JP2000132643A - Inspecting device for non-contact ic card and its method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the productivity and quality by preventing an interference between detecting heads so as to surely confirm operation and a function without making a trouble in a device in the state of a card base material sheet state, where inlets are plurally alignadly arranged, before making a card even in the case of generating a defective connection of an IC module and an antenna connection part or incorporation of a defective IC module in the production of a noncontact IC card so as to prevent production of a defective card and to reduce wasteful consumption of materials, the increase of the producing cost and incorporation of detective cards into a finished card. SOLUTION: With respect to the card base material sheet obtained by aligning arranging plural inlets for the non-contact IC card obtained by integrating the IC module and the antenna, etc., 71 of a non-contact element on a sheet, the inspecting device for a non-contact IC card and its method prepare plural detecting head parts, selectively switch these to successively inspect the inlets for the non-contact IC card and use a means 72 preventing interference between detecting head parts 72 adjacent to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact type information medium,
Specifically, this is a technology related to the manufacture of non-contact IC cards used in the fields of office automation (OA), factory automation (FA), and security, and has a defective IC module in the manufactured non-contact IC card. The present invention relates to an effective technique for preventing a non-contact IC card from being mixed or a manufactured non-contact IC card from causing a trouble due to an inlet failure.

[0002]

2. Description of the Related Art In recent years, with the advent of a non-contact IC card incorporating a semiconductor memory or the like, the storage capacity has been dramatically increased as compared with a conventional magnetic card, and the card can be inserted into a slot of a read / write device. It became unnecessary and convenience was improved. A non-contact IC card is provided with a field of vibration energy such as a high-frequency electromagnetic field, ultrasonic waves, and light in a space, and absorbs and rectifies the energy to form a DC power source for driving an electronic circuit built in the card. Either use the frequency of the AC component of the field as it is, or multiply or divide it to obtain an identification signal, and transmit this identification signal to an information processing circuit of a semiconductor device via a non-contact transmission element such as an antenna or a coil or a capacitor. Is what you do.

The terms "antenna" and "coil" used herein have the following meanings. The former is an element that performs communication by radio waves, and its shape and material can be arbitrarily designed in accordance with standards and applications. The latter is an element that performs communication by a magnetic field, and has a conductive wire or a conductor pattern wound in a coil shape.

[0004] In particular, many non-contact IC cards for the purpose of authentication and simple counting processing are hard-wired wireless authentication (R) without a battery and a CPU (Central Processing Unit).
adio Frequency IDentifica
This is hereinafter simply referred to as RF-ID. With the advent of the non-contact IC card, the security against forgery and tampering is improved as compared with the magnetic card, and at the time of passing through the gate, the card carrier can use the communication function unit of the read / write device attached to the gate device. Or simply touch the card carried by the user to the communication function section of the read / write device, and the complexity of data communication of removing the card from the case and inserting the card into the slot of the read / write device has been reduced.

[0005] A non-contact IC card is internationally standardized by the ISO standard. Generally, an IC card generally includes an IC module such as a semiconductor memory in a card body made of plastic or the like. An antenna or a coil which is a non-contact transmission element is incorporated. And
An electromagnetic field or an alternating magnetic field radiated from the communication function unit of the read / write device is detected by an antenna or a coil inside the card, and coupled to each other to exchange data with the read / write device.

[0006] Generally, the non-contact IC card is prepared as follows. An antenna or coil made of metal foil for non-contact transmission is formed on the card base sheet by etching, and a pattern portion for connecting to an IC module is provided at the end of the antenna or coil. Then, the connection portion of the IC module with the antenna or coil is connected to the pattern portion by soldering or using a conductive adhesive or the like, and serves as a non-contact IC card inlet. In some cases, the IC chip is directly connected to a connection portion with an antenna or a coil to form an inlet. Thereafter, the card base sheet on which the IC module is mounted and the inlet is formed is sandwiched between the front and back sheets, and is subjected to lamination processing to create a card body.

In order to increase the adhesive strength of the front and back sheets, a method of laminating the front and back sheets while applying an adhesive to the front and back sheets can be considered. In addition, there is a method of sealing the inlet-formed card base sheet by injection (injection molding) to produce a card body.

[0008] In addition to the antenna or coil made of metal foil, it is conceivable that the antenna or coil for non-contact transmission is formed by a conductive wire coated with an insulating film.

However, in order to enhance the production efficiency, a method capable of producing a plurality of non-contact IC cards in the same process is desirable from the viewpoint of productivity. That is, an antenna or a coil formed by etching a metal foil or an antenna or a coil formed by a conductive wire coated with an insulating film is arranged and arranged on a card base sheet having a size capable of arranging a plurality of inlets. Alternatively, an IC module is mounted on the coil end portion to form a card base sheet composed of a plurality of inlets. The card base sheet is sandwiched between front and back sheets, and after being laminated, cut into a predetermined size. This is a method of manufacturing a processed card body. Such a method is disclosed in Japanese Patent Application Laid-Open No. 62-12729.
No. 0 publication.

[0010] The non-contact IC card manufactured in this manner utilizes a non-contact IC card read / write device for confirming the operation and function after completion, for example, as disclosed in Japanese Patent Application Laid-Open No. 9-102221. The inspection device using such a communication device performs a final inspection in the non-contact IC card manufacturing process, and detects a malfunctioning or malfunctioning card.

[0011]

However, since the inspection for malfunctions and malfunctions is made after the completion of the card,
Even if there is a connection failure between the IC module and the antenna or the coil, the card is manufactured normally,
Only after completion of the card is the result that the card is found to be defective. This means that a problem may occur in the manufacturing equipment during the process of mounting the IC module on the antenna or coil termination, and if there is a problem with the antenna, coil, IC module, or their connection, a large number of defective cards may be produced. I do.

Therefore, if an inspection is performed on a card base sheet in which a plurality of inlets in which an IC module and an antenna or a coil are integrated are arranged in a line, it is possible to prevent the occurrence of a large number of defective cards due to troubles caused by the manufacturing apparatus. It becomes possible.

[0013] In view of the inspection speed, such an inspection apparatus is provided with one antenna or coil mounted on a card base sheet in which a plurality of inlets in which an IC module and an antenna or a coil are integrated are arranged and arranged. Rather than moving the detection head over the target inlet,
A method in which a plurality of detection heads each having an antenna or a coil individually arranged at a position corresponding to each inlet on the card base sheet and using a plurality of detection heads to selectively switch and sequentially inspect the detection heads is advantageous in terms of time. It is. Also, in consideration of the cost of the card base sheet, the interval between the inlets arranged on the card base sheet is as close as possible to avoid the cost increase due to the enlargement of the card base sheet. It is required to arrange them, that is, the detection heads are also densely arranged.

In response to the above requirements, particularly when the detection heads are densely arranged, the interference between the detection heads increases due to the approach of the antenna or coil, and the interference between the antenna or coil and the high-frequency output circuit of the read / write device. In addition to the decrease in the energy field from the antenna or the coil due to the mismatch, the high-frequency output circuit may be seriously damaged, which has been a major obstacle in realizing an inspection apparatus having the above-described functions. .

According to the present invention, as described above, a plurality of inlets in which an IC module and an antenna or a coil are integrated are arranged on a card base sheet in which a plurality of inlets are arranged.
The purpose of this is to solve the problems in performing the operation and the function check, and to check the operation function in a card base sheet state in which a plurality of inlets before the carding step are arranged and arranged in the card manufacturing process. It is an object of the present invention to provide an inspection technique capable of overcoming the above-mentioned obstacles in an inspection apparatus for improving quality and preventing occurrence of a large number of troubles. It is an object of the present invention to provide an inspection technique that makes it possible to easily, quickly, safely, and accurately perform the above-described inspection even when the inspection is performed.

[0016]

Means provided by the present invention to solve the above-mentioned problems include: an IC module having a semiconductor chip; an antenna as a non-contact element; A plurality of non-contact IC card inlets, each of which has a coil integrated therewith, are arranged on a base sheet. And a plurality of non-contact IC card inlets are sequentially inspected by selectively switching the detection heads, each of which has an antenna or a coil individually disposed at a position corresponding to the non-contact IC card. A non-contact IC card inspection apparatus, comprising: a non-contact IC card inspection device, comprising: an interference preventing unit between the detection head unit and an adjacent detection head unit. An inspection apparatus for a card.

According to the present invention, by preventing interference between the detection head portions, the detection heads can be densely arranged without seriously damaging the high-frequency output circuit of the read / write device. A card that can be manufactured and inspected on a card base sheet in which a plurality of inlets are aligned and arranged as densely as possible in the production of multiple non-contact IC cards in the same process with high production efficiency, leading to an increase in inspection speed and cost. It is possible to prevent an increase in the size of the base sheet, and to prevent the occurrence of a large number of defective cards due to a trouble or the like caused by the manufacturing apparatus.

According to a second aspect of the present invention, the first aspect has a basic configuration. In particular, the interference preventing means includes a resonance circuit including an antenna or a coil mounted on the detection head unit. An inspection device for a non-contact IC card, which is a quality factor Q adjusting means.

According to the present invention, it is possible to prevent interference between detection heads relatively inexpensively and easily. Particularly, when the interference is small or when there is a relatively large margin in the high frequency output of the read / write device. It is valid.

According to a third aspect of the present invention, the first aspect is a basic configuration. In particular, the interference prevention means cuts a closed circuit including an antenna or a coil mounted on the detection head. An inspection device for a non-contact IC card, which is a cutting means.

According to the present invention, the influence of the antenna or coil of the adjacent detection head can be completely prevented,
This is particularly effective when the interference is significant and the output of the read / write device has no margin.

Then, as described in claim 4,
An IC module having a semiconductor chip, and a non-contact IC card inlet formed by integrating an antenna or a coil as a non-contact element, with respect to a card base sheet in which a plurality of non-contact IC card inlets are arranged on the base sheet. A plurality of detection heads each having an antenna or a coil individually arranged at a position corresponding to each non-contact IC card inlet on the card base sheet, and selectively detecting the detection heads. Non-contact IC that sequentially inspects a plurality of non-contact IC card inlets by switching
An inspection method for a non-contact IC card, wherein the inspection is performed while preventing interference using interference prevention means between the detection head unit and an adjacent detection head unit.

According to the present invention, by preventing interference between the detection head portions, the detection heads can be densely arranged without seriously damaging the high-frequency output circuit of the read / write device. A card that can be manufactured and inspected on a card base sheet in which a plurality of inlets are aligned and arranged as densely as possible in the production of multiple non-contact IC cards in the same process with high production efficiency, leading to an increase in inspection speed and cost. It is possible to prevent an increase in the size of the base sheet, and to prevent the occurrence of a large number of defective cards due to a trouble or the like caused by the manufacturing apparatus.

[0024]

Embodiments of the present invention will be described below. FIG. 4 shows a non-contact IC module 1 and a non-contact transmission element 2 for improving the manufacturing efficiency of the non-contact IC card.
FIG. 2 is a diagram showing an outline of a non-contact IC card in which a card base sheet 4 in which a plurality of inlets 3 formed integrally with each other are arranged and arranged between a top sheet 5 and a back sheet 6 and laminated.

The non-contact transmission element 2 has a metal foil antenna or coil for non-contact transmission formed on the card base sheet 4 by etching, and further, the terminal of the antenna or coil is connected to the IC module 1. Pattern portion is provided. The connection portion of the IC module with the antenna or coil is connected to this pattern portion by soldering or using a conductive adhesive, etc.
Inlet for card. In addition, the IC chip is directly connected to a connection portion with an antenna or a coil, and the inlet 3
In some cases, In addition, the non-contact transmission element 2 may form an antenna or a coil by a conductive wire provided with an insulating film, in addition to an antenna or a coil made of a metal foil.

The card base sheet 4 formed as described above has a connection failure between the IC module and the antenna or the coil, a disconnection or short circuit of the antenna or the coil, a defect in the IC module itself, an inlet before the laminating step. Inspection is performed by an inspection device that aims to discover troubles during manufacturing.

The inspection apparatus for such a purpose has a position corresponding to each inlet on the card base sheet with respect to the card base sheet 4 in which a plurality of inlets in which an IC module and an antenna or a coil are integrated are arranged and arranged. A method is used in which a plurality of detection heads each having an antenna or a coil individually arranged thereon are used, and the detection heads are selectively switched and sequentially inspected. FIG. 5 is a view schematically showing such an inspection apparatus. The outline of the operation will be described below with reference to FIG. In FIG. 5, reference numeral 7 denotes a detection head unit on which an antenna or a coil is mounted, 8 denotes a read / write device, and 10 denotes a detection head switching device for electrically selectively switching a plurality of detection head units 7.

The plurality of detection heads 7 are respectively installed at positions corresponding to the central portions of the respective inlets. Among the plurality of detection heads 7, switching within the detection head switching device 10 is performed according to an instruction from a controller (not shown). The switch 101 is connected to any one of the read / write devices 8, and communication is performed between an inlet (not shown) corresponding to the detection head unit 7 and the read / write device 8.

First, the detection head unit 7 located at the communication target inlet (not shown) is selected by the operation of the detection head switching device 10 according to the instruction of the controller (not shown).
It is connected to the read / write device 8. Next, the operation of the inlet,
An instruction for performing the function check is sent from the controller (not shown) to the read / write device 8. Read / write device 8
Then, a read signal or a write signal is transmitted to the detection head unit 7 selectively connected in accordance with the instruction. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 7, and the information in the communication target inlet is transmitted to the read / write device 8, or
Communication processing is performed on the write information of the read / write device 8 to the communication target inlet.

If this communication process is performed as specified, it is determined that the inlet is normal, and if communication is not possible or if the predetermined communication process is not performed, the inlet is abnormal. These pieces of information are sent from the read / write device 8 to a controller (not shown), and the controller (not shown) displays inspection result information based on the information and controls an external device (not shown). When the inspection of an arbitrary communication target inlet is completed as described above, the controller (not shown) instructs the detection head switching device 10 to change the connection to the next inlet, and the corresponding switch 101 is operated. The corresponding detection head unit 7 is connected to the read / write device 8. Then, the same communication processing is performed again, and the communication target inlet is inspected.

FIG. 6 shows a detection head unit 7 of such an inspection apparatus.
FIG. 3 is a diagram schematically showing an example of an electrical equivalent circuit of FIG. 71 is an antenna or coil, 711 is an inductor of the antenna or coil, 712 is an equivalent series resistance of the antenna or coil, 73 is a matching circuit, 731 is a capacitor forming a matching circuit, and 732 is another capacitor forming a matching circuit. is there. FIG. 7 is a diagram showing two adjacent detection heads arranged at positions corresponding to the inlets of the card base sheet and extracting only two electrical equivalent circuits. Now, it is assumed that the detection head unit B is connected to the read / write device by the above-described switching device, and the detection head unit A is not connected.

However, as shown in FIG. 7, in the detection head section A not connected to the read / write device, the inductor 712, the series resistor 711, and the capacitor 732 forming a matching circuit, which are equivalent elements of an antenna or a coil, are closed circuits. 11, the antenna or the coil 712 of the detection head B connected to the read / write device and the inductor 712 of the detection head unit A not connected to the read / write device are close to each other. The larger the mutual inductance M, the larger the mutual inductance. Although only two adjacent heads are shown in FIG. 7, the number of detection heads is actually equal to the number of inlets mounted on the inlet base sheet. Therefore, there are a plurality of detection head units that are coupled with each other by the mutual inductance around the detection head unit performing communication.
In other words, if only a plurality of detection heads whose input impedances are adjusted by a matching circuit in a single state are arranged, as described above, the inductance of the antenna or coil of the detection head unit connected to the connection device by the mutual inductance as described above. Is complicatedly changed, and as a result, the function of the matching circuit is hindered.

As described above, this not only reduces the energy field from the antenna or coil due to the mismatch between the antenna or coil and the high-frequency output circuit of the read / write device, but also causes serious damage to the high-frequency output circuit. This is a major obstacle in building an inspection device. In order to solve the above problem, it has been a general method to increase the distance between a plurality of detection heads in order to reduce the influence of the mutual inductance. The present invention is characterized in that an interference preventing means 72 is provided between the antenna or coil 71 of the detection head unit 7 and the matching circuit 73 as shown in the schematic configuration diagram of the detection head unit in FIG. FIG. 2 is a diagram showing an electrical equivalent circuit of the detection head unit 7 according to the present invention.
FIG. 2A shows that a resistor 721 is inserted between the antenna or coil 71 and the matching circuit 73 as the interference preventing means 72.

FIG. 12 shows an electrical equivalent circuit of FIG. 2A in which the antenna or coil 712 has an inductance of 0.55 μH and a series equivalent resistance Rs of 0.4Ω.
A detection head formed of a square coil of mm × 55 mm, having a return loss of 35 dB at a frequency of 13.56 MHz by a matching circuit, and a quality factor Q = 47 of a resonance circuit is arranged at a pitch of 60 mm, and the spacing is gradually increased. This is a result when a change in the return loss of one detection head is measured. From this figure, it is necessary to provide an interval of 65 mm or more in order to make the influence of the adjacent detection heads completely negligible.
An interval of 0 mm is required.

FIG. 13 shows a change in the return loss of one of the detection heads when the same detection head is used and the detection heads are arranged at a pitch of 60 mm and the resistance Rv721 is changed in the electric equivalent circuit of FIG. Is the result of the measurement. Comparing FIG. 12 with FIG. 13, it is possible to obtain a practical return loss of 20 dB by inserting the resistor Rv721, which is the interference prevention means, at about 1.8Ω and setting the quality factor Q of the resonance circuit at about 21. , About 5Ω, it is possible to secure a completely negligible return loss. As described above, by inserting the resistor Rv as the interference prevention means and adjusting and controlling the quality factor Q, it is possible to relatively easily and inexpensively prevent interference between the detection heads. In the present invention, the resistance Rv is independently described as the interference prevention means. However, the equivalent series resistance Rs of the coil or the antenna is intentionally adjusted,
Obtaining a similar effect is also included in the present invention.

FIG. 2B is a diagram showing an electrical equivalent circuit of the detection head unit 7 representing another interference prevention means 72 of the present invention. As shown in the figure, the interference prevention means 72 is a closed circuit 11 formed by an inductor 712, a series resistor 711, and a capacitor 732 forming a matching circuit, which are shown in FIG. It is characterized in that a cutting device 722 of a cutting means for physically or electrically cutting the object is inserted. By doing so, the mutual inductance with the plurality of detection heads described above is not generated, and therefore, the detection head performing communication is not affected at all. FIG. 3 shows another matching circuit 73, which can be similarly applied.

As described above, if the present invention is applied, it is possible to prevent the interference between the detection head portions and to arrange the detection heads densely without seriously damaging the high-frequency output circuit of the read / write device. As a result, as a result, it is possible to manufacture and inspect a card base sheet in which a plurality of inlets in the production of a plurality of non-contact IC cards in the same process with high production efficiency are arranged as densely as possible, thereby improving the inspection speed and Non-contact I that can prevent the card base sheet from increasing in size, which leads to cost increase, and prevent the occurrence of a large number of defective cards due to troubles caused by manufacturing equipment.
An inspection device for C cards can be configured.

[0038]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A schematic configuration of a noncontact IC card inspection apparatus according to an embodiment of the present invention will be described with reference to FIG.
In the figure, 1 is an IC module, 2 is a non-contact transmission element,
Reference numeral 3 denotes an inlet in which an IC module and an antenna or a coil are integrated, 4 denotes a card base sheet in which a plurality of inlets are arranged and arranged, 21 denotes an antenna or a coil, and a quality factor Q is adjusted as interference prevention means. The detection head unit 8 is a read / write device, 10 is a detection head switching device for electrically selectively switching the plurality of detection head units 21, and 19 is a high-frequency signal line, which is connected to each of the plurality of detection head units. . Reference numeral 9 denotes a controller for controlling the read / write device 8 and the detection head switching device 10.

The plurality of detection heads 21 are respectively installed at positions corresponding to the center of each inlet.
In FIG. 8, the plurality of detection heads 21 are arranged on the upper side of the card base sheet 4, but may be arranged on the lower side.

The detection head switching device 10 is connected to any one of the read / write devices 8 by the instruction of the controller 9 among the plurality of detection head portions 21, and the inlet 3 and the read / write device 8 corresponding to the detection head portion 7 are connected.
Communication is performed with the.

First, the detection head switching device 10 is operated by the instruction of the controller 9 to select the detection head unit 21 located at the communication target inlet, and is connected to the read / write device 8. Next, an instruction for confirming the operation and function of the inlet is sent from the controller 9 to the read / write device 8. The read / write device 8 sends a read signal or a write signal through the high-frequency signal line 19 to the detection head unit 21 selectively connected according to the instruction. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 21,
A communication process is performed between the information in the communication target inlet to the read / write device 8 and the write information of the read / write device 8 to the communication target inlet.

If this communication process is performed as specified, it is determined that the inlet is normal, and if communication is not possible or if the predetermined communication process is not performed, the inlet is abnormal. These information are sent from the read / write device 8 to the controller 9.
The controller 9 displays inspection result information based on this information and controls an external device (not shown). When the inspection of an arbitrary communication target inlet is completed as described above, the controller 9 instructs the detection head switching device 10 to change the connection to the next inlet, and the corresponding detection head unit 21 communicates with the read / write device 8. Connected. Then, the same communication processing is performed again, and the communication target inlet is inspected.

FIG. 10A is a schematic configuration diagram of the detection head unit 21 used in this embodiment. FIG. 10B shows an electrical equivalent circuit thereof. FIG. 10 (a)
Alternatively, in FIG. 10B, reference numeral 12 denotes an antenna or a coil substrate formed by etching using a metal foil. The antenna or coil 71 includes an inductor 71
1 as 0.55 μH, and series equivalent resistance 712 as 0.
It has 44Ω. Reference numeral 13 denotes a board on which a resistor 721 having a resistance value of 3.3 Ω inserted as interference prevention means, a matching circuit composed of trimmer capacitors 731 and 732, and a connector 14 are mounted. Signals from the substrate 13 are connected to the substrate 12 via connection lines 15 and 16 via spacers 17 made of a resin material or the like, as shown in the figure. Further, here, the spacer 17 is used for fixing the substrate 13 and the substrate 12, and if the substrate 13 and the substrate 12 can be fixed, it is not necessary to use the spacer 17. Further, a material having a high magnetic permeability such as ferrite is disposed by utilizing the space of the spacer 17, and the antenna or the coil 7 is disposed.
1 may be used for adjusting the inductance.

Next, another embodiment of the non-contact IC card inspection apparatus according to the present invention will be described with reference to FIG. In the drawing, 1 is an IC module, 2 is a non-contact transmission element, 3 is an inlet in which the IC module and an antenna or a coil are integrated, 4 is a card base sheet in which a plurality of inlets are arranged and arranged, 22 is an antenna or a coil A detection head unit having cutting means for cutting a closed circuit including an antenna or a coil as interference prevention means, 8 is a read / write device, and 10 is a detection head switch for electrically selecting and switching a plurality of detection head units 22 The device 19 is a high-frequency signal line, which is connected to each of the plurality of detection heads. Reference numeral 20 denotes a control signal for controlling cutting means mounted on the detection head unit, which is connected to a plurality of detection head units by a detection head switching device. Reference numeral 9 denotes a controller for controlling the read / write device 8 and the detection head switching device 10.

The plurality of detection heads 22 are respectively installed at positions corresponding to the center of each inlet.
In FIG. 9, the plurality of detection head units 22 are arranged on the upper side of the card base sheet 4, but may be arranged on the lower side.

Among the plurality of detection head units 22, the detection head switching device 10 is connected to any one of the read / write devices 8 by the instruction of the controller 9, and the inlet 3 and the read / write device 8 corresponding to the detection head unit 7 are connected.
Communication is performed with the.

First, the detection head switching device 10 is operated by the instruction of the controller 9 to select the detection head unit 22 located at the communication target inlet, and the disconnection means is released only for the selected detection head unit 22 to read / write. Connected to device 8. Next, an instruction for confirming the operation and function of the inlet is sent from the controller 9 to the read / write device 8. In the read / write device 8, the high-frequency signal line 19 is connected to the detection head 22 selectively connected according to the instruction.
A read signal or a write signal.
The signal is electromagnetically or magnetically coupled with the antenna or coil of the communication target inlet via the detection head unit 22, and the information in the communication target inlet is read / written by the read / write device 8.
Or the write information of the read / write device 8 is communicated to the communication target inlet.

If this communication process is performed as specified, it is determined that the inlet is normal, and if communication is not possible or if the predetermined communication process is not performed, the inlet is abnormal. These information are sent from the read / write device 8 to the controller 9.
The controller 9 displays inspection result information based on this information and controls an external device (not shown). When the inspection of an arbitrary communication target inlet is completed as described above, the controller 9 instructs the detection head switching device 10 to change the connection to the next inlet, and the corresponding detection head unit 21 communicates with the read / write device 8. Connected. Then, the same communication processing is performed again, and the communication target inlet is inspected.

FIG. 11A is a schematic configuration diagram of the detection head unit 22 used in this embodiment. FIG. 11B shows an electrical equivalent circuit thereof. FIG. 11 (a)
Alternatively, in FIG. 11B, reference numeral 12 denotes an antenna or a coil substrate formed by etching using a metal foil. The antenna or coil 71 includes an inductor 71
1 as 0.55 μH, and series equivalent resistance 712 as 0.
It has 44Ω. 23 is a mechanical relay 722, a trimmer capacitor 731 as cutting means of the interference prevention means,
732 and matching connector 1
4. A board on which the control signal connector 18 for controlling the mechanical relay 722 is mounted. Signals from the substrate 23 are connected to the substrate 12 through connection lines 15 and 16 via spacers 17 made of a resin material or the like, as shown in the figure. Further, here, the spacer 17 is used for fixing the substrate 23 and the substrate 12, and it is not necessary to use the spacer 17 as long as the substrate 23 and the substrate 12 can be fixed. Further, a material having high magnetic permeability such as ferrite is arranged by utilizing the space of the spacer 17, and the antenna or the coil 7 is disposed.
1 may be used for adjusting the inductance.

Further, in the inspection apparatus of the present invention, if the number of the detection heads is prepared by the number of the inlets on the card base sheet, the detection heads correspond to the central portions of the respective inlets without depending on the arrangement of the inlets. By simply changing the installation position of the detection head unit and simply changing the switching control procedure, it is possible to handle card base sheets having any inlet arrangement without drastically changing the apparatus.

[0051]

As described above in detail, the interference between the detection heads is prevented by mounting the interference preventing means between the antenna or the coil of the detection head and the matching circuit. In addition, it is realized by inserting an inexpensive and easy resistor as interference prevention means. Furthermore, as an interference prevention means, it is possible to completely prevent generation of mutual inductance by physically and electrically disconnecting a closed circuit that generates mutual inductance existing in the detection head unit. By applying the present invention, it is possible to arrange the detection heads densely without seriously damaging the high-frequency output circuit of the read / write device, and as a result, a plurality of non-contact IC cards in the same process with high manufacturing efficiency The reliability of inspection is high because it enables production and inspection on card base sheets in which multiple inlets are arranged as densely as possible in the production, and ensures that each inlet is electrically switched one by one to confirm operation. For non-contact IC cards that not only improves speed but also prevents the card base sheet from increasing in size, which leads to increased costs, and also prevents the occurrence of a large number of defective cards due to troubles caused by manufacturing equipment. An inspection device can be configured.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a detection head unit of a non-contact IC card inspection device according to the present invention.

FIG. 2 is an electrical equivalent circuit of a detection head unit of the non-contact IC card inspection device according to the present invention.

FIG. 3 is an example of another matching circuit used in the detection head unit of the non-contact IC card inspection device according to the present invention.

FIG. 4 is a schematic configuration diagram of a non-contact IC card.

FIG. 5 is a configuration diagram schematically illustrating a conventional non-contact IC card inspection apparatus.

FIG. 6 is an electrical equivalent circuit of a detection head of a conventional non-contact IC card inspection device.

FIG. 7 is an electrical equivalent circuit for explaining an influence between detection heads of a conventional non-contact IC card inspection device.

FIG. 8 is a schematic configuration diagram of an embodiment of a non-contact IC card inspection apparatus according to the present invention.

FIG. 9 is a schematic configuration diagram of another embodiment of the non-contact IC card inspection apparatus according to the present invention.

FIG. 10 is a schematic configuration diagram of an embodiment of a detection head unit of the non-contact IC card inspection device according to the present invention.

FIG. 11 is a schematic configuration diagram of an example of another detection head unit of the non-contact IC card inspection device according to the present invention.

FIG. 12 is a diagram showing a degree of interference between conventional detection head units.

FIG. 13 is a diagram for explaining the effect of the present invention on interference between detection heads.

[Explanation of symbols]

 1 IC module 2 Non-contact transmission element 3 Inlet 4 · Card base sheet 5 ·········· Top sheet 6 ······· Back face sheet 7, 21, 22 ··· Detection head section 8 ····· ···· Read / write device 9 ······ Controller 10 ······ Detection head switching device 11 ·········· Closed circuit 12, 13, 23 ..Substrate 14... Connection connector 15, 16... Connection line 17... Spacer 18. Connector 19 High frequency signal line 20 Cutting means control signal line 71 Antenna or coil 72: Anti-interference means 73: Matching circuit 101: Changeover switch 711: Series equivalent resistance 712: ······· Inductor 721 ······· Resistance 722 ······· Cutting device 731 and 732 ····· Capacitor

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kazuo Kobayashi F-term (reference), 1-5-1, Taito, Taito-ku, Tokyo 2C005 MA21 NA08 NA09 RA04 5B035 CA01 CA23 5B058 CA17 KA28

Claims (4)

[Claims] 1. An IC module having a semiconductor chip,
A plurality of non-contact IC card inlets formed by integrating an antenna or a coil as a non-contact element are provided on the card base sheet with respect to a plurality of card base sheets arranged and arranged on the base sheet. A plurality of non-contact ICs having a plurality of detection heads each having an antenna or a coil individually arranged at a position corresponding to each non-contact IC card inlet, and selectively switching the detection heads. What is claimed is: 1. A non-contact IC card inspection device for sequentially inspecting card inlets, comprising: a detection head unit and an adjacent detection head unit. 2. The non-contact IC card according to claim 1, wherein said interference preventing means is means for adjusting a quality factor Q of a resonance circuit including an antenna or a coil mounted on said detection head unit. Inspection equipment. 3. The inspection for a non-contact IC card according to claim 1, wherein said interference prevention means is a cutting means for cutting a closed circuit including an antenna or a coil mounted on said detection head unit. apparatus. 4. An IC module having a semiconductor chip,
A plurality of non-contact IC card inlets formed by integrating an antenna or a coil as a non-contact element are provided on the card base sheet with respect to a plurality of card base sheets arranged and arranged on the base sheet. A plurality of non-contact ICs are prepared by preparing a plurality of detection heads each having an antenna or a coil individually arranged at a position corresponding to each non-contact IC card inlet, and selectively switching the detection heads. What is claimed is: 1. An inspection method for a non-contact IC card for sequentially inspecting card inlets, wherein the inspection is performed while preventing interference using interference prevention means between the detection head unit and an adjacent detection head unit. Inspection method for contact IC card.