal. Further, since the band elimination filter 21 is configured not to pass the local oscillation signal, the local oscillation signal does not leak to the output terminal 9 side. The local oscillation signal that has passed through the high-pass filter 22 is distributed in phase at the connection between the strip conductor 6b and the strip conductor 6a, propagates through the annular strip conductor 6a, and the semiconductor element 8a and the semiconductor element 8a arranged near the coupling hole 5 are formed. In-phase input to the semiconductor element 8b, the semiconductor element 8a,
8b is excited, but is not coupled to the radiating element 3 through the coupling hole 5 and is not radiated from the radiating element 3. Semiconductor element 8a
In the semiconductor element 8b, the local oscillation signal and the high frequency signal are mixed in frequency to generate an intermediate frequency signal. The generated intermediate frequency signal is applied to the microstrip line composed of the ground conductor 2 and the strip conductor 6b and the band stop filter 21.
Is output from the output terminal 9 via. Here, since the high-pass filter 22 is configured not to pass the intermediate frequency signal, the intermediate frequency signal does not leak to the local oscillator signal input terminal 11 side.

Example 7. In the above embodiment, the radiating element 3
And the case where there is one microwave circuit connected to each of them, the plurality of radiating elements 3 are two-dimensionally arranged,
A plurality of microwave circuits connected to each radiating element 3 may be arranged.

FIG. 7 is a block diagram showing a seventh embodiment of the present invention. In the figure, 32 is a phase shifter.

The high frequency signal amplified by the low noise amplifier 30 with low noise is input to the phase shifter 32. The phase of the high frequency signal is changed by the phase shifter 32, and the high frequency signal is output from the output terminal 9. Here, by setting the phase shift amount of the phase shifter 32 to a required value for each microwave circuit, it can be used as a phased array.

Although only the reception is described in the above embodiments, a microwave circuit is configured by using a high output amplifier instead of the low noise amplifier 30, and the same configuration as the above embodiments. It goes without saying that an antenna-integrated microwave circuit that can be used for transmission can also be obtained.

[0034]

According to the invention of claim 1, the microwave circuit and the antenna can be separately arranged on the front and back of the ground conductor, and a small antenna-integrated microwave in which unnecessary radiation from the microwave circuit does not disturb the radiation pattern of the antenna. A wave circuit is obtained.

According to the second aspect of the present invention, the size of the expensive semiconductor substrate can be reduced without deteriorating the electrical performance by forming the dielectric substrate around the semiconductor substrate and connecting the ground conductor. The size can be reduced and the cost can be reduced.

According to the third aspect of the invention, by using a plurality of semiconductor substrates, different types of semiconductor elements can be used, and the degree of freedom in design can be improved.

According to the invention of claim 4 or claim 5, since the required microwave circuit can be made small, the interval between the microwave circuits can be narrowed even when the phased array antenna is constructed. You can set the antenna spacing to the required value.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a second embodiment of the present invention.

FIG. 3 is a configuration diagram showing a third embodiment of the present invention.

FIG. 4 is a configuration diagram showing a fourth embodiment of the present invention.

FIG. 5 is a configuration diagram showing a fifth embodiment of the present invention.

FIG. 6 is a configuration diagram showing a sixth embodiment of the present invention.

FIG. 7 is a configuration diagram showing a seventh embodiment of the present invention.

FIG. 8 is a configuration diagram of a conventional microwave circuit integrated with an antenna.

[Explanation of symbols]

 1, 1a, 1b Dielectric substrate 2 Ground conductor 3 Radiating element 4 Semiconductor substrate 5 Coupling hole 6, 6a, 6b Strip conductor 7 Stub 8, 8a, 8b Semiconductor element 9 Output terminal 10 Metal housing 11 Local signal input terminal 12 Wires 13a, 13b Semiconductor elements 15 Lange couplers 20a, 20b Bandpass filters 21 Bandstop filters 22 Highpass filters 30 Low noise amplifiers 31 Frequency converters 32 Phase shifters

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[Procedure amendment]

[Submission date] November 17, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

FIG. 9 is disclosed in Japanese Patent Laid-Open No. 4-160804.
Shown is another conventional antenna integrated microwave circuit shown.
FIG. 9A is a view seen from the radiation conductor side.
(B) is the figure seen from the microwave circuit side. Figure smell
, 1 is a dielectric substrate, 2 is a ground conductor, 3 is a radiation conductor, and 4 is
Semiconductor substrate, 5 is a coupling hole, 6 is a strip conductor, 32 is
A phase shifter, 33 is an amplifier, and 34 is an input terminal. Input end
The high-frequency signal input to the child 34 has a predetermined phase by the phase shifter.
It is set and input to the amplifier 33. Amplified by amplifier 33
The generated high frequency signal is applied to the strip conductor 6 and the ground conductor 2 on the back surface.
A microstrip composed of a semiconductor substrate 4 with a
It is constructed on the dielectric substrate 1 via the connecting line 5 and the connecting line.
Is input to the radiated element 3. Here, the radiating element 3 and the ground
The conductors make up the microstrip antenna and
The frequency signal is radiated into space from the radiating element 3. Here, one antenna and a circuit connected to the antenna are shown, but the circuits shown in FIGS. 8 and 9 are two-dimensionally arranged and a phase shifter connected to each antenna is provided. It can be used as a phased array by changing the amount of phase shift.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0004

[Correction method] Change

[Correction content]

[0004]

The conventional microwave circuit integrated with an antenna is constructed as described above, and an unnecessary radiation image from the microwave circuit on the same plane as the antenna,
There was a problem of disturbing the radiation pattern of the antenna.
In addition, since the antenna radiating element and the microwave circuit are arranged two-dimensionally, the area of the sentence in which the antenna and the microwave circuit are added is required, and when the phased array is constructed, the required performance is obtained. For the spacing of radiating elements for
There was a problem that it could not be narrowed . Also, dielectric substrate
Because of the overlapping structure, mechanically weak input
You cannot use connectors as terminals and output terminals
There was a problem.

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] 0005

[Correction method] Change

[Correction content]

The present invention has been made to solve the above problems, and the antenna and the microwave circuit do not interfere with each other, and the antenna interval can be sufficiently narrowed even when a phased array antenna is constructed. Can , connect
The objective is to obtain a compact microwave circuit with an integrated antenna that can be easily connected to an external circuit using a connector .

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] Figure 9

[Correction method] Added

[Correction content]

FIG. 9 is a configuration diagram of a conventional antenna integrated microwave circuit.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] Explanation of code

[Correction method] Change

[Correction content]

[Explanation of reference signs] 1,1a, 1b Dielectric substrate 2 Ground conductor 3 Radiating element 4 Semiconductor substrate 5 Coupling hole 6,6a, 6b Strip conductor 7 Stub 8,8a, 8b Semiconductor element 9 Output terminal 10 Metal housing 11 Station Source signal input terminal 12 Wires 13a, 13b Semiconductor element 15 Lange coupler 20a, 20b Band pass filter 21 Band stop filter 22 High pass filter 30 Low noise amplifier 31 Frequency converter 32 Phase shifter 33 Amplifier 34 Input terminal

[Procedure correction 6]

[Document name to be corrected] Drawing

[Correction target item name] Figure 9

[Correction method] Added

[Correction content]

[Figure 9]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location // H01Q 13/08 8940-5J

Claims (5)

[Claims] 1. A first substrate made of a dielectric material or a semiconductor, and a ground conductor formed on one surface of the first substrate,
A coupling hole provided in the ground conductor, a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric or a semiconductor, the second substrate A radiation conductor formed on one surface of the substrate; and a metal casing that is electrically continuous with the ground conductor and is provided with a notch for avoiding the second substrate, Laminating the first substrate and the second substrate with the other surface facing the ground conductor, and electromagnetically coupling the radiation conductor and the microwave circuit through the coupling hole. Microwave circuit with integrated antenna. 2. A first substrate made of a dielectric or a semiconductor, and a ground conductor formed on one surface of the first substrate,
A coupling hole provided in the ground conductor, a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric or a semiconductor, the second substrate A radiation conductor formed on one surface of the substrate, a ground conductor formed on the other surface of the second substrate, and a notch for avoiding the first substrate, which is made of a dielectric or a semiconductor, are provided. A third substrate, a ground conductor formed on one surface of the third substrate, a microwave circuit formed on the other surface of the third substrate, and a ground conductor of the third substrate And a metal housing that is electrically continuous with a notch that avoids the second substrate, and connects the ground conductor of the second substrate to the first ground conductor and the third substrate. The first substrate, the second substrate, and the third substrate are stacked with the ground conductors facing each other so that they are electrically continuous. And an antenna integrated microwave circuit, characterized in that to electromagnetically couple the microwave circuit formed on the radiating conductor and the first substrate through the coupling hole. 3. A first substrate made of a dielectric or a semiconductor, and a ground conductor formed on one surface of the first substrate,
A coupling hole provided in the ground conductor, a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric or a semiconductor, the second substrate A radiation conductor formed on one surface of the substrate, a ground conductor formed on the other surface of the second substrate, a semiconductor element arranged on the ground conductor of the second substrate, a dielectric or A third substrate made of a semiconductor and provided with a notch for avoiding the first substrate and the semiconductor element, a ground conductor formed on one surface of the third substrate, and the third substrate. A microwave circuit formed on the other surface of the substrate, and electrically continuous with the ground conductor of the third substrate, a metal housing provided with a notch for avoiding the second substrate, The ground conductor of the second substrate is electrically connected to the ground conductor of the first substrate and the ground conductor of the third substrate. A first substrate, a second substrate, and a third substrate are laminated so as to face each other continuously, and a radiation conductor and a microwave circuit formed on the first substrate through the coupling hole, An antenna-integrated microwave circuit characterized by electromagnetic coupling. 4. A first substrate made of a dielectric material or a semiconductor, and a ground conductor formed on one surface of the first substrate,
A coupling hole provided in the ground conductor, a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric or a semiconductor, the second substrate A radiation conductor formed on one surface of the substrate, the other surface of the second substrate is opposed to the ground conductor, the first substrate and the second substrate are laminated, and the coupling hole is formed. In an antenna integrated microwave circuit for electromagnetically coupling the radiation conductor and the microwave circuit through the microwave circuit, the length of coupling the microwave circuit to the radiation conductor through the coupling hole is λ / 2 (λ). A first strip conductor of one wavelength of an antenna signal wave on the strip conductor), and two semiconductor elements in which one terminal is connected to both ends of the first strip conductor and the other terminal is common , Common to the above two semiconductor devices A microwave circuit integrated with an antenna, comprising: a frequency converter configured to include a second strip conductor connected to the terminal. 5. A first substrate made of a dielectric material or a semiconductor, and a ground conductor formed on one surface of the first substrate,
A coupling hole provided in the ground conductor, a microwave circuit using a semiconductor element formed on the other surface of the first substrate, a second substrate made of a dielectric or a semiconductor, the second substrate A radiation conductor formed on one surface of the substrate, the other surface of the second substrate is opposed to the ground conductor, the first substrate and the second substrate are laminated, and the coupling hole is formed. An antenna-integrated microwave circuit for electromagnetically coupling the radiation conductor and the microwave circuit via the microwave circuit, wherein the microwave circuit is coupled to the radiation conductor via the coupling hole and an annular first strip conductor. , Λ / 4 (λ: from the position where the second strip conductor is connected to the first strip conductor at a position symmetrical to the coupling hole, and the second strip conductor is connected to the first strip conductor. A on the strip conductor A frequency converter configured to include two semiconductor elements in which one terminal is connected to each other at one wavelength) of the antenna signal wave and the other terminal is connected to the ground conductor. Microwave circuit with integrated antenna.