JP3632466B2 - Inspection device and inspection method for non-contact IC card - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention relates to a non-contact type information medium, and more specifically to a non-contact type IC card manufactured in the field of office automation (OA), factory automation (FA), security (Security), etc. The present invention relates to an effective technique for preventing a non-contact IC card having a defective IC module from being mixed in a card or a trouble caused by an inlet failure in a manufactured non-contact IC card.
[0002]
[Prior art]
In recent years, with the advent of contactless IC cards with built-in semiconductor memory, etc., the storage capacity has increased dramatically compared to conventional magnetic cards, and it has become unnecessary to insert the card into the slot of the read / write device. Improved.
A non-contact IC card is a DC power source that provides a field of vibration energy such as a high-frequency electromagnetic field, ultrasonic waves, or light in a space, absorbs and rectifies the energy, and drives an electronic circuit built in the card. Use the frequency of the AC component of the field as it is, or multiply or divide it into an identification signal, and transmit this identification signal to the information processing circuit of the semiconductor element via a non-contact transmission element such as an antenna or a coil or capacitor To do.
[0003]
In addition, the antenna or coil as used in this specification was used for the following meaning, respectively. The former is an element that communicates by radio waves, and the shape and material can be arbitrarily designed according to standards and applications. The latter is an element that communicates with a magnetic field, and is a conductor or conductor pattern wound in a coil shape.
[0004]
In particular, many of the non-contact IC cards for the purpose of authentication and simple counting processing are wireless logic identification (Radio Frequency IDentification) which does not include a battery and a CPU (Central Processing Unit); With the advent of this non-contact IC card, the safety against forgery and tampering is enhanced as compared with the magnetic card, and the card holder can read and write devices attached to the gate device when passing through the gate. You just need to bring the card close to the communication function unit or touch the card with the communication function unit of the read / write device, reducing the complexity of data communication by removing the card from the case and inserting it into the slot of the read / write device. It was.
[0005]
In addition, non-contact IC cards are internationally standardized by the ISO standard. In general, an IC card generally has an IC module such as a semiconductor memory and a non-contact transmission on a card body based on plastic or the like. An element antenna or coil is incorporated. An electromagnetic field or an alternating magnetic field radiated from the communication function unit of the read / write device is detected by an antenna or a coil inside the card and coupled to each other to exchange data with the read / write device.
[0006]
In general, the non-contact IC card is produced as follows.
A metal foil antenna or coil for non-contact transmission is formed on the card base sheet by etching, and a pattern portion for connecting to the IC module is provided at the end of the antenna or coil. And the connection part with the antenna or coil of IC module is connected with this pattern part using soldering, a conductive adhesive, etc., and becomes an inlet for non-contact IC cards. In some cases, an IC chip is directly connected to a connection portion with an antenna or a coil to form an inlet.
Thereafter, the card base sheet on which the IC module is mounted and the inlet is formed is sandwiched between the front and back sheets and laminated to form the card body.
[0007]
Further, in order to increase the adhesive strength of the front and back sheets, a method of laminating while applying an adhesive to the front and back sheets is conceivable. In addition, there is a method of sealing the inlet card-formed card base sheet by injection (injection molding) to create a card body.
[0008]
In addition to the antenna or coil made of metal foil, it is also conceivable that the non-contact transmission antenna or coil is formed of a conductive wire with an insulating film.
[0009]
However, in order to increase manufacturing efficiency, a method capable of manufacturing a plurality of non-contact IC cards in the same process is desirable from the viewpoint of productivity. That is, an antenna or a coil formed by etching a metal foil or an antenna or a coil formed by a conductive wire coated with an insulating film is arranged on a card base sheet having a size capable of arranging and arranging a plurality of inlets. Alternatively, an IC module is mounted on the coil end, and a card base sheet composed of a plurality of inlets. The card base sheet is sandwiched between front and back sheets, laminated, and then cut to a predetermined size. This is a method of manufacturing a processed card body. Such a method is introduced in Japanese Patent Laid-Open No. 62-127290.
[0010]
The non-contact IC card manufactured in this way uses a non-contact IC card read / write device to check the operation and function after completion, for example, communication as disclosed in Japanese Patent Laid-Open No. 9-102021. A final inspection of the non-contact IC card manufacturing process is performed by an inspection apparatus using the apparatus, and malfunctioning and malfunctioning cards are detected.
[0011]
[Problems to be solved by the invention]
However, since the inspection of malfunctions and malfunctions is after the card is completed, even if there is a connection failure between the connection part of the IC module and the antenna or coil, the card is manufactured as usual. It turns out that it is.
This means that trouble may occur in the manufacturing equipment during the IC module mounting process on the antenna or coil terminal, and if there is a problem with the antenna or coil, IC module, or its connection, a large number of defective cards may be produced. To do.
[0012]
Therefore, if inspection is performed with a card base sheet in which a plurality of inlets in which an IC module and an antenna or a coil are integrated are arranged, it becomes possible to prevent a large number of defective cards from occurring due to troubles caused by the manufacturing apparatus. .
[0013]
In consideration of the inspection speed, such an inspection apparatus has a single detection head mounted with an antenna or coil on a card base sheet in which a plurality of inlets each having an integrated IC module and antenna or coil are arranged. Rather than moving to the target inlet, the detection head is selectively used by using a plurality of detection heads each equipped with an antenna or a coil individually arranged at a position corresponding to each inlet on the card base sheet. The method of switching and sequentially inspecting is advantageous in terms of time. Also, considering the cost of the card base sheet, the intervals between the multiple inlets arranged on the card base sheet are as dense as possible to avoid the cost increase due to the card base sheet becoming larger. It is required to arrange, that is, the detection heads are also arranged closely.
[0014]
In response to the above requirements, particularly when the detection heads are densely arranged, the interference between the detection heads increases because the antennas or coils approach each other. Not only is the energy field from the antenna or coil reduced, but the high frequency output circuit may be severely damaged, which has been a major obstacle in realizing an inspection apparatus having the functions described above.
[0015]
As described above, the present invention has problems in confirming operation and function on a card base sheet in which a plurality of inlets each having an integrated IC module and antenna or coil are arranged. In order to solve this problem, in the card manufacturing process, the operation function is confirmed in the card base sheet state in which multiple inlets before the carding process are arranged and arranged. An object of the present invention is to provide an inspection technique capable of overcoming the above-described obstacles in an inspection apparatus for preventing the occurrence, in particular, even when the intervals between the inlets are particularly narrow and densely arranged, An object of the present invention is to provide an inspection technique that can easily, quickly, safely, and accurately execute this.
[0016]
[Means for Solving the Problems]
In order to solve the above problems, the means provided by the present invention is a non-contact device in which an IC module including a semiconductor chip and an antenna or a coil as a non-contact element are integrated. A plurality of contact IC card inlets are individually arranged at positions corresponding to the respective contactless IC card inlets on the card base sheet with respect to the card base sheet in which a plurality of contact IC cards are arranged on the base sheet. A non-contact IC card inspection apparatus that has a plurality of detection head portions mounted with an antenna or a coil, and selectively inspects a plurality of non-contact IC card inlets by selectively switching the detection head portions. The non-contact IC card inspection apparatus further comprises means for preventing interference between the detection head part and the adjacent detection head part.
[0017]
According to the present invention, it is possible to arrange the detection heads densely without damaging the high-frequency output circuit of the read / write device by preventing the interference between the detection head portions, and as a result, the production efficiency is improved. Card base sheet that enables manufacture and inspection with a card base sheet in which multiple inlets in a plurality of non-contact IC card manufacturing in the same high process are arranged as closely as possible, leading to improved inspection speed and cost In addition, it is possible to prevent a large number of defective cards from occurring due to troubles caused by the manufacturing apparatus.
[0018]
Further, as described in claim 2, the basic configuration of claim 1 is used, and in particular, the interference prevention means includes a quality factor Q of a resonance circuit including an antenna or a coil mounted on the detection head unit. It is a non-contact IC card inspection device characterized by the above-mentioned adjustment means.
[0019]
According to the present invention, it is possible to prevent interference between detection heads relatively inexpensively and easily, and particularly effective when the interference is slight or when there is a relatively high margin in the high-frequency output of the read / write device. .
[0020]
Further, as described in claim 3, the basic configuration of claim 1 is provided, and in particular, the interference prevention means is a cutting means for cutting a closed circuit including an antenna or a coil mounted on the detection head unit. There is a non-contact IC card inspection device.
[0021]
According to the present invention, it is possible to completely prevent the influence of the antenna or coil of the adjacent detection head, and it is particularly effective when the interference is great and the output of the read / write device has no margin.
[0022]
Then, as described in claim 4, a plurality of non-contact IC card inlets in which an IC module including a semiconductor chip and an antenna or a coil as a non-contact element are integrated are formed on a base sheet. A plurality of detection head portions each mounted with an antenna or a coil individually arranged at a position corresponding to each non-contact IC card inlet on the card substrate sheet with respect to the card substrate sheet arranged in an array. A non-contact IC card inspection method for sequentially inspecting a plurality of non-contact IC card inlets by selectively switching the detection head portion,
An inspection method for a non-contact IC card, wherein an inspection is performed while preventing interference using a means for preventing interference between adjacent detection head portions.
[0023]
According to the present invention, it is possible to arrange the detection heads densely without damaging the high-frequency output circuit of the read / write device by preventing the interference between the detection head portions, and as a result, the production efficiency is improved. Card base sheet that enables manufacture and inspection with a card base sheet in which multiple inlets in a plurality of non-contact IC card manufacturing in the same high process are arranged as closely as possible, leading to improved inspection speed and cost In addition, it is possible to prevent a large number of defective cards from occurring due to troubles caused by the manufacturing apparatus.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention are described below.
FIG. 4 shows a card base sheet 4 in which a plurality of inlets 3 formed by integrating the non-contact IC module 1 and the non-contact transmission element 2 are arranged in order to increase the manufacturing efficiency of the non-contact IC card. 5 is a view showing an outline of a non-contact IC card that is sandwiched between the back sheet 6 and laminated.
[0025]
In the non-contact transmission element 2, a metal foil antenna or coil for non-contact transmission is formed on the card base sheet 4 by etching, and a pattern for connecting to the IC module 1 at the end of the antenna or coil Parts are provided. And the connection part with the antenna or coil of IC module is connected with this pattern part using soldering, a conductive adhesive, etc., and becomes an inlet for non-contact IC cards. In some cases, the IC chip is directly connected to a connection portion with an antenna or a coil to form the inlet 3. Moreover, the non-contact transmission element 2 may form an antenna or a coil with the conducting wire which provided the insulating film other than the antenna or coil by metal foil.
[0026]
The card base sheet 4 formed as described above has a connection failure between the IC module and the antenna or the coil before the laminating process, a disconnection or short circuit of the antenna or the coil, a defect in the IC module itself, an inlet manufacturing time, and the like. It is inspected with an inspection device for the purpose of finding troubles.
[0027]
The inspection device for such a purpose is individually provided at a position corresponding to each inlet on the card base sheet with respect to the card base sheet 4 in which a plurality of inlets each of which an IC module and an antenna or a coil are integrated are arranged. A method is used in which a plurality of detection heads each equipped with an antenna or a coil mounted on is used, and the detection heads are selectively switched and sequentially inspected. FIG. 5 is a diagram showing an outline of such an inspection apparatus.
Hereinafter, an outline of the operation will be described with reference to FIG. In FIG. 5, reference numeral 7 denotes a detection head portion on which an antenna or a coil is mounted, 8 denotes a read / write device, and 10 denotes a detection head switching device for electrically selecting and switching a plurality of detection head portions 7.
[0028]
The plurality of detection head portions 7 are respectively installed at positions corresponding to the center portions of the respective inlets, and among the plurality of detection head portions 7, a changeover switch 101 inside the detection head switching device 10 is instructed by a controller portion (not shown). , Communication is performed between an inlet (not shown) corresponding to the detection head unit 7 and the read / write device 8.
[0029]
First, a detection head unit 7 located at a communication target inlet (not shown) is selected and connected to the read / write device 8 by the operation of the detection head switching device 10 according to an instruction from a controller (not shown). Next, an instruction for confirming the operation and function of the inlet is sent to the read / write device 8 from a controller (not shown). The read / write device 8 sends a read signal or a write signal to the detection head unit 7 that is selectively connected according to the command. The signal is electromagnetically or magnetically coupled with the antenna or coil of the communication target inlet via the detection head unit 7, and the information in the communication target inlet is sent to the read / write device 8 or the write information of the read / write device 8 is the communication target. Communication processing is performed to the inlet.
[0030]
If this communication process is performed in a predetermined manner, it is determined as a normal inlet. If communication is impossible or the predetermined communication process is not performed, an abnormal inlet is set. These pieces of information are sent from the read / write device 8 to a controller (not shown). The controller (not shown) displays inspection result information or controls an external device (not shown) based on this information. When the inspection of an arbitrary communication target inlet is completed as described above, a controller (not shown) instructs the detection head switching device 10 to change the connection to the next inlet, and the corresponding selector switch 101 is operated. The corresponding detection head unit 7 is connected to the read / write device 8. Then, the same communication process is performed again, and the communication target inlet is inspected.
[0031]
FIG. 6 is a diagram showing an outline of an example of an electrical equivalent circuit of the detection head unit 7 of such an inspection apparatus. 71 is an antenna or coil, 711 is an inductor of the antenna or coil, 712 is an equivalent series resistance of the antenna or coil, 73 is a matching circuit, 731 is a capacitor forming the matching circuit, 732 is another capacitor constituting the matching circuit is there. FIG. 7 is a diagram showing only the electrical equivalent circuit by extracting two adjacent detection head portions arranged at positions corresponding to the inlets of the card base sheet. Now, it is assumed that the detection head unit B is connected to the read / write device by the switching device described above, and the detection head unit A is not connected.
[0032]
However, as shown in FIG. 7, in the detection head portion A not connected to the read / write device, the inductor 712, which is an equivalent element of the antenna or coil, the series resistor 711, and the capacitor 732 that forms the matching circuit form the closed circuit 11. Therefore, as the distance between the antenna 712 of the detection head B to which the read / write device is connected and the inductor 712 of the detection head unit A not connected to the read / write device is closer to each other, the larger the mutual They are coupled by the inductance M. In FIG. 7, only the two adjacent ones are used, but actually, the detection head portions are arranged as many as the number of inlets mounted on the inlet base sheet. Therefore, there are a plurality of detection head portions coupled with each other's mutual inductance around the detection head portion performing communication. That is, the antenna or coil inductance of the detection head part connected to the connecting device by the mutual inductance as described above only by arranging a plurality of detection head parts adjusted by the matching circuit in a single state. Means that the function of the matching circuit is hindered.
[0033]
As described above, this not only reduces the energy field from the antenna or coil due to mismatch between the antenna or coil and the high-frequency output circuit of the read / write device, but also seriously damages the high-frequency output circuit. It is a big obstacle in building.
In order to solve the above problem, it has been a general method to solve the problem by increasing the interval between the plurality of detection head portions in order to reduce the influence of the mutual inductance.
The present invention is characterized in that interference preventing means 72 is provided between the antenna or coil 71 of the detection head section 7 and the matching circuit 73, as shown in the schematic configuration diagram of the detection head section in FIG. FIG. 2 is a diagram showing an electrical equivalent circuit of the detection head unit 7 of the present invention. FIG. 2A shows a resistor 721 inserted between the antenna or coil 71 and the matching circuit 73 as the interference preventing means 72. .
[0034]
12 is a 65 mm × 55 mm square coil having an antenna or coil 712 inductance of 0.55 μH and a series equivalent resistance Rs of 0.4Ω in the electrical equivalent circuit of FIG. When a detection head having a return loss of 35 dB at 56 MHz and a resonance circuit quality factor Q = 47 is arranged at a pitch of 60 mm, and a change in the return loss of one detection head when the interval is gradually widened is measured. It is a result. From this figure, in order to make the influence of adjacent detection heads completely negligible, it is necessary to make the interval 65 mm or more, and practically, an interval of about 20 mm with a return loss of 20 dB is necessary.
[0035]
In FIG. 13, a similar detection head is used, the detection heads are arranged at a pitch of 60 mm, and the change in the return loss of one detection head when the resistance Rv721 is changed in the electrical equivalent circuit of FIG. Is the result of when. Comparing FIG. 12 and FIG. 13, a practical return loss of 20 dB can be obtained by inserting a resistance Rv721 as an interference preventing means of about 1.8Ω and setting the quality factor Q of the resonance circuit to about 21. Thus, it is possible to secure a return loss that can be completely ignored at about 5Ω.
In this way, by interposing the resistor Rv as an interference preventing means and adjusting and controlling the quality factor Q, it is possible to prevent interference between the detection heads relatively easily and inexpensively. In the present invention, the resistance Rv is independently described as the interference preventing means. However, the present invention includes that the equivalent series resistance Rs of the coil or the antenna is intentionally adjusted to obtain the same effect.
[0036]
FIG. 2B is a diagram showing an electrical equivalent circuit of the detection head unit 7 representing another interference preventing means 72 of the present invention. As shown in the figure, the interference preventing means 72 is a closed circuit 11 formed by the inductor 712, which is an equivalent element of an antenna or a coil, a series resistor 711, and a capacitor 732 that forms a matching circuit shown in FIG. It is characterized in that a cutting device 722 of a cutting means for the purpose of physically or electrically cutting is inserted. By doing so, mutual inductance with the plurality of detection head units arranged as described above is not generated, and therefore the detection head unit performing communication is not affected at all.
FIG. 3 shows another matching circuit 73, which can be similarly applied.
[0037]
As described above, if the present invention is applied, it becomes possible to arrange the detection heads closely without damaging the high-frequency output circuit of the read / write device by preventing the interference between the detection head portions. As a result, it is possible to manufacture and inspect with a card base sheet in which multiple inlets in multiple non-contact IC card manufacturing in the same process with high manufacturing efficiency are arranged as closely as possible, improving inspection speed and increasing costs It is possible to configure a non-contact IC card inspection device that can prevent an increase in the size of the connected card base sheet and can prevent the occurrence of a large number of defective cards due to troubles caused by the manufacturing device.
[0038]
【Example】
A schematic configuration of an embodiment of the non-contact IC card inspection apparatus according to the present invention will be described with reference to FIG. In the figure, 1 is an IC module, 2 is a non-contact transmission element, 3 is an inlet in which an IC module and an antenna or a coil are integrated, 4 is a card substrate sheet in which a plurality of inlets are aligned, and 21 is an antenna or coil. And a detection head switching device for adjusting the quality factor Q as an interference prevention means, 8 is a read / write device, 10 is a detection head switching device that electrically switches a plurality of detection head portions 21, and 19 is a high-frequency signal line. And each connected to a plurality of detection heads. Reference numeral 9 denotes a controller for controlling the read / write device 8 and the detection head switching device 10.
[0039]
The plurality of detection head portions 21 are installed at positions corresponding to the central portions of the respective inlets. In FIG. 8, the plurality of detection head portions 21 are arranged on the upper side of the card base sheet 4, but may be arranged on the lower side.
[0040]
Of the plurality of detection head units 21, the detection head switching device 10 is connected to any one of the read / write devices 8 by an instruction from the controller 9, and communication is performed between the inlet 3 corresponding to the detection head unit 7 and the read / write device 8. Is done.
[0041]
First, the detection head unit 21 located at the communication target inlet is selected and connected to the read / write device 8 by the operation of the detection head switching device 10 according to an instruction from the controller 9. Next, an instruction for confirming the operation and function of the inlet is sent from the controller 9 to the read / write device 8. In the read / write device 8, a read signal or a write signal is sent through the high-frequency signal line 19 to the detection head unit 21 that is selectively connected according to the command. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 21, and the information in the communication target inlet is sent to the read / write device 8 or the write information of the read / write device 8 is the communication target. Communication processing is performed to the inlet.
[0042]
If this communication process is performed in a predetermined manner, it is determined as a normal inlet. If communication is impossible or the predetermined communication process is not performed, an abnormal inlet is set. These pieces of information are sent from the read / write device 8 to the controller 9, and the controller 9 displays inspection result information based on this information and controls an external device (not shown). If the inspection of an arbitrary communication target inlet is completed as described above, the controller 9 instructs the detection head switching device 10 to change the connection to the next inlet, and the corresponding detection head unit 21 is connected to the read / write device 8. Connected. Then, the same communication process is performed again, and the communication target inlet is inspected.
[0043]
FIG. 10A is a schematic configuration diagram of the detection head unit 21 used in this embodiment. FIG. 10B shows an electrical equivalent circuit thereof. In FIG. 10A or 10B, reference numeral 12 denotes an antenna or a coil substrate formed by etching using a metal foil. The antenna or coil 71 has 0.55 μH as the inductor 711 and 0.44Ω as the series equivalent resistance 712. Reference numeral 13 denotes a board on which a resistor 721 having a resistance value of 3.3Ω inserted as interference preventing means, a matching circuit composed of trimmer capacitors 731 and 732, and a connector for connection 14 are mounted. A signal from the substrate 13 is connected to the substrate 12 through connection lines 15 and 16 as shown in the figure through a spacer 17 made of a resin material or the like. Further, here, the spacer 17 is used for fixing the substrate 13 and the substrate 12, and if the substrate 13 and the substrate 12 can be fixed, it is not necessary to use the spacer 17. Furthermore, a material having a high magnetic permeability such as ferrite may be disposed using the space of the spacer 17 and used for adjusting the inductance of the antenna or the coil 71.
[0044]
Next, a schematic configuration of another embodiment of the non-contact IC card inspection apparatus according to the present invention will be described with reference to FIG. In the figure, 1 is an IC module, 2 is a non-contact transmission element, 3 is an inlet in which an IC module and an antenna or a coil are integrated, 4 is a card base sheet in which a plurality of inlets are arranged, 22 is an antenna or coil And a detection head section having a cutting means for cutting a closed circuit including an antenna or a coil as an interference prevention means, 8 is a read / write device, and 10 is a detection head switch for electrically selecting and switching a plurality of detection head sections 22. An apparatus 19 is a high-frequency signal line, and is connected to a plurality of detection heads. Reference numeral 20 denotes a control signal for controlling the cutting means mounted on the detection head unit, which is connected to each of the plurality of detection head units by the detection head switching device. Reference numeral 9 denotes a controller for controlling the read / write device 8 and the detection head switching device 10.
[0045]
The plurality of detection head portions 22 are respectively installed at positions corresponding to the central portion of each inlet. In FIG. 9, the plurality of detection head portions 22 are arranged on the upper side of the card base sheet 4, but may be arranged on the lower side.
[0046]
Of the plurality of detection head units 22, the detection head switching device 10 is connected to one of the read / write devices 8 according to an instruction from the controller 9, and communication is performed between the inlet 3 corresponding to the detection head unit 7 and the read / write device 8. Is done.
[0047]
First, the detection head switching device 10 is operated by the instruction of the controller 9 to select the detection head unit 22 located at the communication target inlet, and only the selected detection head unit 22 releases the cutting means, Connected. Next, an instruction for confirming the operation and function of the inlet is sent from the controller 9 to the read / write device 8. In the read / write device 8, a read signal or a write signal is sent through the high-frequency signal line 19 to the detection head unit 22 that is selectively connected according to the command. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 22, and the information in the communication target inlet is sent to the read / write device 8 or the write information of the read / write device 8 is the communication target. Communication processing is performed to the inlet.
[0048]
If this communication process is performed in a predetermined manner, it is determined that the inlet is normal. If communication is impossible or the predetermined communication process is not performed, an abnormal inlet is set. These pieces of information are sent from the read / write device 8 to the controller 9, and the controller 9 displays inspection result information based on this information and controls an external device (not shown). If the inspection of an arbitrary communication target inlet is completed as described above, the controller 9 instructs the detection head switching device 10 to change the connection to the next inlet, and the corresponding detection head unit 21 is connected to the read / write device 8. Connected. Then, the same communication process is performed again, and the communication target inlet is inspected.
[0049]
FIG. 11A is a schematic configuration diagram of the detection head unit 22 used in this embodiment. FIG. 11B shows an electrical equivalent circuit thereof. In FIG. 11A or 11B, reference numeral 12 denotes an antenna or a coil substrate formed by etching using a metal foil. The antenna or coil 71 has 0.55 μH as the inductor 711 and 0.44Ω as the series equivalent resistance 712. Reference numeral 23 denotes a substrate on which a mechanical relay 722, a matching circuit composed of trimmer capacitors 731 and 732, a connector 14 for connection, and a control signal connector 18 for controlling the mechanical relay 722 are mounted as means for cutting off the interference preventing means. A signal from the substrate 23 is connected to the substrate 12 through connection lines 15 and 16 as shown in the figure through a spacer 17 made of a resin material or the like. Here, the spacer 17 is used for fixing the substrate 23 and the substrate 12, and if the substrate 23 and the substrate 12 can be fixed, it is not necessary to use the spacer 17. Further, a material having a high magnetic permeability such as ferrite may be disposed using the space of the spacer 17 and used for adjusting the inductance of the antenna or the coil 71.
[0050]
Further, in the inspection apparatus of the present invention, if the detection head portions are prepared for the number of inlets on the card base sheet, detection is performed at a position corresponding to the central portion of each inlet without depending on the arrangement configuration of the inlets. By changing the installation of the head and changing the switching control procedure, it is possible to handle any card base sheet with any inlet arrangement without drastically changing the device.
[0051]
【The invention's effect】
As described above in detail, the interference between the detection head portions is prevented by mounting the interference prevention means between the antenna or coil of the detection head portion and the matching circuit.
Moreover, it was realized by inserting an inexpensive and easy resistor as an interference prevention means. Furthermore, as a means for preventing interference, it is possible to completely prevent the generation of mutual inductance by physically and electrically disconnecting the closed circuit that generates the mutual inductance existing in the detection head unit. By applying the present invention, it is possible to arrange the detection heads densely without damaging the high-frequency output circuit of the read / write device. As a result, a plurality of non-contact IC cards in the same process with high manufacturing efficiency Inspection reliability is ensured by making it possible to manufacture and inspect the card base sheet in which multiple inlets are arranged as closely as possible, and to check the operation by electrically switching each inlet one by one. For non-contact IC cards that not only increase the speed but also prevent the card base sheet from increasing in size, and prevent the occurrence of a large number of defective cards due to troubles caused by the manufacturing equipment. An inspection device can be configured.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a detection head unit of a non-contact IC card inspection apparatus according to the present invention.
FIG. 2 is an electrical equivalent circuit of a detection head portion of the non-contact IC card inspection apparatus according to the present invention.
FIG. 3 is an example of another matching circuit used in the detection head unit of the non-contact IC card inspection apparatus according to the present invention.
FIG. 4 is a schematic configuration diagram of a non-contact IC card.
FIG. 5 is a configuration diagram illustrating an outline of a conventional non-contact IC card inspection apparatus.
FIG. 6 is an electrical equivalent circuit of a detection head portion of a conventional non-contact IC card inspection device.
FIG. 7 is an electrical equivalent circuit for explaining the influence between detection head portions of a conventional non-contact IC card inspection apparatus.
FIG. 8 is a schematic configuration diagram of an embodiment of a non-contact IC card inspection apparatus according to the present invention.
FIG. 9 is a schematic configuration diagram of another embodiment of the non-contact IC card inspection apparatus according to the present invention.
FIG. 10 is a schematic configuration diagram of an embodiment of a detection head portion of the inspection apparatus for a non-contact IC card according to the present invention.
FIG. 11 is a schematic configuration diagram of an example of another detection head unit of the non-contact IC card inspection apparatus according to the present invention.
FIG. 12 is a diagram showing the degree of interference between conventional detection head units.
FIG. 13 is a diagram for explaining an effect on interference between detection heads of the present invention.
[Explanation of symbols]
1 ... IC module
2 ... Non-contact transmission element
3. Inlet
4 ... Card base sheet
5 .... Surface sheet
6 …… Back sheet
7, 21, 22... Detection head
・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Read / write device
9 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Controller
10 .... Detection head switching device
11 .... Closed circuit
12, 13, 23... Substrate
14 .... Connector for connection
15, 16 ... Connection lines
17 ..... Spacer
18 ... Control signal connector
19 ············· High frequency signal line
20 ..... Cutting means control signal line
71 ..... Antenna or coil
72... Interference prevention means
73 ..... matching circuit
101 ・ ・ ・ ・ ・ ・ ・ ・ Changeover switch
711 ... Series equivalent resistance
712 ... Inductor
721 ... Resistance
722 ... Cutting device
731, 732... Capacitors

Claims (4)

For a card base sheet in which a plurality of inlets for a non-contact IC card in which an IC module having a semiconductor chip and an antenna or coil as a non-contact element are integrated are arranged on the base sheet. A plurality of detection head portions each having an antenna or a coil individually disposed at a position corresponding to each non-contact IC card inlet on the card base sheet, and selectively detecting the detection head portions. A non-contact IC card inspection device for sequentially inspecting a plurality of non-contact IC card inlets by switching,
An inspection apparatus for a non-contact IC card, comprising an interference preventing means between the detection head section and the adjacent detection head section. 2. The non-contact IC card inspection device according to claim 1, wherein the interference prevention means is a means for adjusting a quality factor Q of a resonance circuit including an antenna or a coil mounted on the detection head unit. The non-contact IC card inspection device according to claim 1, wherein the interference prevention unit is a cutting unit that cuts a closed circuit including an antenna or a coil mounted on the detection head unit. For a card base sheet in which a plurality of inlets for a non-contact IC card in which an IC module having a semiconductor chip and an antenna or coil as a non-contact element are integrated are arranged on the base sheet. Preparing a plurality of detection head portions each equipped with an antenna or a coil individually arranged at a position corresponding to each non-contact IC card inlet on the card base sheet. A non-contact IC card inspection method for sequentially inspecting a plurality of non-contact IC card inlets by switching,
An inspection method for a non-contact IC card, wherein the inspection is performed while preventing interference using a means for preventing interference between adjacent detection head portions.

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