JP2015060504A - Non-contact ic label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC label capable of downsizing the non-contact IC label to be adhered on a surface of an adherend while securing necessary communication properties, and also to provide a non-contact IC label having a configuration difficult to restore and reuse of as well as leaving a trace, when removing from an adherend.SOLUTION: A non-contact IC label includes, on a label base material 1: an antenna circuit 4 formed in a pattern; an IC chip 7 disposed across electrically connecting the antenna circuit 4; and an adhesion layer 8 laminated. In the non-contact IC label, a multilayer of antenna circuits 5a, 5b are formed interposing the insulator 8. The multilayer of antenna circuits are formed by printing using a conductive paste. Easy destruction section to be broken in pattern is provided between the label base material 1 and the antenna circuit.

Description

  The present invention relates to a non-contact IC label that can send and receive data to and from an external data reader without contact. The present invention also relates to a non-contact IC label having a configuration that leaves a trace when it is peeled off from a sticker and cannot be restored and reused.

  Conventionally, non-contact IC labels having an IC chip and an antenna circuit are used for merchandise management in retail stores, rental stores, and the like. In this method, a contactless IC label is attached to a product to be managed, and data stored in an IC chip is read and written by a dedicated data read / write device, and product entry / exit management, inventory management, lending management, and the like are performed. Since it has an IC chip, it can record and manage not only the product code but also a lot of information such as the date of receipt and the person in charge, etc., together with the product. In addition, the anti-counterfeiting effect has been obtained by using the data read / write function of the non-contact IC label, such as securities, cards, certificates, guarantees, passports etc. if security related, cigarettes, drugs, There has been proposed a method of attaching and managing non-contact IC labels on cosmetics, liquor and the like.

  Non-contact IC labels are available for short-range communication and long-distance communication. In recent years, NFC (Near Field Communication) = near-field communication technology has been established as an international standard, and non-contact IC cards are widely used all over the world. For this reason, electromagnetic induction type non-contact IC tags and IC labels using the 13.56 MHz (HF) frequency range are attracting attention.

  As an antenna circuit constituting the non-contact IC label, a method of forming a copper wire in a coil shape or a method of manufacturing a metal thin film by etching is often used. On the other hand, as described above, in the case of a non-contact IC label for the purpose of preventing counterfeiting, a method of printing and forming an antenna circuit using a conductive paste has been devised (for example, see Patent Documents 1 and 2 below). However, in the case of an antenna circuit using a conductive paste, the resistance value becomes higher than that of a copper wire or a metal film, so that a reduction in communication performance is a problem. Also, in order to ensure communication performance, the antenna circuit size must be increased, and it has been difficult to reduce the size of the label.

Patent No. 5169109 JP 2000-105807 A

  The present invention has been made in view of the above circumstances, and provides a non-contact IC label capable of reducing the size of a non-contact IC label to be attached to the surface of an adherend and ensuring necessary communication characteristics. is there. Further, the present invention provides a non-contact IC label having a configuration that leaves a trace when it is peeled off from an adherend and cannot be restored and reused.

In order to solve the above problems, the present invention provides the following means.
In the non-contact IC label according to claim 1, an antenna circuit formed in a pattern shape, an IC chip electrically connected across the antenna circuit, and an adhesive layer are laminated on a label base material. In the non-contact IC label, the antenna circuit is formed in multiple layers through an insulator.

  The contactless IC label according to claim 2, wherein the antenna circuit includes a first conductive layer, an insulating layer provided so as to partially cover the conductive layer, and one of the first conductive layers. It is characterized by comprising a second conductive layer provided so as to be overlapped with each other in the thickness direction and electrically joined.

  The non-contact IC label according to claim 3, wherein the antenna circuit includes a first conductive layer provided on one surface of the label base material and a second conductive layer provided on the other surface of the label base material. The first conductive layer and the second conductive layer are configured such that a part of the first conductive layer and the second conductive layer are electrically joined through a through hole provided in the label base material. It is characterized by that.

  The non-contact IC label according to claim 4 is characterized in that a conductive paste is used for the first conductive layer and the second conductive layer.

The non-contact IC label according to claim 5, wherein the base material and the first conductive layer or a part of the second conductive layer are provided with easy-to-break parts that are easily broken. To do.
The non-contact IC label according to claim 6 uses a frequency band of 13.56 MHz.

  Since the non-contact IC label of the present invention is composed of an antenna circuit in which conductive layers are formed in multiple layers, the label size can be reduced while ensuring communication characteristics. That is, the first conductive layer and the second conductive layer are divided and laminated, and they are electrically coupled to form a single antenna circuit. Can be secured. Further, since the circuit width can be increased, the printed antenna can be formed without lowering the resistance value, and communication characteristics can be ensured.

  Further, in order to provide an easily breakable portion that breaks in a pattern under the first conductive layer or the second conductive layer, when the non-contact IC label of the present invention attached to the adherend is to be peeled off, the antenna circuit is formed in the pattern. Since it is destroyed and communication becomes impossible, the trace can be left.

Sectional drawing which shows embodiment of the 1st non-contact IC label which concerns on this invention. Sectional drawing which shows the destruction image at the time of peeling the 1st non-contact IC label which concerns on this invention from the to-be-adhered body. The top view of (a) 1st conductive layer, (b) insulating layer, and (c) 2nd conductive layer which comprise the antenna as embodiment of this invention. Sectional drawing which shows embodiment of the 2nd non-contact IC label which concerns on this invention. The top view which shows the antenna circuit of the comparative example which concerns on this invention.

Hereinafter, a sealing label according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a cross-sectional view of a non-contact IC label A as a first embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a destruction image when the non-contact IC label A as the first embodiment of the present invention is peeled off from the adherend X.
FIG. 3 is a plan image view of each of (a) the first conductive layer, (b) the insulating layer, and (c) the second conductive layer constituting the antenna according to the embodiment of the present invention.
FIG. 4 shows a cross-sectional view of a non-contact IC label B as a second embodiment of the present invention.

(Label substrate)
As the label substrate 1, for example, a film material made of a resin such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), acrylonitrile, butadiene, styrene copolymer synthetic resin (ABS) can be suitably used. In addition, paper materials such as coated paper can also be used.

(Easy to break)
On the label substrate 1, an easily breakable part is partially provided so that an antenna 4 (conductive layer) described later is broken. That is, the structure which partially reduces the adhesiveness of the label base material 1 and the conductive layer 5 is provided.

  As a specific example, as shown in FIG. 1, a label base material 1 and a material having high adhesiveness (pattern adhesive layer 2) are coated on the label base material 1 in a pattern, and the label base material 1 is coated thereon. A material with low adhesion (peeling layer 3) is coated on the entire surface. With this configuration, when the label is made and attached to the adherend X, and peeled off, the pattern adhesive layer 2 part is not peeled off from the label base material 1 and the release layer 3 part is peeled off from the label base material 1. It becomes possible to destroy by a pattern like.

  In the present invention, as shown in FIG. 1, it is preferable to provide the easily breakable portion in a pattern. Since patterning can make a difference in peel strength, it can be expected to break more easily. In particular, it is provided around the IC chip and the antenna so that the non-contact IC labels A and B are not broken when being peeled off from the release sheet 9, and the antenna is also disconnected if it is peeled off after being attached to the adherend. The function can be disabled. Further, the entire layer of the label or a part of the layer is cut with leather or the like (not shown). At this time, if a cut is provided in accordance with the pattern shape of the easily breakable portion, a higher effect can be obtained.

(Multilayer antenna)
Here, the antenna circuit which comprises the non-contact IC label A as 1st Embodiment is demonstrated using FIG.
As shown in FIG. 1, the first conductive layer 5a is printed in the antenna circuit shape as shown in FIG. 3A on the pattern adhesive layer 2 and the release layer 3 formed on the label substrate 1 described above.
On top of that, the insulating layer 6 is printed in a shape as shown in FIG. At this time, it is necessary to align the positions so as not to cover the joint portion S and the chip mounting portion C in FIG. As the insulating layer 6, as will be described later, the first conductive layer 5a and the second conductive layer 5b do not have to be electrically joined except for the joint S, and a non-conductive material (for example, an insulating material made of a resin component). Ink or the like) can be used.

  Subsequently, the second conductive layer 5b is printed on the antenna circuit shape as shown in FIG. At this time, printing is performed by aligning the positions so that the joining portion S in FIG. 3A and the joining portion S in FIG. In this way, the first conductive layer 5a and the second conductive layer 5b are stacked, and they can be electrically coupled via the junction S to form one antenna circuit.

Subsequently, an antenna constituting the non-contact IC label A as the second embodiment will be described with reference to FIG.
First, as shown in FIG. 4, a through hole H is opened using a punching die or the like so as to penetrate the label base material 1, the pattern adhesive layer 2, and the release layer 3. At this time, the through hole H is provided so as to be aligned with the joint S in FIG.

  And on the said peeling layer 3, the 1st conductive layer 5a is printed on the antenna circuit shape like FIG. 3 (a) using a conductive paste. At this time, it is necessary to align the positions so that the through holes H and the joints S overlap, and it is also necessary to print so as to fill the through holes H with a conductive paste.

  Subsequently, the second conductive layer 5b is printed on the other surface of the label substrate 1 in an antenna circuit shape as shown in FIG. At this time, printing is performed by aligning the positions so that the joining portion S in FIG. 3A and the joining portion S in FIG. In this way, the first conductive layer 5a and the second conductive layer 5b are stacked, and they can be electrically coupled via the through hole H to form one antenna circuit.

  The first conductive layer 3 and the second conductive layer 4 are preferably formed by printing a conductive paste. The conductive material by this conductive paste is preferably silver, and includes a binder resin, a solvent, and silver powder of an evaporative drying type that obtains conductivity by contact with silver powder, such as screen printing, flexographic printing, It can be formed by printing by a printing method such as gravure printing or offset printing. It is also possible to print conductive ink with a printer. As a result, the antenna is more easily broken, and the total thickness of the label can be reduced.

(Merit of multilayer antenna)
With the above structure, a multilayer antenna can be formed.
In the electromagnetic induction type (13.56 MHz band) IC tag, the antenna circuit has a coil shape as shown in FIG. The number of turns of the coil and the like is adjusted by design, but generally, the smaller the antenna size, the larger the number of turns, so there is a limit to downsizing. Further, in order to increase the number of turns, it is necessary to reduce the line width of the circuit (L1, L2 in FIG. 3). In particular, in the case of a printed antenna, the resistance value is increased and the communication characteristics are significantly deteriorated.

  Since the antenna constituting the non-contact IC label of the present invention is formed in multiple layers as described above, the number of turns per layer can be reduced, and the antenna size can be reduced. Further, since the circuit line widths L1 and L2 can also be increased, the resistance value of the printed antenna is reduced, and the communication characteristics can be ensured.

(IC chip)
The IC chip 7 is made of silicon single crystal or the like, and bumps (not shown) are bonded by heating and pressing using an anisotropic conductive adhesive or the like and electrically connected to the chip mounting portion C of the first conductive layer 5a. Has been implemented.

(Adhesive layer)
Examples of the material of the adhesive layer 8 include an acrylic thermal adhesive, a hot melt resin (for example, polyamide, urethane, EVA, etc.), an adhesive, and the like.
Further, a release sheet 9 that can be easily peeled is temporarily adhered to the surface of the adhesive layer 8. As the release sheet, a separator in which a release agent layer such as silicone resin is laminated on a paper or plastic sheet by coating or the like is used.

  Specific examples of the present invention will be described below.

(1) Formation of label substrate 1 / pattern adhesive layer 2 / peeling layer 3 On a PET film having a thickness of 50 μm, an ink of the following composition (a) is applied with a gravure coater in an oblique line pattern, about 0.1 μm thick The pattern adhesive layer 2 was provided. On top of that, the entire surface was coated with a gravure coater using an ink having the following composition (b), and a release layer 3 having a thickness of about 1.6 μm was provided, followed by curing at 80 ° C. for 7 days.

[Pattern adhesive layer (a)]
Polyester resin 3.0% by weight
97.0% by weight of THF

[Peeling layer (b)]
Acrylic polyol resin 25.0% by weight
Nitrocellulose resin 5.0% by weight
Xylylene diisocyanate 5.0% by weight
Toluene 25.0% by weight
Isobutyl acetate 20.0% by weight
MEK 20.0% by weight

(2) Production of antenna 4 On the release layer 3 formed on the label substrate 1 as described above, a silver paste (LS453-1: manufactured by Asahi Chemical Research Laboratory) is screen printed (250 mesh). The pattern shape of 3 (a) was printed and dried at 140 ° C. for 2 minutes to form the first conductive layer 5a. On the top surface, insulation paste (CR18T: manufactured by Asahi Chemical Research Laboratories) was screen-printed (120 mesh), aligned with the pattern shape of Fig. 3 (b), dried at 140 ° C for 2 minutes, and insulation layer 6 Formed. Thereafter, the silver paste was printed by screen printing with the position of the pattern shape shown in FIG. 3 (c), dried at 140 ° C. for 2 minutes to form the second conductive layer 5b, and a multilayer antenna was produced.

(3) IC chip mounting, label processing First, the IC chip (MifareUL: made by NXP) is passed through the ACP (anisotropic conductive paste) to the multilayer antenna formed on the label substrate as described above. Bonded to the conductive layer 5a (chip mounting portion C).
A non-contact IC label having a label size of 20 × 40 mm is provided by applying a 50 μm thick acrylic adhesive to a release sheet 9 having a silicon treatment on one side of PET, and transferring the adhesive to the antenna surface. A was produced.

(1) Formation of Label Base 1 / Pattern Adhesive Layer 2 / Peeling Layer 3 After forming the pattern adhesive layer 2 and the peeling layer 3 on the label base 1 in the same manner as in Example 1 (1), Through holes H2 were formed so as to penetrate the substrate using a mold.

(2) Production of antenna 4 On the release layer 3 formed on the label substrate 1 as described above, a silver paste (LS453-1: manufactured by Asahi Chemical Research Laboratory) is screen printed (250 mesh). The pattern shape of 3 (a) was printed and dried at 140 ° C. for 2 minutes to form the first conductive layer 5a. At that time, the positions of the through holes H and the joints S were aligned, and printing was performed so that the silver paste filled the through holes. Thereafter, a silver paste is printed on the other surface of the label substrate 1 by screen printing so as to align with the pattern shape of FIG. 3 (c), dried at 140 ° C. for 2 minutes, and the second conductive layer 5b is formed. Formation of a multilayer antenna was made.

(3) IC chip mounting, label processing First, IC chips (MifareUL: made by NXP) are placed on the multilayer antenna formed on the label substrate as described above via ACP (anisotropic conductive paste). The conductive layer 5a (chip mounting portion C) was joined. Acrylic adhesive 50μm on release sheet 9 with silicon treatment on one side of PET
The adhesive layer 8 was provided by applying the thickness and transferring this to the antenna surface, and a non-contact IC label B having a label size of 20 × 40 mm was produced.

(Comparative Example 1)
The antenna circuit 5c having the pattern shape of FIG. 5 was formed on a PET substrate having a thickness of 50 μm by screen printing using a silver paste. On this, an insulating layer 10, a jumper layer 11, and an IC chip were formed, and finally an adhesive was applied to obtain a non-contact IC medium label C having a label size of 20 × 40 mm.

(Comparative Example 2)
An antenna circuit 5c having a pattern shape shown in FIG. 5 was formed on a 50 μm thick PET substrate by etching an aluminum thin film having a thickness of 20 μm. An insulating layer 10, a jumper layer 11, and an IC chip were formed thereon, and finally an adhesive was applied to obtain a non-contact IC medium label D having a label size of 20 × 40 mm.

Each non-contact IC label was peeled off from the release sheet and attached to the adherend X.
The contactless IC labels A and B composed of the multilayer antennas of Examples 1 and 2 had a low resistance value and sufficient communication characteristics because the circuit line widths L1 and L2 were as thick as 1 mm. Moreover, when peeled off from the adherend, the antenna was broken in a hatched pattern, making communication impossible, and the label could not be reused.

  On the other hand, the non-contact IC label C composed of the single-layer antenna of Comparative Example 1 had a high resistance value and a sufficient communication function could not be obtained because the circuit line width L3 was as thin as 0.2 mm. In addition, the contactless IC label D consisting of the etching antenna circuit of Comparative Example 2 has a sufficient communication function, but it can be peeled cleanly from the adherend and can communicate, so the label can be reused. It was possible.

A First non-contact IC label
B Second non-contact IC label 1 Label substrate 2 Pattern adhesive layer 3 Release layer 4 Antenna 5a First conductive layer 5b Second conductive layer 5c Antenna layer 6 of comparative example 7 Insulating layer 7 IC chip 8 Adhesive layer 9 Release Sheet 10 Comparative Example Insulating Layer 11 Comparative Example Jumper Layer
S junction
C chip mounting part
H Through hole
L Circuit width

Claims (6)

On the label base material, in the non-contact IC label in which the antenna circuit formed in a pattern, the IC chip electrically connected across the antenna circuit, and the adhesive layer are laminated,
A non-contact IC label, wherein the antenna circuit is formed in multiple layers via an insulator.   The antenna circuit is electrically overlapped in the thickness direction with a part of the first conductive layer, an insulating layer provided so as to partially cover the conductive layer, and a part of the first conductive layer. The non-contact IC label according to claim 1, comprising a second conductive layer provided so as to be bonded.   The antenna circuit is composed of a first conductive layer provided on one surface of the label base material and a second conductive layer provided on the other surface of the label base material, The one conductive layer and the second conductive layer are configured so that a part thereof is electrically joined through a through hole provided in the label base material. Non-contact IC label.   The contactless IC label according to claim 2 or 3, wherein a conductive paste is used for the first conductive layer and the second conductive layer.   5. The non-contact IC label according to claim 4, wherein the base material and the first conductive layer or a part of the second conductive layer are provided with easy-to-break parts that are easily broken.   The non-contact IC label according to claim 5, wherein a frequency band of 13.56 MHz is used.