JP4662400B2 - Articles with coil-on-chip semiconductor modules - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an article with a coil-on-chip type semiconductor module provided with a coil-on-chip type semiconductor module provided with a coil connected to a terminal of a semiconductor chip, and a sales system using an information network such as the Internet. .
[0002]
[Prior art]
In recent years, IC cards are becoming increasingly popular in terms of information confidentiality, and in recent years, contactless IC cards that exchange information without being in contact with a read / write device (reader / writer) have been manufactured. In general, a method of exchanging signals with an external read / write device (reader / writer) or performing signal exchange and power supply by electromagnetic waves is generally used.
In addition, various types of non-contact IC tags in the form of sheets or bills, in which data loaded ICs are connected to antenna coils, have recently been proposed and attached to products, packaging boxes, etc. for shoplifting prevention, logistics systems, etc. It has come to be used.
[0003]
On the other hand, in recent years, a backbone network of information has been established, multimedia has progressed on a global scale, and sophistication and activation of economic activities have been promoted, and business transactions using the Internet have also been activated.
[0004]
[Problems to be solved by the invention]
Under such circumstances, when purchasing goods such as electrical products, it is common to obtain various information about the product or transaction information related to the product purchase as an attached document at the same time. It was supposed to be such a thing. In some cases, it may be difficult to transport the object to be purchased.
The present invention corresponds to these. Specifically, when purchasing an article, various information about the product or transaction information regarding the product purchase is not attached as an attached document, but as digital information or the sales object itself. It is an object of the present invention to provide a sales system that can be easily obtained by downloading from the Internet as digital information.
At the same time, it is intended to provide an article with a coil-on-chip type semiconductor module, which is used in such a system and is provided with a coil-on-chip type semiconductor module provided with a coil connected to a terminal of a semiconductor chip. To do.
[0005]
[Means for Solving the Problems]
  An article with a coil-on-chip type semiconductor module of the present invention includes a booster circuit member in which a booster antenna coil is arranged on one surface side of a base substrate, and an external device that reads and / or writes via the booster antenna coil. A coil-on-chip type semiconductor module provided with a coil for non-contact communication connected to a terminal of a semiconductor chip is provided on one side of a product part which is an article body, and the booster The wiring of the booster antenna coil of the circuit member includes a dense portion overlapping with the wiring of the coil of the coil-on-chip semiconductor module, and the booster antenna coil of the booster circuit member and the coil of the coil-on-chip semiconductor module With the coil on chip facing each other. The wiring of the coil type semiconductor modules, wiring and coil dense portion of the booster circuit member, so as to overlap each other, those are aligned, Product departmentOn the side, a recess for accommodating the coil-on-chip type semiconductor module is formed, and the coil-on-chip type semiconductor module is fitted into the recess, and the coil surface is aligned with one surface of the product part,The booster circuit member is arranged along the one surface with the wiring of the coil facing the one surface side of the product portion, and the coil-on-chip type semiconductor module is coated with the coating member by coating the coating member. The film member is held between the member and the product portion, and the coating member does not appear to expose the adhesive or the adhesive at the portion where the coil-on-chip type semiconductor module is located. In addition, it is bonded and held on the product part using an adhesive or adhesive.It is characterized by this.
And it is an article with a semiconductor module of the above-mentioned coil on chip type,A coil-on-chip type semiconductor module and a film member for holding the coil-on-chip type semiconductor module are disposed at the end of the product portion.
  The product section referred to here includes not only the product body but also its package such as a case.
[0006]
  The present inventionSales related toThe selling system is an article selling system in which a purchaser of an article equipped with a semiconductor module storing key information for downloading and obtaining product information from an information network such as the Internet obtains product information from the information network, The key information for downloading and obtaining the product information from the information network such as the Internet is stored in the semiconductor module, and the key information is received from the semiconductor module-equipped article of the present invention and the semiconductor module of the article with the semiconductor module. A reader, and a data input device that has an interface with the reader, can access the information network, and can input information from the information network. Access and download product information from the information network And obtaining the key information to be sent to the seller side of the article with the semiconductor module via the information network, and the seller side is digital contents such as character information, image information, music information, or The purchaser side is permitted to download other product information, and the purchaser downloads and obtains them via the Internet. The product information is obtained from the information network. And in the above, when a data input device receives merchandise information, it has a display part for displaying the merchandise information. The product information referred to here includes various information about products, transaction information regarding product purchases, etc. as digital information, or digital information about the sales target itself.
[0007]
[Action]
The article with a coil-on-chip type semiconductor module of the present invention includes a coil-on-chip type semiconductor module as described above, and includes a booster circuit unit having an external device for reading / writing and a booster antenna coil. Through this, it is possible to perform non-contact communication, whereby information such as key information is stored in the semiconductor module, and this information can be read in a non-contact manner by a reader.
As a result, when purchasing goods, various information about products, transaction information about product purchases, etc. are not attached documents, but they are obtained as digital information or as digital information on the sales target itself, which can be downloaded from the Internet. It is possible to provide a sales system that can
[0008]
  In particular, the booster circuit unit is provided with a coil of a coil-on-chip type semiconductor module so that communication can be performed in a non-contact manner by an external device that performs reading and / or writing while the coil-on-chip type semiconductor module is provided. Aligned with theByWhen reading, readSeeIt is only necessary to bring the external device (hereinafter also referred to as a reader) to be performed closer to the booster circuit portion provided in the article.
  In addition, when the booster circuit part is not attached to the article, it is necessary to arrange the booster circuit part separate from this when aligned with the coil of the coil-on-chip type semiconductor module. The work on the purchaser side is complicated and difficult.
  Of course, if there is a reader that can easily cope with this, such as a reader equipped with a booster circuit unit, the work is not complicated.
[0009]
  For holding a coil-on-chip type semiconductor module, a coating member that coats the semiconductor module is held between the coating member and the product portion, and the coating member is attached to the product portion using an adhesive or an adhesive. Adhesion retentionTo do.
  Since the adhesive or adhesive is not exposed at the position where the coil-on-chip type semiconductor module is located, the coil-on-chip type semiconductor module does not move and touch the adhesive surface or adhesive side. In addition, by forming a recess for housing the coil-on-chip type semiconductor module on the product part side, adverse effects on the semiconductor module are eliminated, and the semiconductor module can be recycled.
  In addition, the coil-on-chip semiconductor module and the coating member for holding the coil-on-chip semiconductor module are disposed at the end of the product portion, so that the coating member can be easily peeled off. The work for recycling is made easier.
[0010]
  The present inventionInvolved inWith such a configuration, the sales system does not include various information about the product or transaction information about the product purchase as digital information, or the sales target itself as digital information. It is possible to provide a sales system that can be downloaded from the Internet.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
  Embodiments of the present invention will be described with reference to the drawings.
  FIG. 1A is a schematic cross-sectional view showing a characteristic part of a first example of an embodiment of an article with a coil-on-chip type semiconductor module according to the present invention. FIG. 1B, FIG. FIG. 1D is a schematic cross-sectional view showing features of Reference Embodiment Example 1, Reference Embodiment Example 2, and Reference Embodiment Example 3, respectively.2 (e), 2 (f), and 2 (g) are schematic cross-sectional views showing features of Reference Embodiment Example 4, Reference Embodiment Example 5, and Reference Embodiment Example 6, respectively. 2 (h) is a schematic cross-sectional view showing a characteristic part of a second example of the embodiment of the article with a coil-on-chip type semiconductor module of the present invention,FIG. 3 is a diagram for explaining a sales system according to the present invention, FIG. 4 (a) is a diagram showing an example of the shape of a booster coil of a booster circuit, and FIG. 4 (b) is a coil of a semiconductor module. It is the figure which showed one example of the shape.
  1-4, 101-108 are articles with a coil-on-chip semiconductor module, 110 is a product part, 115 is a recess, 117 is a hole, 120 is a (coil-on-chip) semiconductor module, and 121 is a coil. , 121s is connection wiring, 122 is a semiconductor chip, 125 is a terminal, 130 is a booster circuit member, 131 is a coil, 131a is a dense part, 131s is connection wiring, 132 is a base substrate, 141, 142, 143, and 144 are coatings 150, an adhesive (or adhesive), 310, the Internet, 320, a reading device (also referred to as a reader), 330, a personal computer, 340, a display device (display device), and 341, a screen.
  A0 is an area including a semiconductor module (coil-on-chip type) and a booster circuit forming unit provided in an article, B1 is an article seller side, and B2 is an article purchaser side.
[0012]
First, a first example of an embodiment of an article with a coil-on-chip semiconductor module according to the present invention will be described with reference to FIG.
In the first example, a coil 121 for non-contact communication is connected to a terminal of a semiconductor chip via an external device that performs reading and / or writing and a booster circuit unit having a booster antenna coil. A coil-on-chip type semiconductor module comprising a coil-on-chip type semiconductor module 120 and a booster circuit member 130 having a booster circuit unit provided in the product unit 110. 120, and the booster circuit member 130, the circuit portion of the booster circuit member 130 is positioned on the coil 121 of the coil-on-chip type semiconductor module 120 so that the reader / writer can communicate without contact. It is provided together.
And the semiconductor module 120 and the booster circuit member 130 are covered with the film member 141, and the adhesive (adhesive) 150 is provided and fixed to the product part in the surrounding part.
In this example, since the semiconductor module 120 is fitted into the recess 115 of the product part 110 and the coil 121 surface is substantially aligned with one surface of the product part 110, the movement of the semiconductor module 120 can be reliably restricted, and an adhesive (adhesive) Agent) 150 can be prevented from being brought into contact with the circuit portion of the booster circuit member 110.
[0013]
For example, examples of the coil wiring of the booster circuit member 130 and the coil wiring of the semiconductor module 120 include those shown in FIGS. 4A and 4B, respectively.
The coil wiring of the booster circuit member 130 has a dense portion 131a, and a loop is formed by the connection wiring 131s.
Then, the coil wiring of the semiconductor module 120 and the coil wiring portion of the dense portion 131a of the booster circuit member 130 are aligned so that they substantially overlap each other, and the semiconductor module 120 and the booster circuit member 130 are provided in the product portion 110. .
As a method for forming the booster circuit member 130, for example, a material in which aluminum or copper foil having a thickness of 5 to 50 μm is laminated on both surfaces of an insulating sheet is used, and aluminum or copper foil is etched by a photoetching method. Although a method of forming a loop by forming a wiring portion such as the antenna coil 131 and the connection wiring 131 s and then pressing the connection portions on both sides of the insulating sheet to perform caulking connection is exemplified, the method is not limited thereto.
As the insulating sheet, a vinyl chloride sheet, a polyester sheet (PET), a polyimide, a glass epoxy resin sheet, or the like having a thickness of about 20 to 150 μm is used.
The coil 121 of the semiconductor module 120 is formed by directly forming a coil wiring formed by selective plating on a transfer plate on the terminal surface of the semiconductor chip 122 by a selective plating method or a printing method using a conductive paste. However, the present invention is not limited to this.
Examples of the coil wiring formed by selective plating include a copper plating layer alone or a copper plating layer as a main layer and a nickel plating layer and a gold plating layer laminated.
As a method for forming such a coil-on-chip type semiconductor module, recently, a method has been proposed in which a wiring portion such as a coil is formed at a wafer level and then cut and separated for each semiconductor chip.
[0014]
There is no limitation in particular as the product part 110, In addition to a product main body, its package, such as a case, is included.
Examples of the product include, but are not limited to, electric appliances, games, cards, magazines such as weekly magazines, monthly magazines, and books.
[0015]
The semiconductor module 120 of this example includes a semiconductor chip 122 and a coil 121, both of which are not shown, but the semiconductor chip 122 includes a memory, a control circuit, a power generation unit for obtaining an operating voltage, and a coil. A receiving circuit that receives radio waves from 121 and a transmitting circuit that transmits data to the coil 121 are provided.
The power generation unit obtains the operating voltage from the radio wave received by the coil 121 via the booster antenna circuit unit 130 from the external device.
The transmission circuit uses the demodulation circuit to detect the received radio wave and restore the signal.
Further, the transmission circuit changes the carrier wave in accordance with the transmission data in the modulation circuit and transmits the carrier wave to the coil 121.
It goes without saying that ISO 14443 type A and type B semiconductor chips can also be applied as the semiconductor chip 122.
Communication with an external device can be performed at various frequencies such as 13.56 MHz, 2.45 GHz, and microwaves.
[0016]
Next, an example of using the coil-on-chip type article with a semiconductor module of this example will be described with reference to FIG.
In addition, it replaces with description of one example of embodiment of the sales system of this invention by this.
First, a key for a person (hereinafter referred to as a purchaser) to download and obtain product information from an information network such as the Internet (
Key) Purchase an article equipped with a semiconductor module that stores information.
As shown in FIG. 1A, the article includes a semiconductor module 120 in which key information for downloading and obtaining product information from the Internet is stored in the memory of the semiconductor chip 122, and a booster circuit member 130. In the state covered with the member 141, it is conveyed or directly delivered to the purchaser.
As shown in B2 of FIG. 3, the purchaser brings the reader 320 connected to the personal computer 330 close to the booster circuit member 130 (A0 part) of the article 101, and contactlessly through the booster circuit of the booster circuit member 130. Thus, key information for downloading and obtaining the product information from the Internet stored in the memory of the semiconductor chip 122 of the semiconductor module 120 is obtained.
Next, when the purchaser presents the obtained key information to the seller side of the article with the semiconductor module via the Internet 310 using the personal computer 330, the seller confirms this, and the predetermined character information, The purchaser is permitted to download digital contents such as image information and music information, or other product information. Thereafter, the purchaser downloads predetermined product information via the Internet 310 and obtains it on the personal computer 330.
Here, a display device (display device) 340 is provided for displaying product information when the product information is received by the personal computer 330 which is a data input device.
In this way, the purchaser can purchase the article with the semiconductor module and obtain the product information from the Internet.
Here, the personal computer 330 is a data input device, but the present invention is not limited to this.
The same thing can be done via a mobile phone.
[0017]
The sales system shown in FIG. 3 is a system for providing a purchaser with key information for obtaining product information as digital information from the Internet, such as a magazine such as a weekly magazine or a monthly magazine, a book, etc. Can also be used.
The product information (digital information) mentioned here is Bunyu data, image data, and other digital contents, and also includes music data as necessary.
The sales system shown in FIG. 3 may be a system that provides key information for obtaining product information as digital information from the Internet to various products such as electric appliances, games, cards, etc. Can be used.
The product information (digital information) mentioned here is character data, temporary image data, music data, and other digital contents.
Other digital contents include digital information such as how to enjoy products, benefits, sweepstakes, safety, warranty card, and the like.
Only those who own this product will be available.
[0018]
  Next, the coil-on-chip type article with a semiconductor module of the present inventionReference embodiment example 1This will be described with reference to FIG.
  Reference embodiment example 1In the first example shown in FIG. 1 (a), the booster circuit unit 130 is not provided. Like the first example, the semiconductor module 120 is fitted into the recess 115 of the product unit 110, and the coil 121 surface is arranged. Since it almost matches one surface of the product part 110, the movement of the semiconductor module 120 can be surely restricted and contact with the adhesive (adhesive) 150 can be prevented. The coating member 142 is fixed along the one surface of the product part 110 via an adhesive (adhesive) 150 so as to cover the semiconductor module 120.
  About each part, it is the same as that of a 1st example, and it abbreviate | omits description here.
  Reference embodiment example 1In the case of reading the key information stored in the memory of the semiconductor chip 122 by the reader, for example, the first booster circuit unit is aligned with the coil 121 of the semiconductor module 120 at the time of reading. Proceed as in the example.
  About others, it can use similarly to the 1st example.
[0019]
  Next, the coil-on-chip type article with a semiconductor module of the present inventionReference embodiment example 2This will be described with reference to FIG.
  Reference embodiment example 2In the first example shown in FIG. 1 (a), the semiconductor module 120 is fitted and does not have the concave portion 115 of the product portion 110, and the semiconductor module 120 protrudes outward from the product portion 110 by that amount. The booster circuit member 130 is covered with the coating member 141.
  Of course, the coil 121 of the semiconductor module 120 and the booster circuit member 130 circuit portion are aligned.
  Reference embodiment example 2Compared to the first example, the movement of the semiconductor module 120 cannot be reliably limited. About each part, it is the same as that of a 1st example, and it abbreviate | omits description here.
  The usage is the same as in the first example.
[0020]
  Next, the coil-on-chip type article with a semiconductor module of the present inventionReference embodiment example 3Will be described with reference to FIG.
  Reference embodiment example 3Does not use the coating member 141 in the first example, the circuit portion of the booster circuit member 130 and the coil 121 of the semiconductor module 120 are aligned, and the booster circuit member 130 and the surface of the product portion 110 are aligned. In between, the semiconductor module 120 is placed, and these are provided via an adhesive (adhesive) 150.
  In the case of this example, since the circuit portion of the booster circuit member 130 and the coil 121 of the semiconductor module 120 are fixed and integrated through an adhesive (adhesive) 150, they are relatively caused by vibration or the like. No position movement occurs.
  About each part, it is the same as that of a 1st example, and it abbreviate | omits description here.
  The usage is the same as in the first example.
[0021]
  Next, the coil-on-chip type article with a semiconductor module of the present inventionReference embodiment example 4Will be described with reference to FIG.
  Reference embodiment example 4The semiconductor module 120 is housed in a hole 117 provided in the product part 110, and the other parts are the same as in the first example.
  In the case of this example, the semiconductor module 120 can be completely separated from the booster circuit member 130.
  About each part, it is the same as that of a 1st example, and it abbreviate | omits description here.
  The usage is the same as in the first example.
[0022]
  Next, the coil-on-chip type article with a semiconductor module of the present inventionReference embodiment example 5Will be described with reference to FIG.
  Reference embodiment example 5Is formed by forming a coil 131 to be a booster circuit part on the surface of the product part 110 and providing the semiconductor module 120 on the coating member 141 side. The semiconductor module 120 is aligned with the coil 121 side facing the coil 131 side. In this state, it is fixed to the coating member via an adhesive (adhesive) 150.
  The coating member 141 is provided with an adhesive (adhesive) 150 on the entire surface on the semiconductor module 120 side, and an adhesive tape, an adhesive tape, or the like can be used therefor.
  In this example, the booster circuit portion can be easily formed by printing using a conductive paste. By using an adhesive tape, an adhesive tape, or the like as the coating member 141, the conductor module 120, the booster circuit portion can be applied to the product portion. Installation is relatively easy.
  About each part, it is the same as that of a 1st example, and it abbreviate | omits description here.
  The usage is the same as in the first example.
[0023]
  Next, the coil-on-chip type article with a semiconductor module of the present inventionReference embodiment example 6Will be described with reference to FIG.
  Reference embodiment example 6The booster circuit member 130 is formed on the surface of the product part 110 with the coil 131 outside, and the coil 121 side of the semiconductor module 120 is coiled in the state where the semiconductor module 120 is placed in the bag covering member 144. The film member 144 is fixed to the product portion 110 via an adhesive (adhesive) 150 by being aligned toward the 131 side.
  In this example, the semiconductor module 120 is separated from the adhesive (adhesive) 150.
  As the material of the bag-shaped film member 144, the same material as the film member of the first example can be used.
  Other parts are the same as those in the first example, and a description thereof is omitted here.
  The usage is the same as in the first example.
[0024]
  Next, an embodiment of an article with a coil-on-chip type semiconductor module of the present invention will be described.Second exampleThis will be described with reference to FIG.
  Second exampleIn which the coil 121 faces outward and the semiconductor module 120 is housed in the recess 115 provided on the surface of the product part 110, and the coil 131 faces the semiconductor module 120 and is placed in the cover member 144 of the bag body. With the booster circuit member 130 inserted, the coil 121 of the semiconductor module 120 and the coil 131 of the booster circuit member 130 are aligned, and the coating member 144 is attached to the product part 110 via the adhesive (adhesive) 150. And fixed around the periphery.
  About each part, it is the same as that of a 1st example, and it abbreviate | omits description here.
  The usage is the same as in the first example.
[0025]
【The invention's effect】
As described above, the present invention does not use various information about products or transaction information related to product purchases as digital information, or the sales target itself as digital information when purchasing goods. This makes it possible to provide a sales system that can be easily downloaded and obtained.
At the same time, it is possible to provide an article with a coil-on-chip type semiconductor module equipped with a coil-on-chip type semiconductor module, which is used in such a system and is provided with a coil connected to a terminal of a semiconductor chip. It was.
[Brief description of the drawings]
[Figure 1]FIG. 1A is a schematic cross-sectional view showing a characteristic part of a first example of an embodiment of an article with a coil-on-chip type semiconductor module according to the present invention. FIG. 1B, FIG. FIG. 1D is a schematic cross-sectional view showing the characteristic portions of Reference Embodiment Example 1, Reference Embodiment Example 2, and Reference Embodiment Example 3, respectively.
[Figure 2]2 (e), 2 (f), and 2 (g) are schematic cross-sectional views showing features of Reference Embodiment Example 4, Reference Embodiment Example 5, and Reference Embodiment Example 6, respectively. 2 (h) is a schematic cross-sectional view showing a characteristic part of a second example of the embodiment of the article with a coil-on-chip type semiconductor module of the present invention.
FIG. 3 is a diagram for explaining a sales system according to the present invention.
4A is a diagram showing an example of a booster coil shape of a booster circuit, and FIG. 4B is a diagram showing an example of a coil shape of a semiconductor module.
[Explanation of symbols]
101-108 Article with coil-on-chip type semiconductor module
110 Product Department
115 recess
117 hole
120 Semiconductor module (coil-on-chip type)
121 coils
121s connection wiring
122 Semiconductor chip
125 terminals
130 Booster circuit members
131 coils
131a crowded area
131s connection wiring,
132 Base substrate
141, 142, 143, 144 Film member
150 Adhesive (or adhesive)
310 Internet
320 Reading device (also called reader)
330 PC
340 Display device (display device)
341 screen

Claims (2)

A semiconductor chip including a booster circuit member having a booster antenna coil disposed on one side of a base substrate, and a coil for performing non-contact communication with an external device for reading and / or writing via the booster antenna coil A coil-on-chip type semiconductor module provided to be connected to the terminal of the product is provided on one side of the product part which is an article body, and the booster antenna coil wiring of the booster circuit member is connected to the coil-on-chip. The coil-on-chip type includes a dense portion that overlaps the wiring of the coil of the semiconductor module of the type, and the booster antenna coil of the booster circuit member and the coil of the coil-on-chip type semiconductor module face each other. The wiring of the semiconductor module coil and the booster times The wiring of the coils of dense portions of the member, so as to overlap each other, those are aligned, the product side, a recess to accommodate the semiconductor module of the coil-on-chip type, wherein the recess Koiruon A chip-type semiconductor module is fitted, the coil surface thereof is aligned with one surface of the product portion, the wiring of the coil is directed to the one surface side of the product portion, and the booster circuit member is disposed along the one surface. The on-chip type semiconductor module is held between the coating member and the product portion by a coating member that coats the on-chip type semiconductor module, and the coating member is the coil-on-chip type semiconductor module. the position parts of, as adhesive or adhesive is not exposed, characterized in that it is bonded held by the product portion using an adhesive agent or adhesive Koiruon -Up type semiconductor module with articles of. The article with a coil-on-chip type semiconductor module according to claim 1, wherein a coil-on-chip type semiconductor module and a coating member for holding the coil-on-chip type semiconductor module are disposed at an end of the product part. A coil-on-chip type article with a semiconductor module.

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