JPH10193851A - Non-contact card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a non-contact card at a low cost by a method wherein a coil antenna capable of obtaining required antenna characteristics is formed by use of conductive paste which is excellent in mass productivity. SOLUTION: An antenna part 13 of a first layer is formed by printing a pattern of a loop shape by use of silver paste on a surface of a base material 12 of an IC card. Then, an insulating layer 14 on which a through hole 17 is opened is formed by printing resist ink so as to cover the antenna part 13 of the first layer. Further, an antenna part 15 of a second layer is formed so as to be superimposed just on the antenna part 13 by printing a pattern of the same shape as that of the antenna part 13 of the first layer by use of the silver paste on the insulating layer 14. By such the procedure, a coil antenna of a hierarchical structure is formed on the IC card. Consequently, though the coil antenna is formed by use of silver paste of higher resistance compared with that of a copper wire or the like, the coil antenna capable of obtaining required antenna characteristics can be constituted by avoiding an embossed area of the IC card.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless card used for access control, commuter pass, credit card and the like.

[0002]

2. Description of the Related Art Conventionally, this type of non-contact card has a coil antenna for transmitting and receiving signals to and from an external device in a non-contact manner. The coil antenna is formed, for example, by winding a copper wire in a coil shape and attaching it to a card substrate, or by using a copper-clad substrate as the card substrate and etching the same to form a coil on one or both surfaces of the card. Is formed on the card substrate.

When a coil antenna is formed using a copper wire, the winding start and end lines can be brought to the same place, so that a through hole is formed in the card substrate or a jumper wire is provided. Although it is not necessary, there is a problem in that the mass productivity is poor, and it is difficult to reduce the cost even in large-scale production.

On the other hand, when a coil is formed only on one side of a card substrate by etching a copper-clad substrate, it is necessary to pull out one (eg, inside) end of the coil to the other (eg, outside) end of the coil. Therefore, one end of the coil is passed through the back surface of the board through the through hole formed in the card board, pulled out to the other end side of the coil with another pattern formed on the back side, and another formed on the card board It is returned to the surface of the card via a through hole. When coils are formed on both sides of the card substrate, for example, as disclosed in JP-A-8-87583, one end of the coil formed on each substrate surface is connected via a through-hole, and The other end of the coil formed on the substrate surface is drawn out to the other substrate surface via a through hole.

Therefore, when a coil antenna is formed on a card substrate by etching, a through hole must be formed in the card substrate, and patterns formed on both surfaces of the substrate must be connected to each other through a conductive material provided in the through hole. In addition, there is a problem that the production of the card substrate is troublesome and the cost reduction is limited. When a coil pattern is formed on a copper-clad substrate by etching,
There is also a problem that the pattern is easily cut by bending the card.

On the other hand, in order to realize such a coil antenna at a lower cost, it is conceivable to form a coil on a card base material by a printing method using a conductive paste excellent in mass productivity. For example, if a coil is formed in the same size as the above-mentioned etching pattern, the conductive paste pattern has high resistance, so that sufficient antenna characteristics cannot be obtained, and there is a problem that practical use is difficult.

Further, if the width of the conductive paste pattern is increased to solve this problem, the number of turns of the coil that can be wound on a plane is reduced, and sufficient antenna characteristics cannot be obtained. In particular, when embossing a card with a card number or the like is imprinted on a card, a coil cannot be formed in the embossed area, so that an area where the coil can be formed is limited, and it is difficult to obtain desired antenna characteristics. become.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is intended to form a coil antenna having desired antenna characteristics by using a conductive paste excellent in mass productivity, and to realize a non-contact card at low cost. The purpose is to.

[0009]

According to a first aspect of the present invention, there is provided a non-contact card, wherein a plurality of loop-shaped antenna portions are insulated from a base material of the card with a conductive paste. While laminating layers in order,
A coil antenna having a hierarchical structure formed by connecting one end of an adjacent antenna unit via a through hole formed in an insulating layer is provided.

Therefore, according to the present invention, the number of turns of the coil antenna can be ensured by the number of layers of the layered antenna portions, and the coil antenna is formed of the conductive paste as described above. In this case, since the resistance of the conductive paste is high, the pattern width of each antenna portion is increased, and there is no need to increase the arrangement area of the coil antenna with respect to the base material.

Therefore, according to the present invention, a coil antenna having desired antenna characteristics can be realized using a conductive paste excellent in mass productivity, and a non-contact card can be realized at low cost. It becomes possible. In the present invention, connection between adjacent antenna units is performed through through holes formed in the insulating layer. However, since the antenna units are formed by a printing method using a conductive paste, If a hole to be a through hole is formed in the insulating layer formed on the insulating layer, the adjacent antenna units can be connected to each other only by printing a pattern of the antenna unit on the insulating layer. Therefore, mass productivity does not decrease due to the connection between the antenna units.

Here, the coil antenna may be formed by laminating the antenna section only on one side of the base material. The part is laminated on the front side of the base material and the remaining part is laminated on the back side of the base material, and the connection between the coil antennas consisting of the antenna parts laminated on each side is directly formed on each side of the base material By performing one end of the lowermost antenna part through a through hole formed in the base material,
One coil antenna may be configured.

In the case where the non-contact card has an embossed area on which characters and figures are imprinted, the area outside the embossed area (for example, the peripheral portion of the card) may be What is necessary is just to laminate | stack each antenna part which comprises a coil antenna. That is, according to the present invention, in order to secure the number of turns of the coil antenna, it is sufficient to increase the number of stacked antenna parts, and it is not necessary to increase the area of the coil antenna with respect to the base material. Even in this case, it is extremely easy to form a coil antenna avoiding the embossed area, and even a non-contact card to be embossed can be easily realized.

Next, the antenna portions of each layer constituting the coil antenna may be formed in the same shape and at the same position, but in this case, the antenna portions of each layer are formed between the patterns of the antenna portions. The capacitance has increased,
It is also conceivable that desired antenna characteristics cannot be obtained. Accordingly, in such a case, all or a part of the plurality of antenna units constituting the coil antenna may be shifted from each other for each layer.

In this case, the shape of each antenna portion may be the same, and only the stacking position may be shifted, or the shape of each antenna portion may be changed to shift the stacking position. Further, both ends of the coil antenna having the hierarchical structure formed as described above are respectively connected to the IC, and the connection between the coil antenna and the IC is different from that of the fifth embodiment. It is preferable to use a conductive film. That is, as is well known, the anisotropic conductive film is formed by dispersing metal particles in a resin, and connection and fixing can be performed simultaneously by heating and pressing. Therefore, if an anisotropic conductive film is used to connect the coil antenna to the IC, the connection between the coil antenna and the IC can be extremely easily performed. Further, when an anisotropic conductive film is used for connection between the coil antenna and the IC, the connection portion can be made thinner, so that the non-contact card itself can be made thinner.

On the other hand, conventionally, as a contactless card,
It is known that a power supply signal is transmitted from an external device, and the non-contact card receives and smoothes the signal to generate a power supply voltage for an IC.
In such a contactless card, an antenna for power reception is provided in addition to the antenna for data transmission and reception. As described in above, each antenna may be constituted by a coil antenna having a hierarchical structure.

That is, when two coil antennas are provided, the arrangement area of the antenna with respect to the base material is increased as compared with a non-contact card provided with one coil antenna.
According to the present invention, since the coil antenna can be configured with a small layout area, even if it is necessary to provide an embossed area on the non-contact card, two antennas can be formed avoiding this area, An antenna for data communication and an antenna for power supply can be respectively realized by using a conductive paste.

The base material may be, for example, PET (polyethylene terephthalate).
For example, it is desirable to use a sheet material made of a polyester resin which has been conventionally used as a material of a flexible substrate. Then, in this case, if the conductive paste forming the antenna portion is a polyester-based paste obtained by mixing a conductive metal with a polyester-based resin of the same system as the base, the coil antenna can be easily laminated on the base. .

As the conductive paste forming the antenna portion, it is desirable to use a conductive paste made of a conductive metal having a small resistance value so that the resistance of the antenna portion is as low as possible. As described, it is preferable to use a silver paste mixed with silver as the conductive metal.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. [First Embodiment] FIG. 2 shows the configuration of a non-contact card (hereinafter referred to as an IC card) 2 of a first embodiment to which the present invention is applied.
(B) is a sectional view taken along line AA shown in (a). The IC card 2 according to the present embodiment has a size (length and width: 54 mm × 85.6 m) standardized by Japanese Industrial Standards and the International Organization for Standardization.
m, thickness 0.7 ± 0.08 mm). However, in FIG. 2 (the same applies to the drawings described below), in order to make the structure easy to understand, the dimensions of each part are actual ones. Is different.

As shown in FIG. 2, the IC card 2 of this embodiment
Is formed on a side surface of a film-shaped (for example, 188 μm-thick) base material 12 made of, for example, PET (polyethylene terephthalate), and a first-layer antenna portion 1 formed in a loop shape is formed.
3 and a second layer antenna portion 15 formed in a loop shape is further laminated thereon with an insulating layer 14 interposed therebetween, thereby forming a coil having a hierarchical structure composed of two antenna portions 13 and 15. An antenna is formed, and an IC 20 is connected and fixed to both ends of the coil antenna by flip-chip mounting using an anisotropic conductive film 18, respectively.
0 is provided.

On one side of the card substrate 10 on which the antenna portions 13 and 15 constituting the coil antenna are laminated, a spacer is provided via an adhesive layer 22 made of an insulating material so as to surround the periphery of the IC 20. 23, and a surface sheet 2 made of the same sheet material as the base material 12 is further provided thereon via an adhesive layer 24 made of an insulating material.
5 are stacked. As a result, in the IC card 2 of the present embodiment, the antenna units 13 and
15 and an IC 20 that communicates with an external device via the coil antenna are sealed between the base material 12 of the card substrate 10 and the topsheet 25 and are protected from the outside.

The IC 20 surrounded by the spacer 23
Is filled with a sealing material 26, and the IC 20 is also protected by the sealing material 26. In addition, the IC of this embodiment
The card 2 is provided with an embossed area 28 for engraving a card number or the like in advance, and the antenna portions 13 and 15 constituting the coil antenna are formed around the card so as to avoid the embossed area 28. .

Next, the card substrate 1 which is a main part of the present invention
0 and its manufacturing method will be described with reference to FIGS. In FIG. 1, (a) is a plan view of the card substrate 10 viewed from one side on which a coil antenna is formed.
(B) is a sectional view taken along line BB shown in (a), and (c) is (a)
It is CC sectional view taken on the line shown in FIG.

As shown in FIG. 1, the two-layered antenna portions 13 and 15 constituting the coil antenna are formed in the same shape with each other, and one end thereof is formed through a through hole 17 formed in the insulating layer 14. The connection forms a coil antenna having a laminated structure. One end of each of the antenna units 13 and 15 at both ends of the coil antenna is
It is pulled out inside the loop, and at its end, IC2
0 are stacked.

Here, each of the antenna portions 13 and 15 constituting the coil antenna is formed by using a silver paste obtained by mixing silver as a conductive metal in a resin (for example, a polyester resin) of the same system as the base material 12. You. That is, as shown in FIG. 3A, the coil antenna according to the present embodiment firstly has a thickness of 20 μm on a surface of the base material 12 using a silver paste.
By printing a loop-shaped pattern with a width of 5 mm and a width of 5 mm, the antenna section 13 of the first layer is formed.
As shown in FIG. 3B, an insulating layer 14 having a thickness of, for example, 20 μm and having a through-hole 17 formed therein is formed by printing a resist ink so as to cover the first-layer antenna portion 13. ), On the insulating layer 14,
By printing a pattern having the same shape as the first-layer antenna section 13 using silver paste, the second-layer antenna section 15 is formed so as to exactly overlap the antenna section 13. .

As a result, the antenna section 13 of the first layer and the antenna section 15 of the second layer are connected via the through hole 17 formed in the insulating layer 14 when the antenna section 15 of the second layer is printed. Thus, a two-turn coil antenna is completed. As described above, in the IC card 2 of the present embodiment, the two-turn coil antenna is formed by sequentially stacking the loop-shaped antenna portions 13 and 15 on one side of the base material 12 with the insulating layer 14 interposed therebetween. doing.

Therefore, it is possible to form a two-turn coil antenna in the space of one turn of the coil of the base material 12, and use a conductive paste (silver paste) having a higher resistance than the etching pattern. Is formed, it is possible to configure a coil antenna that can obtain desired antenna characteristics while avoiding the embossed area 28 of the IC card 2.

That is, first, the width and thickness of the antenna portions 13 and 15 constituting the coil antenna are determined by the relationship between the specific resistance of the conductive paste and the embossed region 28. For example,
When the width of the coil antenna allowed from the embossed area 28 is about 6 mm at the maximum, it is desirable that the width of the antenna sections 13 and 15 is about 5 mm in view of a margin. On the other hand, the antenna units 13 and 15 are set to have a specific resistance of 1.6 × 10 ⁻⁵ Ω
In the case where the coil antenna is formed by using a silver paste of 10 cm, the resistance is ten times larger than that of a copper wire (specific resistance 1.6 × 10 ⁻⁶ Ω · cm). To achieve the same resistance, the cross-sectional area of the antenna units 13 and 15 needs to be ten times the copper wire. Therefore, for example, in order to make the antenna portions 13 and 15 have the same resistance as a copper wire having a diameter (φ) of 0.1 mm, the thickness of the antenna portions 13 and 15 may be set as follows.

The cross-sectional area of the copper wire = π × (0.05 × 0.05) = 7.8 × 10 ⁻³ mm ^{2 The} cross-sectional area required for the antenna units 13 and 15 = 10 of the cross-sectional area of the copper wire × = 7.8 × 10 ⁻² mm ² · Thickness required for antenna units 13 and 15 = 7.8 × 10 ⁻² mm ² ÷ 5 mm = 15.6 μm That is, specific resistance 1.6 × 10 ⁻⁵ Ω.・ When forming the antenna parts 13 and 15 (and thus the coil antenna) using a silver paste having a diameter of 5 cm and a silver paste pattern having a width of 5 mm and a thickness of 16 μm or more, a copper wire of φ0.1 mm is used. It is possible to configure a coil antenna of the same degree as that of the above-described case.

In the present embodiment, for the sake of simplicity, a case in which a two-turn (two-layer) coil antenna is formed on the base material 12 has been described. Is not obtained, the number of turns of the coil antenna may be increased by increasing the number of stacked antenna units.

In order to increase the number of turns of the coil antenna in this manner, for example, the loop of the antenna unit formed in each layer may be multiplexed, and two or more antenna units may be formed in each layer. However, in this case, in order to secure the embossed area 28, it is necessary to reduce the width of the antenna unit, and it is necessary to consider that the conductivity of the coil antenna is reduced.

In this embodiment, the substrate 12 is made of PE
Although T film was used, PPS (polyphenylene sulfide) film, PI (polyimide) film, etc.
A film generally used as a flexible substrate may be used. As the conductive paste forming the antenna portion, for example, a copper paste can be used in addition to the silver paste. In other words, any conductive paste may be used as long as it can be printed on the film constituting the base material 12 to form the coil.

In this embodiment, the insulating layer 14 has been described as being formed by printing resist ink.
For example, the insulating layer 14 may be formed by attaching a PET film of about 10 μm with an adhesive. In this case, the through holes 17 were formed in the PET film.
Need to be drilled in advance. Second Embodiment Next, a card board 30 according to a second embodiment of the present invention will be described with reference to FIG. 4A is a plan view of the card substrate 30 viewed from one side, FIG. 4B is a cross-sectional view taken along line DD of FIG. 4A, and FIG.
FIG. 2 is a sectional view taken along line EE shown in FIG.

The card substrate 30 of this embodiment is for forming an IC card similarly to the card substrate 10 of the first embodiment. As shown in FIG. 4, both sides of a substrate 32 made of a PET film are used. Is formed with a coil antenna.
That is, similarly to the card board 10 of the first embodiment, the antenna section 33 is formed on the surface side of the base material 32 using silver paste, and the through-hole 37 is formed thereon. The provided insulating layer 34 is formed, and an antenna part 35 having the same shape as that of the antenna part 33 is formed on the insulating layer 34 by using a silver paste so that the antenna part 33 just overlaps the antenna part 33, thereby forming a two-turn coil. At the same time, the antenna section 4 is also laminated on the back side of the base material 32 in the same manner as described above.
4, a two-turn coil composed of an insulating layer 44 provided with a through hole 47 and an antenna part 45 is laminated, and the antenna part 3 of the first layer of the coil laminated on each surface of the substrate 32 is formed.
4 and 44, one end of which is formed in the base material 32 through hole 3
9 to form a coil antenna having a total of four turns, each having two turns formed on both surfaces of the base material 32.

Then, the 2 formed on the back side of the substrate 32
The terminal end of the antenna portion 45 of the layer is connected to a connection pattern 45a formed on the surface side of the base material 32 through a through hole 49 formed in the base material 32. The IC 40 is connected and fixed to the end of the second-layer antenna portion 35 formed on the front surface side of the base material 32 by using an anisotropic conductive film.

As described above, according to the card board 30 of the present embodiment, the coils are formed on both sides of the base material 32, and the coils are connected to form a coil antenna. The number of turns of the coil antenna can be increased without increasing the number of antenna portions stacked on one surface of the base material 32 with respect to the card substrate 30 of the embodiment.

The materials, sizes, and the like of the components constituting the card board 30 of this embodiment are the same as those of the first embodiment. When an IC card is configured using the card substrate 30 of the present embodiment, the card substrate 30 on which the IC 40 is laminated is used.
The top sheet may be laminated not only on the front side but also on the back side of the card substrate 30 via an adhesive layer. Third Embodiment Next, in the first and second embodiments, the first-layer antenna portion and the second-layer antenna portion formed on one surface of the base material have the same shape. Although the parts have been described as overlapping vertically, in this case,
It is conceivable that the capacitance between the first-layer antenna portion and the second-layer antenna portion is increased, and desired antenna characteristics cannot be obtained.

Accordingly, in such a case, the loop of the antenna section 13 'of the first layer is slightly smaller than the loop of the antenna section 15' of the second layer, for example, as in a card board 10 'shown in FIG. By increasing the size and slightly shifting the antenna sections 13 'and 15', the overlap between the antenna sections 13 'and 15' (and hence the capacitance between the antenna sections) is reduced, and the antenna characteristics are improved. You may make it set to a characteristic.

The card board 10 'of the present embodiment (third embodiment) shown in FIG. 5 is different from the card board 10 of the first embodiment shown in FIG. FIG. 5 shows a card board shifted by half the width of the section, and the configuration of each section is the same as that of the card board 10 shown in FIG. 1. Therefore, in FIG. The same reference numerals as those described above are denoted by the same reference numerals with the addition of “′”, and detailed description is omitted. [Fourth Embodiment] Further, as in the third embodiment, in setting the antenna characteristics to desired characteristics by reducing the overlap between the first-layer antenna portion and the second-layer antenna portion,
For example, as in a card substrate 10 "shown in FIG. 6, the width of the second-layer antenna portion 15" may be smaller than the width of the first-layer antenna portion 13 ".

The card board 10 ″ of the present embodiment (fourth embodiment) shown in FIG. 6 is different from the card board 10 of the first embodiment shown in FIG. FIG. 6 shows a half of a card substrate, and the configuration of each part is the same as that of the card substrate 10 shown in FIG.
The components constituting the card substrate 10 "are denoted by the same reference numerals as in FIG. 1 with""added thereto, and detailed description will be omitted.

Further, the third and fourth parts shown in FIGS.
It goes without saying that the configurations of the card boards 10 'and 10 "of the embodiment can be applied to the card board 30 of the second embodiment in which coils are formed on both surfaces of the base material 32. Embodiment, Sixth Embodiment] Next, in each of the above embodiments,
Although the card substrate in which one coil antenna having a hierarchical structure is provided on the base material has been described, the card substrate has two coil antennas, for example, a coil antenna for data communication and a coil antenna for supplying power to an IC. May be laminated.

Next, a fifth embodiment and a sixth embodiment of the present invention will be described.
As an example, a card substrate in which two coil antennas are formed on a base material will be described. First, FIG. 7 shows a card board 50 of a fifth embodiment, (a) is a plan view of the card board 50 viewed from one side, and (b) is a sectional view taken along line FF shown in (a).

As shown in FIG. 7, the card substrate 5 of this embodiment is
Numeral 0 denotes two loop-shaped antenna portions 53a, 53a on one side of a base material 52 made of a PET film using a silver paste.
53b, an insulating layer 54 having through holes 57a, 57b is formed on each of the antenna portions 53a, 53b, and the antenna portion 5 is formed thereon by using a silver paste.
Antenna parts 55a, 55b having the same shape as 3a, 53b
By forming the antenna portions 53a and 53b so as to overlap with each other, a two-turn coil antenna composed of the antenna portions 53a and 55a and the antenna portions 53b and 55b
And two types of coil antennas formed integrally with the base material 52. In the present embodiment, the loop of each coil antenna is individually formed, and like the coil antenna of the first embodiment,
One end of each coil antenna is drawn out to the IC 60 side and connected to the IC 60 by an anisotropic conductive film.

FIG. 8 shows a card board 70 according to the sixth embodiment.
(A) is a plan view of the card substrate 70 viewed from one side, and (b) is a cross-sectional view taken along line GG shown in (a). FIG.
As shown in FIG. 7, the card board 50 of the present embodiment is similar to the card board 50 of the fifth embodiment shown in FIG.
b, an insulating layer 74 provided with through holes 77a, 77b,
By stacking the antenna units 75a and 75b in order, two types of coil antennas, that is, a two-turn coil antenna including the antenna units 73a and 75a and a two-turn coil antenna including the antenna units 73b and 75b are used as base materials. 72 are integrally formed. The difference from the card board 50 of the fifth embodiment is that the loops of the antenna sections 73a and 75a forming one coil antenna are inserted into the antenna sections 73b and 75 forming the other coil antenna.
This is the point where the loop b is formed. One end of each coil antenna is connected to the IC 80 by an anisotropic conductive film.

As described above, in the card boards 50 and 70 of the fifth and sixth embodiments shown in FIGS. 7 and 8, two coil antennas are integrally formed. For this reason, if an IC card is configured using each of the card boards 50 and 70, power is supplied to the ICs 60 and 80 from the outside via one coil antenna, and the IC is connected to the IC via the other coil antenna. , Predetermined data communication can be performed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a configuration of a card board according to a first embodiment.

FIG. 2 is an explanatory diagram illustrating a configuration of an IC card according to a first embodiment.

FIG. 3 is an explanatory diagram illustrating a procedure for forming a coil antenna on a card substrate according to the first embodiment.

FIG. 4 is an explanatory diagram illustrating a configuration of a card board according to a second embodiment.

FIG. 5 is an explanatory diagram illustrating a configuration of a card board according to a third embodiment.

FIG. 6 is an explanatory diagram illustrating a configuration of a card board according to a fourth embodiment.

FIG. 7 is an explanatory diagram illustrating a configuration of a card board according to a fifth embodiment.

FIG. 8 is an explanatory diagram illustrating a configuration of a card board according to a sixth embodiment.

[Explanation of symbols]

2 IC card 10, 30, 50, 70 Card substrate 12, 32, 52, 72 Base material 13, 33, 43, 53a, 53b, 73a, 73b
Antenna part (first layer) 14, 34, 44, 54, 74 ... insulating layer 15, 35, 45, 55a, 55b, 75a, 75b ...
Antenna part (second layer) 17, 37, 39, 47, 57a, 57b, 77a, 7
7b: Through hole 20, 40, 60, 80: IC 28: Embossed area

Claims (8)

[Claims] 1. A non-contact card in which a coil antenna and an IC for transmitting / receiving a signal to / from an external device via the coil antenna are laminated on an insulating base material. A plurality of loop-shaped antenna portions are sequentially laminated with an insulating layer sandwiched between conductive pastes, and one end of an adjacent antenna portion is connected via a through hole formed in the insulating layer to form a hierarchical structure. A non-contact card characterized in that it is configured as a coil antenna. 2. A part of the plurality of antenna units is on the front side of the base, and the other part is on the back side of the base,
The coil antennas are respectively stacked, and the coil antenna is configured as one coil antenna by connecting one end of an antenna unit directly formed on each surface of the base material through a through hole formed in the base material. The contactless card according to claim 1, wherein 3. The non-contact card according to claim 1, wherein each of the antenna units constituting the coil antenna is stacked in an area outside an embossed area where a character or a figure is imprinted. Contactless card according to 1. 4. The apparatus according to claim 1, wherein at least a part of the plurality of antenna units constituting the coil antenna are formed so as to be shifted from each other for each layer.
Contactless card according to any of the above. 5. The non-contact card according to claim 1, wherein the coil antenna and the IC are connected by an anisotropic conductive film. 6. An antenna for transmitting / receiving data to / from an external device, and an antenna for receiving an electrode supply signal from the external device, wherein each of the coil antennas includes: The non-contact card according to any one of claims 1 to 5, wherein the non-contact card comprises a coil antenna having a hierarchical structure. 7. The method according to claim 1, wherein the base material is a sheet material made of a polyester-based resin, and the conductive paste forming the antenna portion is a polyester-based paste in which a conductive metal is mixed into a polyester-based resin. Item 1
A non-contact card according to any one of claims 6 to 7. 8. The non-contact card according to claim 1, wherein the conductive paste forming the antenna section is a silver paste mixed with silver as a conductive metal.