JP2009182630A - Booster antenna board, booster antenna board sheet and non-contact type data carrier device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To extend a data communication distance of a non-contact type data carrier, and to use the non-contact type data carrier in the proximity of a conductor such as metal. <P>SOLUTION: The non-contact type data carrier device 1 includes an antenna layer 7 having a magnetic field converging part 12 for converging an external magnetic field, a booster antenna board 5 provided with a magnetic layer 9 arranged so as to face the antenna layer 7, and a small tag 3 attached to a position (position 12a to be attached) where the magnetic field converging part 12 on the booster antenna board 5 is held between the small tag and the magnetic layer 9. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a booster antenna substrate, a booster antenna substrate sheet, and a non-contact data carrier device that are used with a non-contact data carrier attached thereto.

  An IC chip capable of storing data and a non-contact type data carrier on which a patterned antenna coil, for example, is mounted on a wiring board are used as a carrier for tag information of articles. This type of non-contact type data carrier can form a small antenna coil by using a technique for miniaturizing a wiring pattern, thereby realizing miniaturization of a single component.

  On the other hand, in applications where a relatively long communication distance is required, it is effective to make the coil diameter of the antenna coil large, but in this case, it is difficult to reduce the size of the non-contact data carrier itself. Therefore, a configuration has been proposed in which a small non-contact type data carrier as a main part and a booster antenna substrate on which an antenna coil having a large coil diameter is mounted are used in combination (for example, see Patent Document 1).

In other words, such a booster antenna board adopts a cheaper configuration according to the required function, and combines it with a small non-contact data carrier for mass production, thereby reducing the cost of the entire device. It becomes possible to plan.
JP 2005-323019 A

  However, in the device configuration in which the booster antenna substrate and the small non-contact data carrier described above are used together, there is a concern about the occurrence of a communication error, and consideration is given to satisfying the use near a conductor such as metal. There is no need for improvement in this regard.

  Accordingly, the present invention has been made to solve the above-described problems, and in addition to being able to extend the data communication distance, a booster antenna substrate and a booster antenna substrate that can be used in the proximity of a conductor such as metal An object is to provide a sheet and a non-contact type data carrier device.

  In order to achieve the above object, a booster antenna substrate according to the present invention is a booster antenna substrate that is used by attaching a non-contact data carrier, and has an antenna layer having a magnetic field converging part for converging an external magnetic field, and the antenna And a magnetic layer disposed so as to face the layer.

  That is, according to the present invention, by attaching a non-contact type data carrier at a position where the magnetic field converging portion on the antenna layer is sandwiched between the magnetic layer, the external magnetic field (magnetic flux) serving as the data carrier is converged. It is possible to efficiently guide to the non-contact data carrier side, and the data communication distance can be extended. In addition, according to the present invention, a magnetic path that substantially facilitates the passage of magnetic flux can be formed in the magnetic layer, so that the magnetic layer side is opposed to, for example, a metal article side, By arranging a booster antenna substrate carrying a contact type data carrier, it is possible to suppress so-called eddy currents on the metal article, thereby communicating data even at close positions such as metal conductors. It becomes possible.

  In the present invention, a booster antenna substrate sheet on which a plurality of booster antenna substrates are mounted can be configured. Furthermore, in the present invention, a non-contact type data carrier is attached to a position where the magnetic field converging part on the booster antenna substrate is sandwiched between the magnetic layer and a window part constituting the magnetic field converging part. It is also possible to obtain a data carrier device.

  As described above, according to the present invention, in addition to extending the data communication distance, the booster antenna substrate, the booster antenna substrate sheet, and the non-contact type data carrier that can be used in the proximity of a conductor such as metal An apparatus can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
[First Embodiment]
FIG. 1A is a plan view schematically showing a configuration of a non-contact data carrier device 1 according to the first embodiment of the present invention, and FIG. 1B is a sectional view thereof. 2A is a plan view showing a state before the small tag 3 is attached to the booster antenna substrate 5 which is a component of the non-contact type data carrier device 1, and FIG. 2B is a cross-sectional view thereof. 3 is a plan view showing the configuration of the small tag 3 of FIG. 1A, and FIG. 4 is a diagram for explaining the function of the antenna layer 7 laminated on the booster antenna substrate 5 shown in FIG. 2A. . In FIGS. 1A, 2A and 3 (and FIGS. 5A and 6 to be described later) shown in plan views, hatching is given to make it easy to visually grasp the formation region of the conductor pattern.

  As shown in FIGS. 1A to 1B, the non-contact type data carrier device 1 includes a booster antenna substrate 5 and a small tag 3 as a non-contact type data carrier attached to the booster antenna substrate 5. Yes.

  The small tag 3 is, for example, an electromagnetic induction type RFID [Radio Frequency Identification] tag that can perform wireless communication of data using a band of 13.56 MHz. As shown in FIG. 3, the small tag 3 is formed in a rectangular shape when viewed from the plane direction, and has a size of, for example, 5 mm square (see FIG. 6 described later). Further, the small tag 3 can be reduced in size by applying a pattern miniaturization technique or a longitudinal conductive technique in recent years, and is mass-produced at a low cost. Such a small tag 3 mainly includes a wiring board 14, an antenna coil (antenna pattern) 17, an IC chip 16, a bonding wire 16a, and a mold resin 18.

  The IC chip 16 is connected to the antenna coil 17 through a bonding wire 16a, and includes a ROM, a RAM, an RF circuit, a CPU, and the like as main internal components. The CPU executes various arithmetic processes such as communication control with the reader (or reader / writer) and response processing using programs and data stored in the ROM and RAM.

  The ROM stores a tag identification code unique to each tag when the small tag 3 is manufactured. Further, the IC chip 16 is mounted with a rewritable nonvolatile memory that does not require a power backup, in addition to the RF circuit that is a communication control circuit for performing wireless communication via the antenna coil 17. Further, the IC chip 16 is mounted substantially at the center of the wiring substrate 14 and is further sealed with a mold resin 18 from the outside.

  As shown in FIG. 3, the antenna coil 17 has a shape in which a strip-shaped pattern circulates a plurality of times in a rectangular shape on one main surface of the wiring board 14, and an outer peripheral end serves as a vertical conductor land 17 a. It is configured. The vertical conductor land 17a is electrically connected to a vertical conductor located on the lower side thereof, and the vertical conductor is provided on the other main surface (back surface) of the wiring board 14. The antenna coil (antenna pattern) (not shown) is electrically connected to the outer peripheral end. An antenna coil (not shown) provided on the other main surface of the wiring board 14 is formed in a spiral shape in the same direction as the antenna coil 17, and an inner peripheral end thereof is a longitudinal conductor land via a longitudinal conductor. 17b is electrically connected.

  As described above, the antenna coil 17 and the antenna coil (not shown) form a round antenna coil (antenna pattern) connected in series. Note that, for example, a multilayer wiring board having three or more layers is adopted as the wiring board 14, antenna patterns are respectively formed on the wiring layers having three or more layers, and these are connected in series to form a circuit antenna coil. It may be.

  Further, the small tag 3 is not limited to the one shown in FIG. 3, and other configurations can be used. For example, in addition to using the multilayer wiring board described above, the mounting of the IC chip 16 is flip chip mounting, the resin layer covering the entire surface of the wiring board 14 is formed instead of the mold resin 18, and the wiring board 14 The IC chip 16 is embedded in the embedded substrate, the circular pattern of the antenna coil 17 is not a rectangular shape, but a polygon larger than that, and a curved pattern is introduced into a part of the circular pattern of the antenna coil 17, Etc. can be adopted as appropriate.

  Next, the structure of the booster antenna substrate 5 to which such a small tag 3 is attached will be described. That is, as shown in FIGS. 1A to 2B, the booster antenna substrate 5 faces the antenna layer 7 through an antenna layer 7 formed by patterning a conductor and an adhesive layer (adhesive layer) 8. The magnetic material layer 9 is arranged as described above.

  As shown in FIGS. 1A to 2B and 4, the antenna layer 7 is provided with an antenna main body (antenna element main body) 6, a magnetic field converging portion 12, and a notch groove (groove) 10. The antenna body 6 is configured by patterning a wheel paper (metal sheet) made of metal such as copper or aluminum, which is a conductor, by punching, for example. Specifically, as shown in FIGS. 1A, 2A, and 4, the antenna body 6 is formed of a substantially rectangular conductive solid pattern. The magnetic field converging part 12 is configured as a rectangular window part 12 in which the central part of the antenna body part 6 is opened (penetrated) in the thickness (lamination) direction, and converges an external magnetic field (magnetic flux from the outside). It has a function to make it. The notch groove 10 is formed so as to open from the magnetic field converging part (window part) 12 to reach the outer edge (periphery part) of the antenna body 6, and in the magnetic field converging part (window part) and the groove part, The conductor of the antenna layer 7 is removed.

Here, the communication distance extending function (boost function) by the antenna layer 7 provided in the booster antenna substrate 5 will be described.
That is, as shown in FIG. 4, when the antenna layer 7 of the booster antenna substrate 5 is disposed perpendicularly to the traveling direction of the magnetic field (magnetic flux) 7a generated by the reader / writer (or reader), this antenna is obtained according to the so-called Lenz law. An eddy current 7 c is generated at the periphery of the antenna body 6 of the layer 7. The eddy current 7c acts to prevent the magnetic field 7a from traveling toward the antenna layer 7 (generates a demagnetizing field in a direction that cancels the progress of the magnetic field 7a). However, on the other hand, an eddy current 7d that flows in the opposite direction to the eddy current 7c is generated around the magnetic field converging part (window part) 12 connected to the notch groove 10. That is, the magnetic field converging unit 12 reverses the direction in which the eddy current circulates (the direction of the magnetic flux) in cooperation with the notch groove 10, whereby the eddy current 7 d around the magnetic field converging unit 12 causes the magnetic field 7 a to It acts so as to converge (a magnetic field [magnetic flux] 7b that enhances the progression of the magnetic field 7a is generated).

  Therefore, by attaching the small tag 3 to a position (attached position 12a) between which the magnetic field converging portion 12 on the antenna layer 7 is sandwiched between the magnetic layer 9 described in detail later, a carrier wave of data from the reader / writer side and The alternating magnetic field (magnetic flux) to be converged can be efficiently guided to the small tag 3 side, whereby the data communication distance can be extended. Specifically, as shown in FIGS. 1A to 2B, the small tag 3 is joined to an attached position 12 a immediately above the antenna layer 7 via an adhesive layer (adhesive layer) 2. That is, in the non-contact type data carrier device 1, data is exchanged in a positional relationship in which the side on which the small tag 3 is attached and the reader / writer side face each other.

  Further, the non-contact type data carrier device 1 of the present embodiment is a wireless tag device including a metal-compatible booster antenna substrate 5 that can be used in the proximity of a conductor such as metal. That is, as shown in FIGS. 1A to 2B, the booster antenna substrate 5 to which the small tag 3 is attached has the magnetic layer 9 disposed so as to face the antenna layer 7 with the adhesive layer 8 interposed therebetween as described above. Is provided. Specifically, the magnetic layer 9 functioning as a radio wave shield is laminated so as to cover the antenna layer 7 from one main surface side (the non-mounting surface side of the small tag 3) with the adhesive layer 8 interposed therebetween. .

  The constituent material of the magnetic layer 9 is a material having a high magnetic permeability called a so-called soft magnetic material or a metallic magnetic material. Specifically, the material of the magnetic layer 9 is preferably a magnetic material having high electrical insulation properties such as Mn—Zn ferrite and Ni—Zn ferrite in consideration of prevention of electrical short circuit. In forming the magnetic layer 9, a resin binder mixed with the ferrite magnetic powder or the like may be applied.

  This resin binder is mainly composed of a thermoplastic resin, and if necessary, coupling agents such as silane, titanate and aluminum which improve the affinity between the magnetic powder and the resin, phthalic acid and sulfone which improve the fluidity of the resin. Acidic, phosphoric acid and epoxy plasticizers, stearic acid, stearates, fatty acid amides, waxes and other lubricants that increase the fluidity of the mixture, and hindered phenols to prevent oxidation of fillers, sulfur Those to which antioxidants such as those based on phosphorus and phosphorus are appropriately added are suitable.

  That is, in the non-contact type data carrier device 1 provided with the booster antenna substrate 5 having such a structure, a magnetic path can be formed in the magnetic layer 9 having a high magnetic permeability, so that the magnetic layer 9 side of the booster antenna substrate 5 is provided. For example, by facing the metal article (conductor) side, it is possible to suppress the generation of eddy current (eddy current flowing in the direction of canceling the received radio wave) on the metal article, and the metal conductor Data communication is possible even at close positions such as.

  Next, the communication characteristics of the non-contact type data carrier device configured as described above will be considered based on FIGS. 5A to 8. Here, FIG. 5A is a plan view for explaining the relationship between the relative mounting positions of the booster antenna substrate 15 and the small tag 3. FIG. 5B is a cross-sectional view for explaining the relationship of the attachment positions in FIG. 5A. FIG. 6 is a plan view for explaining schematic dimensions of the booster antenna substrate 15 and the small tag 3. Further, FIG. 7 is a diagram showing the characteristics of the communication distance based on the relationship between the relative mounting positions of the booster antenna substrate 15 and the small tag 3, and FIG. 8 shows the operating environment of the non-contact type data carrier device 11 and It is a figure showing the characteristic of the communication distance at the time of changing the thickness of the magnetic body layer 9 of the booster antenna board | substrate 15.

  More specifically, as data measurement conditions shown in FIG. 7, as shown in FIGS. 5A to 6, adhesion for attachment to an article is performed on the surface (outer surface) of the magnetic layer 9 of the booster antenna substrate 5. A non-contact type data carrier device 11 having a booster antenna substrate 15 on which a layer 19 was further laminated was applied. Further, the external size a1 × a2 of the small tag 3 as viewed from the direction (plane direction) orthogonal to the pattern surface of the antenna coil 17 is 5.5 mm × 5.5 mm. On the other hand, the external size of the booster antenna substrate 15 (substantially the same size as the outermost shape of the antenna main body 6) c1 × c2 viewed from a direction (plane direction) orthogonal to the surface of the antenna main body 6 is 30 mm × 30 mm. .

  Furthermore, the planar size b1 × b2 of the magnetic field converging portion 12 formed as a rectangular window portion is 4 mm × 4 mm. In addition, the magnetic layer 9 having a thickness t1 of 100 μm was applied. Here, as shown in FIG. 6, the ideal attached position 12 a on the booster antenna substrate 15 to which the small tag 3 is to be attached is the center position G <b> 1 in the planar direction of the magnetic field converging unit 12 and the planar direction of the small tag 3. Is the position where the center position (winding center of the antenna coil 17) G2 overlaps in the plane direction. Therefore, as shown in FIG. 5A to FIG. 6, the positions where the center positions G1 and G2 coincide with each other are set as reference positions (± 0 mm positions) and small in the X1 direction (plus direction) and the X2 direction (minus direction). The communication distance (communication possible distance) when the tag attachment position of the tag 3 was shifted by 1 mm with the upper limit being ± 5 mm was measured.

  More specifically, while changing the separation distance between the surface of the antenna coil 17 of the small tag 3 on the non-contact type data carrier device 11 and the reader / writer (manufactured by Takaya; output 100 mW) opposed to the surface of the antenna coil 17. The communication distance (communication possible distance) was measured. In this case, in response to a reply request from the reader / writer side, the communication distance was determined based on whether or not the response signal from the small tag 3 could be received on the reader / writer side.

  From the measurement results shown in FIG. 7, the small tag 3 is positioned and attached to the booster antenna substrate 15 so that the positional deviation between the center position G1 of the magnetic field converging unit 12 and the center position G2 of the small tag 3 is within ± 2 mm. Thus, a communication distance of about 20 mm can be obtained.

  On the other hand, as a measurement condition of the data (communication distance) shown in FIG. 8, the non-contact type data carrier device 11 including the booster antenna substrate 15 and the small tag 3 shown in FIGS. 5A to 6 is applied. Here, the data shown in FIG. 8 is described above in a state in which the center position G1 of the magnetic field converging unit 12 on the booster antenna substrate 15 and the center position G2 of the small tag 3 are fixed to the reference position (position of ± 0 mm). Similar to the measurement, the communicable distance was obtained. Furthermore, the measurement conditions of the data shown in FIG. 8 are 15 samples in which the thickness t1 of the magnetic layer 9 (of the booster antenna substrate 15) in the non-contact data carrier device 11 is 50 μm, and 15 which is 100 μm. Samples were prepared, and the communication distance was measured in each operation environment on a metal (iron article) and a nonmetal (insulator) in each non-contact data carrier device.

  In the single small tag 3 that does not use the booster antenna substrate 15, the communication distance is about 30 mm when the operating environment is non-metal, while the communication distance is 0 mm when the operating environment is metal. Furthermore, when a magnetic sheet is laid on a metal and the small tag 3 is placed on the metal sheet, communication itself is possible, but the magnetic material sheet is interposed to extend the direction of magnetic flux (spreading of magnetic flux). ) Is restricted, and the communication distance of 30 mm on the non-metal is reduced to about 2 mm due to the influence.

  On the other hand, as can be seen from the measurement results shown in FIG. 8, contactless data including a booster antenna substrate 15 in which an antenna layer 7 having a magnetic field converging part 12 and a magnetic layer 9 (thickness 50 μm / 100 μm) are laminated. The carrier device 11 can obtain a communication distance of about 20 mm under any operating environment on metal or non-metal.

  As described above, according to the non-contact type data carrier devices 1 and 11 including the booster antenna substrates 5 and 15 according to the present embodiment, the magnetic field converging part (window part) 12 on the antenna layer 7 is replaced with the magnetic layer. By attaching the small tag 3 to a position sandwiched between 9 (attached position 12a), the external magnetic field (magnetic flux) serving as a data carrier wave from the reader / writer side is converged, and the small tag 3 side is efficiently collected. It is possible to guide, and the data communication distance can be extended.

  Further, according to the non-contact data carrier devices 1 and 11 of the present embodiment, a magnetic path that facilitates the passage of magnetic flux can be formed in the magnetic layer 9, so that the magnetic layer 9 side is made of a conductor. For example, by arranging the booster antenna substrates 5 and 15 on which the small tag 3 is mounted in a posture facing the metal article side, it is possible to suppress so-called eddy currents on the metal article. Data can be communicated even at close positions such as metal conductors. Furthermore, in the non-contact type data carrier devices 1 and 11 of the present embodiment, the magnetic field converging portion 12 on the antenna layer 7 is connected to the rectangular window 3 with respect to the rectangular small tag 3 to be attached to the booster antenna substrates 5 and 15 side. By comprising the part (square hole), the alignment reference when the small tag 3 is attached becomes visually clear. Therefore, it is possible to improve the mounting position accuracy of the small tag 3 that greatly affects the communication characteristics.

  In place of the non-contact type data carrier devices 1 and 11 having the booster antenna substrates 5 and 15 shown in FIGS. 1B and 5B, as shown in FIG. 9, the antenna layer 7 and the magnetic layer 9 are interposed. You may comprise the non-contact-type data carrier apparatus 21a provided with the booster antenna board | substrate 25a which interposed the insulator layer 22 which has electrical insulation. Specifically, in this configuration, the base material is a laminated plate 24a in which the magnetic material layer 9 is formed by applying the above-described magnetic material to a resin substrate such as PET (polyethylene terephthalate) to be the insulator layer 22, for example. As an example, the embodiment is applied.

  Further, instead of the non-contact type data carrier device 21a, as shown in FIG. 10, in order to interpose the insulator layer 22, a laminated board in which a conductor layer is stuck on an insulating substrate such as a single-sided copper-clad laminated board. Non-contact type data carrier including a booster antenna substrate 25b prepared by using 24b as a base material and forming the antenna layer 7 (antenna body 6 shown in FIG. 2A, etc.) by punching the laminated plate 24b. The device 21b can also be configured.

  Further, in place of the non-contact type data carrier device 21b, as shown in FIG. 11, in order to interpose the insulator layer 22, a structure in which a conductor layer is laminated on an insulating substrate similar to the above-described laminated plate 24b. A non-contact type data carrier device 21c having a booster antenna substrate 25c prepared by patterning the antenna layer 7 (antenna body 6) by preparing the laminate 24c as a base material and etching the laminate 24c is configured. May be. Further, the antenna layer 7 (antenna body 6) on the booster antenna substrate 25c having the structure shown in FIG. 11 can be formed by printing a conductive paste such as a silver paste on an insulating substrate.

  In the non-contact type data carrier devices 21a, 21b, and 21c shown in FIGS. 9 to 11 with the insulator layer 22 interposed as described above, the rigidity of the booster antenna substrates 25a, 25b, and 25c can be increased, and the antenna Since the separation distance between the layer 7 and the magnetic layer 9 can be increased, the magnetic influence of the magnetic layer 9 functioning as a radio wave shield (the magnetic layer 9 restricts the direction in which the magnetic flux extends and spreads). Thus, communication performance can be improved.

  Here, as the insulating resin material for constituting the insulator layer 22, PET, phenol resin, urea resin, melamine resin, polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyethersulfone, polyphenylene sulfide, PBT, Polyarylate, silicon resin, diallyl phthalate, polyimide and the like can be applied. In addition, when a relatively strong insulating resin material such as so-called reinforced plastic or polycarbonate is applied, the mechanical strength of the booster antenna substrates 25a, 25b, and 25c can be further improved.

  Furthermore, in place of the booster antenna substrate provided in the non-contact type data carrier device described above, as shown in FIG. 12, the magnetic field converging portion configured as a window portion rather than the external size in the planar direction of the small tag 3 You may comprise the non-contact-type data carrier apparatus 21d provided with the booster antenna board | substrate 25d which formed the size of the planar direction of 12b large. In the case of this structure, since the non-contact type data carrier device 21d is configured by attaching the small tag 3 in the window functioning as the magnetic field converging portion 12b on the booster antenna substrate 25d, the entire device can be reduced in thickness and size. Can be planned. Further, as shown in FIG. 13, a booster antenna substrate 25e having both a configuration capable of mounting the small tag 3 in the magnetic field converging portion 12b (window portion) and a configuration in which the above-described insulator layer 22 is interposed is provided. It is also possible to obtain a non-contact type data carrier device 21e.

  Similarly to the non-contact type data carrier device 11 including the booster antenna substrate 15 illustrated in FIG. 5B, as shown in FIG. 14, the booster antenna substrate 35 in which the adhesive layer 19 is laminated on the surface (bottom surface) of the magnetic layer 9. It is also possible to configure a non-contact type data carrier device 31 comprising: Similarly, a non-contact type data carrier device may be configured by laminating an adhesive layer 19 on the surface (bottom surface) of the magnetic layer 9 of the booster antenna substrates 21a to 21d exemplified in FIGS. . When the adhesive layer 19 is provided, an operation for attaching the non-contact data carrier device to the article becomes easy. Moreover, you may comprise the booster antenna board | substrate (and non-contact-type data carrier apparatus provided with this) which affixed release paper on the further outer side of such an adhesive layer 19. FIG.

  Further, as shown in FIG. 15, the booster antenna substrate 35 or the booster antenna substrate 15 (or booster antenna substrates 25a, 25b, 25c, 25d, 21e) shown in FIG. For example, a plurality of booster antenna substrate sheets 45 mounted on a base material sheet formed of release paper or the like can be configured. Alternatively, the booster antenna substrate sheet 45 may be wound into a roll shape to constitute a booster antenna substrate roll.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS. Here, FIG. 16 is a cross-sectional view schematically showing the structure of a non-contact type data carrier device 51 according to the second embodiment of the present invention. FIG. 17A is a cross-sectional view showing a state before the small tag 3 is positioned on the tag positioning portion 54 of the primary molding processing portion 52 of the non-contact type data carrier device 51. Further, FIG. 17B is a cross-sectional view showing a state before positioning the booster antenna substrate 25 to the antenna substrate positioning portion 58 of the primary molding processing portion 52, and FIG. 17C shows the small tag 3 and the booster positioned relative to each other. FIG. 6 is a cross-sectional view showing a state in which the antenna substrate 25 is housed in the forming dies 56 and 57 together with the primary forming portion 52.

  FIG. 18 is a cross-sectional view showing another non-contact type data carrier device 61 having a partial structure different from that of the non-contact type data carrier device 51 of FIG. Further, FIG. 19A is a cross-sectional view showing a state before the small tag 3 is positioned on the tag positioning portion 64 of the primary molding processing portion 62 of the non-contact type data carrier device 61, and FIG. 19B is a cross-sectional view of FIG. It is sectional drawing which shows the state before attaching the booster antenna board | substrate 25 to the small tag 3 side positioned by the tag positioning part 64. FIG. 16 to 19B described above, the same components as those provided in the non-contact data carrier devices 1 and 21a of the first embodiment illustrated in FIGS. 1B and 9 are the same. Reference numerals are given and description thereof is omitted.

  As shown in FIG. 16, the non-contact type data carrier device 51 according to this embodiment covers the small tag 3 from the outside together with the booster antenna board 25a (or the booster antenna boards 5, 25b, 25c, 25d, 21e). The primary molding processing part 52 which is the first exterior constituent part and the secondary molding processing part 53 which is the second exterior constituent part (covering the non-contact type data carrier device exemplified in the first embodiment from the outside) Prepare as a part. Thereby, in the non-contact-type data carrier device 51, the small tag 3 and the booster antenna substrate can be protected from the external environment and mechanical stress.

  Moreover, the primary shaping | molding process part 52 is formed by solidifying the molding material of a molten state (primary shaping | molding), and tag positioning which positions the small tag 3 and the booster antenna board | substrate 25 (or 5) each relatively. The part 54 and the antenna substrate positioning part 58 are provided as concave parts. That is, the tag positioning portion 54 and the antenna substrate positioning portion 58 are small in size through the side wall portions 54a and 58a and the center position G1 of the magnetic field converging portion 12 on the booster antenna substrate as illustrated in FIG. 5A to FIG. A predetermined position in the window portion constituting the magnetic field converging portion 12b exemplified in FIG. 13 or the like on the attached position 12a of the booster antenna substrate so that the positional deviation of the tag 3 from the center position G2 is within ± 2 mm as described above. ) To position the small tag 3.

  On the other hand, the secondary molding processing unit 53 is formed by solidifying a molding material in a molten state (secondary molding), and the small tag 3 and the booster positioned by the tag positioning unit 54 and the antenna substrate positioning unit 58, respectively. The antenna substrate is covered from the outside with the primary molding unit 52. Examples of the material of the primary molding portion 52 and the secondary molding portion 53 described above include PS (polystyrene), PPS (polyphenylene sulfide), silicone rubber, NBR (acrylonitrile butadiene rubber), and the like. By using such a rubber material or a resin material, the primary molding processing part 52 and the secondary molding processing part 53 are molded, so that the chemical resistance, heat resistance, flame resistance, etc. of the non-contact type data carrier device Can be improved.

  Here, when the non-contact type data carrier device 51 having the above structure is manufactured, first, as shown in FIG. 17A, a tag 1 having a tag positioning portion 54 and an antenna substrate positioning portion 58 is used by using a predetermined mold. The next molding processing part 52 is primary molded. In addition, this primary shaping | molding process part 52 is not restricted to shaping | molding using a type | mold, You may produce by cutting out from a base material. Next, as shown in FIGS. 17A and 17B, the small tag 3 is set (attached) from the non-laminated side of the adhesive layer 2 to the tag positioning portion 54 of the primary molding portion 52. Subsequently, as shown in FIGS. 17B and 17C, the booster antenna substrate 25 (or 5) is set (attached) from the antenna layer 7 to the antenna substrate positioning portion 58.

  Next, as shown in FIG. 17C, the small tag 3 and the booster antenna substrate, which are positioned relative to each other, are accommodated in the molding dies 56 and 57 together with the primary molding processing portion 52, and the gaps 57a in the molding dies 56 and 57 are accommodated. The molten molding material is filled through a material injection port (not shown). Thereafter, secondary molding of the filled molding material is performed, and the non-contact type data carrier device 51 having an exterior portion composed of the solidified secondary molding processing portion 53 and the primary molding processing portion 53 is formed into a molding die. Remove from 56, 57.

  According to the non-contact type data carrier device 51 manufactured in this way, the mounting position 12a on the magnetic field converging part 12 on the booster antenna substrate (or the window part constituting the magnetic field converging part 12b illustrated in FIG. 13 and the like) The small tag 3 can be accurately positioned with respect to the predetermined position), so that the mounting position accuracy of the small tag 3 that greatly affects the communication performance can be improved. Moreover, the adhesive layer 2 between the booster antenna substrate and the small tag 3 can be deleted by applying the primary molding processing unit 52 having the tag positioning unit 54 and the antenna substrate positioning unit 58.

  Further, in place of the non-contact type data carrier device 51 having such a structure, as shown in FIGS. 18 to 19B, the primary having only the positioning portion (the tag positioning portion 64 having the side wall portion 64a) of the small tag 3 is provided. A compact processing part (first exterior component part) 62 and a small tag 3 formed by solidifying a molten molding material and positioned by a tag positioning part 64 are connected to a booster antenna substrate 25a (or booster antenna substrate 5, 25b, 25c, 25d, 25e) and a secondary molding processing part (second exterior component part) 63 covering between the primary molding process part 62 and the non-contact data carrier device 61 as an exterior part You can also

  In the non-contact type data carrier device 61 having such a configuration, as shown in FIGS. 19A and 19B, the magnetic field of the booster antenna substrate is applied to the small tag 3 positioned by the tag positioning unit 64 of the primary molding unit 62. After the attachment position 12a on the converging part 12 (or a predetermined position in the window part constituting the magnetic field converging part 12b illustrated in FIG. 13 and the like) is joined via the adhesive layer 2, as shown in FIG. The small tag 3 and the booster antenna substrate can be covered from the outside by the secondary molding portions (62, 63).

  Therefore, also in the non-contact type data carrier device 61, it is possible to improve the mounting position accuracy of the small tag 3 with respect to the magnetic field converging portion 12 (or 12b) on the booster antenna substrate. Here, in the case where there is a concern that the adhesion force of the adhesive layer 2 on the small tag 3 exceeds the adhesive force due to factors such as heating during the molding process and the booster antenna substrate flows, FIG. 17A to FIG. 17C It is preferable to apply the non-contact type data carrier device 51 of FIG. 16 adopting the manufacturing method shown. Further, according to the non-contact type data carrier device 61 shown in FIG. 18, the small tag 3 and the booster antenna board are protected from the external environment and mechanical stress as in the non-contact type data carrier device 51 shown in FIG. Can be protected.

  Although the present invention has been specifically described with reference to the first and second embodiments, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the present invention. . For example, in the above-described embodiment, the electromagnetic induction type small tag 3 using the 13.56 MHz band is exemplified as the target non-contact data carrier for extending the communication distance. However, the booster antenna of the present invention is exemplified. Since the substrate does not use resonance to extend the communication distance, the application can be expanded. In other words, the present invention can be applied to a magnetic field type non-contact data carrier even if a band other than the above 13.56 MHz is used.

1 is a plan view schematically showing a configuration of a non-contact data carrier device according to a first embodiment of the present invention. 1B is a cross-sectional view of the non-contact data carrier device shown in FIG. 1A. FIG. The top view which shows the state before attaching a small tag to the booster antenna board | substrate which is a component of the non-contact-type data carrier apparatus of FIG. 1A. Sectional drawing which shows the state before attaching a small tag to the booster antenna board | substrate of FIG. 2A. The top view which shows the small tag which is a component of the non-contact-type data carrier apparatus of FIG. 1A. The figure for demonstrating the function of the antenna layer laminated | stacked on the booster antenna board | substrate shown to FIG. 2A. The top view for demonstrating the relationship of the relative attachment position of a booster antenna board | substrate and a small tag. Sectional drawing for demonstrating the relationship of the relative attachment position of the booster antenna board | substrate and small tag in FIG. 5A. FIG. 5B is a plan view for explaining schematic dimensions of the booster antenna substrate and the small tag shown in FIG. 5A. The figure showing the characteristic of the communication distance based on the relationship of the relative attachment position of the booster antenna board | substrate shown to FIG. 5A, and a small tag. The figure showing the characteristic of the communication distance at the time of changing the operating environment of the non-contact-type data carrier apparatus shown to FIG. 5A, and the thickness of the magnetic body layer of a booster antenna board | substrate. Sectional drawing which shows the non-contact-type data carrier apparatus provided with the booster antenna board | substrate of FIG. 1B and FIG. Sectional drawing which shows the booster antenna board | substrate of FIG. 1B, FIG. 5B, and FIG. Sectional drawing which shows the booster antenna board | substrate of FIG. 1B, FIG. 5B, FIG. 9, FIG. Sectional drawing which shows the booster antenna board | substrate of FIG. 1B, FIG. 5B, and FIGS. Sectional drawing which shows the booster antenna board | substrate of FIG. 1B, FIG. 5B, and FIGS. Sectional drawing which shows the booster antenna board | substrate of FIG. 1B, FIG. 5B, and FIGS. Sectional drawing which shows the structure of the booster antenna board | substrate sheet | seat which mounts multiple booster antenna boards of FIG. 5B and FIG. Sectional drawing which shows schematically the structure of the non-contact-type data carrier apparatus which concerns on the 2nd Embodiment of this invention. Sectional drawing which shows the state before positioning a small tag in the tag positioning part of the primary shaping | molding process part of the non-contact-type data carrier apparatus shown in FIG. FIG. 17B is a cross-sectional view showing a state before the booster antenna substrate is positioned at the antenna substrate positioning portion of the primary molding processing portion of FIG. 17A. FIG. 18B is a cross-sectional view showing a state in which the small tag and the booster antenna substrate positioned in FIG. 17B are housed in the mold together with the primary molding portion. FIG. 17 is a cross-sectional view showing another non-contact type data carrier device having a partial structure different from that of the non-contact type data carrier device of FIG. 16. Sectional drawing which shows the state before a small tag is positioned by the tag positioning part of the primary shaping | molding process part of the non-contact-type data carrier apparatus shown in FIG. FIG. 19B is a cross-sectional view showing a state before the booster antenna substrate is attached to the small tag side positioned at the tag positioning portion of FIG. 19A.

Explanation of symbols

  1, 11, 21a, 21b, 21c, 21d, 21e, 31, 51, 61 ... non-contact type data carrier device, 3 ... small tag (non-contact type data carrier), 5, 15, 25a, 25b, 25c, 25d , 25e, 35 ... booster antenna substrate, 6 ... antenna body, 7 ... antenna layer, 7a, 7b ... magnetic field (magnetic flux), 7c, 7d ... eddy current, 9 ... magnetic layer, 10 ... notch groove, 12, 12b ... Magnetic field converging part (window part), 12a ... Installation position, 22 ... Insulator layer, 45 ... Booster antenna substrate sheet, 52, 62 ... Primary forming part, 53, 63 ... Secondary forming part, 54 , 64 ... tag positioning part, 56, 57 ... mold, 58 ... antenna substrate positioning part.

Claims (9)

A booster antenna substrate used with a non-contact data carrier attached,
An antenna layer having a magnetic field converging unit for converging an external magnetic field;
A magnetic layer disposed to face the antenna layer;
A booster antenna substrate comprising: The antenna layer is
An antenna main body formed of a conductive solid pattern;
A window part that opens the antenna body part in the thickness direction and constitutes the magnetic field converging part;
A groove that opens from the window to the outer edge of the antenna body, and
The booster antenna substrate according to claim 1, further comprising:   The booster antenna substrate according to claim 1 or 2, further comprising an insulating layer having electrical insulation interposed between the antenna layer and the magnetic layer.   A booster antenna substrate sheet comprising a plurality of booster antenna substrates according to any one of claims 1 to 3.   The non-contact type data carrier is attached to a position where the magnetic field converging portion on the booster antenna substrate according to claim 1 is sandwiched between the magnetic material layer. Non-contact data carrier device.   4. A non-contact type data carrier device, wherein the non-contact type data carrier is mounted in the window part constituting the magnetic field converging part on the booster antenna substrate according to claim 2.   7. The non-contact type data carrier device according to claim 5, further comprising an exterior part that covers the non-contact type data carrier together with the booster antenna substrate from the outside. The exterior part is
A first exterior component having a positioning portion of the non-contact data carrier;
A second exterior component that is formed by solidifying a molding material in a molten state and covers the non-contact type data carrier positioned by the positioning unit between the booster antenna substrate and the first exterior component. When,
The non-contact type data carrier device according to claim 7, comprising: The first exterior component further includes a positioning part of the booster antenna substrate,
The second exterior component covers the non-contact data carrier and the booster antenna substrate respectively positioned by the positioning unit, with the first exterior component.
The non-contact type data carrier device according to claim 8.

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