JP2002183690A - Noncontact ic tag device - Google Patents
Noncontact ic tag deviceInfo
- Publication number
- JP2002183690A JP2002183690A JP2000376040A JP2000376040A JP2002183690A JP 2002183690 A JP2002183690 A JP 2002183690A JP 2000376040 A JP2000376040 A JP 2000376040A JP 2000376040 A JP2000376040 A JP 2000376040A JP 2002183690 A JP2002183690 A JP 2002183690A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- tag device
- contact
- antenna
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、アンテナコイルが
一体形成されたＩＣ素子とブースタコイルとを有する非
接触ＩＣタグ装置に係り、特に、一辺の幅が狭い細長形
の非接触ＩＣタグ装置に好適なブースタコイルの構成に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC tag device having an IC element integrally formed with an antenna coil and a booster coil, and more particularly to an elongated non-contact IC tag device having a narrow side. It relates to a preferred booster coil configuration.
【０００２】[0002]
【従来の技術】従来より、絶縁性の基体内にＩＣ素子と
当該ＩＣ素子の端子部に電気的に接続されたアンテナコ
イルとを備え、リーダライタからの電力の受給及びリー
ダライタとの間のデジタル信号の送受信を電磁波を用い
て非接触で行う非接触式のタグ装置が知られている。2. Description of the Related Art Conventionally, an IC element and an antenna coil electrically connected to a terminal portion of the IC element are provided in an insulating base, so as to receive power from a reader / writer and to establish a connection between the reader and writer. 2. Description of the Related Art A non-contact tag device that transmits and receives digital signals in a non-contact manner using electromagnetic waves is known.
【０００３】従来、この種の非接触ＩＣタグ装置として
は、アンテナコイルを絶縁部材にパターン形成したも
の、或いは、巻線からなるアンテナコイルを絶縁部材に
担持したものが用いられているが、近年に至って、アン
テナコイルとＩＣ素子との接続点の保護処理や防湿対策
が不要で安価に作成できること、及び絶縁部材に曲げや
ねじれ等のストレスが作用した場合にもコイルに断線を
生じることがなく耐久性に優れることなどから、ＩＣ素
子自体にアンテナコイルが一体形成されたＩＣ素子を絶
縁部材上に搭載したものが提案されている。Conventionally, as this type of non-contact IC tag device, a device in which an antenna coil is formed in a pattern on an insulating member, or a device in which an antenna coil composed of a winding is supported on an insulating member, has been used. Therefore, it is not necessary to protect the connection point between the antenna coil and the IC element and to provide a damp-proof countermeasure, so that the coil can be made inexpensively, and even if stress such as bending or torsion acts on the insulating member, the coil does not break. Due to its excellent durability and the like, an IC element in which an antenna coil is integrally formed with an IC element itself is mounted on an insulating member.
【０００４】アンテナコイルをＩＣ素子に一体形成した
場合、アンテナコイルを絶縁部材にパターン形成した
り、巻線からなるアンテナコイルを絶縁部材に担持する
場合に比べて、コイルの巻径や導体幅が小さくなり、巻
数についても自ずと限界があるため、リーダライタとの
間の通信距離を大きくすることが困難で、必要な通信距
離を確保することできない場合がある。そこで、従来よ
り、特開平１０−５０６７４０号公報等に記載されてい
るように、ＩＣ素子に一体形成されたアンテナコイルと
リーダライタに備えられたアンテナコイルとの間に、各
アンテナコイル間の電磁誘導結合を強化するための導体
ループを配置する技術が提案されている。[0004] When the antenna coil is formed integrally with the IC element, the winding diameter and the conductor width of the coil are smaller than when the antenna coil is patterned on an insulating member or the antenna coil composed of a winding is carried on the insulating member. Since the number of turns is small and the number of turns is naturally limited, it is difficult to increase the communication distance with the reader / writer, and it may not be possible to secure the required communication distance. Therefore, conventionally, as described in Japanese Patent Application Laid-Open No. 10-506740, an electromagnetic field between each antenna coil is provided between an antenna coil formed integrally with an IC element and an antenna coil provided in a reader / writer. Techniques for arranging conductor loops for enhancing inductive coupling have been proposed.
【０００５】なお、本明細書においては、このアンテナ
コイル間の電磁結合を強化するための導体ループを、
「ブースタコイル」という。[0005] In the present specification, a conductor loop for enhancing the electromagnetic coupling between the antenna coils is provided as follows.
"Booster coil".
【０００６】前記公知例に記載のブースタコイルは、Ｉ
Ｃ素子に一体形成されたアンテナコイルとほぼ同一寸法
に形成され、ＩＣ素子に一体形成されたアンテナコイル
と主に電磁結合する第１コイルと、当該第１コイルと電
気的に接続され、絶縁部材の寸法範囲で当該第１コイル
よりも大型に形成されて、リーダライタに備えられたア
ンテナコイルと主に電磁結合する１ターンの第２コイル
とを有する構成になっている。本構成のブースタコイル
を用いることによって、非接触ＩＣタグ装置とリーダラ
イタとの間の通信距離を数ｃｍにすることができる。[0006] The booster coil described in the above-mentioned known example has an I
A first coil formed to have substantially the same size as the antenna coil formed integrally with the C element and mainly electromagnetically coupled to the antenna coil formed integrally with the IC element; an insulating member electrically connected to the first coil; The first coil is formed larger than the first coil within the dimension range described above, and has a one-turn second coil mainly electromagnetically coupled to the antenna coil provided in the reader / writer. By using the booster coil having this configuration, the communication distance between the non-contact IC tag device and the reader / writer can be reduced to several cm.
【０００７】[0007]
【発明が解決しようとする課題】ところで、非接触ＩＣ
タグ装置は、交通、流通及び情報通信などの各分野で普
及が進んでおり、通信距離の拡大が強く求められている
と共に、各種の形状及び各種サイズのものが求められて
いる。However, non-contact ICs
Tag devices have been widely used in various fields such as traffic, distribution, and information communication, and there is a strong demand for an increase in communication distance, as well as various shapes and sizes.
【０００８】通信距離の拡大を図るためには、ＩＣ素子
に一体形成されたアンテナコイルと主に電磁結合する第
１コイル及びリーダライタに備えられたアンテナコイル
と主に電磁結合する第２コイルの巻数を多くすること、
並びに、第１コイルのサイズを最適化することが必要不
可欠であるが、従来のように第１コイルの外周に第２コ
イルを配置するという構成によると、例えばＣＤ収納ボ
ックスのインデックス部分に装着されるような一辺の長
さが６ｍｍ程度の非接触ＩＣタグ装置に適用した場合、
第１コイル及び第２コイルの巻数を増加することが難し
く、通信距離の拡大を図ることができない。また、本願
発明者らの実験によると、第１コイルの直径（矩形スパ
イラル状の第１コイルについては、一辺の長さ）は、Ｉ
Ｃ素子に一体形成されたアンテナコイルの直径の２〜３
倍にした場合の方が同一径にした場合よりも良好な通信
特性が得られることが確認されており、このような事情
から第１コイルの直径を大型化すると、それに伴って第
２コイルを形成するためのスペースが小さくなるため、
第２のコイルの巻数が減少して、やはり通信距離の拡大
を図ることが困難になる。To increase the communication distance, a first coil mainly electromagnetically coupled to an antenna coil formed integrally with the IC element and a second coil mainly electromagnetically coupled to an antenna coil provided in the reader / writer are provided. Increase the number of turns,
In addition, it is indispensable to optimize the size of the first coil. However, according to the conventional configuration in which the second coil is arranged on the outer periphery of the first coil, for example, it is mounted on the index portion of the CD storage box. When applied to a non-contact IC tag device with a side length of about 6 mm,
It is difficult to increase the number of turns of the first coil and the second coil, and the communication distance cannot be increased. Further, according to the experiments performed by the inventors of the present application, the diameter of the first coil (the length of one side of the rectangular spiral first coil) is I
2-3 of the diameter of the antenna coil formed integrally with the C element
It has been confirmed that better communication characteristics can be obtained when the diameter is doubled than when the diameter is the same. When the diameter of the first coil is increased from such circumstances, the second coil is accordingly connected. Because the space for forming is small,
Since the number of turns of the second coil is reduced, it is also difficult to increase the communication distance.
【０００９】本発明は、かかる従来技術の不備を解決す
るためになされたものであって、その課題は、ブースタ
コイルの巻線パターンを最適化し、細長形にして通信距
離が大きい非接触ＩＣタグ装置を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned deficiencies of the prior art, and an object thereof is to optimize a winding pattern of a booster coil, to make the booster coil elongated, and to make a non-contact IC tag having a large communication distance. It is to provide a device.
【００１０】[0010]
【課題を解決するための手段】本発明は、前記の課題を
解決するため、第１に、アンテナコイルが一体形成され
たＩＣ素子と、前記ＩＣ素子に一体形成されたアンテナ
コイルとリーダライタに備えられたアンテナコイルとの
電磁結合を強化するブースタコイルと、これらＩＣ素子
及びブースタコイルを担持する絶縁部材とを備えた非接
触ＩＣタグ装置において、前記ブースタコイルを、前記
ＩＣ素子に一体形成されたアンテナコイルと主に電磁結
合する第１コイルと、当該第１コイルと電気的に接続さ
れ、前記リーダライタに備えられたアンテナコイルと主
に電磁結合する第２コイルとから構成し、前記第１コイ
ルの外径を前記第２コイルの内径よりも大きく形成する
という構成にした。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention firstly provides an IC element integrally formed with an antenna coil and an antenna coil integrated with the IC element and a reader / writer. In a non-contact IC tag device including a booster coil for enhancing electromagnetic coupling with a provided antenna coil and an insulating member that carries the IC element and the booster coil, the booster coil is integrally formed with the IC element. A first coil mainly electromagnetically coupled to the antenna coil, and a second coil electrically connected to the first coil and mainly electromagnetically coupled to the antenna coil provided in the reader / writer. The outer diameter of one coil is made larger than the inner diameter of the second coil.
【００１１】このように、ブースタコイルを、ＩＣ素子
に一体形成されたアンテナコイルと主に電磁結合する第
１コイルと、当該第１コイルと電気的に接続され、リー
ダライタに備えられたアンテナコイルと主に電磁結合す
る第２コイルとから構成し、第１コイルの外周を第２コ
イルの内周よりも大きく形成すると、第２コイルの巻数
を減少することなく、第１コイルの巻径の拡大を図るこ
とができるので、非接触ＩＣタグ装置の通信距離を拡大
することができる。As described above, the first coil which mainly electromagnetically couples the booster coil to the antenna coil formed integrally with the IC element, and the antenna coil electrically connected to the first coil and provided in the reader / writer When the outer circumference of the first coil is formed larger than the inner circumference of the second coil, the number of turns of the first coil is reduced without reducing the number of turns of the second coil. Since the extension can be achieved, the communication distance of the non-contact IC tag device can be extended.
【００１２】本発明は、前記の課題を解決するため、第
２に、前記絶縁基板の表面に前記第２コイルを渦巻き状
に形成し、当該絶縁基板の表面の前記第２コイルの内部
に前記第１コイルの一部を渦巻き状に形成すると共に、
前記絶縁基板の裏面に前記第１コイルの他の一部を渦巻
き状に形成し、当該第１コイルの他の一部の外周を前記
第２コイルの内周よりも大きく形成するという構成にし
た。According to the present invention, in order to solve the above-mentioned problem, secondly, the second coil is formed in a spiral shape on the surface of the insulating substrate, and the second coil is formed inside the second coil on the surface of the insulating substrate. A part of the first coil is formed in a spiral shape,
The other part of the first coil is formed in a spiral shape on the back surface of the insulating substrate, and the outer circumference of the other part of the first coil is formed larger than the inner circumference of the second coil. .
【００１３】このように、第１コイルを絶縁基板の第２
コイル形成面側に形成される部分とその裏面に形成され
る部分とから構成すると、絶縁基板の裏面に形成される
部分については、第２コイルのサイズに関係なく、絶縁
基板の面積の範囲で自由に形成することができるので、
第１コイルの直径及び巻数の増加を図ることができて、
非接触ＩＣタグ装置の通信距離を拡大することができ
る。Thus, the first coil is connected to the second substrate of the insulating substrate.
When a portion formed on the coil forming surface side and a portion formed on the back surface thereof are formed, the portion formed on the back surface of the insulating substrate is within the area of the insulating substrate regardless of the size of the second coil. Because it can be formed freely,
The diameter and the number of turns of the first coil can be increased,
The communication distance of the non-contact IC tag device can be increased.
【００１４】本発明は、前記の課題を解決するため、第
３に、前記絶縁基板の表面に前記第２コイルを渦巻き状
に形成し、当該絶縁基板の表面の前記第２コイルの外部
に前記第１コイルを渦巻き状に形成すると共に、前記絶
縁基板の裏面に前記第１コイルと前記第２コイルとを接
続するリードを形成するという構成にした。According to the present invention, in order to solve the above-mentioned problem, thirdly, the second coil is formed in a spiral shape on the surface of the insulating substrate, and the second coil is formed on the surface of the insulating substrate outside the second coil. The first coil is formed in a spiral shape, and a lead for connecting the first coil and the second coil is formed on the back surface of the insulating substrate.
【００１５】このように、第２コイルの外部に第１コイ
ルを形成すると、絶縁基板の表面における第１コイルの
形成エリアと第２コイルの形成エリアとを分離すること
ができ、第１コイルを第２コイルのサイズに関係なく、
絶縁基板の面積の範囲で自由に形成することができるの
で、第１コイルの直径及び巻数の増加を図ることができ
て、非接触ＩＣタグ装置の通信距離を拡大することがで
きる。As described above, when the first coil is formed outside the second coil, the area where the first coil is formed and the area where the second coil is formed on the surface of the insulating substrate can be separated. Regardless of the size of the second coil,
Since it can be formed freely within the area of the insulating substrate, the diameter and the number of turns of the first coil can be increased, and the communication distance of the non-contact IC tag device can be increased.
【００１６】本発明は、前記の課題を解決するため、第
４に、前記第１コイルと第２コイルとの間に静電容量を
直列に挿入するという構成にした。Fourth, in order to solve the above-mentioned problem, the present invention is configured to insert a capacitance in series between the first coil and the second coil.
【００１７】このように、第１コイルと第２コイルとの
間に静電容量を直列に挿入すると、これら第１コイル及
び第２コイルから構成されるブースタコイルのインダク
タンスをＬ、挿入された静電容量のキャパシタンスをＣ
としたとき、ｆ０＝１／｛２π√（ＬＣ）｝で表される
所要の周波数で非接触ＩＣタグ装置を共振させることが
できるので、非接触ＩＣタグ装置の通信距離を拡大する
ことができる。As described above, when the capacitance is inserted in series between the first coil and the second coil, the inductance of the booster coil composed of the first coil and the second coil is set to L, and the inserted static electricity is increased. Capacitance of capacitance is C
Then, since the non-contact IC tag device can resonate at a required frequency represented by f0 = 1 / {2π} (LC)}, the communication distance of the non-contact IC tag device can be extended. .
【００１８】本発明は、前記の課題を解決するため、第
５に、前記絶縁基板の表面に前記第２コイルを渦巻き状
に形成し、当該絶縁基板の表面の前記第２コイルの外部
に前記第１コイルを渦巻き状に形成すると共に、前記絶
縁基板の裏面に、前記絶縁基板の表面側から見て巻線方
向が前記第２コイルと逆向きの導線を前記第２コイルと
対向に形成するという構成にした。In order to solve the above-mentioned problems, the present invention fifthly forms the second coil in a spiral shape on the surface of the insulating substrate, and forms the second coil on the surface of the insulating substrate outside the second coil. The first coil is formed in a spiral shape, and a conducting wire whose winding direction is opposite to the second coil when viewed from the front side of the insulating substrate is formed on the back surface of the insulating substrate so as to face the second coil. Was configured.
【００１９】このように、第２コイルの外部に第１コイ
ルを形成すると、絶縁基板の表面における第１コイルの
形成エリアと第２コイルの形成エリアとを分離すること
ができ、第１コイルを第２コイルのサイズに関係なく、
絶縁基板の面積の範囲で自由に形成することができるの
で、第１コイルの直径及び巻数の増加を図ることができ
て、非接触ＩＣタグ装置の通信距離を拡大することがで
きる。また、絶縁基板を介して第２コイルを構成する導
体と他の導体とを対向に形成すると、これらの各導体間
に静電容量が形成されるので、チップコンデンサ等の搭
載を省略することができ、非接触ＩＣタグ装置の薄形化
及び低コスト化を図ることができる。As described above, when the first coil is formed outside the second coil, the area where the first coil is formed and the area where the second coil is formed on the surface of the insulating substrate can be separated. Regardless of the size of the second coil,
Since it can be formed freely within the area of the insulating substrate, the diameter and the number of turns of the first coil can be increased, and the communication distance of the non-contact IC tag device can be increased. Further, when the conductor forming the second coil and the other conductor are formed to face each other via the insulating substrate, a capacitance is formed between these conductors, so that the mounting of a chip capacitor or the like can be omitted. Thus, the thickness and cost of the non-contact IC tag device can be reduced.
【００２０】本発明は、前記の課題を解決するため、第
６に、前記第１コイル及び／又は第２コイルの一辺の長
さを５ｍｍとし、前記ブースタコイルの長さを５０ｍｍ
に形成するという構成にした。In order to solve the above-mentioned problems, the present invention sixthly sets a length of one side of the first coil and / or the second coil to 5 mm and a length of the booster coil to 50 mm.
Was formed.
【００２１】このように、第１コイル及び／又は第２コ
イルの一辺の長さを５ｍｍとし、これら第１コイル及び
第２コイルで構成されるブースタコイルの長さを５０ｍ
ｍに形成すると、例えばＣＤ収納ボックスのインデック
ス部分に装着可能な一辺の長さが５〜６ｍｍ程度の非接
触ＩＣタグ装置を得ることができる。As described above, the length of one side of the first coil and / or the second coil is 5 mm, and the length of the booster coil composed of the first coil and the second coil is 50 m.
m, it is possible to obtain a non-contact IC tag device having a side length of about 5 to 6 mm that can be attached to the index portion of the CD storage box, for example.
【００２２】本発明は、前記の課題を解決するため、第
７に、前記第１コイルの一辺の長さを前記ＩＣ素子に一
体形成されたアンテナコイルの一辺の長さの２倍乃至３
倍に形成するという構成にした。In order to solve the above-mentioned problems, the present invention seventhly sets a length of one side of the first coil to twice to three times a length of one side of an antenna coil formed integrally with the IC element.
It was configured to be doubled.
【００２３】このように、第１コイルの一辺の長さをＩ
Ｃ素子に一体形成されたアンテナコイルの一辺の長さの
２倍乃至３倍に形成すると、第１コイルとＩＣ素子に一
体形成されたアンテナコイルとの電磁結合の範囲が広が
るので、非接触ＩＣタグ装置の製造工程において、第１
コイルの形成位置に対するＩＣ素子の設定位置がずれた
場合や、第１コイルの形状又は導体幅にばらつきを生じ
た場合にも、第１コイルに生じる誘導起電力の低下を少
なくすることができ、通信特性のばらつきが小さい非接
触ＩＣタグ装置を得ることができる。As described above, the length of one side of the first coil is I
If the length of one side of the antenna coil formed integrally with the C element is twice or three times, the range of electromagnetic coupling between the first coil and the antenna coil formed integrally with the IC element is widened. In the manufacturing process of the tag device,
Even when the set position of the IC element with respect to the coil formation position is displaced, or when the shape or conductor width of the first coil varies, the reduction of the induced electromotive force generated in the first coil can be reduced. A non-contact IC tag device with a small variation in communication characteristics can be obtained.
【００２４】[0024]
【発明の実施の形態】〈第１実施形態例〉第１実施形態
例に係る非接触ＩＣタグ装置を、図１乃至図４に基づい
て説明する。図１は第１実施形態例に係る非接触ＩＣタ
グ装置の断面図、図２は第１実施形態例に係る非接触Ｉ
Ｃタグ装置に備えられる絶縁部材の表面図、図３は第１
実施形態例に係る非接触ＩＣタグ装置に備えられる絶縁
部材の表面側から裏面側を見た透視図、図４は第１実施
形態例に係る非接触ＩＣタグ装置に搭載されるＩＣ素子
の斜視図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A non-contact IC tag device according to a first embodiment will be described with reference to FIGS. FIG. 1 is a sectional view of a non-contact IC tag device according to the first embodiment, and FIG. 2 is a non-contact IC tag device according to the first embodiment.
FIG. 3 is a front view of an insulating member provided in the C tag device.
FIG. 4 is a perspective view of the insulating member provided in the non-contact IC tag device according to the embodiment when viewed from the front side to the back side. FIG. FIG.
【００２５】図１に示すように、本例の非接触ＩＣタグ
装置は、アンテナコイル１が一体形成されたＩＣ素子２
と、ブースタコイル３及び静電容量接続パッド４ａ，４
ｂが形成された絶縁部材５と、前記静電容量接続パッド
４ａ，４ｂに接続されたチップコンデンサ６と、これら
ＩＣ素子２、チップコンデンサ６及び絶縁部材５を一体
にケーシングする基体７とからなる。As shown in FIG. 1, the contactless IC tag device of this embodiment has an IC element 2 in which an antenna coil 1 is integrally formed.
And the booster coil 3 and the capacitance connection pads 4a, 4
b, a chip capacitor 6 connected to the capacitance connection pads 4a and 4b, and a base 7 casing the IC element 2, the chip capacitor 6 and the insulating member 5 integrally. .
【００２６】ＩＣ素子２は、図４に示すように、入出力
端子２ａの形成面に、ポリイミド樹脂膜等からなる絶縁
層２ｂを介して矩形スパイラル状のアンテナコイル１を
一体に形成してなる。アンテナコイル１は、フォトレジ
スト法、即ち、ＩＣ素子２の絶縁層２ｂ上に導電性金属
材料をスパッタリング又は真空蒸着し、ＩＣ素子２（よ
り実際的には、個々のＩＣ素子に分割される以前の完成
ウエハ）の絶縁層形成面に、フォトレジスト層を均一の
厚さに形成し、このフォトレジスト層に所要のコイルパ
ターンを露光・現像した後、フォトレジスト層をマスク
としてエッチングし、しかる後に、フォトレジスト層を
除去して入出力端子４ａの形成面に導電性金属材料から
なるコイルパターンを形成するといった方法で形成する
ことができる。なお、コイルパターンの電気抵抗を減少
するため、導電性金属膜の表面に銅めっき層を形成する
こともできる。As shown in FIG. 4, the IC element 2 is formed by integrally forming a rectangular spiral antenna coil 1 on a surface on which input / output terminals 2a are formed with an insulating layer 2b made of a polyimide resin film or the like interposed therebetween. . The antenna coil 1 is formed by a photoresist method, that is, a conductive metal material is sputtered or vacuum-deposited on the insulating layer 2b of the IC element 2 to form the IC element 2 (more practically, before being divided into individual IC elements). A photoresist layer is formed to a uniform thickness on the insulating layer forming surface of the completed wafer), a required coil pattern is exposed and developed on the photoresist layer, and then etched using the photoresist layer as a mask. Alternatively, the photoresist layer may be removed to form a coil pattern made of a conductive metal material on the surface on which the input / output terminals 4a are formed. In order to reduce the electric resistance of the coil pattern, a copper plating layer can be formed on the surface of the conductive metal film.
【００２７】なお、図４の例では、アンテナコイル１が
複数のターン数を有する矩形スパイラル状に形成されて
いるが、当該アンテナコイル１のターン数や平面形状は
これに限定されるものではない。即ち、ターン数に関し
ては、１ターン以上の任意のターン数とすることがで
き、平面形状に関しては、角部に斜線状又は円弧状の面
取りが施された矩形や円形など、任意の形状に形成でき
る。In the example shown in FIG. 4, the antenna coil 1 is formed in a rectangular spiral shape having a plurality of turns, but the number of turns and the planar shape of the antenna coil 1 are not limited to this. . That is, the number of turns can be any number of one or more turns, and the planar shape can be formed into an arbitrary shape such as a rectangle or a circle with oblique or arcuate chamfers at the corners. it can.
【００２８】ブースタコイル３は、図２及び図３に示す
ように、ＩＣ素子２に一体形成されたアンテナコイル１
と主に電磁結合する第１コイル３ａと、当該第１コイル
３ａと電気的に接続され、図示しないリーダライタに備
えられたアンテナコイルと主に電磁結合する第２コイル
３ｂとから構成されており、前記第１コイル３ａは、絶
縁部材５の表面側に前記第２コイル３ｂと共に形成され
た表面側第１コイル３ａ１ と、絶縁部材５の裏面側に
形成された裏面側第１コイル３ａ２ とから構成されて
いる。ブースタコイル３のターン数を増加し、非接触Ｉ
Ｃタグの通信距離を拡大するため、ブースタコイル３を
構成する導線の導線幅は１００μｍ、導線間のスペース
幅は１５０μｍ程度にすることが好ましい。As shown in FIGS. 2 and 3, the booster coil 3 is an antenna coil 1 integrally formed with the IC element 2.
A first coil 3a mainly electromagnetically coupled to the first coil 3a, and a second coil 3b electrically connected to the first coil 3a and mainly electromagnetically coupled to an antenna coil provided in a reader / writer (not shown). the first coil 3a includes a surface-side first coil 3a 1 formed with the second coil 3b on the surface side of the insulating member 5, the insulating member 5 in the back side formed the back side first coil 3a 2 It is composed of The number of turns of the booster coil 3 is increased,
In order to extend the communication distance of the C tag, it is preferable that the conductors constituting the booster coil 3 have a conductor width of about 100 μm and a space width between the conductors of about 150 μm.
【００２９】前記第２コイル３ｂは、図示しないリーダ
ライタに備えられたアンテナコイルとの間の良好な電磁
誘導結合を確保するため、絶縁部材５の平面積の範囲内
でなるべく大型に形成される。例えば、一辺の長さが６
ｍｍ程度のＣＤ収納ボックスのインデックス部分に装着
される非接触ＩＣタグ装置については、前記第２コイル
２ｂは、短辺の長さが５ｍｍで、長辺の長さが５０ｍｍ
の矩形スパイラル状に形成される。表面側第１コイル３
ａ１ は、図２に示すように、前記第２コイル２ｂの内
周部分に形成される。これに対して、裏面側第１コイル
３ａ２ は、図３に示すように、その外径が前記第２コ
イル２ｂの短辺側の外径と同一寸法に形成され、裏面側
第１コイル３ａ２ の外径が前記第２コイル２ｂの短辺
側の内径よりも大きくなっている。ＩＣ素子２は、図１
及び図３に示すように、アンテナコイル１を裏面側第１
コイル３ａ２ と対向に向けて、絶縁部材５の裏面側に
設定される。ＩＣ素子２は、一辺の長さが２ｍｍ程度の
角形に形成されるため、一辺の長さが５ｍｍ程度の矩形
スパイラル状に形成された裏面側第１コイル３ａ２ は、
アンテナコイル１の外径の約２〜３倍になる。The second coil 3b is connected to a reader (not shown).
Good electromagnetic between the antenna coil provided in the writer
In order to secure inductive coupling, within the plane area of insulating member 5
It is formed as large as possible. For example, if the length of one side is 6
Attached to the index part of a CD storage box of about mm
The non-contact IC tag device, wherein the second coil
2b has a short side length of 5 mm and a long side length of 50 mm
Is formed in a rectangular spiral shape. Front side first coil 3
a1Is inside of the second coil 2b as shown in FIG.
It is formed on the peripheral part. On the other hand, the back side first coil
3a2Has an outer diameter of the second core as shown in FIG.
The same size as the outer diameter of the short side of the file 2b,
First coil 3a2Is the short side of the second coil 2b
Side is larger than the inside diameter. IC element 2 is shown in FIG.
As shown in FIG. 3 and FIG.
Coil 3a2And facing the back of the insulating member 5
Is set. The IC element 2 has a side length of about 2 mm.
Because it is formed in a rectangular shape, a rectangle whose side length is about 5 mm
Backside first coil 3a formed in a spiral shape2 Is
It becomes about 2 to 3 times the outer diameter of the antenna coil 1.
【００３０】表面側第１コイル３ａ１ の内周端と裏面
側第１コイル３ａ２ の内周端は、スルーホール１１を
介して接続され、裏面側第１コイル３ａ２ の外周端と
第２コイル３ｂの内周端はスルーホール１２を介して接
続される。また、表面側第１コイル３ａ１ の外周端と
第１の静電容量接続パッド４ａは、スルーホール１３を
介して接続され、第２コイル３ｂの外周端と第２の静電
容量接続パッド４ｂは、スルーホール１４を介して接続
される。The inner peripheral end and the back-side first inner circumferential end of the coil 3a 2 of the first coil 3a surface 1 is connected via a through hole 11, the rear surface-side first outer peripheral end of the coil 3a 2 and the second The inner peripheral end of the coil 3b is connected via a through hole 12. The outer peripheral end of the first capacitive connection pad 4a of the surface first coil 3a side 1 is connected through the through hole 13, the outer peripheral end of the second coil 3b and the second capacitance connected pads 4b Are connected via a through hole 14.
【００３１】なお、図１及び図３の例では、ブースタコ
イル３が複数のターン数を有する矩形スパイラル状に形
成されているが、ブースタコイル３のターン数や平面形
状はこれに限定されるものではなく、前述のアンテナコ
イル１と同様に、任意のターン数及び形状に形成するこ
とができる。In the examples shown in FIGS. 1 and 3, the booster coil 3 is formed in a rectangular spiral shape having a plurality of turns, but the number of turns and the planar shape of the booster coil 3 are not limited to this. Instead, as in the case of the above-described antenna coil 1, it can be formed into an arbitrary number of turns and a shape.
【００３２】チップコンデンサ６としては、ＩＣ素子２
に一体形成されたアンテナコイル１及びブースタコイル
３を含む系において、アンテナコイル１の両端に最大電
圧が得られる静電容量をもつものが用いられる。As the chip capacitor 6, the IC element 2
In the system including the antenna coil 1 and the booster coil 3 integrally formed with each other, one having a capacitance at both ends of the antenna coil 1 capable of obtaining a maximum voltage is used.
【００３３】絶縁部材５は、所要の誘電率と剛性とをも
った絶縁材料をもって形成される。絶縁部材５を構成す
るに好適な絶縁材料としては、一例として、ガラスエポ
キシ樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリエチ
レンテレフタレート樹脂（以下、ＰＥＴと略称する。）
又は塩化ビニル樹脂などを挙げることができる。The insulating member 5 is formed of an insulating material having a required permittivity and rigidity. As an insulating material suitable for constituting the insulating member 5, for example, glass epoxy resin, polyimide resin, polyamide resin, polyethylene terephthalate resin (hereinafter abbreviated as PET).
Alternatively, a vinyl chloride resin or the like can be used.
【００３４】基体７は、カバーシート８と接着剤層９と
をもって構成される。このうち、カバーシート７は、紙
やプラスチックシートなど、任意のシート状材料をもっ
て形成することができるが、廃棄しても分解し、焼却し
てもダイオキシン等の有害物質を発生しないことから、
紙をもって形成することが最も好ましい。カバーシート
材料としてプラスチックシートを用いる場合には、焼却
してもダイオキシン等の有害物質を発生しないことか
ら、ＰＥＴのような塩素を含まないプラスチックシート
を用いることが特に好ましい。一方、接着剤層９を構成
する接着剤としては、硬化後に所要の硬度を有する任意
の接着剤を用いることができるが、ブースタコイル１、
アンテナコイル３及びＩＣ素子４の保護効果を高めるた
め、例えばエポキシ樹脂のように吸湿性の低い樹脂材料
を用いることが特に好ましい。The base 7 includes a cover sheet 8 and an adhesive layer 9. Among these, the cover sheet 7 can be formed of any sheet-like material such as paper or plastic sheet, but it is decomposed even if discarded, and does not generate harmful substances such as dioxin even when incinerated.
Most preferably, it is formed of paper. When a plastic sheet is used as the cover sheet material, it is particularly preferable to use a chlorine-free plastic sheet such as PET because PET does not generate harmful substances such as dioxin even when incinerated. On the other hand, as the adhesive constituting the adhesive layer 9, any adhesive having a required hardness after curing can be used.
In order to enhance the protection effect of the antenna coil 3 and the IC element 4, it is particularly preferable to use a resin material having low hygroscopicity such as an epoxy resin.
【００３５】前記第１実施形態例に係る非接触ＩＣタグ
装置は、絶縁部材５の表面側に第２コイル３ｂと表面側
第１コイル３ａ１ とを形成し、絶縁部材５の裏面側に
裏面側第１コイル３ａ２ を形成したので、裏面側第１
コイル３ａ２ を第２コイル２ｂのサイズに関係なく絶
縁部材５の平面積の範囲で自由に形成することができ、
第１コイル３ａの直径及び巻数を増加できて、非接触Ｉ
Ｃタグ装置の通信距離を拡大することができる。また、
前記第１実施形態例に係る非接触ＩＣタグ装置は、第１
コイル３ａと第２コイル３ｂとの間にチップコンデンサ
６を直列に挿入したので、これら第１コイル３ａ及び第
２コイル３ｂから構成されるブースタコイル３のインダ
クタンスをＬ、挿入されたチップコンデンサ６のキャパ
シタンスをＣとしたとき、ｆ０＝１／｛２π√（Ｌ
Ｃ）｝で表される所要の周波数で非接触ＩＣタグ装置を
共振させることができて、非接触ＩＣタグ装置の通信距
離を拡大することができる。さらに、前記第１実施形態
例に係る非接触ＩＣタグ装置は、裏面側第１コイル３ａ
２ の外径をアンテナコイル１の一辺の長さの２倍乃至
３倍に形成したので、第１コイル３ａとアンテナコイル
１との電磁結合の範囲を広げることができ、非接触ＩＣ
タグ装置の製造工程において、第１コイル３ａの形成位
置に対するＩＣ素子２の設定位置がずれた場合や、第１
コイル３ａの形状又は導体幅にばらつきを生じた場合に
も、第１コイル３ａに生じる誘導起電力の低下を少なく
することができ、通信特性のばらつきが小さい非接触Ｉ
Ｃタグ装置を得ることができる。[0035] The non-contact IC tag system according to the first embodiment, the first to form a coil 3a 1 second coil 3b and the front side to the surface side of the insulating member 5, the rear surface on the rear surface side of the insulating member 5 since the formation of the side first coil 3a 2, backside first
The coil 3a 2 can be freely formed within the plane area of the insulating member 5 regardless of the size of the second coil 2b,
The diameter and the number of turns of the first coil 3a can be increased,
The communication distance of the C tag device can be increased. Also,
The non-contact IC tag device according to the first embodiment is a first contactless IC tag device.
Since the chip capacitor 6 is inserted in series between the coil 3a and the second coil 3b, the inductance of the booster coil 3 composed of the first coil 3a and the second coil 3b is L, and the inductance of the inserted chip capacitor 6 is L. Assuming that the capacitance is C, f0 = 1 / {2π} (L
C) The non-contact IC tag device can resonate at a required frequency represented by 表, and the communication distance of the non-contact IC tag device can be extended. Further, the non-contact IC tag device according to the first embodiment includes a back side first coil 3a.
2 is formed to be twice or three times the length of one side of the antenna coil 1, so that the range of electromagnetic coupling between the first coil 3a and the antenna coil 1 can be expanded, and the non-contact IC
In the manufacturing process of the tag device, when the set position of the IC element 2 is shifted with respect to the formation position of the first coil 3a,
Even when the shape or conductor width of the coil 3a varies, the reduction of the induced electromotive force generated in the first coil 3a can be reduced, and the non-contact I with a small variation in the communication characteristics can be obtained.
A C tag device can be obtained.
【００３６】〈第２実施形態例〉第２実施形態例に係る
非接触ＩＣタグ装置を、図５乃至図７に基づいて説明す
る。図５は第２実施形態例に係る非接触ＩＣタグ装置の
断面図、図６は第２実施形態例に係る非接触ＩＣタグ装
置に備えられる絶縁部材の表面図、図７は第２実施形態
例に係る非接触ＩＣタグ装置に備えられる絶縁部材の表
面側から裏面側を見た透視図である。<Second Embodiment> A non-contact IC tag device according to a second embodiment will be described with reference to FIGS. FIG. 5 is a sectional view of a non-contact IC tag device according to the second embodiment, FIG. 6 is a front view of an insulating member provided in the non-contact IC tag device according to the second embodiment, and FIG. 7 is a second embodiment. It is the perspective view which looked at the back side from the front side of the insulating member provided in the non-contact IC tag apparatus which concerns on an example.
【００３７】図５に示すように、本例の非接触ＩＣタグ
装置も、アンテナコイル１が一体形成されたＩＣ素子２
と、ブースタコイル３及び静電容量接続パッド４ａ，４
ｂが形成された絶縁部材５と、前記静電容量接続パッド
４ａ，４ｂに接続されたチップコンデンサ６と、これら
ＩＣ素子２、チップコンデンサ６及び絶縁部材５を一体
にケーシングする基体７とからなる。As shown in FIG. 5, the non-contact IC tag device of this embodiment also has an IC element 2 in which an antenna coil 1 is integrally formed.
And the booster coil 3 and the capacitance connection pads 4a, 4
b, a chip capacitor 6 connected to the capacitance connection pads 4a and 4b, and a base 7 casing the IC element 2, the chip capacitor 6 and the insulating member 5 integrally. .
【００３８】本例のブースタコイル３は、図６に示すよ
うに、ＩＣ素子２に一体形成されたアンテナコイル１と
主に電磁結合する第１コイル３ａと、図示しないリーダ
ライタに備えられたアンテナコイルと主に電磁結合する
第２コイル３ｂとが共に絶縁部材５の表面側に形成され
ている。第１コイル３ａは、第２コイル３ｂの形成領域
外に形成され、これら第１コイル３ａの外周端と第２コ
イル３ｂの外周端とは、絶縁部材５の表面側で接続され
ている。絶縁部材５の表面側の前記第２コイル３ｂの形
成領域内には、静電容量接続パッド４ａ，４ｂが形成さ
れ、第１の静電容量接続パッド４ａは、第２コイル３ｂ
の内周端に接続されている。絶縁部材５の裏面側には、
図７に示すように、第１コイル３ａの内周端と第２の静
電容量接続パッド４ｂとを接続するリード１５が形成さ
れており、当該リード１５の一端と前記第１コイル３ａ
の内周端とがスルーホール１６を介して接続され、当該
リード１５の他端と前記第２の静電容量接続パッド４ｂ
とがスルーホール１７を介して接続されている。ＩＣ素
子２は、図５及び図６に示すように、アンテナコイル１
を第１コイル３ａと対向に向けて、絶縁部材５の表面側
に設定される。As shown in FIG. 6, the booster coil 3 of this embodiment includes a first coil 3a mainly electromagnetically coupled to an antenna coil 1 integrally formed with an IC element 2, and an antenna provided in a reader / writer (not shown). The coil and the second coil 3b mainly electromagnetically coupled are both formed on the surface side of the insulating member 5. The first coil 3a is formed outside the region where the second coil 3b is formed, and the outer peripheral end of the first coil 3a and the outer peripheral end of the second coil 3b are connected on the surface side of the insulating member 5. Capacitance connection pads 4a and 4b are formed in the formation area of the second coil 3b on the surface side of the insulating member 5, and the first capacitance connection pad 4a is connected to the second coil 3b.
Is connected to the inner peripheral end of the. On the back side of the insulating member 5,
As shown in FIG. 7, a lead 15 for connecting the inner peripheral end of the first coil 3a to the second capacitance connection pad 4b is formed, and one end of the lead 15 and the first coil 3a are formed.
Is connected through a through hole 16 to the other end of the lead 15 and the second capacitance connection pad 4b.
Are connected via a through hole 17. The IC element 2 includes an antenna coil 1 as shown in FIGS.
Is set on the surface side of the insulating member 5 so as to face the first coil 3a.
【００３９】その他については、第１実施形態例に係る
非接触ＩＣタグ装置と同じであるので、対応する部分に
同一の符号を付して説明を省略する。本例の非接触ＩＣ
タグ装置も、第１実施形態例に係る非接触ＩＣタグ装置
と同様の効果を有する。The other parts are the same as those of the non-contact IC tag device according to the first embodiment, and the corresponding parts are denoted by the same reference numerals and description thereof will be omitted. Non-contact IC of this example
The tag device has the same effect as the non-contact IC tag device according to the first embodiment.
【００４０】〈第３実施形態例〉第３実施形態例に係る
非接触ＩＣタグ装置を、図８乃至図１０に基づいて説明
する。図８は第３実施形態例に係る非接触ＩＣタグ装置
の断面図、図９は第３実施形態例に係る非接触ＩＣタグ
装置に備えられる絶縁部材の表面図、図１０は第３実施
形態例に係る非接触ＩＣタグ装置に備えられる絶縁部材
の表面側から裏面側を見た透視図である。<Third Embodiment> A non-contact IC tag device according to a third embodiment will be described with reference to FIGS. FIG. 8 is a sectional view of a non-contact IC tag device according to the third embodiment, FIG. 9 is a front view of an insulating member provided in the non-contact IC tag device according to the third embodiment, and FIG. 10 is a third embodiment. It is the perspective view which looked at the back side from the front side of the insulating member provided in the non-contact IC tag apparatus which concerns on an example.
【００４１】図８に示すように、本例の非接触ＩＣタグ
装置は、アンテナコイル１が一体形成されたＩＣ素子２
と、ブースタコイル３及び静電容量形成用導体１８が形
成された絶縁部材５と、これらＩＣ素子２及び絶縁部材
５を一体にケーシングする基体７とからなる。As shown in FIG. 8, the non-contact IC tag device of this embodiment has an IC element 2 in which an antenna coil 1 is integrally formed.
And the insulating member 5 on which the booster coil 3 and the conductor 18 for forming a capacitance are formed, and the base 7 that integrally casings the IC element 2 and the insulating member 5.
【００４２】本例のブースタコイル３も、図９に示すよ
うに、ＩＣ素子２に一体形成されたアンテナコイル１と
主に電磁結合する第１コイル３ａと、図示しないリーダ
ライタに備えられたアンテナコイルと主に電磁結合する
第２コイル３ｂとが共に絶縁部材５の表面側に形成され
ている。第１コイル３ａは、第２コイル３ｂの形成領域
外に形成され、これら第１コイル３ａの外周端と第２コ
イル３ｂの外周端とは、絶縁部材５の表面側で接続され
ている。絶縁部材５の裏面側には、図１０に示すよう
に、前記第２コイル３ｂとほぼ同形同大のコイル状に形
成され、巻線方向が前記第２コイル３ｂとは逆向きにさ
れた静電容量形成用導体１８が形成され、当該静電容量
形成用導体１８の外周端と前記第１コイル３ａの内周端
とがスルーホール１９を介して接続されている。前記第
２コイル３ｂを構成する導体と前記静電容量形成用導体
１８とは、絶縁部材５を介して対向に配置され、これら
各導体間に静電容量を形成している。その静電容量は、
ＩＣ素子２に一体形成されたアンテナコイル１及びブー
スタコイル３を含む系において、アンテナコイル１の両
端に最大電圧が得られるように調整される。As shown in FIG. 9, the booster coil 3 of this embodiment also includes a first coil 3a mainly electromagnetically coupled to the antenna coil 1 formed integrally with the IC element 2, and an antenna provided in a reader / writer (not shown). The coil and the second coil 3b mainly electromagnetically coupled are both formed on the surface side of the insulating member 5. The first coil 3a is formed outside the region where the second coil 3b is formed, and the outer peripheral end of the first coil 3a and the outer peripheral end of the second coil 3b are connected on the surface side of the insulating member 5. On the back side of the insulating member 5, as shown in FIG. 10, it is formed in the shape of a coil having substantially the same shape and the same size as the second coil 3b, and the winding direction is opposite to that of the second coil 3b. A conductor 18 for forming a capacitance is formed, and an outer peripheral end of the conductor 18 for forming a capacitance and an inner peripheral end of the first coil 3 a are connected through a through hole 19. The conductor forming the second coil 3b and the capacitance forming conductor 18 are arranged to face each other with an insulating member 5 interposed therebetween, and form a capacitance between these conductors. Its capacitance is
In a system including the antenna coil 1 and the booster coil 3 formed integrally with the IC element 2, the adjustment is performed so that the maximum voltage is obtained at both ends of the antenna coil 1.
【００４３】なお、前記前記第２コイル３ｂを構成する
導体の導体幅と前記静電容量形成用導体１８の導体幅と
は、同一にすることもできるし、互いに異ならせること
もできる。各導体の導体幅を互いに異ならせた場合に
は、製造上、第２コイル３ｂを構成する導体の形成位置
と静電容量形成用導体１８の形成位置とが導体幅の差の
範囲でずれたとしても静電容量の値が変化しないので、
非接触ＩＣタグ装置の通信特性のばらつきを小さくする
ことができる。The conductor width of the conductor forming the second coil 3b and the conductor width of the capacitance forming conductor 18 can be the same or different from each other. When the conductor widths of the conductors are different from each other, the formation positions of the conductors forming the second coil 3b and the formation positions of the capacitance forming conductors 18 deviate from each other in the range of the difference in the conductor widths. Since the value of the capacitance does not change even if
Variations in communication characteristics of the non-contact IC tag device can be reduced.
【００４４】ＩＣ素子２は、図８及び図９に示すよう
に、アンテナコイル１を第１コイル３ａと対向に向け
て、絶縁部材５の表面側に設定される。As shown in FIGS. 8 and 9, the IC element 2 is set on the front side of the insulating member 5 with the antenna coil 1 facing the first coil 3a.
【００４５】その他については、第１実施形態例に係る
非接触ＩＣタグ装置と同じであるので、対応する部分に
同一の符号を付して説明を省略する。The other components are the same as those of the non-contact IC tag device according to the first embodiment, and the corresponding parts are denoted by the same reference numerals and description thereof will be omitted.
【００４６】本例の非接触ＩＣタグ装置は、前記各実施
形態例に係る非接触ＩＣタグ装置と同様の効果を有する
ほか、絶縁基板を介して第２コイル３ｂと静電容量形成
用導体１８とを対向に形成したので、これらの各導体間
に所要の静電容量を形成することができて、チップコン
デンサの搭載を省略することができ、非接触ＩＣタグ装
置の薄形化及び低コスト化を図ることができる。The non-contact IC tag device of this embodiment has the same effects as those of the non-contact IC tag devices according to the above-described embodiments, and the second coil 3b and the conductor 18 Are formed facing each other, a required capacitance can be formed between these conductors, the mounting of a chip capacitor can be omitted, and the non-contact IC tag device can be made thinner and lower cost. Can be achieved.
【００４７】[0047]
【発明の効果】請求項１に記載の発明は、ブースタコイ
ルを、ＩＣ素子に一体形成されたアンテナコイルと主に
電磁結合する第１コイルと、当該第１コイルと電気的に
接続され、リーダライタに備えられたアンテナコイルと
主に電磁結合する第２コイルとから構成し、第１コイル
の外周を第２コイルの内周よりも大きく形成したので、
第２コイルの巻数を減少することなく第１コイルの巻径
の拡大を図ることができて、非接触ＩＣタグ装置の通信
距離を拡大することができる。According to the first aspect of the present invention, there is provided a first coil for mainly electromagnetically coupling a booster coil to an antenna coil formed integrally with an IC element, and a reader coil electrically connected to the first coil. Since the antenna is composed of an antenna coil provided in the writer and a second coil mainly electromagnetically coupled, and the outer periphery of the first coil is formed larger than the inner periphery of the second coil,
The winding diameter of the first coil can be increased without reducing the number of turns of the second coil, and the communication distance of the non-contact IC tag device can be increased.
【００４８】請求項２に記載の発明は、第１コイルを絶
縁基板の第２コイル形成面側に形成される部分とその裏
面に形成される部分とから構成したので、絶縁基板の裏
面に形成される部分については、第２コイルのサイズに
関係なく、絶縁基板の面積の範囲で自由に形成すること
ができ、第１コイルの直径及び巻数の増加を図ることが
できて、非接触ＩＣタグ装置の通信距離を拡大すること
ができる。According to the second aspect of the present invention, since the first coil is composed of the portion formed on the second coil forming surface side of the insulating substrate and the portion formed on the back surface thereof, the first coil is formed on the back surface of the insulating substrate. Regardless of the size of the second coil, the portion to be formed can be formed freely within the area of the insulating substrate, the diameter and the number of turns of the first coil can be increased, and the non-contact IC tag can be formed. The communication distance of the device can be increased.
【００４９】請求項３に記載の発明は、第２コイルの外
部に第１コイルを形成したので、絶縁基板の表面におけ
る第１コイルの形成エリアと第２コイルの形成エリアと
を分離することができ、第１コイルを第２コイルのサイ
ズに関係なく、絶縁基板の面積の範囲で自由に形成する
ことができることから、第１コイルの直径及び巻数の増
加を図ることができて、非接触ＩＣタグ装置の通信距離
を拡大することができる。According to the third aspect of the present invention, since the first coil is formed outside the second coil, the formation area of the first coil and the formation area of the second coil on the surface of the insulating substrate can be separated. Since the first coil can be freely formed within the area of the insulating substrate regardless of the size of the second coil, the diameter and the number of turns of the first coil can be increased, and the non-contact IC can be formed. The communication distance of the tag device can be increased.
【００５０】請求項４に記載の発明は、第１コイルと第
２コイルとの間に静電容量を直列に挿入したので、これ
ら第１コイル及び第２コイルから構成されるブースタコ
イルのインダクタンスをＬ、挿入された静電容量のキャ
パシタンスをＣとしたとき、ｆ０＝１／｛２π√（Ｌ
Ｃ）｝で表される所要の周波数で非接触ＩＣタグ装置を
共振させることができて、非接触ＩＣタグ装置の通信距
離を拡大することができる。According to the fourth aspect of the present invention, since the capacitance is inserted in series between the first coil and the second coil, the inductance of the booster coil composed of the first coil and the second coil is reduced. L, when the capacitance of the inserted capacitance is C, f0 = 1 / {2π} (L
C) The non-contact IC tag device can resonate at a required frequency represented by 表, and the communication distance of the non-contact IC tag device can be extended.
【００５１】請求項５に記載の発明は、第２コイルの外
部に第１コイルを形成したので、絶縁基板の表面におけ
る第１コイルの形成エリアと第２コイルの形成エリアと
を分離することができ、第１コイルを第２コイルのサイ
ズに関係なく、絶縁基板の面積の範囲で自由に形成する
ことができることから、第１コイルの直径及び巻数の増
加を図ることができて、非接触ＩＣタグ装置の通信距離
を拡大することができる。また、絶縁基板を介して第２
コイルを構成する導体と他の導体とを対向に形成したの
で、これらの各導体間に必要な静電容量を形成すること
ができ、チップコンデンサ等の搭載を省略することがで
きて、非接触ＩＣタグ装置の薄形化及び低コスト化を図
ることができる。According to the fifth aspect of the present invention, since the first coil is formed outside the second coil, it is possible to separate the formation area of the first coil and the formation area of the second coil on the surface of the insulating substrate. Since the first coil can be freely formed within the area of the insulating substrate regardless of the size of the second coil, the diameter and the number of turns of the first coil can be increased, and the non-contact IC can be formed. The communication distance of the tag device can be increased. Also, the second through the insulating substrate
Since the conductors constituting the coil and the other conductors are formed facing each other, the required capacitance can be formed between these conductors, and the mounting of a chip capacitor and the like can be omitted, and the contactless The thickness and cost of the IC tag device can be reduced.
【００５２】請求項６に記載の発明は、第１コイル及び
／又は第２コイルの一辺の長さを５ｍｍとし、これら第
１コイル及び第２コイルで構成されるブースタコイルの
長さを５０ｍｍに形成したので、例えばＣＤ収納ボック
スのインデックス部分に装着可能な非接触ＩＣタグ装置
を得ることができる。According to a sixth aspect of the present invention, the length of one side of the first coil and / or the second coil is 5 mm, and the length of the booster coil composed of the first coil and the second coil is reduced to 50 mm. Since it is formed, for example, a non-contact IC tag device that can be mounted on the index portion of the CD storage box can be obtained.
【００５３】請求項７に記載の発明は、第１コイルの一
辺の長さをＩＣ素子に一体形成されたアンテナコイルの
一辺の長さの２倍乃至３倍に形成したので、第１コイル
とＩＣ素子に一体形成されたアンテナコイルとの電磁結
合の範囲を広げることができ、非接触ＩＣタグ装置の製
造工程において、第１コイルの形成位置に対するＩＣ素
子の設定位置がずれた場合や、第１コイルの形状又は導
体幅にばらつきを生じた場合にも、第１コイルに生じる
誘導起電力の低下を少なくすることができ、通信特性の
ばらつきが小さい非接触ＩＣタグ装置を得ることができ
る。According to the present invention, the length of one side of the first coil is formed to be two to three times the length of one side of the antenna coil formed integrally with the IC element. The range of electromagnetic coupling with the antenna coil formed integrally with the IC element can be widened. In the manufacturing process of the non-contact IC tag device, when the set position of the IC element with respect to the formation position of the first coil is shifted, Even if the shape or the conductor width of one coil varies, a decrease in the induced electromotive force generated in the first coil can be reduced, and a non-contact IC tag device with small variation in communication characteristics can be obtained.
【図１】第１実施形態例に係る非接触ＩＣタグ装置の断
面図である。FIG. 1 is a sectional view of a non-contact IC tag device according to a first embodiment.
【図２】第１実施形態例に係る非接触ＩＣタグ装置に備
えられる絶縁部材の表面図である。FIG. 2 is a front view of an insulating member provided in the non-contact IC tag device according to the first embodiment.
【図３】第１実施形態例に係る非接触ＩＣタグ装置に備
えられる絶縁部材の表面側から裏面側を見た透視図であ
る。FIG. 3 is a perspective view of the insulating member provided in the non-contact IC tag device according to the first embodiment as viewed from the front side to the back side;
【図４】第１実施形態例に係る非接触ＩＣタグ装置に搭
載されるＩＣ素子の斜視図である。FIG. 4 is a perspective view of an IC element mounted on the non-contact IC tag device according to the first embodiment.
【図５】第２実施形態例に係る非接触ＩＣタグ装置の断
面図である。FIG. 5 is a sectional view of a non-contact IC tag device according to a second embodiment.
【図６】第２実施形態例に係る非接触ＩＣタグ装置に備
えられる絶縁部材の表面図である。FIG. 6 is a front view of an insulating member provided in the non-contact IC tag device according to the second embodiment.
【図７】第２実施形態例に係る非接触ＩＣタグ装置に備
えられる絶縁部材の表面側から裏面側を見た透視図であ
る。FIG. 7 is a perspective view of the insulating member provided in the non-contact IC tag device according to the second embodiment as viewed from the front side to the back side.
【図８】第３実施形態例に係る非接触ＩＣタグ装置の断
面図である。FIG. 8 is a sectional view of a non-contact IC tag device according to a third embodiment.
【図９】第３実施形態例に係る非接触ＩＣタグ装置に備
えられる絶縁部材の表面図である。FIG. 9 is a front view of an insulating member provided in the non-contact IC tag device according to the third embodiment.
【図１０】第３実施形態例に係る非接触ＩＣタグ装置に
備えられる絶縁部材の表面側から裏面側を見た透視図で
ある。FIG. 10 is a perspective view of the insulating member provided in the non-contact IC tag device according to the third embodiment as viewed from the front side to the back side.
１ アンテナコイル ２ ＩＣ素子 ３ ブースタコイル ３ａ 第１コイル ３ｂ 第２コイル ４ａ，４ｂ 静電容量接続パッド ５ 絶縁部材 ６ チップコンデンサ ３表面パターン ７ 絶縁部材 ８ カバーシート ９ 接着剤層 １１〜１４，１６，１７ スルーホール １５ リード １８ 静電容量形成用導体 DESCRIPTION OF SYMBOLS 1 Antenna coil 2 IC element 3 Booster coil 3a 1st coil 3b 2nd coil 4a, 4b Capacitance connection pad 5 Insulating member 6 Chip capacitor 3 Surface pattern 7 Insulating member 8 Cover sheet 9 Adhesive layer 11-14, 16, 17 Through hole 15 Lead 18 Conductor for forming capacitance
───────────────────────────────────────────────────── フロントページの続き (72)発明者 深尾 隆三 大阪府茨木市丑寅一丁目１番88号 日立マ クセル株式会社内 Ｆターム(参考） 2C005 MA18 MA40 MB06 NA08 NB03 PA18 5B035 BA03 BB09 CA01 CA23 5K012 AA01 AA07 AB03 AC06 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Ryuzo Fukao 1-88 Ushitora, Ibaraki-shi, Osaka F-term (reference) in Hitachi Maxell, Ltd. 2C005 MA18 MA40 MB06 NA08 NB03 PA18 5B035 BA03 BB09 CA01 CA23 5K012 AA01 AA07 AB03 AC06
Claims (7)
子と、前記ＩＣ素子に一体形成されたアンテナコイルと
リーダライタに備えられたアンテナコイルとの電磁結合
を強化するブースタコイルと、これらＩＣ素子及びブー
スタコイルを担持する絶縁部材とを備えた非接触ＩＣタ
グ装置において、前記ブースタコイルを、前記ＩＣ素子
に一体形成されたアンテナコイルと主に電磁結合する第
１コイルと、当該第１コイルと電気的に接続され、前記
リーダライタに備えられたアンテナコイルと主に電磁結
合する第２コイルとから構成し、前記第１コイルの外径
を前記第２コイルの内径よりも大きく形成したことを特
徴とする非接触ＩＣタグ装置。An IC element integrally formed with an antenna coil, a booster coil for enhancing electromagnetic coupling between the antenna coil formed integrally with the IC element and an antenna coil provided in a reader / writer, In a non-contact IC tag device including an insulating member for supporting a booster coil, a first coil mainly electromagnetically coupling the booster coil to an antenna coil integrally formed with the IC element, and an electrical connection between the first coil and the first coil. And an antenna coil provided in the reader / writer and a second coil mainly electromagnetically coupled, wherein the outer diameter of the first coil is larger than the inner diameter of the second coil. Non-contact IC tag device.
おいて、前記絶縁基板の表面に前記第２コイルを渦巻き
状に形成し、当該絶縁基板の表面の前記第２コイルの内
部に前記第１コイルの一部を渦巻き状に形成すると共
に、前記絶縁基板の裏面に前記第１コイルの他の一部を
渦巻き状に形成し、当該第１コイルの他の一部の外周を
前記第２コイルの内周よりも大きく形成したことを特徴
とする非接触ＩＣタグ装置。2. The non-contact IC tag device according to claim 1, wherein the second coil is spirally formed on a surface of the insulating substrate, and the second coil is formed inside the second coil on a surface of the insulating substrate. A part of one coil is formed in a spiral shape, another part of the first coil is formed in a spiral shape on the back surface of the insulating substrate, and an outer periphery of another part of the first coil is formed in the second shape. A non-contact IC tag device formed larger than an inner circumference of a coil.
おいて、前記絶縁基板の表面に前記第２コイルを渦巻き
状に形成し、当該絶縁基板の表面の前記第２コイルの外
部に前記第１コイルを渦巻き状に形成すると共に、前記
絶縁基板の裏面に前記第１コイルと前記第２コイルとを
接続するリードを形成したことを特徴とする非接触ＩＣ
タグ装置。3. The non-contact IC tag device according to claim 1, wherein the second coil is spirally formed on the surface of the insulating substrate, and the second coil is formed on the surface of the insulating substrate outside the second coil. A non-contact IC wherein one coil is formed in a spiral shape and a lead for connecting the first coil and the second coil is formed on a back surface of the insulating substrate.
Tag device.
触ＩＣタグ装置において、前記第１コイルと第２コイル
との間に静電容量を直列に挿入したことを特徴とする非
接触ＩＣタグ装置。4. The non-contact IC tag device according to claim 1, wherein a capacitance is inserted in series between the first coil and the second coil. IC tag device.
おいて、前記絶縁基板の表面に前記第２コイルを渦巻き
状に形成し、当該絶縁基板の表面の前記第２コイルの外
部に前記第１コイルを渦巻き状に形成すると共に、前記
絶縁基板の裏面に、前記絶縁基板の表面側から見て巻線
方向が前記第２コイルと逆向きの導線を前記第２コイル
と対向に形成したことを特徴とする非接触ＩＣタグ装
置。5. The non-contact IC tag device according to claim 1, wherein the second coil is formed in a spiral shape on a surface of the insulating substrate, and the second coil is formed on a surface of the insulating substrate outside the second coil. One coil is formed in a spiral shape, and a conducting wire whose winding direction is opposite to the second coil when viewed from the front side of the insulating substrate is formed on the back surface of the insulating substrate so as to face the second coil. Non-contact IC tag device characterized by the above-mentioned.
触ＩＣタグ装置において、前記第１コイル及び／又は第
２コイルの一辺の長さを５ｍｍとし、前記ブースタコイ
ルの長さを５０ｍｍにしたことを特徴とする非接触ＩＣ
タグ装置。6. The non-contact IC tag device according to claim 1, wherein a length of one side of the first coil and / or the second coil is 5 mm, and a length of the booster coil is 50 mm. Non-contact IC characterized by the following.
Tag device.
触ＩＣタグ装置において、前記第１コイルの一辺の長さ
を前記ＩＣ素子に一体形成されたアンテナコイルの一辺
の長さの２倍乃至３倍に形成したことを特徴とする非接
触ＩＣタグ装置。7. The non-contact IC tag device according to claim 1, wherein a length of one side of the first coil is two times a length of one side of an antenna coil formed integrally with the IC element. A non-contact IC tag device formed by double to triple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000376040A JP2002183690A (en) | 2000-12-11 | 2000-12-11 | Noncontact ic tag device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000376040A JP2002183690A (en) | 2000-12-11 | 2000-12-11 | Noncontact ic tag device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002183690A true JP2002183690A (en) | 2002-06-28 |
Family
ID=18844957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000376040A Withdrawn JP2002183690A (en) | 2000-12-11 | 2000-12-11 | Noncontact ic tag device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002183690A (en) |
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