JP2002042083A - Non-contact communication type information carrier - Google Patents
Non-contact communication type information carrierInfo
- Publication number
- JP2002042083A JP2002042083A JP2000227455A JP2000227455A JP2002042083A JP 2002042083 A JP2002042083 A JP 2002042083A JP 2000227455 A JP2000227455 A JP 2000227455A JP 2000227455 A JP2000227455 A JP 2000227455A JP 2002042083 A JP2002042083 A JP 2002042083A
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- JP
- Japan
- Prior art keywords
- insulating member
- information carrier
- coil
- booster coil
- type information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、アンテナコイルが
一体形成されたＩＣ素子とブースタコイルとを有する非
接触通信式情報担体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact communication type information carrier having an IC element integrally formed with an antenna coil and a booster coil.
【０００２】[0002]
【従来の技術】従来より、絶縁性の基体内にＩＣ素子と
当該ＩＣ素子の端子部に電気的に接続されたアンテナコ
イルとを備え、リーダライタからの電力の受給及びリー
ダライタとの間のデジタル信号の送受信を電磁波を用い
て非接触で行う非接触式の情報担体が知られている。こ
の種の情報担体としては、その外形により、カード形、
コイン形又はボタン形などがある。2. Description of the Related Art Conventionally, an IC element and an antenna coil electrically connected to a terminal portion of the IC element are provided in an insulating base, so as to receive power from a reader / writer and to establish a connection between the reader and writer. 2. Description of the Related Art A non-contact information carrier that transmits and receives digital signals in a non-contact manner using electromagnetic waves is known. Depending on the outer shape, this type of information carrier has a card shape,
There is a coin shape or a button shape.
【０００３】従来、この種の情報担体としては、アンテ
ナコイルを絶縁部材にパターン形成したもの、或いは、
巻線からなるアンテナコイルを絶縁部材に担持したもの
が用いられているが、近年に至って、アンテナコイルと
ＩＣ素子との接続点の保護処理や防湿対策が不要で安価
に作成できること、及び絶縁部材に曲げやねじれ等のス
トレスが作用した場合にもコイルに断線を生じることが
なく耐久性に優れることなどから、ＩＣ素子自体にアン
テナコイルが一体形成されたＩＣ素子を絶縁部材上に搭
載したものが提案されている。Conventionally, as this type of information carrier, an antenna coil formed by patterning an insulating member, or
Although an antenna in which a coiled antenna coil is supported by an insulating member is used, it has been recently required that protection processing of a connection point between the antenna coil and the IC element and moisture proofing measures are not required, and the insulating member can be manufactured at low cost. The IC element with the antenna coil integrated with the IC element itself is mounted on an insulating member because the coil does not break even when stress such as bending or torsion is applied to the coil. Has been proposed.
【０００４】アンテナコイルをＩＣ素子に一体形成した
場合、アンテナコイルを絶縁部材にパターン形成した
り、巻線からなるアンテナコイルを絶縁部材に担持する
場合に比べて、コイルの巻径や導体幅が小さくなり、巻
数についても自ずと限界があるため、リーダライタとの
間の通信距離を大きくすることが困難で、必要な通信距
離を確保することできない場合がある。そこで、従来よ
り、特開平８−５３２９０４号公報等に記載されている
ように、ＩＣ素子に一体形成されたアンテナコイルとリ
ーダライタに備えられたアンテナコイルとの間に、各ア
ンテナコイル間の電磁誘導結合を強化するための導体ル
ープを配置する技術が提案されている。[0004] When the antenna coil is formed integrally with the IC element, the winding diameter and the conductor width of the coil are smaller than when the antenna coil is patterned on an insulating member or the antenna coil composed of a winding is carried on the insulating member. Since the number of turns is small and the number of turns is naturally limited, it is difficult to increase the communication distance with the reader / writer, and it may not be possible to secure a necessary communication distance. Therefore, conventionally, as described in Japanese Patent Application Laid-Open No. 8-532904, an electromagnetic wave between each antenna coil is provided between an antenna coil formed integrally with an IC element and an antenna coil provided in a reader / writer. Techniques for arranging conductor loops for enhancing inductive coupling have been proposed.
【０００５】なお、本明細書においては、このアンテナ
コイル間の電磁結合を強化するための導体ループを、
「ブースタコイル」という。[0005] In the present specification, a conductor loop for enhancing the electromagnetic coupling between the antenna coils is provided as follows.
"Booster coil".
【０００６】前記公知例に記載のブースタコイルは、Ｉ
Ｃ素子に一体形成されたアンテナコイルとほぼ同一寸法
に形成され、ＩＣ素子に一体形成されたアンテナコイル
と主に電磁結合する第１コイルと、当該第１コイルと電
気的に接続され、絶縁部材の寸法範囲で当該第１コイル
よりも大型に形成されて、リーダライタに備えられたア
ンテナコイルと主に電磁結合する第２コイルとを有する
構成になっている。[0006] The booster coil described in the above-mentioned known example has an I
A first coil formed to have substantially the same size as the antenna coil formed integrally with the C element and mainly electromagnetically coupled to the antenna coil formed integrally with the IC element; an insulating member electrically connected to the first coil; The first coil is formed to be larger than the first coil in the dimension range described above, and has a second coil mainly electromagnetically coupled to an antenna coil provided in the reader / writer.
【０００７】ブースタコイルを備えた非接触式情報担体
においては、リーダライタに備えられたアンテナコイ
ル、ブースタコイル及びＩＣ素子に一体形成されたアン
テナコイルを含めた系において効率的なエネルギ伝達を
行うため、所要の静電容量を備える必要がある。従来よ
り、非接触式情報担体に静電容量を備える手段として
は、絶縁部材にチップコンデンサを搭載する方法や、例
えば特開平１０−６９５３３号公報等に記載されている
ように、絶縁部材の表裏両面に導電体膜を対向に形成
し、ブースタコイルとこれら導電体膜とを接続するた
め、絶縁部材の表裏両面に形成された導電体膜の一部を
スルーホールやクリンピング等の手段で電気的に接続す
る方法が提案されている。In a non-contact type information carrier having a booster coil, efficient energy transmission is performed in a system including an antenna coil provided in a reader / writer, a booster coil, and an antenna coil formed integrally with an IC element. Need to have a required capacitance. Conventionally, as means for providing a non-contact type information carrier with a capacitance, a method of mounting a chip capacitor on an insulating member or a method of providing a front and back of an insulating member as described in, for example, JP-A-10-69533. Conductor films are formed on both sides to face each other, and a part of the conductor films formed on both front and back surfaces of the insulating member is electrically connected by means such as through holes and crimping to connect the booster coil and these conductor films. There has been proposed a method of connecting to.
【０００８】[0008]
【発明が解決しようとする課題】前記したように、従来
のブースタコイルは、ＩＣ素子に一体形成されたアンテ
ナコイルと主に電磁結合する第１コイルとリーダライタ
に備えられたアンテナコイルと主に電磁結合する第２コ
イルとを有するが、第２コイルの巻径を大きくするため
には第１コイルを第２コイルの内側に配置せざるを得
ず、したがってＩＣ素子を絶縁部材の中央部分に設定せ
ざるを得ないので、絶縁部材に不正な外力が作用したと
き、ＩＣ素子に大きなストレスが作用し、ＩＣ素子の破
壊や動作不良といった不都合を生じやすいという問題が
ある。As described above, the conventional booster coil is mainly composed of a first coil which is mainly electromagnetically coupled to an antenna coil formed integrally with an IC element and an antenna coil provided in a reader / writer. A second coil that is electromagnetically coupled, but in order to increase the winding diameter of the second coil, the first coil must be arranged inside the second coil, and therefore, the IC element is placed at the center of the insulating member. Since the setting must be performed, when an improper external force acts on the insulating member, a large stress acts on the IC element, and there is a problem that inconvenience such as destruction or malfunction of the IC element is likely to occur.
【０００９】一方、非接触式情報担体に静電容量を備え
る手段に関しては、絶縁部材にチップコンデンサを搭載
する方法をとった場合には、非接触式情報担体が厚型化
すると共に、部品点数の増加と製造工程の複雑化を避け
られないので、非接触式情報担体が高コスト化するとい
う問題がある。On the other hand, with respect to the means for providing the non-contact type information carrier with a capacitance, when the method of mounting the chip capacitor on the insulating member is adopted, the non-contact type information carrier becomes thicker and the number of parts increases. Inevitably, the increase in the number of components and the complexity of the manufacturing process are unavoidable, so that there is a problem that the cost of the non-contact information carrier increases.
【００１０】また、絶縁部材の表裏両面に導電体膜を対
向に形成し、これらの各導電体膜をスルーホールやクリ
ンピング等の手段で電気的に接続する方法をとった場合
にも、ブースタコイルの製造工程が複雑化するため、や
はり非接触式情報担体が高コスト化する。Also, in the case where a conductor film is formed on both the front and back surfaces of the insulating member so as to face each other and these conductor films are electrically connected by means such as through holes or crimping, the booster coil is also required. Since the manufacturing process of the non-contact information carrier is complicated, the cost of the non-contact information carrier is also increased.
【００１１】本発明は、かかる従来技術の不備を解決す
るためになされたものであって、その課題は、ブースタ
コイルに対するＩＣ素子の設定自由度が大きい非接触通
信式情報担体を提供すること、安価かつ薄形にして通信
特性が良好な非接触通信式情報担体を提供することにあ
る。The present invention has been made to solve the above-mentioned deficiencies of the prior art, and an object thereof is to provide a non-contact communication information carrier having a large degree of freedom in setting an IC element with respect to a booster coil. It is an object of the present invention to provide a non-contact communication type information carrier which is inexpensive and thin and has good communication characteristics.
【００１２】[0012]
【課題を解決するための手段】本発明は、前記の課題を
解決するため、第１に、アンテナコイルが一体形成され
たＩＣ素子と、前記ＩＣ素子に一体形成されたアンテナ
コイルとリーダライタに備えられたアンテナコイルとの
電磁結合を強化するブースタコイルと、これらＩＣ素子
及びブースタコイルを担持する絶縁部材とを備えた非接
触通信式情報担体において、前記絶縁部材上に１つのブ
ースタコイルを形成し、当該１つのブースタコイルの一
部と対向に前記ＩＣ素子を配置した。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention firstly provides an IC element integrally formed with an antenna coil and an antenna coil integrated with the IC element and a reader / writer. In a non-contact communication type information carrier comprising a booster coil for enhancing electromagnetic coupling with a provided antenna coil and an insulating member for carrying the IC element and the booster coil, one booster coil is formed on the insulating member Then, the IC element was arranged to face a part of the one booster coil.
【００１３】このように、絶縁部材上に１つのブースタ
コイルを形成し、当該１つのブースタコイルの一部と対
向にＩＣ素子を配置すると、ブースタコイルひいては絶
縁部材に対するＩＣ素子の設定自由度を大きくすること
ができるので、例えばＩＣ素子をブースタコイル（絶縁
部材）の中央領域を除く部分に配置することによって、
絶縁部材に不正な外力が作用したときにＩＣ素子に作用
するストレスを緩和することができ、ＩＣ素子の破壊や
動作不良といった不都合を解消できる。As described above, when one booster coil is formed on the insulating member and the IC element is arranged so as to face a part of the one booster coil, the degree of freedom of setting the IC element with respect to the booster coil and the insulating member is increased. For example, by arranging the IC element in a portion other than the central region of the booster coil (insulating member),
The stress acting on the IC element when an improper external force acts on the insulating member can be reduced, and inconveniences such as destruction and malfunction of the IC element can be eliminated.
【００１４】第２に、前記第１の手段におけるブースタ
コイルを、前記絶縁部材の片面にのみに形成するという
構成にした。Second, the booster coil in the first means is formed on only one surface of the insulating member.
【００１５】このように、ブースタコイルを絶縁部材の
片面にのみ形成すると、ブースタコイル付き絶縁部材の
製造を容易に行うことができるので、非接触通信式情報
担体の製造コストを安価にすることができる。As described above, when the booster coil is formed only on one side of the insulating member, the manufacturing of the insulating member with the booster coil can be easily performed, so that the manufacturing cost of the non-contact communication type information carrier can be reduced. it can.
【００１６】第３に、前記第１の手段におけるブースタ
コイルを、前記絶縁部材の表裏両面に分割して形成する
という構成にした。Third, the booster coil in the first means is formed by being divided on both the front and back surfaces of the insulating member.
【００１７】このように、ブースタコイルを絶縁部材の
表裏両面に分割して形成すると、ブースタコイルの巻数
を増やすことができるので、リーダライタとの間の通信
距離をさらに延長することができる。When the booster coil is divided and formed on both the front and back surfaces of the insulating member, the number of turns of the booster coil can be increased, so that the communication distance with the reader / writer can be further extended.
【００１８】第４に、前記第３の手段における絶縁部材
の片面側に形成されたブースタコイルの両端部に、当該
ブースタコイルと電気的に接続された第１導体膜を形成
すると共に、前記絶縁部材の裏面の前記第１導体膜と対
向する部分に、互いに電気的に接続された２つの導体膜
からなる第２導体膜を形成し、スルーホールを形成する
ことなく、前記ブースタコイルに共振用の静電容量を接
続した。Fourthly, a first conductor film electrically connected to the booster coil is formed at both ends of the booster coil formed on one side of the insulating member in the third means, and the insulating film is formed. A second conductor film made of two conductor films electrically connected to each other is formed on a portion of the back surface of the member opposed to the first conductor film, and the second conductor film is formed on the booster coil for resonance without forming a through hole. Was connected.
【００１９】このように、絶縁部材の表裏面に第１導体
膜及び第２導体膜を対向に形成し、これによってブース
タコイルに共振用の静電容量を接続すると、第１及び第
２導体膜をブースタコイルと同一プロセスで形成するこ
とができるので、非接触通信式情報担体の製造コストを
安価にすることができると共に、静電容量を薄形に形成
できるので、チップコンデンサを搭載する場合に比べ
て、非接触通信式情報担体を薄形化することができる。
また、スルーホールを形成することなく、静電容量付き
のブースタコイルを形成するので、ブースタコイル及び
静電容量付き絶縁部材の製造を容易に行うことができ、
非接触通信式情報担体の製造コストを安価にすることが
できる。As described above, when the first conductor film and the second conductor film are formed opposite to each other on the front and back surfaces of the insulating member, and the capacitance for resonance is connected to the booster coil, the first and second conductor films are formed. Can be formed in the same process as the booster coil, so that the manufacturing cost of the non-contact communication type information carrier can be reduced, and the capacitance can be made thin. In comparison, the non-contact communication type information carrier can be made thinner.
Further, since the booster coil with the capacitance is formed without forming the through hole, the production of the booster coil and the insulating member with the capacitance can be easily performed,
The manufacturing cost of the non-contact communication information carrier can be reduced.
【００２０】第５に、前記第３の手段における絶縁部材
の表面側に形成されたブースタコイルと前記絶縁部材の
裏面側に形成されたブースタコイルとをスルーホールを
介して接続した。Fifth, the booster coil formed on the front side of the insulating member and the booster coil formed on the back side of the insulating member in the third means are connected through a through hole.
【００２１】このように、ブースタコイルを絶縁部材の
表裏両面に分割して形成し、絶縁部材の表裏面に形成さ
れた各ブースタコイルを電気的に接続すると、絶縁部材
の表裏両面を有効利用することができ、ブースタコイル
の巻数を増やすことができるので、通信特性が良好な非
接触通信式情報担体を得ることができる。As described above, when the booster coil is formed by dividing the front and back surfaces of the insulating member and the respective booster coils formed on the front and back surfaces of the insulating member are electrically connected, the front and back surfaces of the insulating member are effectively used. Since the number of turns of the booster coil can be increased, a non-contact communication type information carrier having good communication characteristics can be obtained.
【００２２】第６に、前記第３の手段における絶縁部材
の表面側に形成されたブースタコイルと当該絶縁部材の
裏面側に形成されたブースタコイルの全部又は一部を対
向に配置し、ブースタコイルに共振用の静電容量を接続
した。Sixth, the booster coil formed on the front side of the insulating member and the whole or a part of the booster coil formed on the back side of the insulating member in the third means are arranged to face each other. Was connected to a capacitance for resonance.
【００２３】このように、ブースタコイルを構成する導
体の全部又は一部を対向に配置することによってブース
タコイルに共振用の静電容量を接続すると、静電容量を
形成するための特別な導体膜を絶縁部材状に形成する必
要がないので、絶縁部材の表裏両面を有効利用できてブ
ースタコイルの巻数を増やすことができ、通信特性が良
好な非接触通信式情報担体を得ることができる。As described above, when a capacitance for resonance is connected to the booster coil by arranging all or a part of the conductors constituting the booster coil to face each other, a special conductor film for forming the capacitance is formed. Need not be formed as an insulating member, the front and back surfaces of the insulating member can be effectively used, the number of turns of the booster coil can be increased, and a non-contact communication type information carrier having good communication characteristics can be obtained.
【００２４】第７に、前記第３の手段における絶縁部材
の表面側に形成されたブースタコイルの導体幅と前記絶
縁部材の裏面側に形成されたブースタコイルの導体幅と
を互いに異ならせた。Seventh, the conductor width of the booster coil formed on the front side of the insulating member and the conductor width of the booster coil formed on the back side of the insulating member in the third means are different from each other.
【００２５】このように、絶縁部材の表面側及び裏面側
に形成されるブースタコイルの導体幅とを互いに異なら
せると、製造上、絶縁部材の表面側に形成されたブース
タコイルと絶縁部材の裏面側に形成されたブースタコイ
ルとの形成位置が各ブースタコイルの導体幅の差の範囲
でずれたとしても、静電容量の値が変化しないので、通
信特性のばらつきが小さい非接触通信式情報担体を提供
できる。As described above, if the conductor widths of the booster coils formed on the front side and the back side of the insulating member are made different from each other, the booster coil formed on the front side of the insulating member and the back side of the insulating member become difficult to manufacture. Even if the formation position with the booster coil formed on the side deviates within the range of the conductor width of each booster coil, the value of the capacitance does not change, so that the non-contact communication information carrier with small variation in communication characteristics Can be provided.
【００２６】[0026]
【発明の実施の形態】以下、本発明に係る非接触通信式
情報担体の第１実施形態例を、図１乃至図７に基づいて
説明する。図１は本例の非接触通信式情報担体に備えら
れたブースタコイルとＩＣ素子との配列を示す平面図、
図２は図１のＡ−Ａ断面図、図３は本例の非接触通信式
情報担体に搭載される絶縁部材の表面図、図４は本例の
非接触通信式情報担体に搭載される絶縁部材の裏面図、
図５は本例の非接触通信式情報担体に搭載されるＩＣ素
子の斜視図、図６は本例の非接触通信式情報担体に搭載
されるＩＣ素子の平面図、図７は本例の非接触通信式情
報担体に備えられたブースタコイルの等価回路図であ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a non-contact communication type information carrier according to the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing an arrangement of booster coils and IC elements provided on a non-contact communication type information carrier of the present embodiment,
2 is a sectional view taken along line AA of FIG. 1, FIG. 3 is a front view of an insulating member mounted on the non-contact communication type information carrier of this embodiment, and FIG. 4 is mounted on the non-contact communication type information carrier of this embodiment. Back view of the insulating member,
FIG. 5 is a perspective view of an IC element mounted on the non-contact communication type information carrier of this embodiment, FIG. 6 is a plan view of an IC element mounted on the non-contact communication type information carrier of this embodiment, and FIG. FIG. 4 is an equivalent circuit diagram of a booster coil provided on the non-contact communication type information carrier.
【００２７】図１及び図２に示すように、本例の非接触
通信式情報担体は、アンテナコイル１が一体形成された
ＩＣ素子２と、ブースタコイル３及び静電容量接続用の
導体膜４ａ，４ｂ，５ａ，５ｂが形成された絶縁部材６
と、これらＩＣ素子２及び絶縁部材６を一体にケーシン
グする基体７とからなる。ＩＣ素子２は、図１に示すよ
うに、アンテナコイル１を絶縁部材６側に向けて、絶縁
部材６のブースタコイル形成面側に設定される。As shown in FIGS. 1 and 2, the non-contact communication type information carrier of this embodiment comprises an IC element 2 integrally formed with an antenna coil 1, a booster coil 3 and a conductor film 4a for connecting a capacitance. , 4b, 5a, 5b formed insulating member 6
And a base 7 that integrally casings the IC element 2 and the insulating member 6. As shown in FIG. 1, the IC element 2 is set on the booster coil forming surface side of the insulating member 6 with the antenna coil 1 facing the insulating member 6 side.
【００２８】ＩＣ素子２は、図５及び図６に示すよう
に、入出力端子２ａの形成面に、ポリイミド樹脂膜等か
らなる絶縁層２ｂを介して矩形スパイラル状のアンテナ
コイル１を一体に形成してなる。アンテナコイル１は、
フォトレジスト法、即ち、ＩＣ素子２の絶縁層２ｂ上に
導電性金属材料をスパッタリング又は真空蒸着し、ＩＣ
素子２（より実際的には、個々のＩＣ素子に分割される
以前の完成ウエハ）の絶縁層形成面に、フォトレジスト
層を均一の厚さに形成し、このフォトレジスト層に所要
のコイルパターンを露光・現像した後、フォトレジスト
層をマスクとしてエッチングし、しかる後に、フォトレ
ジスト層を除去して入出力端子４ａの形成面に導電性金
属材料からなるコイルパターンを形成するといった方法
で形成することができる。なお、コイルパターンの電気
抵抗を減少するため、導電性金属膜の表面に銅めっき層
を形成することもできる。As shown in FIGS. 5 and 6, a rectangular spiral antenna coil 1 is integrally formed on an input / output terminal 2a forming surface of the IC element 2 with an insulating layer 2b made of a polyimide resin film or the like interposed therebetween. Do it. The antenna coil 1 is
A photoresist method, that is, a conductive metal material is sputtered or vacuum-deposited on the insulating layer 2b of the IC element 2,
A photoresist layer is formed to a uniform thickness on the insulating layer forming surface of the element 2 (more practically, a completed wafer before being divided into individual IC elements), and a required coil pattern is formed on the photoresist layer. Is exposed and developed, and then etched using the photoresist layer as a mask. Thereafter, the photoresist layer is removed and a coil pattern made of a conductive metal material is formed on the formation surface of the input / output terminal 4a. be able to. In order to reduce the electric resistance of the coil pattern, a copper plating layer can be formed on the surface of the conductive metal film.
【００２９】また、図５及び図６の例では、アンテナコ
イル１が複数のターン数を有する矩形スパイラル状に形
成されているが、当該アンテナコイル１のターン数や平
面形状はこれに限定されるものではない。即ち、ターン
数に関しては、１ターン以上の任意のターン数とするこ
とができ、平面形状に関しては、角部に斜線状又は円弧
状の面取りが施された矩形や円形など、任意の形状に形
成できる。In the examples shown in FIGS. 5 and 6, the antenna coil 1 is formed in a rectangular spiral shape having a plurality of turns, but the number of turns and the planar shape of the antenna coil 1 are not limited thereto. Not something. That is, the number of turns can be any number of one or more turns, and the planar shape can be formed into an arbitrary shape such as a rectangle or a circle with oblique or arcuate chamfers at the corners. it can.
【００３０】ブースタコイル３は、図１乃至図３に示す
ように、絶縁部材６の表面側にのみ形成されており、そ
の両端部は、静電容量接続用の導体膜４ａ，４ｂにそれ
ぞれ接続されている。また、ブースタコイル３は、その
平面形状及び寸法が、絶縁部材６に収まる範囲でなるべ
く大きく形成される。As shown in FIGS. 1 to 3, the booster coil 3 is formed only on the surface side of the insulating member 6, and both ends of the booster coil 3 are connected to the conductor films 4a and 4b for capacitance connection, respectively. Have been. Further, the booster coil 3 is formed as large as possible in a range in which the planar shape and the dimensions are within the insulating member 6.
【００３１】なお、図１及び図３の例では、ブースタコ
イル３が複数のターン数を有する矩形スパイラル状に形
成されているが、ブースタコイル３のターン数や平面形
状はこれに限定されるものではなく、前述のアンテナコ
イル１と同様に、任意のターン数及び形状に形成するこ
とができる。In the examples shown in FIGS. 1 and 3, the booster coil 3 is formed in a rectangular spiral shape having a plurality of turns, but the number of turns and the planar shape of the booster coil 3 are not limited to this. Instead, as in the case of the above-described antenna coil 1, it can be formed into an arbitrary number of turns and a shape.
【００３２】静電容量接続用の導体膜４ａと５ａ及び４
ｂと５ｂは、絶縁部材６の表面及び裏面に対向に形成さ
れる。また、絶縁部材６の表面側に形成された静電容量
接続用の導体膜４ａ，４ｂは、前記したように、ブース
タコイル３を介して電気的に接続され、絶縁部材６の裏
面側に形成された静電容量接続用の導体膜５ａ，５ｂ
は、図４に示すように、導線８を介して電気的に接続さ
れる。したがって、前記ブースタコイル３は、相対向に
配置された静電容量接続用の導体膜４ａと５ａ及び４ｂ
と５ｂを介してその両端部で容量結合されており、図７
に模式的に示すように、両端に導体膜４ａと５ａとで形
成される静電容量ＣＡ と導体膜４ｂと５ｂとで形成さ
れる静電容量ＣＢ とが接続されたブースタコイル３が
得られる。各導体膜４ａ，５ａ，４ｂ，５ｂの面積は、
前記２個の静電容量ＣＡ ，ＣＢの直列インピーダンス
が、ＩＣ素子２に一体形成されたアンテナコイル１及び
ブースタコイル３を含む系において、アンテナコイル１
の両端に最大電圧が得られるように調整される。Conductive films 4a, 5a and 4 for connecting capacitance
b and 5b are formed on the front and back surfaces of the insulating member 6 so as to face each other. Further, the conductor films 4a and 4b for capacitance connection formed on the front surface side of the insulating member 6 are electrically connected via the booster coil 3 and formed on the back surface side of the insulating member 6 as described above. Conductor films 5a and 5b for connecting capacitance
Are electrically connected via a conducting wire 8 as shown in FIG. Therefore, the booster coil 3 is provided with the conductor films 4a, 5a and 4b for capacitance connection, which are arranged opposite to each other.
7 and 5b are capacitively coupled at both ends.
A As shown schematically, the capacitance C A and the conductive film 4b and the capacitance C booster coil 3 B and is connected formed by the 5b formed by the conductive film 4a and 5a at both ends can get. The area of each conductor film 4a, 5a, 4b, 5b is
In a system including the antenna coil 1 and the booster coil 3 formed integrally with the IC element 2, the series impedance of the two capacitances C A and C B
Is adjusted so that the maximum voltage can be obtained at both ends of.
【００３３】前記ブースタコイル３及び静電容量接続用
の導体膜４ａ，５ａ，４ｂ，５ｂは、絶縁部材６の片面
に形成された均一厚さの導電性金属層にエッチングを施
して所要のコイルパターンを形成するエッチング法や、
絶縁部材６の片面に導電性インクを用いて所要の導電パ
ターンを印刷形成する印刷法などをもって形成すること
ができる。The booster coil 3 and the conductive films 4a, 5a, 4b, 5b for connecting the capacitance are formed by etching a conductive metal layer having a uniform thickness formed on one surface of the insulating member 6 to obtain a required coil. Etching method to form a pattern,
A desired conductive pattern can be formed on one surface of the insulating member 6 by printing using a conductive ink by a printing method or the like.
【００３４】絶縁部材６は、所要の誘電率と剛性とをも
った絶縁材料をもって形成される。絶縁部材６を構成す
るに好適な絶縁材料としては、一例として、ガラスエポ
キシ樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリエチ
レンテレフタレート樹脂（以下、ＰＥＴと略称する。）
又は塩化ビニル樹脂などを挙げることができる。The insulating member 6 is formed of an insulating material having required permittivity and rigidity. As an insulating material suitable for forming the insulating member 6, for example, glass epoxy resin, polyimide resin, polyamide resin, polyethylene terephthalate resin (hereinafter abbreviated as PET).
Alternatively, a vinyl chloride resin or the like can be used.
【００３５】基体７は、カバーシート８と接着剤層９と
をもって構成される。このうち、カバーシート７は、紙
やプラスチックシートなど、任意のシート状材料をもっ
て形成することができるが、廃棄しても分解し、焼却し
てもダイオキシン等の有害物質を発生しないことから、
紙をもって形成することが最も好ましい。カバーシート
材料としてプラスチックシートを用いる場合には、焼却
してもダイオキシン等の有害物質を発生しないことか
ら、ＰＥＴのような塩素を含まないプラスチックシート
を用いることが特に好ましい。一方、接着剤層９を構成
する接着剤としては、硬化後に所要の硬度を有する任意
の接着剤を用いることができるが、ブースタコイル１、
アンテナコイル３及びＩＣ素子４の保護効果を高めるた
め、例えばエポキシ樹脂のように吸湿性の低い樹脂材料
を用いることが特に好ましい。The base 7 includes a cover sheet 8 and an adhesive layer 9. Among these, the cover sheet 7 can be formed of any sheet-like material such as paper or plastic sheet, but it is decomposed even if discarded, and does not generate harmful substances such as dioxin even when incinerated.
Most preferably, it is formed of paper. When a plastic sheet is used as the cover sheet material, it is particularly preferable to use a chlorine-free plastic sheet such as PET because PET does not generate harmful substances such as dioxin even when incinerated. On the other hand, as the adhesive constituting the adhesive layer 9, any adhesive having a required hardness after curing can be used.
In order to enhance the protection effect of the antenna coil 3 and the IC element 4, it is particularly preferable to use a resin material having low hygroscopicity such as an epoxy resin.
【００３６】前記第１実施形態例に係る非接触通信式情
報担体は、１つのブースタコイル３条の一部にＩＣ素子
２を搭載したので、ブースタコイル３ひいては絶縁部材
６に対するＩＣ素子２の設定自由度を大きくすることが
でき、例えばＩＣ素子２をブースタコイル３（絶縁部材
６）の中央領域を除く部分に配置することによって、絶
縁部材６に不正な外力が作用したときにＩＣ素子２に作
用するストレスを緩和することができ、ＩＣ素子２の破
壊や動作不良といった不都合を解消できる。また、ＩＣ
素子２をブースタコイル３と対向に配置するので、ＩＣ
素子２に一体形成されたアンテナコイル１とリーダライ
タに備えられたアンテナコイルとの電磁結合を強化する
ことができ、リーダライタとの間の通信距離を延長する
ことができる。また、ブースタコイル３を絶縁基板６の
片面にのみ形成するので、ブースタコイル付き絶縁部材
の製造を容易に行うことができ、非接触通信式情報担体
の製造コストを安価にすることができる。また、絶縁部
材６の表裏面に導体膜４ａと５ａ及び４ｂと５ｂを対向
に形成し、これによってブースタコイル３に共振用の静
電容量を接続するので、各導体膜４ａ，４ｂ，５ａ，５
ｂをブースタコイル３と同一プロセスで形成することが
でき、非接触通信式情報担体の製造コストを安価にする
ことができる。また、静電容量を薄形に形成できるの
で、チップコンデンサを搭載する場合に比べて、非接触
通信式情報担体を薄形化することができる。さらに、ス
ルーホールを形成することなく、静電容量付きのブース
タコイル３を形成するので、ブースタコイル及び静電容
量付き絶縁部材の製造を容易に行うことができ、非接触
通信式情報担体の製造コストを安価にすることができ
る。In the non-contact communication type information carrier according to the first embodiment, since the IC element 2 is mounted on a part of one booster coil, the setting of the IC element 2 with respect to the booster coil 3 and thus the insulating member 6 is performed. The degree of freedom can be increased. For example, by arranging the IC element 2 in a portion other than the central region of the booster coil 3 (insulating member 6), the IC element 2 is acted upon when an improper external force acts on the insulating member 6. The acting stress can be reduced, and disadvantages such as destruction and malfunction of the IC element 2 can be solved. Also, IC
Since the element 2 is arranged to face the booster coil 3, an IC
Electromagnetic coupling between the antenna coil 1 formed integrally with the element 2 and the antenna coil provided in the reader / writer can be strengthened, and the communication distance between the antenna coil 1 and the reader / writer can be extended. Further, since the booster coil 3 is formed only on one surface of the insulating substrate 6, it is possible to easily manufacture the insulating member with the booster coil, and to reduce the manufacturing cost of the non-contact communication information carrier. Further, the conductor films 4a and 5a and 4b and 5b are formed on the front and back surfaces of the insulating member 6 so as to oppose each other, thereby connecting the capacitance for resonance to the booster coil 3. Therefore, each of the conductor films 4a, 4b, 5a, 5
b can be formed by the same process as that of the booster coil 3, and the manufacturing cost of the non-contact communication type information carrier can be reduced. Further, since the capacitance can be made thin, the non-contact communication type information carrier can be made thin as compared with the case where a chip capacitor is mounted. Further, since the booster coil 3 with the capacitance is formed without forming the through hole, the production of the booster coil and the insulating member with the capacitance can be easily performed, and the production of the non-contact communication type information carrier can be facilitated. Cost can be reduced.
【００３７】次に、本発明に係る非接触通信式情報担体
の第２実施形態例を、図８に基づいて説明する。図８は
本例の非接触通信式情報担体に搭載される絶縁部材の表
面図である。Next, a non-contact communication type information carrier according to a second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a front view of the insulating member mounted on the non-contact communication type information carrier of this example.
【００３８】図８から明らかなように、本例の非接触通
信式情報担体は、ブースタコイル３のＩＣ素子２が設定
される部分の形状を巻径が小さいコイルに近似した形状
に形成し、当該部分とＩＣ素子２に一体形成されたアン
テナコイル１とを対向に配置したことを特徴とする。そ
の他については、第１実施形態例に係る非接触通信式情
報担体と同じであるので、重複を避けるために説明を省
略する。As is clear from FIG. 8, the non-contact communication type information carrier of the present embodiment is formed such that the shape of the portion of the booster coil 3 where the IC element 2 is set is similar to a coil having a small winding diameter. The antenna device is characterized in that the portion and the antenna coil 1 formed integrally with the IC element 2 are arranged to face each other. Others are the same as those of the non-contact communication type information carrier according to the first embodiment, so that the description is omitted to avoid duplication.
【００３９】本例の非接触通信式情報担体は、ブースタ
コイル３のＩＣ素子２が設定される部分の形状を巻径が
小さいコイルに近似した形状に形成し、当該部分とＩＣ
素子２に一体形成されたアンテナコイル１とを対向に配
置したので、アンテナコイル１とブースタコイル３との
電磁結合をより強化することができ、リーダライタとの
間に通信距離を延長することができる。In the non-contact communication type information carrier of this embodiment, the portion of the booster coil 3 where the IC element 2 is set is formed in a shape similar to a coil having a small winding diameter.
Since the antenna coil 1 integrally formed with the element 2 is arranged to face the electromagnetic coil 1, the electromagnetic coupling between the antenna coil 1 and the booster coil 3 can be further enhanced, and the communication distance between the antenna coil 1 and the reader / writer can be extended. it can.
【００４０】次に、本発明に係る非接触通信式情報担体
の第３実施形態例を、図９乃至図１１に基づいて説明す
る。図９は本例の非接触通信式情報担体に搭載される絶
縁部材の表面図、図１０は本例の非接触通信式情報担体
に搭載される絶縁部材の裏面図、図１１は本例の非接触
通信式情報担体に備えられたブースタコイルの等価回路
図である。Next, a third embodiment of the non-contact communication type information carrier according to the present invention will be described with reference to FIGS. 9 is a front view of an insulating member mounted on the non-contact communication type information carrier of the present example, FIG. 10 is a rear view of the insulating member mounted on the non-contact communication type information carrier of the present example, and FIG. FIG. 4 is an equivalent circuit diagram of a booster coil provided on the non-contact communication type information carrier.
【００４１】本例の非接触通信式情報担体は、ブースタ
コイルを絶縁部材６の表面及び裏面に分割して形成し、
絶縁部材６を介してブースタコイルを構成する導体の一
部を対向させることによって、ブースタコイルに共振用
の静電容量を接続したことを特徴とする。In the contactless communication information carrier of this embodiment, the booster coil is formed by dividing the front and back surfaces of the insulating member 6.
It is characterized in that a capacitance for resonance is connected to the booster coil by opposing a part of the conductor constituting the booster coil via the insulating member 6.
【００４２】即ち、本例の非接触通信式情報担体におけ
るブースタコイル３は、図９及び図１０に示すように、
絶縁部材６の表面側に形成された表面パターン３ｂ１
と、絶縁部材６の裏面側に形成された裏面パターン３ｂ
２ とからなる。これら表面パターン３ｂ１ を構成す
る導体と裏面パターン３ｂ２ を構成する導体とは、図
９及び図１０から明らかなように、絶縁部材６の表面側
から見て巻線の方向が互いに逆向きになっており、図９
に示す４カ所の黒塗りの部分Ａ，Ｂ，Ｃ，Ｄにおいて互
いに対向に配置され、図１１に示す４個の静電容量
ＣＡ，ＣＢ，ＣＣ，ＣＤを構成している。また、これら
表面パターン３ｂ１を構成する導体と裏面パターン３ｂ
２を構成する導体とは、図９及び図１０から明らかなよ
うに、絶縁部材６に開設されたスルーホール１０を介し
て、各コイル３ｂ１ ，３ｂ２ の内周端で電気的に接
続され、表面パターン３ｂ１ を構成する導体の外周端
Ｘが裏面パターン３ｂ２ を構成する導体の外周端の近
傍Ｘ′と対向に配置され、裏面パターン３ｂ２ を構成
する導体の外周端Ｙが表面パターン３ｂ１ を構成する
導体の外周端の近傍Ｙ′と対向に配置されている。これ
により、図１１に示すように、表裏面のブースタコイル
３ｂ１ ，３ｂ２ が１点で接続され、かつこれら表裏
面のブースタコイル３ｂ１ ，３ｂ２ を合わせたブー
スタコイル３の両端部又はその近傍部分に４個の静電容
量ＣＡ，ＣＢ，ＣＣ，ＣＤが接続されたブースタコイル
３が得られる。That is, as shown in FIGS. 9 and 10, the booster coil 3 in the non-contact communication type information carrier of this embodiment is
Surface pattern 3b 1 formed on the front side of insulating member 6
Back surface pattern 3b formed on the back surface side of insulating member 6
Consists of two . The conductors constituting the conductor and back surface patterns 3b 2 constituting these surface patterns 3b 1, as apparent from FIGS. 9 and 10, in the directions opposite to each other in the winding as viewed from the front side of the insulating member 6 Figure 9
The four blackened portions A, B, C, and D shown in FIG. 11 are arranged so as to face each other, and constitute four capacitances C A , C B , C C , and C D shown in FIG. Further, the conductor forming the front surface pattern 3b 1 and the back surface pattern 3b
The conductors constituting the two, as is apparent from FIGS. 9 and 10, through the through hole 10 which is opened in the insulating member 6 is electrically connected with the inner circumferential end of each coil 3b 1, 3b 2 , the outer peripheral end X of the conductor constituting the surface pattern 3b 1 is disposed opposed to the vicinity X 'of the outer peripheral edge of the conductor constituting the rear surface pattern 3b 2, the outer peripheral end Y of the conductor constituting the rear surface pattern 3b 2 surface pattern It is disposed opposed to the vicinity Y 'of the outer peripheral edge of the conductor constituting the 3b 1. As a result, as shown in FIG. 11, the booster coils 3b 1 and 3b 2 on the front and back surfaces are connected at one point, and both ends of the booster coil 3 in which the booster coils 3b 1 and 3b 2 on the front and back surfaces are combined or at both ends. A booster coil 3 in which four capacitances C A , C B , C C , and C D are connected in the vicinity is obtained.
【００４３】前記４個の静電容量ＣＡ，ＣＢ，ＣＣ，Ｃ
Ｄは、ＩＣ素子２に一体形成されたアンテナコイル１及
びブースタコイル３を含む系において、アンテナコイル
１の両端に最大電圧が得られるように調整される。The four capacitances C A , C B , C C , C
D is adjusted so that a maximum voltage is obtained at both ends of the antenna coil 1 in a system including the antenna coil 1 and the booster coil 3 formed integrally with the IC element 2.
【００４４】なお、前記表面パターン３ｂ１を構成する
導体と裏面パターン３ｂ２を構成する導体の導体幅と
は、同一幅に形成することもできるし、異なる幅に形成
することもできる。これら各導体の導体幅を異ならせる
と、製造上、表面パターン３ｂ １を構成する導体と裏面
パターン３ｂ２を構成する導体の形成位置が導体幅の差
の範囲でずれたとしても静電容量の値が変化しないの
で、非接触通信式情報担体の通信特性のばらつきを小さ
くすることができる。The surface pattern 3b1Make up
Conductor and backside pattern 3b2And the conductor width of the conductor
Can be formed in the same width or in different widths
You can also. Make the conductor width of each of these conductors different
And, in production, the surface pattern 3b 1Constituting conductor and backside
Pattern 3b2The formation position of the conductor that constitutes
The capacitance value does not change even if the
Reduces the variation in communication characteristics of non-contact communication type information carriers.
Can be done.
【００４５】その他については、第１実施形態例に係る
非接触通信式情報担体と同じであるので、重複を避ける
ために説明を省略する。The other parts are the same as those of the non-contact communication type information carrier according to the first embodiment, so that the description will be omitted to avoid duplication.
【００４６】本例の非接触通信式情報担体は、第１実施
形態例に係る非接触通信式情報担体と同様の効果を有す
るほか、ブースタコイル３を絶縁部材６の表裏両面に分
割して形成し、絶縁部材６の表裏面に形成された各ブー
スタコイル３ｂ１ ，３ｂ２ を電気的に接続するので、
絶縁部材６の表裏両面を有効利用できて、ブースタコイ
ル３の巻数を増やすことができ、通信特性が良好な非接
触通信式情報担体を得ることができる。ブースタコイル
３を構成する導体の一部を対向に配置することによって
ブースタコイル３に共振用の静電容量ＣＡ，ＣＢ，
ＣＣ，ＣＤを接続するので、静電容量を形成するための
特別な導体膜を絶縁部材上に形成する必要がなく、絶縁
部材６の表裏両面を有効利用できることから、ブースタ
コイルの巻数を増やすことができ、通信特性が良好な非
接触通信式情報担体を得ることができる。The non-contact communication type information carrier of this embodiment is similar to the first embodiment.
It has the same effect as the non-contact communication type information carrier according to the embodiment.
In addition, the booster coil 3 is separated on both front and back surfaces of the insulating member 6.
Each of the boots formed on the front and back surfaces of the insulating member 6
Star coil 3b1, 3b2 Is electrically connected,
Both sides of the insulating member 6 can be used effectively, booster coil
The number of turns of the cable 3 can be increased, and
A tactile information carrier can be obtained. Booster coil
By arranging some of the conductors that make up 3
The booster coil 3 has a capacitance C for resonance.A, CB,
CC, CDIs connected, so that the capacitance
There is no need to form a special conductor film on the insulation
Since the front and back surfaces of the member 6 can be used effectively, the booster
The number of turns of the coil can be increased,
A contact communication type information carrier can be obtained.
【００４７】なお、前記各実施形態例においては、ＩＣ
素子２が固着された絶縁部材６を２枚のカバーシート８
でケーシングしたが、かかる構成に代えて、ブースタコ
イル３が備えられていない非接触通信式情報担体の片面
に、ブースタコイル３が形成された絶縁部材６を接着す
ることもできる。In each of the above embodiments, the IC
The insulating member 6 to which the element 2 is fixed is attached to two cover sheets 8.
However, instead of such a configuration, an insulating member 6 on which the booster coil 3 is formed may be bonded to one surface of a non-contact communication type information carrier having no booster coil 3.
【００４８】[0048]
【発明の効果】請求項１に記載の発明は、絶縁部材上に
１つのブースタコイルを形成し、当該１つのブースタコ
イルの一部と対向にＩＣ素子を配置したので、ブースタ
コイルひいては絶縁部材に対するＩＣ素子の設定自由度
を大きくすることができるので、例えばＩＣ素子をブー
スタコイル（絶縁部材）の中央領域を除く部分に配置す
ることによって、絶縁部材に不正な外力が作用したとき
にＩＣ素子に作用するストレスを緩和することができ、
ＩＣ素子の破壊や動作不良といった不都合を解消でき
る。According to the first aspect of the present invention, one booster coil is formed on the insulating member, and the IC element is disposed so as to face a part of the one booster coil. Since the degree of freedom for setting the IC element can be increased, for example, by arranging the IC element in a portion other than the center region of the booster coil (insulating member), the IC element is not affected when an improper external force acts on the insulating member. Can reduce the acting stress,
Inconveniences such as destruction and malfunction of IC elements can be solved.
【００４９】請求項２に記載の発明は、ブースタコイル
を絶縁部材の片面にのみ形成するので、ブースタコイル
付き絶縁部材の製造を容易に行うことができ、非接触通
信式情報担体の製造コストを安価にすることができる。According to the second aspect of the present invention, since the booster coil is formed only on one surface of the insulating member, it is possible to easily manufacture the insulating member with the booster coil, and to reduce the manufacturing cost of the non-contact communication type information carrier. It can be cheap.
【００５０】請求項３に記載の発明は、ブースタコイル
を絶縁部材の表裏両面に分割して形成したので、ブース
タコイルの巻数を増やすことができ、リーダライタとの
間の通信距離をさらに延長することができる。According to the third aspect of the present invention, since the booster coil is formed on both the front and back surfaces of the insulating member, the number of turns of the booster coil can be increased, and the communication distance with the reader / writer can be further extended. be able to.
【００５１】請求項４に記載の発明は、絶縁部材の表裏
面に第１導体膜及び第２導体膜を対向に形成し、これに
よってブースタコイルに共振用の静電容量を接続するの
で、第１及び第２導体膜をブースタコイルと同一プロセ
スで形成することができ、非接触通信式情報担体の製造
コストを安価にすることができる。また、静電容量を薄
形に形成できるので、チップコンデンサを搭載する場合
に比べて、非接触通信式情報担体を薄形化することがで
きる。さらに、スルーホールを形成することなく、静電
容量付きのブースタコイルを形成するので、ブースタコ
イル及び静電容量付き絶縁部材の製造を容易に行うこと
ができ、非接触通信式情報担体の製造コストを安価にす
ることができる。According to the fourth aspect of the present invention, the first conductor film and the second conductor film are formed on the front and back surfaces of the insulating member so as to oppose each other, thereby connecting the capacitance for resonance to the booster coil. The first and second conductor films can be formed in the same process as the booster coil, and the manufacturing cost of the non-contact communication information carrier can be reduced. Further, since the capacitance can be made thin, the non-contact communication type information carrier can be made thin as compared with the case where a chip capacitor is mounted. Further, since the booster coil with the capacitance is formed without forming the through hole, the production of the booster coil and the insulating member with the capacitance can be easily performed, and the manufacturing cost of the non-contact communication type information carrier is increased. Can be inexpensive.
【００５２】請求項５に記載の発明は、ブースタコイル
を絶縁部材の表裏両面に分割して形成し、絶縁部材の表
裏面に形成された各ブースタコイルを電気的に接続する
ので、絶縁部材の表裏両面を有効利用できて、ブースタ
コイルの巻数を増やすことができ、通信特性が良好な非
接触通信式情報担体を得ることができる。According to the fifth aspect of the present invention, the booster coil is formed by dividing the front and back surfaces of the insulating member, and the respective booster coils formed on the front and back surfaces of the insulating member are electrically connected. Both the front and back surfaces can be effectively used, the number of turns of the booster coil can be increased, and a non-contact communication type information carrier having good communication characteristics can be obtained.
【００５３】請求項６に記載の発明は、ブースタコイル
を構成する導体の全部又は一部を対向に配置することに
よってブースタコイルに共振用の静電容量を接続するの
で、静電容量を形成するための特別な導体膜を絶縁部材
状に形成する必要がなく、絶縁部材の表裏両面を有効利
用できることから、ブースタコイルの巻数を増やすこと
ができ、通信特性が良好な非接触通信式情報担体を得る
ことができる。According to the sixth aspect of the present invention, the capacitance for resonance is connected to the booster coil by arranging all or some of the conductors constituting the booster coil to face each other, thereby forming the capacitance. It is not necessary to form a special conductive film in the form of an insulating member, and the front and back surfaces of the insulating member can be used effectively, so that the number of turns of the booster coil can be increased and a non-contact communication type information carrier having good communication characteristics can be provided. Obtainable.
【００５４】請求項７に記載の発明は、絶縁部材の表面
側及び裏面側に形成されるブースタコイルの導体幅とを
互いに異ならせるので、製造上、絶縁部材の表面側に形
成されたブースタコイルと絶縁部材の裏面側に形成され
たブースタコイルとの形成位置が各ブースタコイルの導
体幅の差の範囲でずれたとしても、静電容量の値が変化
せず、通信特性のばらつきが小さい非接触通信式情報担
体を提供できる。According to the seventh aspect of the present invention, since the conductor widths of the booster coils formed on the front side and the back side of the insulating member are made different from each other, the booster coil formed on the front side of the insulating member is manufactured. Even if the formation position of the booster coil formed on the back side of the insulating member is shifted within the range of the conductor width of each booster coil, the value of the capacitance does not change and the variation in the communication characteristics is small. A contact communication type information carrier can be provided.
【図面の簡単な説明】[Brief description of the drawings]
【図１】第１実施形態例に係る非接触通信式情報担体に
備えられるブースタコイルとＩＣ素子との配列を示す平
面図である。FIG. 1 is a plan view showing an arrangement of booster coils and IC elements provided on a non-contact communication type information carrier according to a first embodiment.
【図２】図１のＡ−Ａ断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】第１実施形態例に係る非接触通信式情報担体に
搭載される絶縁部材の表面図である。FIG. 3 is a front view of an insulating member mounted on the non-contact communication type information carrier according to the first embodiment.
【図４】第１実施形態例に係る非接触通信式情報担体に
搭載される絶縁部材の裏面図である。FIG. 4 is a rear view of the insulating member mounted on the non-contact communication type information carrier according to the first embodiment.
【図５】第１実施形態例に係る非接触通信式情報担体に
搭載されるＩＣ素子の斜視図である。FIG. 5 is a perspective view of an IC element mounted on the non-contact communication type information carrier according to the first embodiment.
【図６】第１実施形態例に係る非接触通信式情報担体に
搭載されるＩＣ素子の平面図である。FIG. 6 is a plan view of an IC element mounted on the non-contact communication information carrier according to the first embodiment.
【図７】第１実施形態例に係るブースタコイルの等価回
路図である。FIG. 7 is an equivalent circuit diagram of the booster coil according to the first embodiment.
【図８】第２実施形態例に係る非接触通信式情報担体に
搭載される絶縁部材の表面図である。FIG. 8 is a front view of an insulating member mounted on a non-contact communication type information carrier according to the second embodiment.
【図９】第３実施形態例に係る非接触通信式情報担体に
搭載される絶縁部材の表面図である。FIG. 9 is a front view of an insulating member mounted on a non-contact communication type information carrier according to the third embodiment.
【図１０】第３実施形態例に係る非接触通信式情報担体
に搭載される絶縁部材の裏面図である。FIG. 10 is a back view of an insulating member mounted on a non-contact communication type information carrier according to the third embodiment.
【図１１】第３実施形態例に係る非接触通信式情報担体
に備えられたブースタコイルの等価回路図である。FIG. 11 is an equivalent circuit diagram of a booster coil provided on a non-contact communication type information carrier according to the third embodiment.
１ アンテナコイル ２ ＩＣ素子 ３ ブースタコイル ３ｂ１ 表面パターン ３ｂ２ 裏面パターン ４ａ，４ｂ，５ａ，５ｂ 静電容量接続用の導体膜 ６ 絶縁部材 ７ 絶縁部材 ８ カバーシート ９ 接着剤層 １０ スルーホールDESCRIPTION OF SYMBOLS 1 Antenna coil 2 IC element 3 Booster coil 3b 1 Front surface pattern 3b 2 Back surface pattern 4a, 4b, 5a, 5b Conductive film for capacitance connection 6 Insulating member 7 Insulating member 8 Cover sheet 9 Adhesive layer 10 Through hole
Claims (7)
子と、前記ＩＣ素子に一体形成されたアンテナコイルと
リーダライタに備えられたアンテナコイルとの電磁結合
を強化するブースタコイルと、これらＩＣ素子及びブー
スタコイルを担持する絶縁部材とを備えた非接触通信式
情報担体において、前記絶縁部材上に１つのブースタコ
イルを形成し、当該１つのブースタコイルの一部と対向
に前記ＩＣ素子を配置したことを特徴とする非接触通信
式情報担体。An IC element integrally formed with an antenna coil, a booster coil for enhancing electromagnetic coupling between the antenna coil formed integrally with the IC element and an antenna coil provided in a reader / writer, In a non-contact communication type information carrier including an insulating member carrying a booster coil, one booster coil is formed on the insulating member, and the IC element is arranged to face a part of the one booster coil. A non-contact communication type information carrier characterized by the above-mentioned.
において、前記ブースタコイルを前記絶縁部材の片面に
のみ形成したことを特徴とする非接触通信式情報担体。2. The non-contact communication type information carrier according to claim 1, wherein the booster coil is formed only on one surface of the insulating member.
において、前記ブースタコイルを前記絶縁部材の表裏両
面に分割して形成したことを特徴とする非接触通信式情
報担体。3. The non-contact communication type information carrier according to claim 1, wherein the booster coil is formed on both sides of the insulating member.
において、前記絶縁部材の片面側に形成されたブースタ
コイルの両端部に、当該ブースタコイルと電気的に接続
された第１導体膜を形成すると共に、前記絶縁部材の裏
面の前記第１導体膜と対向する部分に、互いに電気的に
接続された２つの導体膜からなる第２導体膜を形成し、
スルーホールを形成することなく、前記ブースタコイル
に共振用の静電容量を接続したことを特徴とする非接触
通信式情報担体。4. The non-contact communication type information carrier according to claim 3, wherein a first conductor film electrically connected to both ends of a booster coil formed on one side of the insulating member. And forming a second conductor film made of two conductor films electrically connected to each other on a portion of the back surface of the insulating member facing the first conductor film,
A non-contact communication information carrier, wherein a resonance capacitance is connected to the booster coil without forming a through hole.
において、前記絶縁部材の表面側に形成されたブースタ
コイルと前記絶縁部材の裏面側に形成されたブースタコ
イルとをスルーホールを介して接続したことを特徴とす
る非接触通信式情報担体。5. The non-contact communication type information carrier according to claim 3, wherein a booster coil formed on a front side of the insulating member and a booster coil formed on a rear side of the insulating member are connected through a through hole. A non-contact communication type information carrier, characterized in that the information carrier is connected by a connection.
において、前記絶縁部材の表面側に形成されたブースタ
コイルと前記絶縁部材の裏面側に形成されたブースタコ
イルの全部又は一部を対向に配置し、前記ブースタコイ
ルに共振用の静電容量を接続したことを特徴とする非接
触通信式情報担体。6. The non-contact communication type information carrier according to claim 3, wherein all or a part of a booster coil formed on a front side of the insulating member and a booster coil formed on a rear side of the insulating member are formed. A non-contact communication type information carrier, wherein the information carrier is arranged opposite to the booster coil and a capacitance for resonance is connected to the booster coil.
において、前記絶縁部材の表面側に形成されたブースタ
コイルの導体幅と前記絶縁部材の裏面側に形成されたブ
ースタコイルの導体幅とを互いに異ならせたことを特徴
とする非接触通信式情報担体。7. The non-contact communication type information carrier according to claim 3, wherein a conductor width of a booster coil formed on a front side of the insulating member and a conductor width of a booster coil formed on a back side of the insulating member. A non-contact communication type information carrier characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000227455A JP2002042083A (en) | 2000-07-27 | 2000-07-27 | Non-contact communication type information carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000227455A JP2002042083A (en) | 2000-07-27 | 2000-07-27 | Non-contact communication type information carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002042083A true JP2002042083A (en) | 2002-02-08 |
Family
ID=18720903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000227455A Withdrawn JP2002042083A (en) | 2000-07-27 | 2000-07-27 | Non-contact communication type information carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002042083A (en) |
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2000
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