JP2000137779A - Non-contact information medium and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact information medium, which can extend a communication distance range through a simple method, imparted features of a chip-on-coil system by providing a non-contact IC module, which is electromagnetically coupled with a booster part, capable of radio communication with the booster part. SOLUTION: A non-contact information medium 10 has a non-contact IC module 30, which enables radio communication, electromagnetically coupled to a booster part 20 inside a substrate 12. The booster part 20 has an antenna coil 22 and a capacitor 24. The coil 22 has a prescribed communication distance range capable of communicating with a reader/writer 1 and the coil length can be adjusted. The radio communication enable non-contact IC module 30 having this coil 22 to extend the transmission to the desired distance. Therefore, the application of the non-contact IC module 30, whose application to the non- contact information medium 10 has been limited because of its short communication distance, is expanded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to a data record carrier, and more particularly, to a non-contact information medium having a built-in IC chip. The “non-contact information medium incorporating an IC chip” is a medium that includes an IC chip as an information recording medium and communicates with an external device in a non-contact manner. Therefore, as long as it is non-contact, the wavelength of the radio wave does not matter, and the length of the communication distance does not matter. Accordingly, a non-contact IC module to be described later and a molded body incorporating such a non-contact IC module are also non-contact information media.

[0002] A typical non-contact information medium having a built-in IC chip is, for example, a non-contact IC card which communicates with a reader / writer using microwaves. In the present application, the “IC card” includes a smart card, an intelligent card, a chip-in card, a microcircuit (microcomputer) card, a memory card, a super card, a multi-function card, a combination card, and the like.

The shape of a non-contact information medium incorporating an IC chip is not limited to a card. Therefore, it also includes so-called IC tags. Here, "IC
The "tag" has the same function as the IC card, but includes all information recording media having a stamp size, a size smaller than that of a stamp, and a shape such as a coin.

[0004]

2. Description of the Related Art IC cards can be classified into a contact type and a non-contact type according to a communication method between an IC chip built in the card and a reader / writer. Among them, the non-contact type has no contact with the reader / writer, so there is no contact failure, it can be used at a distance of several centimeters to several tens of centimeters from the reader / writer, and it is resistant to dirt, rain, and static electricity. It is anticipated that its demand will increase in the future.

A non-contact IC card obtains operating power by electromagnetic induction from a radio wave received from a reader / writer, and exchanges data with the reader / writer using the radio wave. The non-contact IC card usually has an antenna (for example, an antenna coil) for transmitting and receiving such radio waves formed as a member independent of the IC chip.
Connected to C chip.

[0006]

As described above, since the antenna and the IC chip are separate bodies, the conventional non-contact IC
When mounting the cards, they had to be electrically connected. However, the connection between the terminal of the minute IC chip and the antenna involves technical difficulties, and the connection point is particularly stressed when a flexible card is used, causing disconnection. Further, a substrate for holding an IC chip and an antenna is required, which causes an increase in the cost of the IC card. Furthermore, the inspection of the electrical connection and the operation check of the antenna and the IC chip can be performed only after the IC chip and the antenna are mounted on the card and the two are connected, so that the manufacturing efficiency is poor.

On the other hand, an antenna coil may be built into an IC chip (on-chip coil type) (on-chip coil system) due to a demand for downsizing and multifunctional components. Such an on-coil IC chip has advantages that there are few mounting problems and that it contributes to downsizing of components. However, the communication distance is inevitably shortened due to the small size of the antenna, and it cannot be directly applied to a non-contact IC card which can communicate with a reader / writer at a predetermined distance.

[0008]

SUMMARY OF THE INVENTION It is a general object of the present invention to provide a new and useful non-contact information medium which solves such conventional problems.

More specifically, an object of the present invention is to provide a non-contact information medium having the features of the chip-on-coil system and capable of extending the communication distance by a simple method.

Another object of the present invention is to provide a non-contact information medium having high production efficiency.

Further, the present invention provides a non-contact IC capable of wireless communication using a conventional IC chip manufacturing apparatus as it is without adding any new process to a normal IC chip manufacturing process.
Still another object is to provide a method for manufacturing a non-contact information medium capable of manufacturing a C module. In addition,
Here, the term "non-contact IC module" generally means a combination of an IC chip and a coil or an antenna which is a non-contact communication means between the IC chip and an external device, and includes an on-coil IC chip or an IC having a monolithic IC structure. The chip and the coil include everything having the form of a structure that is desired to be mounted on the IC surface or the same substrate. In the broad sense, the non-contact IC module may be any communication means, but in the present application, it is assumed that communication is performed via electric (magnetic) waves.

In order to achieve the above object, a non-contact information medium according to the present invention includes a booster section having a first coil capable of performing wireless communication with an external device using electromagnetic induction, and a booster section having the first coil. A non-contact IC module that is electromagnetically coupled in a non-contact manner and can wirelessly communicate with the booster unit, wherein the non-contact IC module includes an IC chip;
It is smaller than the first coil that is connected to the IC chip and that can generate an induction current by electromagnetic induction from an induction current generated in the first coil as a result of wireless communication with the external device. And a second coil.

Further, the non-contact information medium of the present invention has a booster section having a first communication section having a first communication distance and capable of wirelessly communicating with an external device, and the booster section having the first communication section. A non-contact IC module capable of wireless communication, wherein the non-contact IC module is connected to the IC chip and has a second communication distance shorter than the first communication distance. And a second communication unit that can wirelessly communicate with the first communication unit.

Further, the non-contact information medium of the present invention has a non-contact IC module and a molded article having a predetermined shape for protecting the non-contact IC module.

Further, according to a method of manufacturing a non-contact information medium of the present invention, a step of forming a non-contact IC module capable of wireless communication having an IC chip and an antenna,
A step of forming a booster section that extends the communication distance of the module to enable wireless communication between the non-contact IC module and an external device; and a step of non-contact coupling the non-contact IC module and the booster section. Wherein the step of forming the non-contact IC module includes a wiring step of connecting components of the IC chip, and the wiring step includes a mask having a wiring pattern for the IC chip and a pattern of the antenna. The wiring of the IC chip and the formation of the antenna are performed simultaneously.

[0016] A non-contact IC capable of wireless communication according to the present invention.
A method of manufacturing a module includes forming a gate in a standard MOS semiconductor manufacturing process, forming a source and a drain, and wiring components between the gate, source, drain and other circuit elements. The wiring step includes simultaneously forming the wiring of the IC chip and the formation of the antenna using a mask having a pattern of the wiring and a pattern of an antenna that enables wireless communication of the non-contact IC module. .

Further, according to the inspection system of the present invention, a non-contact probe antenna capable of communicating with a non-contact IC module in a non-contact manner, and the non-contact probe antenna connected to the non-contact probe antenna, and An inspection device for inspecting the non-contact IC module based on a signal received from the contact IC module.

Further, according to the method for manufacturing a non-contact information medium of the present invention, the non-contact probe module uses a non-contact probe antenna to perform non-contact communication with the non-contact IC module; Inspecting the non-contact IC module based on the obtained signal;
Mounting only the non-contact IC module that satisfies predetermined requirements in the inspection step on a base material.

According to the non-contact information medium of the present invention, the non-contact IC module can substantially communicate with an external device via the booster section. Therefore, as long as the booster unit can communicate with the external device and the non-contact IC module can communicate with the booster unit, the non-contact IC module does not need to have a communication distance capable of directly communicating with the external device. Further, the non-contact information medium may be formed as a molded body.

Further, according to the method of manufacturing a non-contact information medium and the method of manufacturing a non-contact IC module capable of wireless communication according to the present invention, the antenna is formed by a semiconductor manufacturing process for manufacturing a normal IC chip and its package. Can be performed simultaneously.

Further, the inspection system of the present invention can inspect a non-contact IC module in a non-contact manner even in a wafer state. Further, the method for producing a non-contact information medium of the present invention can use such a non-contact inspection method.

Other objects and further features of the present invention will be made clear by the embodiments described below with reference to the accompanying drawings.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A non-contact information medium according to the present invention will be described below with reference to the accompanying drawings. In each figure,
The members with the same reference numbers represent the same members, and the members with the same reference numerals added with the alphabets represent the corresponding deformed members, and redundant description will be omitted. Further, unless otherwise specified, the reference numbers are assumed to be all the same reference numbers with alphabets.

First, the non-contact information medium 10 of the present invention will be described with reference to FIGS. FIG. 1 is a block diagram showing the relationship between the configuration of the contactless information medium 10 of the present invention and the reader / writer 1.

The non-contact information medium 10 of the present invention communicates with a reader / writer (R / W) 1, which is an external device, using electromagnetic (magnetic) waves. The non-contact information medium 10 may have a built-in battery. However, it is preferable that the non-contact information medium 10 be battery-less in order to avoid troubles caused by deterioration of the built-in battery and to reduce the size of the chip. Therefore, hereinafter, the contactless information medium 10 exchanges data with the reader / writer 1 using radio waves, and obtains operating power by electromagnetic induction from the radio waves received from the reader / writer 1. The non-contact information medium 10 can have any shape (for example, a pendant shape, a coin shape, a key shape, a card shape, a tag shape, etc.) according to the application.

As described above, the non-contact information medium 10 of the present invention
Can communicate wirelessly with an external device without contact, but this does not exclude the function of the present invention to contact and communicate with the external device. For example, the non-contact information medium 10
By incorporating the contact IC chip, it is possible to constitute a combination card having both functions of a contact IC card and a non-contact IC card together with a non-contact IC module 30 described later in detail.

The present invention does not prevent the non-contact information medium 10 from being applied to a card medium having a magnetic stripe. In this case, the non-contact information medium 10 of the present invention has a function as a magnetic card such as a credit card and a cash card. further,
Optionally, the non-contact information medium 10 may be formed with an emboss, a sign panel, a hologram, a stamp, a hot stamp, an image print, a photograph, and the like.

The reader / writer 1 has a control interface unit (CNT IF) 2 and an antenna unit (ANT) 3, and transmits and receives radio waves W having a predetermined carrier frequency fc to and from the contactless information medium 10. Communicate with the non-contact information medium 10 using wireless communication. The radio wave W can use a carrier frequency fc in an arbitrary frequency band. The reader / writer 1 can be configured as, for example, a reader / writer for a non-contact IC card, and is connected to an external device (processing device, control device, personal computer, display, etc.) via a control interface unit 2. Have been.

The control interface unit 2 is connected to, for example, an antenna unit 3 composed of an antenna coil, and has a built-in modulation circuit and demodulation circuit. The modulation circuit converts the data from the external device into a transmission signal by changing the amplitude of the carrier frequency (ASK modulation method), and transmits the transmission signal to the antenna unit 3. The demodulation circuit converts a signal received from the contactless information medium 10 through the antenna unit 3 into a baseband signal to obtain data, and transmits the data to an external device (not shown). In addition, since the modulation circuit and the demodulation circuit can use a circuit known in the art,
Here, detailed description is omitted.

The non-contact information medium 10 includes a booster section 20
And a non-contact IC module 30 capable of wireless communication electromagnetically coupled to the booster section 20 in the base material 12. The substrate 12 is made of, for example, plastic.

The booster section 20 receives the radio wave W from the reader / writer 1 and transmits it to the non-contact IC module 30, and receives the radio wave W from the non-contact IC module 30 and transmits it to the reader / writer 1. can do.
Therefore, the booster unit 20 is connected to the reader / writer 1 in a non-contact I
It has a function as a relay unit between the C modules 30. As described later, the booster unit 20 uses electromagnetic induction. As long as the function is achieved, the booster unit 20
Can adopt any configuration.

Hereinafter, referring to FIG.
An example of the configuration will be described. As shown in the figure, the booster section 20 includes at least one antenna coil 22.
And preferably a capacitor 24.

The radio wave W received by the reader / writer 1 generates an induced current in the coil 22 as a change in magnetic flux. Such an induced current generates an induced current in a coil 34 of a non-contact IC module 30 described later, which is electromagnetically coupled to the coil 22. The coil 22 can generate a radio wave W from an induced current induced by a change in the current flowing through the coil 34 and transmit the generated radio wave W to the reader / writer 1.

As described above, the coil 22 is connected to the booster 2
0 functions as a communication unit capable of communicating with the reader / writer 1 and the non-contact IC module. Coil 2
2 has a predetermined communication distance with which the reader / writer 1 can communicate, and since the size thereof is adjustable, the predetermined communication distance can be adjusted as needed. For this reason, if the non-contact information medium 10 of the present invention is applied as a substitute for the conventional non-contact IC card using microwaves, the above-mentioned predetermined communication distance is required to be the communication distance required for the conventional non-contact IC card. Can be set to the same distance as. For example, if the communication distance is to be about 10 mm, the coil 22 is made small, if it is about several cm, it is medium, and if it is 10 cm or more, it is made large.

The coil 22 can be formed as a spiral planar coil or a multiple spiral coil which is an air-core coil. Further, the coil 22 can be configured as a flat coil with a ferrite core or a ferrite bar antenna.

FIG. 2 shows a non-contact information medium 10A in which the coil 22 is formed as a ferrite bar antenna coil 26.
Is shown. Regardless of the shape shown in the figure, the ferrite bar antenna coil 26 can adopt any shape such as a round shape, a square shape, and a flat shape. Also, FIG.
2 is two ferrite bar antenna coils 26A and 2
6B shows a non-contact information medium 10B configured as 6B. 2 and 3 will be described later in more detail.

The coil 22 can be formed by any method known in the art, such as etching using copper, aluminum, or the like, printing by a printed wiring method, or formation using a wire.

The configuration of the antenna used as the communication unit of the booster unit 20 is not limited to the antenna coil 22 as long as the booster unit 20 has a predetermined communication distance capable of communicating with the reader / writer 1. Of course. For example, an antenna known in the art such as a dipole antenna, a monopole antenna, a loop antenna, a slot antenna, and a microstrip antenna can be used. Thus, the coil 22 can be conceptually understood as broadly including communication means.

The booster section 20 can further include a condenser 24. The capacitor 24 serves to form a resonance circuit that resonates with the carrier frequency fc in cooperation with the coil 22 as described later. Capacitor 24 can be formed simultaneously with coil 22. Further, the capacitor 24 may be integrated with the coil 22 on a ceramic substrate (not shown).

Referring to FIGS. 4 to 6, booster section 2 which is an example of a specific configuration of booster section 20 shown in FIG.
0A will be described. Here, FIG.
FIG. 5 is a top view of FIG. 0A, and FIG. 5 is a sectional view taken along line AA of FIG. FIG. 6 is an equivalent circuit of the booster section 20A shown in FIG. FIG. 7 shows an equivalent circuit of a booster unit 20B which is another specific configuration example of the booster unit 20 shown in FIG.

As shown in FIG. 4, the booster section 20A
Is a thin dielectric film 28 of, for example, several tens of microns.
A pair of capacitors 24A and 24B facing each other with the dielectric film 28 interposed therebetween; a coil 22A formed between the capacitors 24A and 24B only on one surface of the dielectric film 28; Coil 2 formed between capacitors 24A and 24B
2B. As shown in FIG. 5, the coils 22A and 22B are opposed to each other with the dielectric film 28 interposed therebetween. By adopting a configuration having such two capacitors 24A and 24B, the booster section 20 has an advantage that it is not necessary to provide connection means such as through holes.

The dielectric film 28 is made of, for example, polyethylene or PET (polyethylene terephthalate). The capacitors 24A and 24B are made of, for example, a copper plate. Further, the coils 22A and 22A
B is formed, for example, by etching.

FIG. 5 shows an equivalent circuit of the components shown in FIG. Here, if the self inductance of the coil 22A is L1 and the self inductance of the coil 22B is L2, the combined self inductance Lr is (L1 + L2). Such a combined self-inductance Lr corresponds to the self-inductance of the coil 22 shown in FIG. Similarly, the capacitance of the capacitor 24A is set to C1,
Assuming that the capacitance of 4B is C2, the combined capacitance Cr is
{C1C2 / (C1 + C2)}. Such a combined capacitance Cr corresponds to the capacitance of the capacitor 24 shown in FIG.

Now, the resonance frequency fr of the circuit shown in FIG.
Is (1 / 2π) (LrCr) − ／. Assuming that L1 = L2 = L and C1 = C2 = C for simplicity, the combined self-inductance becomes Lr = 2L, Cr = C / 2, and fr = (1 / 2π) (LC) −1/2. Become. If this value is made to match the carrier frequency fc, the circuit shown in FIG. 6 can resonate at fc and allow a large resonance current to flow through the capacitors 24A and 24B and the coils 22A and 22B. It can be supplied to the non-contact IC module 30.

It goes without saying that the booster section 20 is not limited to the configuration shown in FIG. For example, the booster unit 20 can employ the equivalent circuit shown in FIG.
FIG. 7 shows an equivalent circuit of a booster section 20B in which the coil 22B shown in FIG. 4 is replaced with a metal straight line and only the coil 22A (coil 22) is used. 6, the coil 22B in FIG. 6 is replaced with a straight line, and the coil 22A is the coil 22. It will be appreciated that if L2 is omitted, the resonance frequency can be determined immediately.

Alternatively, instead of the capacitor 24 shown in FIG. 1, a plurality of capacitors may be provided as a matching circuit, and the coil 22 may be provided with a shield for removing noise.

The non-contact IC module 30 includes a memory 32
-1, a power supply circuit 32-3, a transmission / reception circuit 32-4 including a demodulation circuit and a modulation circuit, a clock (not shown), and preferably an IC chip 32 containing a CPU (logic control circuit) 32-2. The coil 34 is mounted on the substrate 31. Alternatively, the contactless IC module 30
Further multi-functionalization may be achieved by providing a display, a keyboard, and the like (not shown). The IC chip 32 has a pair of connection terminals (not shown) with the coil 34. Alternatively, the IC chip 32 may be configured integrally with the coil 34. Such an embodiment will be described later.

The non-contact IC module 30 of the present invention does not have a built-in battery as described above.
Numeral 3 obtains the operating power of the radio wave received by the coil 34 by electromagnetic induction. The demodulation circuit of the transmission / reception circuit 32-4 includes:
The baseband signal is restored to detect the received radio wave and obtain data therefrom. Further, the modulation circuit of the transmission / reception circuit 32-4 changes the carrier in accordance with the transmission data and transmits the data to the coil 34 in order to transmit the data. The modulation method is, for example, A that changes the amplitude of a carrier frequency.
SK, PSK for changing the phase, and the like can be used.

The modulation circuit and the demodulation circuit are the logic control circuit 3
It is controlled by the CPU 2-2 and operates in synchronization with the clock. The memory 32-1 stores R data.
It is composed of OM, RAM, EEPROM and / or FRAM. Since the configuration and operation of the components of the non-contact IC module 30 are well known in the art, detailed description will be omitted.

The IC chip 32 stores predetermined data in the memory 32-1. The IC chip 32 communicates with the reader / writer 1 based on the data, and the CPU can perform predetermined processing. For example, such a memory 32
-1 can store ID information, a value such as a predetermined amount of electronic money, a transaction record, and the like, and the CPU increases or decreases the value by a predetermined transaction (for example, purchasing a ticket or depositing electronic money). can do.

The coil 34 is connected to the IC chip 32 and is electromagnetically coupled to the coil 22 in a non-contact manner. The coil 34 and the coil 22 are arranged close to each other or close to each other by a minute gap. The coil 34 functions as a communication unit in the non-contact IC module 30. Since the coil 34 is arranged close to or close to the coil 22, the communication distance is very small compared to the communication distance (of the coil 22) of the booster section 20. An example of the arrangement of both coils will be described later. The coil 34 has a desired size, shape, self-inductance, and mutual inductance according to the arrangement with the coil 22, the mounting area, and other conditions. For example, when viewed from above, the shape of the coil is not limited to a circle, but may be a square, an ellipse, or the like.

The positional relationship between the coil 34 (or the on-coil IC chip 32A described later) and the coil 22 will be described below with reference to FIGS.
The coil may be formed not only in a planar shape but also in a three-dimensional structure. 9 to 11 are cross-sectional views showing different positional relationships between the coil 34 and the coil 22. 9 to 11, the coil 34 is enlarged for convenience of drawing. The on-coil IC chip 32A is equivalent to a coil 34 built in the IC chip 32 as described later with reference to FIG. 12, except that the size of the built-in coil is smaller than the coil 34. Since the function is the same as that of the coil 34, the following description will be made in accordance with the coil 34.

FIG. 2 shows an on-coil IC chip 32 A and a coil 2 configured as a ferrite bar antenna 26.
2 and the relationship with the antenna 3 of the reader / writer 1. Preferably, as described above, the capacitor 24
And the ferrite bar antenna 26 constitute a resonance circuit that resonates at the carrier frequency fc.

In FIG. 2, the radio wave W from the antenna 3
The magnetic flux generated from the ferrite bar antenna 26 is linked to the ferrite bar antenna 26, and the magnetic flux generated from the ferrite bar antenna 26 is converted to the on-coil IC chip 32A (internal coil (not shown)).
Are linked. The distance H between the antenna 3 and the ferrite bar antenna 26 corresponds to the shorter one of the communicable distances of the antenna 3 and the ferrite bar antenna 26, and the gap G between the ferrite bar antenna 26 and the on-coil IC chip 32A. Corresponds to the communicable distance of the on-coil IC chip 32A. Gap G
Is very small (for example, about 0 to several millimeters) with respect to the communication distance H, and the gap G is zero (ie, the on-coil IC
(When the chip 32A is bonded to the ferrite bar antenna 26). As can be understood, the on-coil IC chip 32A can communicate with the reader / writer 1 with the communication distance substantially extended while the communication distance is the small gap G. In actual use, the on-coil IC chip 32A, the capacitor 24, and the ferrite bar antenna 26 are housed in one non-contact information medium 10A having an arbitrary shape according to the application.

FIG. 3 shows the non-contact information medium 10A shown in FIG.
Shows a non-contact information medium 10B which is a modification of FIG.
The coil 22 shown in FIG.
6A and 26B. Each ferrite bar antenna has the same size and shape.
Corresponds to the ferrite bar antenna 26 shown in FIG. Therefore, the magnetic flux linking the on-coil IC chip 32A and the ferrite bar antennas 26A and 26B is larger than that in the case of FIG. 2, so that the communication reliability is increased. Further, the communication distance of the non-contact information medium 10B can be increased.

First, referring to FIG. 9, the coil 22 and the coil 34 are adhered to the respective surfaces of the support 40 so that their center lines are aligned. The support 40 is, for example, 10
It is composed of a film having a film thickness of about a micron and made of polypropylene, polyerythylene, polyethylene terephthalate, or the like. Although the coil 34 is small, the support 40 and the coil 22 are arranged so that the magnetic flux linked to the coil 34 can pass through the coil 34. Thus, the coil 22 and the coil 34 are electromagnetically coupled to each other, and a change in the current flowing in one of the coils generates an induced current in the other.

FIG. 10 is similar in operation to FIG. 9 but shows a state in which the coil 34 is arranged inside the coil 22. Since the coil 34 has a very small area compared to the coil 22, such a structure is also possible.

As a further alternative, as shown in FIG.
The coil-on IC chip 32A (or the non-contact IC module 30A) shown in FIG. 10 may be arranged inside the coil 34 as in FIG. Coil-on IC chip 32A
In FIG. 1, the coil 34 shown in FIG. 1 is integrated with the IC chip 32. In this case, the coil 22 and the coil on I
The C chip 32A is placed and supported on the substrate 31 (or a support plate other than a substrate made of polyimide or the like). FIG.
1 is functionally similar to FIG.

The coil 34, like the coil 22, can be formed as a spiral planar coil or a multiple spiral coil which is an air-core coil. Further, the coil 34 may be configured as a planar coil with a ferrite core or a ferrite bar antenna.

FIG. 8 shows the coil 34 configured as a spiral planar coil 36. As shown in the figure, the spiral planar coil 36 is mounted on the same substrate 31 together with the IC chip 32, and is connected to the IC chip 32 at a pair of connection terminals 33. The spiral planar coil 36 shown in the figure has an intersection portion 37, where it partially intersects itself.

The coil 34, like the coil 22, can be formed by any method known in the art, such as etching using copper or aluminum, printing by a printed wiring method, or forming with a wire. However, as described later, when the coil 34 of the present invention is integrated with the IC chip 32,
The coil 34 can be formed at the same time when the IC chip 32 is manufactured without adding any new process to the process for manufacturing the IC chip.

The configuration of the antenna used as the communication section of the non-contact IC module 30 is not limited, and is similar to the coil 22 in that it can be understood as broadly including communication means.

The non-contact IC module 30 has an IC chip 32 and a coil 34 mounted on one substrate 31.
Therefore, the non-contact IC module 30 is functionally
As such, a conventional non-contact IC card or IC tag or a radio frequency ID (RFID: Radio Frequ
It has a function similar to that of “Encryption Identification”. However, it is different from the conventional non-contact IC card in the following points.

In the conventional non-contact IC card, since the portion corresponding to the coil 34 is an antenna coil for communicating with the reader / writer 1, it needs to have substantially the same size and communication distance as the coil 22. Further, since such an antenna coil is much larger than an IC chip, it is manufactured separately without being mounted on the IC chip, and is manufactured by a wire bonding method or TAB (Tape Automata).
ed Bonding) method or IC
A bump was formed on the chip and the chip was connected to the IC chip by a face-down method using an anisotropic conductive film.
As will be understood, the non-contact IC module 30 of the present invention
However, the communication distance was short due to the small size of the coil 34 and could not be used as it was as a conventional non-contact IC card.

According to the present invention, the communication distance of the non-contact IC module 30 is extended by disposing the booster section 20 near the non-contact IC module 30. In addition,
The non-contact IC module 30 shown in FIG. 1 in which the coil 34 is formed separately from the IC chip 32 and connected to the IC chip 32 to be mounted on one substrate 31 has an on-coil chip It may be replaced with a non-contact IC module 30A shown in FIG. In this case, placing the on-coil IC chip 32A on the substrate 31 is optional. In any case, the coil 34 is disposed on the same substrate 31 as the IC chip 32 or is integrated with the IC chip 32. The state of the built-in coil is, for example, as shown in FIG.
2 is read as the active element area of the IC, and the substrate 3
It can be understood by reading 1 as an IC chip substrate. As described above, the coil 22 and the coil 3
4 can communicate without contact. Thereby, the non-contact IC module 30 of the present invention is characterized by
Alternatively, the performance and connection can be inspected by the IC chip 32A alone.

In a conventional non-contact IC card, an IC chip and an antenna coil are separately manufactured and inspected, mounted on the card, and then connected to each other. Then,
The above-mentioned performance and connection were inspected as a whole, and defective products were replaced. Therefore, the conventional non-contact IC card cannot perform these inspections until the IC chip and the antenna coil are mounted on the card and connected thereto, so that the manufacturing efficiency is low. On the other hand, the non-contact information medium 10 of the present invention can be subjected to a function test as a single unit, and has improved manufacturing efficiency as compared with the conventional non-contact IC card.

The present invention also relates to a non-contact IC module 30 which cannot be applied to a conventional non-contact IC card due to its short communication distance. Making it possible. Therefore, the contactless IC module 30 of the present invention can be an independent transaction medium having economic value. That is, non-contact IC
The module 30 can have various shapes, and can be housed in a package (molded body) having a desired shape. Therefore, the wireless communication I
The C chip is not limited to an IC card or an IC tag, but can be widely applied to a device that performs wireless communication with an external device. Hereinafter, such an embodiment will be described with reference to FIGS.

FIG. 13 is a sectional view of the resin molded body 50 of the present invention. FIG. 14 shows a resin molded body 50 of the present invention obtained by removing the coil forming portion 52 from the resin molded body 50 shown in FIG.
It is sectional drawing of A. FIG. 15 shows a resin molded body 50B of the present invention, which is a modification of the resin molded body 50A shown in FIG. FIG. 16 shows a resin molded product 50C of the present invention, which is still another modified example of the resin molded product 50A shown in FIG. FIG.
7 is a resin molded body 50D of the present invention, which is a modification of the resin molded body 50 shown in FIG.

The resin molding 50 of the present invention shown in FIG.
The on-coil IC chip 32A shown in FIG. 12 is housed therein with a resin 54 molded in a bobbin shape, and functions as a package of the on-coil IC chip 32A. In addition, the constricted side surface serves as a coil forming portion 52, around which the coil 22 is wound. The resin molding 50 supports the coil 22 on the coil forming portion 52. It is to be noted that the coil 22 is illustrated as being wound three times in FIG. The resin 54 has a function of sealing and protecting the on-coil IC chip 32A. The arrangement of the coil 22 and the on-coil IC chip 32A is substantially the same as the relationship between the two shown in FIG. 11, and the two are electromagnetically coupled.

Since the on-coil IC chip 32A is sealed in the resin molded body 50, there is no problem such as breakage or inspection accompanying handling of the bare chip. The resin molded body 50 is
The non-contact information medium of the present invention can be provided in a shape and size that meet various requirements because it is covered with a resin that is easy to process. For example, the reader / writer 1 may be embedded in the vehicle key at the tip of the key together with the booster unit 20.
And the processing device connected thereto, the processing device obtains the ID information stored in the memory (not shown) of the on-coil IC chip 32A from the reader / writer 1 and checks the ID information by a predetermined method to obtain the ID information. It can be determined whether a person or an authorized person is going to drive. Thereby, the resin molded body 50 can achieve the anti-theft function. At this time, the resin molded body 50 can be processed into an arbitrary shape and size that match the shape of the key of the car.

The resin molded body 50A shown in FIG.
5 corresponds to the resin molded body 50 shown in FIG. In FIG. 13, the coil 22 is wound around and supported by the coil forming portion 52. The resin molded body 50A shown in FIG.
It can be used in an arrangement as shown in FIG. 9 or FIG.

The resin molded body 50B shown in FIG.
The substrate 31 in which the resin molded body 50A shown in FIG.
Are included. The function and usage of the resin molded body 50B are the same as those of the resin molded body 50A shown in FIG. As will be understood, such a resin molding 50
B functions as an independent IC package without pins.

The substrate 31 shown in the resin molded body 50B merely has the same function as a mere support table, but this
As shown in FIG. 6, the lead frame 35 can be replaced. The lead frame 35 includes test terminals (pins) and the like, and has the advantage that it can be used for inspection during assembly. That is, the resin molded body 50C shown in FIG. 16 functions as an independent IC package having pins. After the inspection, the end surface of the lead frame 35 is cut. That is, the lead frame 35 in the resin molded body 50C shown in FIG. 16 shows a state before cutting, and the protruding lead frame 35 is placed on the end surface of the resin molded body 50C (in FIG. At the end). Of course, the resin molded body 50C may be selectively used with the lead frame 35 protruding. Since the lead frame 35 has the same function as the support base as the substrate 31, the substrate 31 and the lead frame 35 can be replaced with each other not only in FIG. 15 but also in other drawings.

FIG. 17 shows still another resin molded product 50D. The resin molding 50D is a resin molding 50 shown in FIG.
, The on-coil IC chip 32A is connected to the IC chip 3
2 and a coil 34 (or a combination of the IC chip 32 and the spiral planar coil 36 shown in FIG. 8). That is, since the resin molded body 50D has a coil larger than the resin molded body 50, the resin molded body 50D has a feature that the communication distance is longer than that of the resin molded body 50. The coil 34 and the IC chip 32 are connected by a wire bonding (or TAB) wire 38. As described above, the lead frame 35
May be the substrate 31.

FIG. 18 is a block diagram showing a non-contact information medium 10C according to another embodiment of the present invention. The non-contact information medium 10C includes a booster section 2 instead of the booster section 20.
It is different from the non-contact information medium 10 shown in FIG. 1 in having 0C. The booster section 20C
It differs from the booster section 20 in that it has a coil 29 in addition to the coil 22.

According to the booster section 20C of the present embodiment,
The coil 22 communicates with the reader / writer 1, and the coil 29 communicates with the coil 34 of the non-contact IC module 30. The coil 29 is electromagnetically coupled to the coil 34 and communicates with the coil 34 in a non-contact manner, similarly to the coil 22 in FIG.

In this case, the arrangement of the capacitor 24 and the coil 22 may be the LC series resonance circuit shown in FIG. 18 or the LC parallel resonance circuit shown in FIG. In this case, the coils 29 and 34 in FIG. 18 have a current transformer function of converting the current of the LC series resonance circuit and transmitting the converted current to the IC chip 32. On the other hand, the coils 29 and 34 in FIG. 19 convert the voltage of the LC
2 having a voltage transformer function.

Hereinafter, a method for manufacturing the non-contact information medium 10 of the present invention will be described. The configuration of the booster section 20 is simply composed of a communication section composed of a coil (or an antenna) and a capacitor. A person skilled in the art will understand that the manufacturing method can be understood from the above description, and a description thereof will be omitted.

The non-contact IC module 30 is basically the same as the conventional non-contact IC card manufacturing method except that the size of the coil 34 is small and mounted on the substrate 31 as described above. However, the non-contact IC of the present invention
The module 30 itself is unitized, and since it is not in contact with the booster unit, the communication performance, processing performance, storage performance, connection status, etc. can be inspected before mounting with the non-contact memory element 30 alone. It is. Therefore, the production efficiency is higher than that of the conventional non-contact IC card manufacturing method in that only the non-contact memory element 30 that has passed the inspection need be mounted.

For example, the non-contact IC module 30 can form an antenna circuit using the hybrid IC technology as shown in FIG. According to this method, the antenna circuit 3 is mounted on the substrate 31 or the lead frame 35.
Thereafter, the IC chip 32 is mounted, and both are connected by wire bonding (or TAB).

Hereinafter, a method of manufacturing the on-coil IC chip 32A, which is one of the features of the present invention, will be described. According to the method of manufacturing the on-coil IC chip 32A of the present invention, the on-coil IC chip 32A is manufactured according to the basic process for manufacturing the IC chip 32 (for example, CMOS) without any new process and with minor changes. (Monolithic method). Therefore, if a conventional CMOS manufacturing device for a non-contact IC card is provided, the IC chip 32 is
The C chip 32A can be manufactured in either case.

As shown in FIG. 20, the method of manufacturing the on-coil IC chip 32A according to the present invention includes a well forming step 101
An element isolation step 102, a gate formation step 103,
Source / drain forming step 104 and wiring step 105
And a protective film forming step 106. Since each step is substantially the same as the basic step of the well-known CMOS manufacturing method, the wiring step 105 which is a feature of the present invention will be described.

The wiring step 105 is a step of connecting each terminal (gate, source, drain) and other components by wiring. In such a process, wiring is performed using a mask (group). In the present invention, a pattern of a built-in (antenna) coil is added to the mask. Thus, the on-coil IC chip 32A of the present invention can be manufactured using a conventional CMOS manufacturing apparatus without any special process of forming a built-in coil.

The on-coil IC chip 32A, as read with reference to FIG. 8, may form a coil on substantially the same plane as a terminal such as a gate (and a peripheral region of an active element of the IC). Alternatively, a coil may be laminated on the terminal.

FIGS. 21 and 22 show a case where a coil is formed by the above-described wiring process. FIG. 21 shows the built-in coil in FIG.
An on-coil I formed as a simple spiral planar coil as shown in FIG.
3 shows a cross section of a main part of the C chip 60. FIG. 22 shows, for example, that the built-in coil is formed as a multiple spiral coil,
The cross section of the main part of the on-coil IC chip 90 in which the wiring and the coil are formed of three-layer metal is shown. In FIG. 22, the wiring between the well, the source, the gate, the drain, and other components and the method of flattening are omitted, but these are easily understood from techniques well known in the art. . Each metal layer is mainly made of aluminum, but is preferably made of an alloy containing a small amount of another element for reasons such as improvement of reliability. This applies to all metal layers described later.

As shown in FIG. 21, in the on-coil IC chip 60, a PMOS gate (PM) 70 and an NMOS gate (NM) 72 are connected together. In the present embodiment, the P substrate 62 and the N well 66 in which the ion implantation is diffused are used. However, it is obvious that the N substrate and the P well can be used. The N-type impurity concentration is higher than the P-type impurity concentration of the substrate 62. Metals 80 and 82 which also serve as wiring and coil formation are formed between the interlayer films 74 and 76 and between the interlayer film 76 and the protective film 78, respectively. As each interlayer film, those well-known in the art can be used, and thus detailed description is omitted here.

As described above, the reason why two metal layers are required to form the built-in coil is that the intersection 37 shown in FIG.
It is for forming. However, the coil has less cross-sectional unevenness than an active element or the like. Further, depending on the number of turns of the coil or the adopted three-dimensional structure, three or more layers may be required as described later. Metal layer 8
0 and 82 are contact holes 64 and metal connection holes 84.
Are electrically connected to each other or to each device component.

Referring to FIG. 22, on-coil IC chip 90 shows a three-layer metal applied to a coil having a large number of turns (multiple spiral coil). Main part 9 of device including substrate, well, source, drain, gate, etc. 9
1, three metal layers 92, 94, and 96 and interlayer films 91, 95, and 97 are formed. In addition, a protective film 98 is formed on the upper part. Each metal layer is connected at 10
At 0, 102, 104 and 106, they are connected to each other or to the main part 91.

The method of manufacturing the on-coil IC chip according to the present invention is not limited to the above-described monolithic method. For example, the on-chip antenna coil may be formed using an input / output pin wiring method. Here, as described above, the normal wiring method is a method in which bumps are formed on an IC chip and the IC chip and the antenna are connected by a face-down method via an anisotropic conductive film. Wiring technology is a conventional coil 22
This is different from the usual method in that the antenna coil having the same size as that of the above is miniaturized. Note that whether to dispose an anisotropic conductive film is optional.

First, an antenna can be formed by a rewiring layer using the above wiring method. FIG.
On-coil IC chip 11 manufactured by such a method
0 shows a cross section of a main part. In this case, after completion of the wiring step 105 in FIG.
An insulating layer 112 is further formed on 11. Next, a metal layer 114 is formed on the insulating layer 112 and is patterned to form an antenna circuit. The antenna circuit and each terminal of the IC circuit 111 in the lower layer are connected through a through hole 116 provided in the insulating layer 114 via an aluminum pad 118 previously formed on each terminal. The finished product can be formed into a resin molded body 120 as shown in FIGS.

Of course, as shown in FIG. 24, mounting terminals 132 such as bumps are formed
The chip 32 may be connected face down to the antenna coil 134 via the bump 132. FIG. 24 shows a cross section of a main part of the on-coil IC chip 130 having such a configuration. The anisotropic conductive film 136 may be selectively provided between the bump 132 and the coil 134. Further, as shown in FIGS.
Can be molded.

As described above, according to the method shown in FIG.
Instead of forming the bumps 132 shown in FIG. 24 (before the bump forming step), a rewiring layer (metal layer) is formed to form an antenna coil. On the other hand, according to the method shown in FIG. 24, the antenna coil is formed by using the wiring means used for the connection between the IC terminal and the mounting terminal. Therefore, according to the method shown in FIG. 24, the antenna coil is formed after the bump forming step.

Next, the non-contact IC module 30 of the present invention
Will be described with reference to FIG. FIG. 25 is a perspective view for explaining an inspection method and an inspection system 150 of the present invention for inspecting the non-contact IC module 30 using a non-contact probe (antenna) 152 instead of a conventional contact.

First, the non-contact IC module 30 is mounted on the front surface of the wafer 151 and the non-contact probe 15
2 is brought into contact. The inspection result is transmitted to the reader / writer 156 via the transmission / reception circuit 154 connected to the antenna 152 (and selectively to an external processing device connected to the reader / writer 156), and its performance and connection are determined. As described above, according to the inspection method of the present invention, the inspection which was conventionally performed by contacting the probe with the IC can be performed in a non-contact manner. Since it is not necessary to bring the probe into contact with a simple terminal, the inspection becomes easy. Further, the probe used in the present invention may be larger than a conventional probe, and it is not necessary to manufacture a minute probe, which leads to a reduction in the manufacturing cost of the inspection apparatus and the inspection cost. According to the method for manufacturing the non-contact information medium 10 of the present invention, such a non-contact inspection method can be performed after the completion of the packaging process, so that the inspection can be performed only once at the final time.

Hereinafter, the operation of the non-contact information medium 10 of the present invention will be described. Referring to FIG. 1, the non-contact information medium 10 of the present invention is expected to have various multi-purpose uses like a non-contact IC card and an IC tag. These fields include finance (cash card, credit card, electronic money management, farm banking, home banking, etc.) distribution (shopping cards, gift certificates, etc.), medical care (medical consultation tickets, health insurance cards, health handbooks, etc.), transportation (Stored fair (SF) card, coupon, license, commuter pass,
Passports), insurance (such as insurance certificates), securities (such as securities), education (such as student ID cards, transcripts), companies (such as ID cards), administration (such as seal seals, resident certificates, etc.). For example, when the IC chip 32 stores the ID information in its memory (ROM or the like), the non-contact information medium 10 can be used as an input / output management medium of a company, research institute, university, or the like.

In this case, first, the user holds the non-contact information medium 10 over a reader / writer 1 provided near the door at a distance of, for example, 10 to 50 cm. In response to this, the reader / writer 1 transmits the radio wave W at the carrier frequency fc to urge the non-contact information medium 10 to reply with the ID number. The radio wave W is preferably received by the coil 22 of the booster unit 20 that resonates at the carrier frequency fc, and is simultaneously transmitted to the coil 34 of the non-contact IC module 30 electromagnetically coupled to the coil 22. As a result, an induced current is generated in the coil 34, and the induced current is supplied to the IC chip 32. Since the induced current is an alternating current, the IC chip 32 converts it into a direct current in a power supply circuit (not shown) to obtain a constant voltage for operation of each unit.

On the other hand, a CPU (not shown) receives a signal (induced current) received through the coil 34 and a demodulation circuit (not shown).
In response to this, each unit is operated so as to read out the ID information from the memory (not shown) and send it out of the coil 34. As a result, the ID information is read from the memory and sent out through a modulation circuit and a coil 34 (not shown). The ID information from the coil 34 is transmitted to the coil 22 of the booster unit and the antenna unit 3 of the reader / writer 1 electromagnetically coupled to the coil 22 by electromagnetic induction. The antenna unit 3 sends the received ID information to the control interface unit 2, and the control interface 2 requests a host computer or the like connected thereto to check the validity.

Optionally, the reader / writer 1 may prompt the user to enter a password or supply fingerprint, voiceprint, and iris information. This makes it possible to simultaneously check whether the user is a valid owner of the non-contact information medium 10. In this case, the reader / writer 1 uses a fingerprint reader (not shown) or the like. Thereafter, if it is confirmed that the ID information is correct, the door is unlocked and the user can open the door and enter inside. The same applies when the door is a safe door. If the ID information is incorrect, the door lock is maintained.

The preferred embodiments of the present invention have been described above. However, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the invention.

For example, the non-contact IC module 30 can be configured as a unit that can be separated from the booster section 20. Such a unit can be mechanically engaged with the reader / writer 1, and the non-contact IC module 30 can directly and non-contactly communicate with the antenna unit 3 on condition that such a mechanical engagement exists.

For example, since the non-contact information medium 10 exchanges data with the reader / writer 1 by radio waves (for example, microwaves), there is a possibility that the information is intercepted. Also, if a device that performs the function of a reader / writer is brought close to the non-contact information medium 10 in the pocket, it will communicate with the IC chip 32 and
The value stored in the C chip 32, for example, electronic money,
May be taken. Therefore, in the case of using for settlement purposes, if the communication distance with the reader / writer 1 is made small and the communication is performed in a close contact type, system security can be enhanced.

[0102]

According to the non-contact information medium of the present invention, the non-contact IC module capable of wireless communication having communication means such as minute coils can extend its communication distance to a desired distance by the booster. Therefore, the conventional non-contact I.D.
The use of the C module has been expanded by the present invention.

In addition, since the non-contact IC module itself can be inspected for its operational performance (including its processing, storage, and communication functions) before being mounted on a base material (including a case where it is formed into a molded product), for example, The manufacturing efficiency can be improved as compared with the conventional non-contact IC card. In addition, the non-contact IC module can be processed into various shapes and sizes according to various uses irrespective of a card or a tag, by itself or being packaged.

Further, the non-contact IC module has at least a communication means such as an IC chip and a coil connected thereto, but does not exclude the incorporation of other components.

In a non-contact IC module using an IC chip and a coil, the coil may be arranged on a substrate on which the IC chip is mounted, or the coil may be integrated with the IC chip to form an on-coil IC chip. . Since such an on-coil IC chip can be manufactured using the same basic process as that of the method for manufacturing an IC chip without adding a new process, a manufacturer can use a conventional IC chip or an on-coil IC according to the application. Chips can be selected and manufactured.

However, the manufacturing method of the present invention may employ another process as described above with reference to FIGS.

Further, since the inspection method and system of the present invention can inspect a non-contact IC module in a non-contact manner, it is easier and less expensive than a normal inspection method, and does not damage the IC. .

[Brief description of the drawings]

FIG. 1 is a block diagram showing a relationship between a configuration of a non-contact information medium 10 of the present invention and a reader / writer 1;

FIG. 2 shows a non-contact information medium 10A according to another embodiment of the present invention.
FIG. 3 is a block diagram showing the configuration of FIG.

FIG. 3 shows a non-contact information medium 1 according to still another embodiment of the present invention.
It is a block diagram which shows the structure of OC.

FIG. 4 is a top view showing an example of a specific configuration of the booster unit 20 shown in FIG.

FIG. 5 is a sectional view taken along line AA of FIG. 4;

FIG. 6 is an equivalent circuit of the booster section shown in FIG.

FIG. 7 shows an equivalent circuit of an example of a specific configuration different from that of FIG.

8 is a non-contact IC of the non-contact information medium 10 shown in FIG.
FIG. 3 shows a top view of a spiral planar coil that can be used for module 30.

9 is a cross-sectional view showing a positional relationship between two coils in the non-contact information medium 10 shown in FIG.

FIG. 10 is a view showing a reference numeral 2 in the non-contact information medium 10 shown in FIG.
It is sectional drawing of another example which shows the positional relationship between two coils.

FIG. 11 is a diagram illustrating a part 2 of the non-contact information medium 10 shown in FIG.
It is sectional drawing of another example which shows the positional relationship between two coils.

12 shows a non-contact I of the non-contact information medium 10 shown in FIG.
It is a block diagram which shows the on-coil IC chip applicable to C module.

FIG. 13 is a sectional view of a resin molded body 50 according to one embodiment of the present invention.

FIG. 14 shows a resin molded body 50 according to another embodiment of the present invention.
It is sectional drawing of A.

15 is a sectional view of a resin molded body 50B of the present invention, which is a modification of the resin molded body 50A shown in FIG.

FIG. 16 is a sectional view of a resin molded body 50C of the present invention, which is still another modified example of the resin molded body 50A shown in FIG.

17 is a cross-sectional view of a resin molded body 50D of the present invention, which is a modification of the resin molded body 50 shown in FIG.

FIG. 18 is a block diagram showing a non-contact information medium 10C according to another embodiment of the present invention.

FIG. 19 is a block diagram showing a modification of the booster unit of the non-contact information medium 10C shown in FIG.

FIG. 20 is a flowchart illustrating a method for manufacturing the on-coil IC chip 32A of the present invention.

FIG. 21 is a cross-sectional view showing a two-layer metal structure applicable to the on-coil IC chip 32A of the present invention.

FIG. 22 is a sectional view showing a three-layer metal structure applicable to the on-coil IC chip 32A of the present invention.

FIG. 23 is a fragmentary cross-sectional view for explaining another method for manufacturing the on-coil IC chip 32A of the present invention.

FIG. 24 is a fragmentary cross-sectional view for explaining still another manufacturing method of the on-coil IC chip 32A of the present invention.

FIG. 25 is a diagram illustrating a method for inspecting the non-contact IC module 30 of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Non-contact information medium 20 Booster part 22 Coil 29 Coil 30 Non-contact IC module 32 IC chip 32A On-coil IC chip 34 Coil

Claims (25)

[Claims] 1. A booster unit having a first coil capable of performing wireless communication with an external device using electromagnetic induction, and wirelessly communicating with the booster unit by being electromagnetically coupled to the booster unit in a non-contact manner. A non-contact information medium including an IC module capable of communicating with the external device in a non-contact manner via the booster section. 2. The non-contact IC module according to claim 1, wherein the non-contact IC module is connected to the IC element and generates an induced current by electromagnetic induction from an induced current generated in the first coil by the external device. The non-contact information medium according to claim 1, further comprising a second coil capable of performing the following. 3. The non-contact information medium according to claim 2, wherein the second coil is sealed with a resin integrally with the IC element. 4. The non-contact information medium according to claim 2, wherein in the non-contact information medium, the IC element has a memory unit. 5. The booster unit resonates with a carrier frequency of a signal transmitted by the external device, the booster unit further includes first and second capacitors, and the first coil includes the first and second capacitors. 2. The non-contact information medium according to claim 1, wherein the non-contact information medium is connected between the second capacitors. 6. The non-contact information medium according to claim 1, wherein the booster unit further includes a capacitor forming a series resonance circuit with the first coil. 7. The non-contact information medium according to claim 1, wherein the booster unit further includes a capacitor forming a parallel resonance circuit with the first coil. 8. The non-contact information medium according to claim 1, wherein the first coil and the second coil are arranged so as to overlap each other so that the directions of magnetic fluxes of the first coil and the second coil substantially coincide with each other. 9. The non-contact information medium further includes a support, wherein the first coil is disposed on one surface of the support, and the other surface of the support opposes the first coil. Second
The non-contact information medium according to claim 1, wherein the coils are arranged. 10. The non-contact information medium according to claim 1, wherein the non-contact information medium includes the second coil disposed inside the first coil. 11. The non-contact information medium according to claim 1, wherein the booster unit further includes a third coil that receives an induced current generated in the first coil and is electromagnetically coupled to the second coil. 12. A booster unit having a first communication unit having a first communication distance and capable of wireless communication with an external device, and a non-contact I / O capable of wireless communication with the booster unit.
A non-contact information medium having a C module, wherein the non-contact IC module has an IC element, a second communication distance shorter than the first communication distance, and a second communication distance connected to the IC element. And a second communication unit capable of wireless communication with the first communication unit. 13. The non-contact IC module according to claim 1, wherein
The non-contact information medium according to claim 12, further comprising a substrate on which the C element and the second communication unit are mounted. 14. The non-contact information medium according to claim 12, wherein the first communication unit has a ferrite bar antenna. 15. A non-contact information medium having a non-contact IC module and a molded article having a predetermined shape for protecting the non-contact IC module. 16. The non-contact information medium according to claim 15, wherein the molded body has a resin filling the inside thereof. 17. The non-contact information medium according to claim 15, further comprising a substrate on which the non-contact IC module is mounted. 18. The non-contact information medium according to claim 17, wherein the substrate comprises a lead frame. 19. The non-contact IC module according to claim 19, wherein the molded body includes a booster portion for extending a communication distance of the non-contact IC module.
The non-contact information medium according to claim 15, further comprising a connection portion that enables the non-contact connection to the module. 20. The non-contact information medium according to claim 15, further comprising a booster connected to the molded body to extend a communication distance of the non-contact IC module. 21. A step of forming a wirelessly communicable non-contact IC module having an IC element and an antenna, and extending the communication distance of the non-contact IC module to perform wireless communication between the non-contact IC module and an external device. Forming a booster unit that enables the non-contact IC module and a step of non-contact coupling the booster unit with the non-contact IC module, wherein the non-contact IC module is formed. The wiring step includes a wiring step of connecting the constituent elements of the IC element, and the wiring step uses the mask having the wiring pattern for the IC element and the pattern of the antenna to form the IC.
A method for manufacturing a non-contact information medium, wherein wiring of a C element and formation of the antenna are simultaneously performed. 22. The method of manufacturing a non-contact information medium, comprising: a step of inspecting the performance of the non-contact IC module; and a step of mounting only the non-contact IC module that has passed the inspection step on a base material. 22. The non-contact information medium according to claim 21, further comprising a step of connecting the contact IC module and the booster unit in a non-contact manner. 23. A non-wireless communication device comprising: a step of forming a gate in a semiconductor manufacturing process; a step of forming a source and a drain; and a step of wiring the gate, source, drain and other components of an IC element. Contact I
A method for manufacturing a C module, wherein the wiring step comprises:
Non-contact IC capable of wireless communication for simultaneously performing wiring of the IC element and formation of the antenna using a mask having an antenna pattern that enables wireless communication of a module
How to make a module. 24. A non-contact probe antenna capable of communicating with a non-contact IC module in a non-contact manner, based on a signal connected to the non-contact probe antenna and received by the non-contact probe antenna from the non-contact IC module An inspection apparatus for inspecting the non-contact IC module. 25. A step of contactlessly communicating with a non-contact IC module using a non-contact probe antenna, and inspecting the non-contact IC module based on a signal received by the non-contact probe antenna from the non-contact IC module. And a step of mounting only the non-contact IC module that satisfies predetermined requirements in the inspection step on a base material.